CN111441073A - Plating cavity capable of improving uniformity of Ni-SiC composite plating layer on inner wall of hollow part - Google Patents
Plating cavity capable of improving uniformity of Ni-SiC composite plating layer on inner wall of hollow part Download PDFInfo
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- CN111441073A CN111441073A CN202010393813.7A CN202010393813A CN111441073A CN 111441073 A CN111441073 A CN 111441073A CN 202010393813 A CN202010393813 A CN 202010393813A CN 111441073 A CN111441073 A CN 111441073A
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
Abstract
A plating chamber capable of improving the uniformity of a Ni-SiC composite coating on the inner wall of a hollow part is characterized in that an electroplating anode is arranged on the upper surface of a plating chamber base, and the lower end of the electroplating anode is embedded into an anode tank on the upper surface of the plating chamber base. The electroplating cathode is sleeved on the electroplating anode, the lower end of the electroplating cathode is embedded into the cathode groove on the upper surface of the plating cavity base, and the plating cavity top cover is supported by the electroplating cathode and the electroplating anode. The invention realizes the plating of the Ni-SiC composite plating layer under the sealing condition, can effectively improve the uniformity of the flowing state of the Ni-SiC composite plating solution in the plating cavity and the dispersion degree and uniformity of SiC particles, and further effectively improves the integrity and uniformity of the Ni-SiC composite plating layer prepared on the inner surface of the hollow workpiece.
Description
Technical Field
The invention relates to the field of metal materials, in particular to a plating cavity capable of improving the uniformity of a Ni-SiC composite plating layer on the inner wall of a hollow part.
Background
At present, when electroplating is carried out in the field of domestic engineering machinery, a traditional immersion type production process is generally used, and the process technology has the problems of low utilization rate of particles, uneven distribution in a coating, high sealing requirement and the like when composite electroplating is carried out besides the adverse effects on the service life of a plating solution and the safety and health of related workers caused by an open type production mode. Therefore, designing a new electroplating device, updating and optimizing the traditional electroplating production process, and realizing green, environment-friendly, energy-saving and efficient production is a necessary trend of the development of the electroplating technology.
The method comprises the steps of outputting electroplating solution from a liquid storage tank under the action of a circulating pump, electroplating a plating cavity with a cathode and an anode, and finally returning the electroplating solution to the liquid storage tank, wherein the electroplating process is realized in the plating cavity, the whole process is carried out in a closed environment, the defect of waste acid mist discharge in an open production process is effectively overcome, meanwhile, the control on the deposition rate of a composite coating and the quantity of reinforced particles can be realized by changing the cathode current density and the circulating flow rate of the electroplating solution, in addition, when the circulating plating solution method is used, additional sealing treatment on a non-working surface is not needed, the dispersion effect of the reinforced particles is good, the deposition quantity is high, the deposition speed is high, and the control is easy.
Patents JPA1999350195U and US5647967 all set up the inlet outlet in the device bottom anchor clamps under the electroplating chamber, and the reservoir can be flowed back to the plating bath under the action of gravity need not auxiliary device such as plus water pump, but when the plating bath flow is lower, the plating bath is difficult to be full of the chamber of plating, can lead to work piece upper portion to leak and plate, and simultaneously, second phase reinforcing particle easily takes place the reunion under the low velocity of flow, appears in the messenger plating layer that second phase particle reunion tissue etc. is unfavorable to the plating layer quality.
The patent Z L201610828514.5 and the patent 201610810698.2 are novel environment-friendly Ni-SiC composite plating devices based on plating solution circulation, which are applied by northwest industrial university, the preparation of the Ni-SiC composite plating layer on the inner surface of the hollow workpiece under a closed condition can be realized, but the design of a sealed plating cavity is not perfect, the leakage fault of the plating solution can occur in the Ni-SiC plating process, and meanwhile, the flowing state of the plating solution in the plating cavity is not uniform enough due to the reason of the plating cavity, so that the macro integrity uniformity and the micro uniformity of the prepared Ni-SiC composite plating layer are further improved.
Disclosure of Invention
In order to solve the problems of liquid leakage caused by the design defect of a sealed plating cavity and insufficient macroscopic integrity and macroscopic and microscopic uniformity of the prepared Ni-SiC composite plating layer in the prior art, the invention provides a plating cavity capable of improving the uniformity of the Ni-SiC composite plating layer on the inner wall of a hollow part.
