CN111547675A - 一种柔性电子器件、微结构柔性电极及其制备方法 - Google Patents
一种柔性电子器件、微结构柔性电极及其制备方法 Download PDFInfo
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- CN111547675A CN111547675A CN202010323012.3A CN202010323012A CN111547675A CN 111547675 A CN111547675 A CN 111547675A CN 202010323012 A CN202010323012 A CN 202010323012A CN 111547675 A CN111547675 A CN 111547675A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00166—Electrodes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Micromachines (AREA)
- Electroluminescent Light Sources (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Abstract
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Priority Applications (1)
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CN202010323012.3A CN111547675B (zh) | 2020-04-22 | 2020-04-22 | 一种柔性电子器件、微结构柔性电极及其制备方法 |
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CN202010323012.3A CN111547675B (zh) | 2020-04-22 | 2020-04-22 | 一种柔性电子器件、微结构柔性电极及其制备方法 |
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CN111547675A true CN111547675A (zh) | 2020-08-18 |
CN111547675B CN111547675B (zh) | 2022-08-16 |
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CN202010323012.3A Active CN111547675B (zh) | 2020-04-22 | 2020-04-22 | 一种柔性电子器件、微结构柔性电极及其制备方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113697757A (zh) * | 2021-08-26 | 2021-11-26 | 上海交通大学 | 一种金属复合柔性衬底及其制备方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001024300A (ja) * | 1999-07-08 | 2001-01-26 | Nec Akita Ltd | プリント配線基板の接続構造 |
US20030227255A1 (en) * | 2002-06-10 | 2003-12-11 | Institute Of Materials Research And Engineering | Patterning of electrodes in oled devices |
EP1968360A1 (en) * | 2007-03-08 | 2008-09-10 | IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A. | Method for manufacturing flexible printed circuitry |
CN104008991A (zh) * | 2013-02-27 | 2014-08-27 | 三星电子株式会社 | 转移半导体元件的方法和制造柔性半导体器件的方法 |
CN105615874A (zh) * | 2016-03-01 | 2016-06-01 | 中国科学院半导体研究所 | 可用于动态心电测量的柔性心电电极及制作方法 |
CN106663703A (zh) * | 2014-07-23 | 2017-05-10 | 埃特19有限公司 | 柔性衬底材料和制造电子薄膜器件的方法 |
CN106802200A (zh) * | 2017-02-23 | 2017-06-06 | 北京航空航天大学 | 一种柔性矢量触滑觉复合传感器 |
-
2020
- 2020-04-22 CN CN202010323012.3A patent/CN111547675B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001024300A (ja) * | 1999-07-08 | 2001-01-26 | Nec Akita Ltd | プリント配線基板の接続構造 |
US20030227255A1 (en) * | 2002-06-10 | 2003-12-11 | Institute Of Materials Research And Engineering | Patterning of electrodes in oled devices |
EP1968360A1 (en) * | 2007-03-08 | 2008-09-10 | IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A. | Method for manufacturing flexible printed circuitry |
CN104008991A (zh) * | 2013-02-27 | 2014-08-27 | 三星电子株式会社 | 转移半导体元件的方法和制造柔性半导体器件的方法 |
CN106663703A (zh) * | 2014-07-23 | 2017-05-10 | 埃特19有限公司 | 柔性衬底材料和制造电子薄膜器件的方法 |
CN105615874A (zh) * | 2016-03-01 | 2016-06-01 | 中国科学院半导体研究所 | 可用于动态心电测量的柔性心电电极及制作方法 |
CN106802200A (zh) * | 2017-02-23 | 2017-06-06 | 北京航空航天大学 | 一种柔性矢量触滑觉复合传感器 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113697757A (zh) * | 2021-08-26 | 2021-11-26 | 上海交通大学 | 一种金属复合柔性衬底及其制备方法 |
CN113697757B (zh) * | 2021-08-26 | 2023-12-29 | 上海交通大学 | 一种金属复合柔性衬底及其制备方法 |
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CN111547675B (zh) | 2022-08-16 |
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Inventor after: Wang Chenying Inventor after: Niu Zhongnan Inventor after: Lu Dejiang Inventor after: Wang Song Inventor after: Zhang Yaxin Inventor after: Jiang Zhuangde Inventor before: Niu Zhongnan Inventor before: Lu Dejiang Inventor before: Wang Chenying Inventor before: Wang Song Inventor before: Zhang Yaxin Inventor before: Jiang Zhuangde |
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