CN111542215A - Camera module attaching system and method for improving arrangement reliability - Google Patents
Camera module attaching system and method for improving arrangement reliability Download PDFInfo
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- CN111542215A CN111542215A CN201910172000.2A CN201910172000A CN111542215A CN 111542215 A CN111542215 A CN 111542215A CN 201910172000 A CN201910172000 A CN 201910172000A CN 111542215 A CN111542215 A CN 111542215A
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- module
- attaching
- tray
- printed circuit
- flexible printed
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
Abstract
The invention relates to a camera module attaching system and a camera module attaching method using the same. The system comprises: a module conveying part for conveying the first tray containing a plurality of modules in a certain advancing direction; an FPCB conveying section includes: an FPCB loading part for loading a second tray containing a plurality of FPCB substrates and an FPCB discharging part for discharging the second tray, and conveying the second tray at a position not crossed with the module conveying part; an ACF attaching part for attaching an ACF to the upper surface of the module; an FPCB attaching part for picking up the FPCB of the second tray and attaching the FPCB on the upper side of the ACF adhered to the module; a thermal hardening part for hardening ACF separated between the module and the FPCB by applying heat; and a control unit for controlling the plurality of structures; an ACF attaching part configured at the upper side of any one position of the module conveying part and attaching an ACF to the upper side of the module; the FPCB input part and the FPCB discharge part are arranged on the front surface of the system.
Description
Technical Field
The present invention relates to a system and a method for manufacturing a camera module, and more particularly, to a camera module attaching system and a camera module attaching method using the same, which improve arrangement reliability, as follows: the module is not attached to the module which is not properly accommodated in the tray in a different attaching structure.
Background
A general camera module is a general term for a component that converts an optical signal entering through a lens into an RGB electrical signal by an image sensor and displays the RGB electrical signal on a screen of a digital video device such as a mobile phone or a monitor. That is, a component necessary for taking and storing a picture in a mobile device such as a smartphone can sense the facial expression of a person and the movement of an object such as a manual operation to operate a digital device, and thus the application field thereof is expanded to an input device.
The camera module is generally constructed by attaching a connection PCB, a cemented lens assembly, and a Flexible Printed Circuit Board (FPCB) to a substrate that is separately cut from a wafer.
Korean registered patent publication No. 10-2008-0015257 describes a method of manufacturing a camera module. An ultra-thin type camera module can be manufactured by a method for manufacturing a camera module, the method comprising: a step of attaching an adhesive tape to one side of the substrate having the through-hole formed therein; mounting an imaging element on the substrate through-hole; a step of bonding the image pickup element and the substrate with a wire; a step of injecting a binder between the plurality of structures; and a step of assembling the shell by removing the adhesive tape.
However, when the camera module is manufactured by the method described in the above-mentioned conventional document, a step of checking the arrangement of the structures is not performed in the middle of the process, and thus there is a problem that the defective product generation rate may increase.
Prior art documents
Patent documents: korean laid-open patent publication No. 10-2008-0015257 "Camera Module and method for manufacturing the same"
Disclosure of Invention
Technical problem to be solved
The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a camera module attaching system and attaching method that minimize the defective product generation rate due to non-alignment when manufacturing a camera module.
Means for solving the problems
The system for manufacturing a camera module by attaching a flexible printed circuit board of the present invention includes: a module conveying part for conveying the first tray containing a plurality of modules in a certain advancing direction; a flexible printed circuit board conveying section including a flexible printed circuit board input section for inputting a second tray accommodating a plurality of flexible printed circuit boards, and a flexible printed circuit board discharge section for discharging a flexible printed circuit board discharge section of the second tray empty by completing the input of the flexible printed circuit board into the system, and conveying the second tray at a position not intersecting with the module conveying section; an Anisotropic Conductive Film (ACF) attaching part for attaching the ACF to the upper surface of the module accommodated in the first tray; a flexible printed circuit board attaching part picking up the flexible printed circuit board of the second tray and attaching the flexible printed circuit board on the upper side of the anisotropic conductive film adhered to the module; a thermal curing part for curing the anisotropic conductive film provided between the module and the flexible printed circuit board by applying heat thereto; and a control unit for controlling the plurality of structures; the anisotropic conductive film attaching part is arranged above any one place where the module conveying part is arranged, and the anisotropic conductive film is attached to the upper side of the module accommodated in the first tray; the flexible printed circuit board input part and the flexible printed circuit board discharge part are arranged in front of the system, and the input and discharge of the second tray are easy.