The invention comprises a plating chamber top cover, an electroplating cathode, a plating chamber base, an anode conducting rod, a locking clamp and an electroplating anode. Wherein, the electroplating anode is arranged on the upper surface of the plating cavity base, and the lower end of the electroplating anode is embedded into the anode tank on the upper surface of the plating cavity base. The electroplating cathode is sleeved on the electroplating anode, and the lower end of the electroplating cathode is embedded into the cathode groove on the upper surface of the plating cavity base. The plating chamber top cover is placed on the upper end surfaces of an electroplating cathode and an electroplating anode which are sleeved together, the upper end of the electroplating anode is embedded into an anode tank on the lower surface of the plating chamber top cover, and the upper end of the electroplating cathode is embedded into a cathode tank on the lower surface of the plating chamber top cover; the plating chamber top cover is supported by the plating cathode and the plating anode. The plating cavity top cover, the electroplating cathode, the plating cavity base, the anode conducting rod and the electroplating anode are coaxial.
And sealing ring notches are respectively arranged between the lower surface of the plating cavity top cover and the upper end surface of the electroplating cathode and between the lower surface of the plating cavity top cover and the upper end surface of the electroplating anode, and between the upper end surface of the plating cavity base and the lower end surface of the electroplating cathode, and are used for placing sealing rings.
Two plating cavity water outlets are distributed on the plating cavity top cover; a plating cavity water inlet is formed in the center of the plating cavity base; plating solution enters the plating cavity from the water inlet of the plating cavity and flows out from the water outlet of the plating cavity and flows back to the liquid storage tank, and a flow path which enters from bottom to top and exits is formed in the plating cavity.
The distance between the inner surface of the plating cathode and the outer surface of the plating anode was 26.5 mm. The lower end of the anode conducting rod penetrates through an anode conducting rod mounting hole in the center of the plating cavity top cover to be in threaded connection with the electroplating anode.
Three groups of locking clamps are uniformly distributed on the outer circumference of the plating cavity; the lock clamp is composed of a lock clamp hanging lug and a lock clamp lock catch, and the lock clamp hanging lugs are fixed on the outer circumference of the plating cavity base through bolts. And each locking clamp is fixed on the outer circumference of the plating cavity top cover through a bolt. The lock clamp hanging lug is matched with the lock clamp lock catch for use.
And reinforced steel rings made of stainless steel materials are sleeved on the outer circumferential surfaces of the plating cavity top cover and the plating cavity base.
An anode conducting rod mounting hole is formed in the center of the plating cavity top cover, two plating cavity water outlets are symmetrically distributed on two sides of the anode conducting rod mounting hole, and the positions of the plating cavity water outlets are located between the inner surface of the electroplating cathode and the outer surface of the electroplating anode after assembly; a step-shaped groove is formed in the lower surface of the top cover of the plating cavity; in the ladder-shaped groove: the small-diameter groove positioned at the lowermost layer is an anode groove embedded with the electroplating anode; an anode sealing ring groove is arranged on the bottom surface of the anode groove close to the mounting hole of the anode conducting rod; the groove with the largest diameter positioned on the uppermost layer is a cathode groove embedded with the electroplating cathode; the bottom surface of the cathode groove is provided with a cathode upper sealing ring groove close to the groove wall.
A through plating cavity water inlet is formed in the center of the plating cavity base; the upper surface of the plating cavity base is provided with a step-shaped groove, wherein the small-diameter groove positioned at the lowest layer in the step-shaped groove is an anode groove embedded with the electroplating anode; the groove with the largest diameter at the uppermost layer in the three-stage stepped grooves is a cathode groove embedded with the electroplating cathode, and a lower cathode sealing ring groove is arranged at the bottom surface of the cathode groove close to the groove wall.
The invention mainly comprises a plating cavity top cover, a plating cavity base, an electroplating cathode and an electroplating anode, wherein the plating cavity base is fixed on an operation table of an electroplating device through bolts, the anode is connected with an external direct current power supply through a conducting rod, the plating cavity top cover and the plating cavity base are both provided with openings and are connected with a circulating pipeline, and when a pendant is fastened, an upper clamp, a lower clamp and the electroplating cathode and the electroplating anode form a sealed plating cavity. When the device works, the circulating plating solution is filled in the plating cavity through the water inlet at the bottom of the plating cavity, and the preparation of the Ni-SiC composite plating layer is realized. And after the preparation is finished, the plating solution returns to the liquid storage tank from a water outlet at the top of the plating cavity for circulation.
