CN111527798A - 内埋式电路板及其制作方法 - Google Patents

内埋式电路板及其制作方法 Download PDF

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Publication number
CN111527798A
CN111527798A CN201880024758.5A CN201880024758A CN111527798A CN 111527798 A CN111527798 A CN 111527798A CN 201880024758 A CN201880024758 A CN 201880024758A CN 111527798 A CN111527798 A CN 111527798A
Authority
CN
China
Prior art keywords
circuit board
layer
embedded
sides
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201880024758.5A
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English (en)
Inventor
李彪
钟浩文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
Original Assignee
Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avary Holding Shenzhen Co Ltd, Qing Ding Precision Electronics Huaian Co Ltd filed Critical Avary Holding Shenzhen Co Ltd
Publication of CN111527798A publication Critical patent/CN111527798A/zh
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

本发明提供一种内埋式电路板的制作方法，包括：提供内层叠构(10)，其为双面线路板；提供第三线路板(103)和第四线路板(104)，并将其分别压合至内层叠构(10)的两侧；在上一步骤得到的结构上开设两个间隔的穿孔(30)；电镀第三线路板(103)和第四线路板(104)的外侧面以及穿孔(30)的内侧面，以形成第一电镀层(50)；去掉两个穿孔(30)之间的结构以形成以两个穿孔(30)为两端的槽孔(40)；将电子元件(200)收容并固定于槽孔(40)的中间部分，以使电子元件(200)的电极(201)分别朝向槽孔(40)的两端并电连接第一电镀层(50)；提供第一线路板(101)和第二线路板(102)，并将其分别压合至上一步骤得到的结构的两侧以埋设电子元件(200)；对上一步骤得到的结构进行表面处理以得到内埋式电路板(100)。本发明还提供一种由上述制作方法制作的内埋式电路板(100)。

Description

PCT国内申请，说明书已公开。

Claims (11)

  1. PCT国内申请，权利要求书已公开。
CN201880024758.5A 2018-10-12 2018-10-12 内埋式电路板及其制作方法 Withdrawn CN111527798A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/110153 WO2020073344A1 (zh) 2018-10-12 2018-10-12 内埋式电路板及其制作方法

Publications (1)

Publication Number Publication Date
CN111527798A true CN111527798A (zh) 2020-08-11

Family

ID=70160719

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880024758.5A Withdrawn CN111527798A (zh) 2018-10-12 2018-10-12 内埋式电路板及其制作方法

Country Status (4)

Country Link
US (1) US20200120805A1 (zh)
CN (1) CN111527798A (zh)
TW (1) TWI698158B (zh)
WO (1) WO2020073344A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115484754A (zh) * 2021-06-16 2022-12-16 宏启胜精密电子(秦皇岛)有限公司 具有内埋元件的线路板及其制作方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112770495B (zh) * 2019-10-21 2022-05-27 宏启胜精密电子(秦皇岛)有限公司 全向内埋模组及制作方法、封装结构及制作方法
WO2022000191A1 (zh) * 2020-06-29 2022-01-06 庆鼎精密电子（淮安）有限公司 内埋式电路板及其制作方法
CN116158200A (zh) * 2021-06-17 2023-05-23 庆鼎精密电子（淮安）有限公司 电路板组件及电路板组件的制作方法
CN115474353A (zh) * 2022-08-29 2022-12-13 福立旺精密机电（中国）股份有限公司 一种高频混压板的粘合工艺

Family Cites Families (11)

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KR100573999B1 (ko) * 2001-03-23 2006-04-25 가부시끼가이샤 후지꾸라 다층 배선판, 다층 배선판용 기재 및 그 제조 방법
WO2004034759A1 (ja) * 2002-10-08 2004-04-22 Dai Nippon Printing Co., Ltd. 部品内蔵配線板、部品内蔵配線板の製造方法
US6916994B2 (en) * 2003-05-14 2005-07-12 Visteon Global Technologies, Inc. Conformal sealing film
TWI305479B (en) * 2006-02-13 2009-01-11 Advanced Semiconductor Eng Method of fabricating substrate with embedded component therein
KR101154739B1 (ko) * 2010-09-10 2012-06-08 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
JP2013038374A (ja) * 2011-01-20 2013-02-21 Ibiden Co Ltd 配線板及びその製造方法
CN202206659U (zh) * 2011-09-22 2012-04-25 温州银河电子有限公司 内埋元件的双层线路板
US20130258623A1 (en) * 2012-03-29 2013-10-03 Unimicron Technology Corporation Package structure having embedded electronic element and fabrication method thereof
KR101483825B1 (ko) * 2012-12-04 2015-01-16 삼성전기주식회사 전자부품 내장기판 및 그 제조방법
CN105530765A (zh) * 2014-09-29 2016-04-27 富葵精密组件(深圳)有限公司 具有内埋元件的电路板及其制作方法
CN108617089B (zh) * 2016-12-10 2020-12-22 宏启胜精密电子(秦皇岛)有限公司 内埋元件柔性电路板及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115484754A (zh) * 2021-06-16 2022-12-16 宏启胜精密电子(秦皇岛)有限公司 具有内埋元件的线路板及其制作方法

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Publication number Publication date
TWI698158B (zh) 2020-07-01
US20200120805A1 (en) 2020-04-16
WO2020073344A1 (zh) 2020-04-16
TW202015497A (zh) 2020-04-16

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Application publication date: 20200811

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