In addition, the anisotropic conductive film attachment portion further includes: a cutting part which is cut into a shape and a specification corresponding to the module; a first attaching part for attaching the anisotropic conductive film cut at the cutting part to the upper side of the module; a loading unit configured to supply an anisotropic conductive film to the cutting unit; and a first visual inspection unit for acquiring a photographed image of a lower position perpendicular to the first attachment unit and confirming whether the modules are correctly arranged.
The first visual detection unit receives an image preset for the module from the control unit, and when the image does not match the photographed module pattern, sends a signal to the control unit to stop the operation of the first sticking unit.
In addition, the flexible printed circuit board attaching part further includes: an adsorption conveying part for conveying the flexible printed circuit board accommodated in the second tray from the upper side of the module accommodated in the first tray conveyed by the module conveying part by vacuum adsorption; and a second vision detecting part for obtaining the shot image of the lower position vertical to the adsorption conveying part and confirming whether the modules adhered with the anisotropic conductive film are correctly arranged.
The suction transfer unit is provided with at least one suction port communicating with a vacuum pump for vacuum-sucking the upper part of the flexible printed circuit board.
The second visual detection unit receives an image preset for the module from the control unit, and transmits a signal to the control unit when the image does not match the captured image of the module.
The thermal curing unit is disposed on the upper rear side of a position where the flexible printed circuit board attaching unit is disposed along a path where the module conveying unit conveys the first tray; at least one heat cylinder is formed, and the heat cylinder descends from the upper side of the module attached with the anisotropic conductive film and the flexible printed circuit board to apply heat.
In addition, a pulse heating cable for transferring heat energy is combined with one side of the hot cylinder; the pulse heating cable transfers heat energy instantaneously after the flexible printed circuit board contacts the underside of the heat cylinder.
The heat cylinder does not descend when the first tray that is imaged by the first vision inspection unit or the second vision inspection unit and sends a signal to the control unit is disposed on the lower side.
In addition, a method of attaching a camera module using the camera module attaching system includes: a first tray loading step of loading a first tray, in which a plurality of modules are accommodated, into the system via the module transfer unit; a second tray loading step of loading a second tray containing a plurality of flexible printed circuit boards into the system via the flexible printed circuit board conveying section; an anisotropic conductive film attaching step of attaching an anisotropic conductive film to an upper side of a module accommodated in a first tray by an anisotropic conductive film attaching portion; a flexible printed circuit board attaching step of attaching the flexible printed circuit board to the upper side of the module to which the anisotropic conductive film is attached, the flexible printed circuit board being transported and accommodated in the second tray; a thermal curing step of thermally curing the components housed in the first tray by the thermal curing section; a first tray discharge step of discharging the first tray, which accommodates the component that has been attached, to the outside of the system; and a second tray discharging step of discharging the second tray, from which the flexible printed circuit board is dropped, to the outside of the system through the flexible printed circuit board conveying section.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, it is possible to minimize the occurrence of defective camera modules caused by the bonding between a plurality of structures that are not aligned with each other.
In addition, in the attaching process, the full automation can be realized regardless of the size or thickness of the camera module.
Drawings
Fig. 1 is an exemplary view showing a camera module attaching system for improving arrangement reliability according to the present invention.
Fig. 2 is an exemplary view showing the inside of a frame of the camera module attaching system for improving the arrangement reliability according to the present invention.
Fig. 3 is an exemplary view illustrating an FPCB conveying part according to the present invention.
Fig. 4 is an exemplary view illustrating an FPCB carrying portion and an FPCB attaching portion according to the present invention.
Fig. 5 is an exemplary view showing a plurality of structures arranged at an upper side of the module transfer part according to the present invention.
Fig. 6 is an exemplary view showing a heat-hardened portion according to the present invention.
Fig. 7 is an exemplary view showing an Anisotropic Conductive Film (ACF) attachment part according to the present invention.
Fig. 8 is an explanatory view showing a method of attaching a camera module by the attaching system of the present invention.