In the plating cavity, because the pH value of the Ni-SiC composite plating solution is 4.0 +/-0.1 and the Ni-SiC composite plating solution has stronger corrosivity, polytetrafluoroethylene is selected as the materials of the plating cavity top cover and the plating cavity base, and the plating cavity top cover, the plating cavity base, the plating anode and the plating cathode are coaxial and sequentially comprise the plating cavity base, the plating cathode, the plating anode and the plating cavity top cover from bottom to top, wherein the anode is positioned in the structure and is opposite to the plating cathode.
In the plating cavity, a top cover and a base of the plating cavity are provided with an inner layer of circular groove and an outer layer of circular groove which are coaxial, wherein the diameter of the inner groove is equivalent to the outer diameter of an electroplating anode, the geometric center of the inner groove of the top cover of the plating cavity is provided with an opening, the opening can fix a conductive rod and ensure the electrical connection stability of the conductive rod and the anode, and the geometric center of the inner groove of the base of the plating cavity is also provided with an opening which is communicated with a plating solution circulating pipeline and used as a plating solution water inlet of the plating; the diameter of the outer groove is equal to the outer diameter of the electroplating cathode, two symmetrically distributed openings are arranged between the inner groove and the outer groove of the top cover of the plating cavity, the openings are communicated with the pipeline and are water outlets of the plating cavity, and therefore the flow path of the plating solution in the plating cavity is from bottom to top, namely from bottom to top.
According to the invention, the sealing ring arranged on the top cover of the plating cavity and the sealing ring arranged on the base of the plating cavity respectively ensure that the anode rod and the screw hole at the top of the anode are isolated from the plating solution during operation, so that the disconnection of an electroplating loop caused by dissolution of chemical or electrochemical factors is avoided.
According to the invention, the locking clamps are adopted for fastening and sealing, the three groups of locking clamps are distributed at equal intervals, the locking clamp sealing has the characteristics of rapidness, convenience, easy adjustment and good fastening effect, and compared with a fastening mode of directly adopting bolts for pressing, the working efficiency can be effectively improved.
In the invention, the outer sides of the plating cavity base and the plating cavity top cover are respectively provided with a fastening steel ring, the three groups of locking clamps are connected and fixed with the steel rings and the plating cavity base body through bolts, and the screw holes are processed by synchronously tapping the steel rings, the plating cavity base and the top cover so as to ensure the fixing effect of the locking clamps.
The invention relates to a plating cavity in circulating electroplating equipment for improving a Ni-SiC composite plating layer on the inner surface of a hollow workpiece, which can effectively improve the integrity and macro/micro uniformity of the Ni-SiC composite plating layer on the inner wall of the hollow workpiece, in particular the distribution uniformity of SiC particles in the composite plating layer.
The plating chamber can effectively improve the integrity and macro/micro uniformity of the Ni-SiC composite plating layer on the inner wall of the hollow part and the distribution uniformity of SiC particles, and the design principle is as follows:
1. in the plating cavity, the flow path of the Ni-SiC composite plating solution flows in from the bottom of the plating cavity and flows out from the top of the plating cavity, so that the plating cavity can be fully filled with the composite plating solution, namely, the cathode to be plated is fully submerged by the composite plating solution in the preparation process of the Ni-SiC composite plating layer, and the macroscopic integrity of the Ni-SiC composite plating layer on the inner surface of the hollow workpiece to be plated is guaranteed. In contrast, when the flow mode of the plating solution with the lower inlet and the lower outlet and the upper inlet and the lower outlet is adopted, if the flow rate of the composite plating solution is low, the plating solution cannot fill the plating cavity, so that the upper end of the workpiece to be plated is subjected to plating leakage.
