CN111448650B - 集成电路装置和电子设备 - Google Patents

集成电路装置和电子设备 Download PDF

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Publication number
CN111448650B
CN111448650B CN201880064882.4A CN201880064882A CN111448650B CN 111448650 B CN111448650 B CN 111448650B CN 201880064882 A CN201880064882 A CN 201880064882A CN 111448650 B CN111448650 B CN 111448650B
Authority
CN
China
Prior art keywords
protruding
pattern
flexible film
chip
wirings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201880064882.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN111448650A (zh
Inventor
冈村和浩
大久保刚
中込祐一
濑纳刚史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Synaptics Inc
Original Assignee
Synaptics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Synaptics Inc filed Critical Synaptics Inc
Priority claimed from PCT/JP2018/036904 external-priority patent/WO2019069935A1/ja
Publication of CN111448650A publication Critical patent/CN111448650A/zh
Application granted granted Critical
Publication of CN111448650B publication Critical patent/CN111448650B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN201880064882.4A 2017-10-06 2018-10-02 集成电路装置和电子设备 Active CN111448650B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2017-195938 2017-10-06
JP2017195938 2017-10-06
JP2018010029A JP7108415B2 (ja) 2017-10-06 2018-01-24 集積回路装置及び電子機器
JP2018-010029 2018-01-24
PCT/JP2018/036904 WO2019069935A1 (ja) 2017-10-06 2018-10-02 集積回路装置及び電子機器

Publications (2)

Publication Number Publication Date
CN111448650A CN111448650A (zh) 2020-07-24
CN111448650B true CN111448650B (zh) 2024-11-12

Family

ID=66440735

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880064882.4A Active CN111448650B (zh) 2017-10-06 2018-10-02 集成电路装置和电子设备

Country Status (3)

Country Link
US (1) US11171111B2 (https=)
JP (1) JP7108415B2 (https=)
CN (1) CN111448650B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102901103B1 (ko) 2020-03-04 2025-12-17 삼성디스플레이 주식회사 표시 장치
WO2022097340A1 (ja) 2020-11-06 2022-05-12 株式会社ワコム センサ
GB2644158A (en) * 2024-08-27 2026-03-25 Pragmatic Semiconductor Ltd Integrated circuit chip

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330682A (ja) * 1995-05-30 1996-12-13 Sharp Corp 半導体部品実装型フレキシブルプリント基板
CN101118327A (zh) * 2006-07-31 2008-02-06 三星电子株式会社 多层柔性膜封装和包括其的液晶显示装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58105165U (ja) * 1982-01-09 1983-07-18 キヤノン株式会社 フレキシブルプリント板
JPS62269399A (ja) * 1986-05-19 1987-11-21 松下電器産業株式会社 シ−ルド装置
JPH04263495A (ja) * 1991-02-18 1992-09-18 Ibiden Co Ltd フレキシブル配線板
JP3550253B2 (ja) * 1996-07-23 2004-08-04 株式会社東芝 電子機器
JP3426140B2 (ja) 1998-08-27 2003-07-14 シャープ株式会社 テープキャリアパッケージ
JP3874059B2 (ja) 2000-06-14 2007-01-31 セイコーエプソン株式会社 半導体装置の製造方法
JP4640819B2 (ja) 2005-12-02 2011-03-02 日東電工株式会社 配線回路基板
US7777329B2 (en) * 2006-07-27 2010-08-17 International Business Machines Corporation Heatsink apparatus for applying a specified compressive force to an integrated circuit device
JP2008091797A (ja) 2006-10-04 2008-04-17 Olympus Corp フレキシブル基板の接合装置
JP2008159873A (ja) 2006-12-25 2008-07-10 Epson Imaging Devices Corp フレキシブルプリント配線基板およびその製造方法、電気光学装置および電子機器
TWI337402B (en) * 2007-01-03 2011-02-11 Chipmos Technologies Inc Semiconductor packaging substrate improving capability of electrostatic dissipation
US9953952B2 (en) * 2008-08-20 2018-04-24 Infineon Technologies Ag Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330682A (ja) * 1995-05-30 1996-12-13 Sharp Corp 半導体部品実装型フレキシブルプリント基板
CN101118327A (zh) * 2006-07-31 2008-02-06 三星电子株式会社 多层柔性膜封装和包括其的液晶显示装置

Also Published As

Publication number Publication date
JP7108415B2 (ja) 2022-07-28
CN111448650A (zh) 2020-07-24
JP2019071401A (ja) 2019-05-09
US20200279828A1 (en) 2020-09-03
US11171111B2 (en) 2021-11-09

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