Wherein the reference numerals are as follows:
10: a camera module attachment system; 11: a frame; 100: a module conveying part; 110: a base; 200: a FPCB conveying section; 201: a vertical conveying section; 210: an FPCB input section; 220: an FPCB discharging section; 230: a FPCB waiting section; 300: an ACF attachment section; 310: a loading section; 320: a cutting section; 330: a first attaching portion; 400: an FPCB attaching portion; 410: a vacuum adsorption part; 500: a heat-hardened portion; 510: a hot cylinder; 511: the lower surface of the hot cylinder.
Detailed Description
The terms or words used in the present specification and claims should not be construed as limited to general or dictionary meanings, but interpreted as meanings and concepts conforming to the technical idea of the present invention on the basis of the principle that the inventor can appropriately define the concept of the terms in order to explain his invention in the most preferable way.
Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferable embodiments of the present invention, and do not represent the entire technical idea of the present invention, and it should be understood that various equivalents and modifications may be possible in place of them at the time of filing this application.
In the following, before the description with reference to the drawings, it is stated in advance that the gist of the present invention is emphasized, and unnecessary matters, that is, well-known structures that can be obviously added by those skilled in the art are not illustrated or specifically described.
Fig. 1 is an exemplary view showing a camera module attaching system 10 for improving arrangement reliability according to the present invention; fig. 2 is an exemplary view showing the inside of a frame of the camera module attaching system for improving the arrangement reliability according to the present invention. As shown in fig. 1, the system of the present invention may be configured such that the module transfer unit 100 penetrates into the system.
The module conveying unit 100 conveys the first tray on which the plurality of modules are accommodated in a fixed direction, and attaches the ACF and the FPCB to the upper side of the modules during the conveyance.
The controller 600 may be further provided outside the frame, and the controller 600 may be interlocked with a controller for controlling the operation of the plurality of components, and the plurality of components constituting the present invention may be selectively operated as a manager operates the controller.
As shown in fig. 2, the frame of the present invention may internally include a module transfer portion 100, an FPCB transfer portion 200, an ACF attachment portion 300, an FPCB attachment portion 400, and a heat curing portion 500.
The module conveying unit 100 feeds a first tray, in which a plurality of modules are accommodated, into the system, conveys the first tray in a predetermined direction, discharges the first tray, and conveys the first tray in a state in which the first tray is placed on the upper portion.
The FPCB conveying portion 200 may be conveyed in the same manner as the module conveying portion 100 conveys the first tray. That is, the second pallet containing the plurality of FPCBs is loaded into the system and transported, and then discharged to the outside of the system.
The ACF attachment unit 300 is configured to attach an ACF to an upper side of a module, and the module transfer unit 100 may be disposed at an upper side of any point of a path for transferring a first tray. The ACF of a shape and specification corresponding to the module is attached to the upper side of the module, and then a bonding force for FPCB attachment is imparted to the module.
The FPCB attachment portion 400 is configured to attach the FPCB accommodated in the second tray to the module to which the ACFs are attached, and may be disposed above a path where the module conveying portion 100 conveys the first tray, as in the ACF attachment portion 300. In addition, the module received in the first tray is attached with the ACF in a complete state, and the FPCB attachment portion 400 is disposed behind the ACF attachment portion 300 with reference to the advancing direction of the module transport portion 100.
The heat curing part 500 is a structure for curing the module having the ACF and the FPCB attached thereto by the plurality of attaching parts by applying heat and pressure, and may be disposed on an upper side of a path where the module conveying part 100 conveys the second tray, as in the plurality of attaching parts. The heat curing part 500 is disposed behind the FPCB bonding part 400 with reference to the advancing direction of the module transfer part 100, and is configured to apply heat and pressure only to the bonded modules.
Fig. 3 is an exemplary view illustrating the FPCB conveying portion 200 according to the present invention. As shown in fig. 3, the FPCB conveying part 200 may include: an FPCB input unit 210 and an FPCB discharge unit 220 formed on a lower side with respect to a base 110 supporting the module transfer unit 100 from below, and an FPCB waiting unit 230 formed on an upper side of the base 110.
The FPCB input unit 210 and the FPCB discharging unit 220 are formed in the front of the system, and when a plurality of FPCBs are received in the second tray discharged by the FPCB discharging unit 220 and then are loaded into the FPCB input unit 210, the work of the manager can be easily performed.
The FPCB waiting portion 230 is configured to wait for a predetermined time until the FPCB attaching portion 400 vacuum-adsorbs the FPCB, and the FPCB conveying portion 200 further includes a vertical conveying portion 201 between the upper side and the lower side of the base 110, and the vertical conveying portion 201 conveys the second tray.