2. In the plating cavity, the flow path of the Ni-SiC composite plating solution flows in from the bottom of the plating cavity and flows out from the top of the plating cavity, so that the dispersion uniformity of SiC particles in the plating solution can be effectively improved, and the distribution uniformity of the SiC particles in the Ni-SiC composite plating layer is further improved. Since the SiC particle density was 3.2g/cm3And is much higher than the density of the composite plating solution, so that SiC particles can be settled in the plating solution. Although the flowing modes of the plating solution in different paths in the plating cavity, such as the lower inlet and the lower outlet of which the water inlet and the water outlet are arranged at the bottom of the plating cavity, the upper inlet and the upper outlet of which the water inlet and the water outlet are arranged at the top of the plating cavity, the upper inlet and the lower outlet of which the water inlet and the water outlet are arranged at the top of the plating cavity, the lower inlet and the upper outlet of which the water outlet is arranged at the bottom of the plating cavity, the lower inlet and the upper outlet and the like, can play a role in stirring the SiC particles by the flowing plating solution, and weaken the sedimentation of the SiC particles under the action of gravity to a certain extent, the flowing mode of the lower inlet and the upper outlet selected by the invention can ensure that the plating solution is filled in the plating. In contrast, although the flow mode of the plating solution from the upper part to the upper part can also fully ensure that the plating solution is filled in the whole plating cavity, due to the action of gravity, SiC particles can be seriously settled, so that the concentration of the SiC particles at the lower end of the plating cavity is higher than that at the upper part of the plating cavity, and even serious SiC particle agglomeration occurs at the bottom end of the plating cavity, so that the SiC particles of the prepared Ni-SiC composite plating layer are unevenly distributed and are in gradient distribution from top to bottom along the plating cavity, the concentration of the SiC particles at the upper end is low, and the concentration of the SiC particles at the.
3. In the plating cavity, a plating solution water inlet is positioned in the center of the bottom of the plating cavity, and water outlets are symmetrically distributed on two sides of the top of the plating cavity. The design can effectively improve the flowing uniformity of the Ni-SiC composite plating solution in the plating cavity, namely, the plating solution states of all areas in the plating cavity are similar without overlarge difference, thereby ensuring the distribution uniformity of SiC particles in the plating cavity and further effectively improving the macro/micro uniformity of the prepared plating layer and the distribution uniformity of the SiC particles in the plating layer. On one hand, the water inlet of the plating cavity is positioned at the central position of the bottom, the Ni-SiC composite plating solution does not directly end with a cathode to be plated after entering the plating cavity, but collides with the inner wall of the anode firstly and then passes through the anode wall slot to contact with the cathode to realize the plating of the Ni-SiC composite plating layer, so that the phenomena that the plating layer surface is scratched and SiC particles are difficult to deposit into the plating layer due to the strong scouring action of the high-speed flowing plating solution on the cathode can be effectively avoided; on the other hand, the water inlet and the water outlet are not aligned, so that a negative pressure region in which the plating solution flows rapidly is effectively prevented from being formed in the region aligned with the water inlet and the water outlet in the electroplating process, and experiments show that the plating solution in the negative pressure region has a higher flow speed and a higher chaos degree than those in the peripheral region, has a strong scouring effect on the cathode surface, is far away from the negative pressure region, has a low flow speed and a low chaos degree, and the cathode bears a weaker scouring effect on the plating solution, so that SiC particles in different regions are unevenly distributed, adsorbed on the cathode surface and subjected to codeposition with different difficulties, and finally the appearance of the Ni-SiC composite plating layer and the.
FIG. 5 shows the macro/micro morphology of the Ni-SiC composite plating layer produced on the inner surface of the hollow workpiece by using the design of the water inlets at the two sides of the bottom of the plating chamber and the downward and upward paths of the composite plating solution. The visible coating is obviously bright and dark, wherein the bright area is close to the water inlet, the metal luster of the coating in the area is strong, and the content of SiC particles is low; the dark area is far away from the water inlet, the metal luster in the area is weak, and the SiC content is high. This is because when the bottom double-side water inlet design is adopted, the flow state of the plating solution inside the plating cavity is not uniform: the water inlet is opposite to the area, the flow rate of the plating solution is high, and the washing effect on the surface of the cathode is strong, so that the SiC particle deposition difficulty in the area is high, the SiC content in the coating is low, and the color of the coating is bright; and vice versa away from the water inlet area.
FIG. 6 shows that when the inlet and outlet are set at the bottom of the plating chamber, i.e. the inlet and outlet paths under the composite plating solution are designed, the macroscopic morphology of the Ni-SiC composite plating layer is produced on the inner surface of the hollow workpiece, the upper part of the workpiece can be seen to be plated, and when the circulation flow of the Ni-SiC composite plating solution is high, a complete plating layer can be produced, but the SiC content of the obtained plating layer is low or even no SiC is produced, and in addition, when the flow path design of the plating solution from the top to the bottom is adopted, the macroscopic morphology of the produced Ni-SiC composite plating layer is.