That is, as the second tray is transferred between the FPCB input unit 210 and the FPCB discharge unit 220 formed at the lower side of the base 110 and the FPCB waiting unit 230 formed at the upper side of the base 110, the process from input to discharge of the second tray accommodating the FPCBs can be fully automated.
Fig. 4 is a view illustrating the FPCB carrying portion 200 and the FPCB sticking portion 400 according to the present invention. As shown in fig. 4, the FPCB sticking portion 400 may include an adsorption conveying portion 410, and the adsorption conveying portion 410 reciprocates between any one point on the upper side of the module conveying portion 100 and the FPCB waiting portion 230. The adsorption conveying part 410 is movable on three axes, and includes at least one adsorption port for vacuum-adsorbing the FPCB.
The suction port communicates with a vacuum pressure pump formed inside the suction conveying unit 410, and the vacuum pressure pump forms a vacuum pressure around the suction port according to a command of the control unit to suck the FPCB.
In addition, the FPCB sticking portion 400 forms a second vision inspection portion that obtains a photographed image of a lower point perpendicular to the suction conveying portion. Whether the ACF modules are correctly arranged can be confirmed based on the image shot by the second visual detection part.
The control part may suspend the operation of the FPCB attaching part 400 if the modules are not properly arranged. That is, in the process in which the module transfer part 100 continuously transfers the first pallet, the restart of the FPCB sticking part 400 transits to the next module due to the time difference.
Fig. 5 is an exemplary view illustrating a plurality of structures disposed at the upper side 100 of the module transferring part according to the present invention, and fig. 6 is an exemplary view illustrating the thermosetting part 500 according to the present invention. As shown in fig. 5, the ACF applying portion 300 and the heat curing portion 500 are disposed above the module conveying portion 100. The thermal curing unit 500 is required to perform curing work only on a module in which ACF and FPCB are attached to the upper side of the module accommodated in the first tray, and therefore should be disposed behind the plurality of attaching units with reference to the direction in which the module conveying unit 100 conveys the first tray.
As shown in fig. 6, the heat-cured portion 500 is formed with at least one heat cylinder 510, and the heat cylinder 510 is lowered from the upper side of the module accommodated in the first tray to apply heat. The embodiment of fig. 6 is an embodiment in which 4 heat cartridges 510 are formed in order to simultaneously perform hardening work for a plurality of modules.
The heat cylinder 510 transfers heat energy through a pulse heating cable combined to one side, the pulse heating cable being selectively operated by the control part.
That is, at the moment the FPCB contacts the lower surface 511 of the heat cylinder, the pulse heating cable transfers heat energy to the heat cylinder 510, and thus the attached structures are hardened each other.
Fig. 7 is an exemplary view showing an ACF attachment part 300 according to the present invention. As shown in fig. 7, the ACF attachment part 300 includes: a cutting part 320 cut into a shape and specification corresponding to the module; a first attaching part 330 for attaching the ACF cut by the cutting part 320 to the upper side of the module; a loading unit 310 configured to supply the ACF to the cutting unit; and a first visual inspection unit for acquiring a photographed image of a lower position perpendicular to the first attachment unit and confirming whether the modules are correctly arranged.
The cutting part 320 cuts the ACF supplied from the loading part 310 into a shape corresponding to the upper side of the module. The cut ACF is attached to the upper side of the module accommodated in the first tray by the vertical reciprocating movement of the first attaching part 330.
The first visual inspection part obtains a photographed image of the lower side of the first attachment part 330. Whether the modules accommodated in the first tray are correctly arranged can be confirmed based on the image shot by the first visual detection part.
If the modules are not arranged correctly, the control part can stop the action of the first attaching part 330. That is, in the above-described process, the module transfer part 100 continuously transfers the first tray, and the restart of the first attaching part 330 transits to the next module due to the time difference.
Fig. 8 is an exemplary view showing a camera module attaching method using the camera module attaching system of the present invention. First, a first pallet loading step S110 of loading a first pallet containing a plurality of modules into the system and a second pallet loading step S120 of loading a second pallet containing a plurality of FPCBs into the system are performed. The above-described process is performed in the module conveying portion 100 and the FPCB conveying portion 200, and the module conveying portion 100 conveys the first tray to the ACF applying portion 300.