The macroscopic morphology of the Ni-SiC composite plating layer prepared on the inner surface of the hollow workpiece by using the method is shown in FIG. 7, so that the visible plating layer is uniform and complete and has no defects of plating leakage, scratching, bubbling and scorching and the like in a macroscopic view; under the microscopic condition, SiC particles are uniformly distributed in the nickel-based metal, and no defects such as visible nodule tissues, microscopic cracks and the like exist. FIG. 8 shows that the SiC content and hardness distribution of the prepared Ni-SiC composite coating are measured in random selected areas, and the coating components and performance have higher uniformity and consistency.
Therefore, the invention can realize the plating of the Ni-SiC composite plating layer in a sealed environment, and can effectively improve the uniformity of the flowing state of the Ni-SiC composite plating solution in the plating cavity and the dispersion degree and uniformity of SiC particles, thereby effectively improving the integrity and uniformity of the Ni-SiC composite plating layer prepared on the inner surface of the hollow workpiece.
Drawings
Figure 1 is a schematic structural view of the present invention,
fig. 2 is a top view of fig. 1.
Fig. 3 is a cross-sectional view of fig. 1.
FIG. 4 is a schematic structural view of a plating chamber top cover; fig. 4a is a front view, and fig. 4b is a plan view of fig. 4 a.
FIG. 5 is a schematic structural view of a plating chamber base; fig. 5a is a front view, and fig. 5b is a plan view of fig. 5 a.
FIG. 6 shows the macro-micro surface of the Ni-SiC composite coating produced on the inner wall of the hollow workpiece by adopting the design of double-side water inlet at the bottom of the plating chamber and water outlet at the top of the plating chamber; wherein, FIG. 6a shows the macroscopic surface of the prepared Ni-SiC composite coating, FIG. 6b shows the microscopic surface topography of the dark region in FIG. 6a, and FIG. 6c shows the microscopic surface topography of the light region in FIG. 6 a.
FIG. 7 shows the macroscopic morphology of the Ni-SiC composite coating on the inner surface of the hollow workpiece obtained by the invention.
FIG. 8 shows the macro-micro morphology of the Ni-SiC composite coating on the inner surface of the hollow workpiece obtained by the present invention; wherein, FIG. 8a shows the macroscopic surface of the prepared Ni-SiC composite coating, and FIG. 8b shows the microscopic morphology of the prepared Ni-SiC composite coating.
FIG. 9 shows the coating thickness, SiC particle content and hardness distribution of the Ni-SiC composite coating obtained by the present invention along the axial and radial directions of a workpiece, wherein curve A is the coating hardness, curve B is the coating thickness, and curve C is the coating SiC particle volume content.
In the figure: 1. plating a top cover of the cavity; 2. electroplating a cathode; 3. a plating chamber base; 4. a locking clip hanging lug; 5. locking the lock clip; 6. an anode conductive rod; 7. a water outlet of the plating cavity; 8. reinforcing the steel ring; 9. locking and clamping; 10. a screw hole is fixed on the plating cavity base; 11. a water inlet of the plating chamber; 12. electroplating an anode; 13. a cathode lower seal ring groove; 14. a cathode upper seal ring groove; 15. an anode seal ring groove; a 16-cathode cell; 17. an anode tank; 18. and an anode conducting rod mounting hole.
Detailed Description
The plating cavity is a detachable plating cavity, and can effectively improve the macro/micro integrity and uniformity of the Ni-SiC composite plating layer on the inner surface of the hollow workpiece.
The plating chamber comprises a plating chamber top cover 1, an electroplating cathode 2, a plating chamber base 3, an anode conducting rod 6, a locking clamp 9 and an electroplating anode 12.
The electroplating anode 12 is arranged on the upper surface of the plating chamber base 3, and the lower end of the electroplating anode is embedded into an anode groove 16 on the upper surface of the plating chamber base. The electroplating cathode 2 is sleeved on the electroplating anode 12, and the lower end of the electroplating cathode is embedded into a cathode groove on the upper surface of the plating cavity base 3. The plating chamber top cover 1 is placed on the upper end surfaces of the plating cathode 2 and the plating anode 12 which are sleeved together, the upper end of the plating anode is embedded into an anode tank 17 on the lower surface of the plating chamber top cover, and the upper end of the plating cathode is embedded into a cathode tank 16 on the lower surface of the plating chamber top cover; the plating chamber top cover 1 is supported by the plating cathode and the plating anode.
The plating cavity top cover 1, the electroplating cathode 2 and the plating cavity base 3 are coaxially distributed from top to bottom, and the upper end surface and the lower end surface of the electroplating cathode 2 are respectively arranged in the plating cavity top cover 1 and the plating cavity base 3 cathode grooves 16; the plating chamber top cover 1, the electroplating anode 12 and the plating chamber base 3 are coaxially distributed from top to bottom, and the upper end face and the lower end face of the electroplating anode 12 are respectively arranged in the plating chamber top cover 1 and the plating chamber base 3 in the anode groove 17. The electroplating cathode and the electroplating anode play a supporting role for the top cover 1 of the plating chamber.
Sealing ring notches are respectively arranged between the lower surface of the plating cavity top cover and the upper end surface of the electroplating cathode and between the lower surface of the plating cavity top cover and the upper end surface of the electroplating anode, and between the upper end surface of the plating cavity base and the lower end surface of the electroplating cathode for placing sealing rings
The distance between the inner surface of the plating cathode and the outer surface of the plating anode was 26.5 mm. The lower end of the anode conducting rod 6 passes through an anode conducting rod mounting hole in the center of the plating cavity top cover 1 and is in threaded connection with the electroplating anode 12.
The plating chamber top cover 1, the electroplating cathode 2, the plating chamber base 3, the anode conducting rod 6 and the electroplating anode 12 are coaxial.
The locking clip 9 is composed of a locking clip hanging lug 4 and a locking clip lock catch 5. The lock clamps are provided with three groups which are uniformly distributed on the outer circumference of the plating cavity, and each lock clamp hanging lug is fixed on the outer circumference of the plating cavity base 3 through a bolt. Each locking clamp lock catch 5 is fixed on the outer circumference of the plating cavity top cover 1 through bolts. The lock clamp hanging lug is matched with the lock clamp lock catch for use.
The outer circumferential surfaces of the plating chamber top cover 1 and the plating chamber base 3 are respectively sleeved with a reinforced steel ring 8 made of stainless steel materials, and leakage caused by reduction of sealing performance due to deformation of the plating chamber top cover and the plating chamber base under long-term high-strength operation is avoided through the reinforced steel rings.
The electroplating anode 12 employs the anode device disclosed in the invention creation with application number 202010385981.1. The electroplating anode comprises an inner layer anode and an outer layer anode, and the outer layer anode and the inner layer anode are coaxially nested to form an anode tube body with a sandwich structure. The distance between the inner surface of the outer layer anode and the inner layer anode is 11 mm. The outer diameter of the outer layer anode is 89mm, and the inner diameter of the inner layer anode is 57 mm.
The inner-layer nickel anode tube is coaxial with the outer-layer nickel anode tube, the positions of the inner-layer anode slits respectively positioned on the tube wall of the inner-layer nickel anode tube are staggered with the positions of the outer-layer anode slits positioned on the tube wall of the outer-layer nickel anode tube, the axial positions of the inner-layer anode slits on the inner-layer nickel anode tube are the same as the axial positions of the outer-layer anode slits on the outer-layer nickel anode tube, and the axial positions of the inner-layer anode slits on the inner-layer nickel anode tube are the same as the axial positions of the outer-layer anode slits on the outer-layer nickel anode tube.
The electroplating cathode 2 is in a sleeve shape. The plating cathode had an outer diameter of 168mm and an inner diameter of 152 mm.
The top cover 1 of the plating cavity is in a circular block shape. An anode conducting rod mounting hole 18 for mounting the plating cavity top cover is arranged in the center of the plating cavity top cover, two plating cavity water outlets 7 are symmetrically distributed on two sides of the anode conducting rod mounting hole, and the positions of the plating cavity water outlets are positioned between the inner surface of the electroplating cathode and the outer surface of the electroplating anode after assembly. The lower surface of the plating chamber top cover is provided with a step-shaped groove. In the ladder-shaped groove: the small-diameter groove positioned at the lowermost layer is an anode groove 17 for embedding the electroplating anode 12; an anode sealing ring groove 15 is arranged on the bottom surface of the anode groove close to the mounting hole of the anode conducting rod. The groove with the largest diameter positioned at the uppermost layer is a cathode groove 16 for embedding the electroplating cathode 2; the bottom surface of the cathode groove is provided with a cathode upper sealing ring groove 14 close to the groove wall. By the sealing ring arranged in the anode sealing ring groove 15 and the sealing ring arranged in the cathode upper sealing ring groove 14, the anode rod and the screw hole at the top of the anode are ensured to be isolated from the plating solution during operation, and the disconnection of an electroplating loop and the sealing performance of the whole plating cavity caused by the dissolution of chemical or electrochemical factors are avoided.