If a first tray is disposed under the ACF attachment unit 300, the first vision inspection unit photographs the arrangement state of the modules. If no problem in arrangement is detected, an ACF attachment step S200 of attaching an ACF to the module upper side by the ACF attachment section 300 is performed.
The ACF-attached module is disposed under the FPCB attachment portion 400 by the module transfer portion 100. Then, the second vision inspection part photographs the arrangement state of the modules, and if the arrangement is correctly performed, the FPCB attaching step S300 of attaching the FPCB attached to the upper side of the ACF by vacuum-adsorbing the FPCB accommodated in the second tray by the FPCB attaching part 400 is performed.
The module assembly having the ACF and the FPCB attached thereto by the plurality of attachment portions is disposed under the heat curing portion 500 by the module conveying portion 100, and the heat curing step S400 of performing the curing process only for the module assembly in which all of the plurality of attachment processes are performed is performed.
Finally, ending all the processes with the first tray discharging step S510 and the second tray discharging step S520, the first tray discharging step S510 discharges the first tray accommodating all the module assemblies having completed all the attaching and thermosetting processes to the outside of the system; in the second tray discharging step S520, the second tray from which the plurality of FPCBs are separated is discharged to the outside of the system through the FPCB sticking portion 400.
The present invention has been described above centering on preferred embodiments thereof.
The embodiments described in the present specification and the configurations shown in the drawings relate to the most preferable one embodiment of the present invention, and do not represent the entire technical idea of the present invention, and it is understood that there may be various equivalents and modified examples that may replace them.
Therefore, the present invention is not limited to the embodiments disclosed, and those skilled in the art to which the present invention pertains can make various modifications and alterations within the scope and range of equivalents of the technical idea of the present invention and the technical idea described in the scope of claims described below.
Claims (10)
1. A camera module attaching system for improving arrangement reliability, attaching a flexible printed circuit board to manufacture a camera module, comprising:
a module conveying part (100) for conveying a first tray containing a plurality of modules in a certain advancing direction;
a flexible printed circuit board conveying part (200) which comprises a flexible printed circuit board input part (210) and a flexible printed circuit board discharge part (220), wherein the flexible printed circuit board input part (210) is used for inputting the flexible printed circuit board input part (210) of a second tray containing a plurality of flexible printed circuit boards, the flexible printed circuit board discharge part (220) is used for discharging the empty second tray which completes the input of the flexible printed circuit board into the system, and conveying the second tray at a position which does not cross the module conveying part;
an anisotropic conductive film attachment unit (300) for attaching an anisotropic conductive film to the upper surface of the module housed in the first tray;
a flexible printed circuit board attaching part (400) for picking up the flexible printed circuit board of the second tray and attaching the flexible printed circuit board on the upper side of the anisotropic conductive film adhered to the module;
a thermal curing unit (500) that cures an anisotropic conductive film provided between the module and the flexible printed circuit board by applying heat thereto; and
a control unit (600) that controls the plurality of structures;
the anisotropic conductive film attaching part (300) is arranged above any place where the module conveying part (100) is arranged, and the anisotropic conductive film is attached to the upper side of the module accommodated in the first tray;
the flexible printed circuit board input part (210) and the flexible printed circuit board discharge part (220) are arranged in front of the system, and the input and discharge of the second tray are easy.
2. The camera module attaching system for improving arrangement reliability according to claim 1,
the anisotropic conductive film attachment part (300) further includes:
a cutting part (310) which is cut into a shape and a specification corresponding to the module; a first attaching part (320) for attaching the anisotropic conductive film cut at the cutting part to the upper side of the module; a loading unit (330) for supplying the anisotropic conductive film to the cutting unit; and a first vision inspection unit for acquiring a photographed image of a lower position perpendicular to the first attaching unit (320) and confirming whether the modules are correctly arranged.
3. The camera module attaching system for improving arrangement reliability according to claim 2,
the first visual detection part receives an image preset for the module from the control part;
when the pattern does not match the photographed module pattern, a signal is sent to the control unit to stop the operation of the first sticking unit (320).
4. The camera module attaching system for improving arrangement reliability according to claim 1,
the flexible printed circuit board attaching part (400) further includes:
a suction conveying part (410) for conveying the flexible printed circuit board accommodated in the second tray by vacuum suction from the upper side of the module accommodated in the first tray conveyed by the module conveying part; and a second vision inspection unit for obtaining a photographed image of a lower portion perpendicular to the suction conveying unit and confirming whether or not the modules having the anisotropic conductive film attached thereto are aligned correctly.