The plating cavity base 3 is in a circular block shape. The center of the plating cavity base is provided with a through plating cavity water inlet 11. The upper surface of the plating cavity base is provided with a step-shaped groove. Wherein, the small-diameter groove positioned at the lowest layer in the stepped grooves is an anode groove 17 for embedding the electroplating anode 12; the groove with the largest diameter at the uppermost layer in the three-stage stepped grooves is a cathode groove 16 in which the electroplating cathode 2 is embedded, and a lower cathode sealing ring groove is arranged at the position, close to the groove wall, of the bottom surface of the cathode groove. The plating cavity base 3 is provided with a plating cavity base fixing screw hole 10 which runs through the upper surface and the lower surface of the plating cavity base.
In the embodiment, two plating cavity water outlets 7 are distributed on the plating cavity top cover 1; a plating cavity water inlet 11 is arranged in the center of the plating cavity base 3; so that the plating solution enters the plating cavity from the water inlet 11 of the plating cavity and flows out from the water outlet of the plating cavity and flows back to the liquid storage tank, and the flow path in the plating cavity is a flow path from bottom to top, namely a flow path from bottom to top.
In the embodiment, because the pH of the Ni-SiC composite plating solution is 4.0 +/-0.1 and has strong corrosivity, the plating cavity top cover 1 and the plating cavity base 3 are both made of polytetrafluoroethylene. After the electroplating cathode 2 and the electroplating anode 12 are assembled with the plating chamber top cover 1 and the plating chamber base 3, a stable plating chamber with good sealing performance can be formed by fastening the locking clamp 9.
In the embodiment, an annular anode sealing ring groove 15 is formed in the bottom surface of the anode groove on the lower surface of the top cover 1 of the plating cavity; an annular upper cathode seal ring groove 14 is formed in the upper end surface of the plating cathode 2, and an annular lower cathode seal ring groove 13 is formed in the lower end surface of the plating cathode. The sealing of the plating cavity is realized by the sealing rings respectively arranged in the anode sealing ring groove and the cathode sealing ring groove, so that the anode rod and the screw hole at the top of the anode are isolated from the plating solution during operation, and the disconnection of an electroplating loop and the sealing performance of the whole plating cavity caused by the dissolution of chemical or electrochemical factors are avoided.
Claims (6)
1. A plating chamber capable of improving the uniformity of a Ni-SiC composite coating on the inner wall of a hollow part is characterized by comprising a plating chamber top cover, an electroplating cathode, a plating chamber base, an anode conducting rod, a lock clamp and an electroplating anode; wherein, the electroplating anode is arranged on the upper surface of the plating cavity base, and the lower end of the electroplating anode is embedded into the anode tank on the upper surface of the plating cavity base; the electroplating cathode is sleeved on the electroplating anode, and the lower end of the electroplating cathode is embedded into the cathode groove on the upper surface of the plating cavity base; the plating chamber top cover is placed on the upper end surfaces of an electroplating cathode and an electroplating anode which are sleeved together, the upper end of the electroplating anode is embedded into an anode tank on the lower surface of the plating chamber top cover, and the upper end of the electroplating cathode is embedded into a cathode tank on the lower surface of the plating chamber top cover; the plating chamber top cover is supported by the plating cathode and the plating anode; the plating cavity top cover, the electroplating cathode, the plating cavity base, the anode conducting rod and the electroplating anode are coaxial;
sealing ring notches are respectively arranged between the lower surface of the plating cavity top cover and the upper end surface of the electroplating cathode and between the lower surface of the plating cavity top cover and the upper end surface of the electroplating anode, and between the upper end surface of the plating cavity base and the lower end surface of the electroplating cathode for placing sealing rings;
two plating cavity water outlets are distributed on the plating cavity top cover; a plating cavity water inlet is formed in the center of the plating cavity base; plating solution enters the plating cavity from the water inlet of the plating cavity and flows out from the water outlet of the plating cavity and flows back to the liquid storage tank, and a flow path which enters from bottom to top and exits is formed in the plating cavity.
2. The plating chamber capable of improving the uniformity of the Ni-SiC composite plating layer on the inner wall of the hollow member as claimed in claim 1, wherein the distance between the inner surface of the plating cathode and the outer surface of the plating anode is 26.5 mm; the lower end of the anode conducting rod penetrates through an anode conducting rod mounting hole in the center of the plating cavity top cover to be in threaded connection with the electroplating anode.
3. The plating chamber capable of improving the uniformity of the Ni-SiC composite plating on the inner wall of the hollow part as claimed in claim 1, wherein three groups of locking clamps are uniformly distributed on the outer circumference of the plating chamber; the lock clamp is composed of a lock clamp hanging lug and a lock clamp lock catch, and each lock clamp hanging lug is fixed on the outer circumference of the plating cavity base through a bolt; each locking clamp is fixed on the outer circumference of the plating cavity top cover through a bolt; the lock clamp hanging lug is matched with the lock clamp lock catch for use.
4. The plating chamber capable of improving the uniformity of the Ni-SiC composite plating on the inner wall of the hollow part as claimed in claim 1, wherein the outer circumferential surfaces of the plating chamber top cover and the plating chamber base are respectively sleeved with a reinforced steel ring made of stainless steel material.
5. The plating chamber capable of improving the uniformity of the Ni-SiC composite plating layer on the inner wall of the hollow part as claimed in claim 1, wherein the center of the top cover of the plating chamber is provided with an anode conducting rod mounting hole, two plating chamber water outlets are symmetrically distributed on two sides of the anode conducting rod mounting hole, and the positions of the plating chamber water outlets are positioned between the inner surface of the electroplating cathode and the outer surface of the electroplating anode after assembly; a step-shaped groove is formed in the lower surface of the top cover of the plating cavity; in the ladder-shaped groove: the small-diameter groove positioned at the lowermost layer is an anode groove embedded with the electroplating anode; an anode sealing ring groove is arranged on the bottom surface of the anode groove close to the mounting hole of the anode conducting rod; the groove with the largest diameter positioned on the uppermost layer is a cathode groove embedded with the electroplating cathode; the bottom surface of the cathode groove is provided with a cathode upper sealing ring groove close to the groove wall.
6. The plating chamber capable of improving the uniformity of the Ni-SiC composite plating layer on the inner wall of the hollow part according to claim 1, wherein the center of the base of the plating chamber is provided with a through plating chamber water inlet; the upper surface of the plating cavity base is provided with a step-shaped groove, wherein the small-diameter groove positioned at the lowest layer in the step-shaped groove is an anode groove embedded with the electroplating anode; the groove with the largest diameter at the uppermost layer in the three-stage stepped grooves is a cathode groove embedded with the electroplating cathode, and a lower cathode sealing ring groove is arranged at the bottom surface of the cathode groove close to the groove wall.
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| CN202010393813.7A CN111441073B (en) | 2020-05-11 | 2020-05-11 | Plating cavity capable of improving uniformity of Ni-SiC composite plating layer on inner wall of hollow part |
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| CN111593381A (en) * | 2020-05-09 | 2020-08-28 | 西北工业大学 | Anode device for preparing Ni-SiC composite coating on inner wall of hollow part |
| CN112301393A (en) * | 2020-10-30 | 2021-02-02 | 中冶赛迪技术研究中心有限公司 | Equipment and process for nano composite electroplating of inner surface of metal pipe fitting |
| CN112301394A (en) * | 2020-10-30 | 2021-02-02 | 西北工业大学 | Plating cavity capable of improving uniformity of electroplated layer on inner surface of ring-shaped piece |
| CN113622013A (en) * | 2021-10-12 | 2021-11-09 | 南通伟腾半导体科技有限公司 | Preparation method of composite deposition layer of wafer cutting blade |
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| CN111593381A (en) * | 2020-05-09 | 2020-08-28 | 西北工业大学 | Anode device for preparing Ni-SiC composite coating on inner wall of hollow part |
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| CN112301393B (en) * | 2020-10-30 | 2021-12-07 | 中冶赛迪技术研究中心有限公司 | Equipment and process for nano composite electroplating of inner surface of metal pipe fitting |
| CN112301394B (en) * | 2020-10-30 | 2022-05-24 | 西北工业大学 | Plating cavity capable of improving uniformity of electroplated layer on inner surface of ring-shaped element |
| CN113622013A (en) * | 2021-10-12 | 2021-11-09 | 南通伟腾半导体科技有限公司 | Preparation method of composite deposition layer of wafer cutting blade |
| CN113622013B (en) * | 2021-10-12 | 2021-12-10 | 南通伟腾半导体科技有限公司 | Preparation method of composite deposition layer of wafer cutting blade |
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