5. The camera module attaching system for improving arrangement reliability according to claim 4,
the adsorption conveying part is provided with at least one adsorption port which is communicated with a vacuum pressure pump and used for vacuum adsorption of the upper part of the flexible printed circuit board.
6. The camera module attaching system for improving arrangement reliability according to claim 4,
the second visual detection unit receives an image preset for the module from the control unit, and transmits a signal to the control unit when the image does not match the captured image of the module.
7. The camera module attaching system for improving arrangement reliability according to claim 1,
the thermal curing part (500) is arranged on the upper rear side of the position where the flexible printed circuit board attaching part (400) is arranged along the path of the module conveying part (100) for conveying the first tray;
at least one heat cylinder (510) is formed, and the heat cylinder descends from the upper side of the module attached with the anisotropic conductive film and the flexible printed circuit board to apply heat.
8. The camera module attaching system for improving arrangement reliability of claim 7,
the heat cylinder (510) is combined with a pulse heating cable for transferring heat energy at one side;
the pulse heating cable instantly transfers thermal energy after the flexible printed circuit board contacts the underside of the heat cylinder (510).
9. The camera module attaching system for improving arrangement reliability of claim 7,
the heat cylinder (510) does not descend when the first tray that is imaged by the first visual detection unit or the second visual detection unit and sends a signal to the control unit is disposed on the lower side.
10. A method of attaching a camera module using the camera module attaching system according to any one of claims 1 to 9, comprising:
a first tray loading step (S110) for loading a first tray, in which a plurality of modules are accommodated, into the system via the module transfer unit;
a second tray loading step (S120) for loading a second tray containing a plurality of flexible printed circuit boards into the system by the flexible printed circuit board conveying part (200);
an anisotropic conductive film attaching step (S200) in which an anisotropic conductive film is attached to the upper side of the module housed in the first tray by the anisotropic conductive film attaching section (300);
a flexible printed circuit board attaching step (S300) of transporting the flexible printed circuit board accommodated in the second tray by the flexible printed circuit board attaching portion (400) and attaching the flexible printed circuit board to the upper side of the module to which the anisotropic conductive film is attached;
a thermal curing step (S400) in which the thermal curing section (500) thermally cures the components housed in the first tray;
a first tray discharge step (S510) of discharging the first tray, which accommodates the component to which the attachment is completed, to the outside of the system; and
and a second tray discharging step (S520) of discharging the second tray, from which the flexible printed circuit board is dropped, to the outside of the system through the flexible printed circuit board conveying part.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2019-0014301 | 2019-02-07 | ||
| KR1020190014301A KR102229686B1 (en) | 2019-02-07 | 2019-02-07 | Camera module attaching system with improved alignment reliability and an attaching method using the system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111542215A true CN111542215A (en) | 2020-08-14 |
| CN111542215B CN111542215B (en) | 2021-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910172000.2A Active CN111542215B (en) | 2019-02-07 | 2019-03-07 | Camera module attaching system and method for improving arrangement reliability |
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| Country | Link |
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| KR (1) | KR102229686B1 (en) |
| CN (1) | CN111542215B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102466154B1 (en) * | 2021-03-25 | 2022-11-14 | 넥스타테크놀로지 주식회사 | Apparatus for manufacturing printed circuit board |
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|---|---|---|---|---|
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| KR20100018252A (en) * | 2008-08-06 | 2010-02-17 | (주)에이에스티 | Bonding apparatus |
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| KR101070918B1 (en) | 2006-08-14 | 2011-10-06 | 삼성테크윈 주식회사 | Camera module and method of manufacturing the same |
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| CN101779530A (en) * | 2008-07-25 | 2010-07-14 | 松下电器产业株式会社 | Component mounting device and method |
| KR20100018252A (en) * | 2008-08-06 | 2010-02-17 | (주)에이에스티 | Bonding apparatus |
| KR20100083008A (en) * | 2009-01-12 | 2010-07-21 | 주식회사 티케이씨 | Auto racking apparatus for printed circuit board |
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| Publication number | Publication date |
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| KR20200097047A (en) | 2020-08-18 |
| KR102229686B1 (en) | 2021-03-19 |
| CN111542215B (en) | 2021-06-08 |
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