CN106637362B - Hollow work-piece inner surface prepares the device of Ni-SiC composite deposites - Google Patents
Hollow work-piece inner surface prepares the device of Ni-SiC composite deposites Download PDFInfo
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- CN106637362B CN106637362B CN201610828514.5A CN201610828514A CN106637362B CN 106637362 B CN106637362 B CN 106637362B CN 201610828514 A CN201610828514 A CN 201610828514A CN 106637362 B CN106637362 B CN 106637362B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
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Abstract
A kind of hollow work-piece inner surface prepares the device of Ni SiC composite deposites, is constituted composite plating solution by composite plating solution reservoir, diaphragm pump, electromagnetic flowmeter, sealing plating station, composite plating solution main line and composite plating solution reflux main channel and is circulated main channel；The flow channel of nickel-plating bath is constituted by leakage fluid dram under nickel-plating bath reservoir, self priming pump and sealing plating station.Water outlet is arranged at the top of upper fixture the present invention, and complete composite deposite can be prepared under small volume flow, good with basal body binding force, and SiC content is high in coating, is evenly distributed.
Description
Technical field
It is specifically a kind of in revolving body or not advising the present invention relates to metal surface properties modification technology and apparatus field
The cycle electroplating device of Ni-SiC composite deposites is then prepared on the inner surface of the hollow work-pieces such as cavity.
Background technology
Using cycle electroplanting device when hollow work-piece inner surface prepares Ni-SiC composite deposites, it is primarily present following ask
Topic：(1) in lower clamp base, easily causing composite plating solution cannot be full of in sealing plating station by work piece inner surface for water outlet setting
The plating chamber formed with anode outer surface, causes workpiece upper end not deposit composite deposite；(2) SiC particles divide in electroplate liquid
It is poor to dissipate property, causes SiC fraction of particle in composite deposite low, lack of homogeneity；(3) knot between Ni-SiC composite deposites and workpiece substrate
It is poor with joint efforts.
The device of patent JPA1995188990 is provided with air stirring branch, air stirring branch road on circulation canal
Compressed air pump be mixed into air into composite plating solution, and then air stirring is carried out to composite plating solution.But circulation canal
The flow velocity of interior composite plating solution is bigger, and the pressure being mixed into electroplate liquid needed for air provided from compressed air pump is bigger,
Air is more difficult to be mixed into.When the flow velocity of electroplate liquid is more than a certain critical value, the pressure that compressed air pump provides not only is insufficient to allow
Air is mixed into composite plating solution, and instead, composite plating solution can flow back in air suspended body flowmeter and air pressure pump, even if
The air stirring branch road, which is provided with double branch stop valve, can not prevent the reflux of composite plating solution.Thus, if being filled in plating
Setting air stirring branch is set, then cannot select excessive plating flow velocity, limit the choosing of composite plating solution volume flow
Select range, and the deposition rate of the stirring efficiency and composite plating of the direct determination device of selection of composite plating solution volume flow.
Therefore, the structure for rationally designing electroplanting device makes the agitating mode that device provides that can realize SiC in composite plating solution fully
It suspends, evenly dispersed effect, and stirring efficiency can be improved, be of great significance.
The plating chamber water outlet of device is arranged at lower clamp base in patent JPA1999350195 and US5647967.Its
Advantage is that liquid energy is electroplated to be flowed back into reservoir under gravity, without the pressure reflux by water pump, has
Energy-saving and environment-friendly effect；Its disadvantage is that composite plating solution enters the speed of plating chamber when composite plating solution volume flow is relatively low
Degree is less than the speed of outflow plating chamber, thus composite plating solution cannot be full of plating chamber always, and workpiece upper end is caused not deposit
Composite deposite.But composite plating solution volume flow is smaller, i.e. the flow velocity of composite plating solution is smaller, SiC content in composite deposite
Higher, coating deposition rate is faster.Therefore, it solves using appearance when relatively low composite plating solution volume flow progress composite plating
Composite plating solution cannot be full of the problem of plating chamber, have for efficiently and rapidly preparing the high Ni-SiC composite deposites of SiC content
It is significant.
A kind of method improving composite deposite binding force is provided in patent US005540829A：Before composite plating
Plating flow velocity and current density are respectively set to 48m/s and 14A/dm in 90s2, obtain the low composite deposite of one layer of SiC content
As prime coat；After 90s, flow velocity is electroplated and current density is respectively set to 15m/s and 28A/dm2, one layer of SiC's high of preparation
Ni-SiC composite deposites.But this mode is difficult to realize in practical operation, because the time for preparing prime coat only has 90s,
And obtain the flow velocity of electroplate liquid is adjusted to by 48m/s after prime coat 15m/s process take it is longer because in order to protect plating to fill
It sets, need to gradually adjust the flow velocity of electroplate liquid, and composite plating is caused since manually operated can not accurately control regulating time
Process has nonrepeatability, and the Ni-SiC composite deposites prepared is caused also to have unstability, thus can not effectively solve
The problem of composite deposite combination force difference.Currently, the Composite Coatings prepared on the electroplanting device that electroplate liquid circulates for raising
The research of the binding force of layer still belongs to blank.
Northwestern Polytechnical University proposes in the innovation and creation application No. is 201610810698.2 a kind of preparing hollow work
The device of part inner surface Ni-SiC composite deposites, the device is in view of being gone out plating chamber using gravity, energy-saving and environment-friendly advantage
The mouth of a river is arranged in lower clamp base, occurs when composite plating solution volume flow being 1.6h/m3When workpiece upper end do not deposit Ni-
The phenomenon that SiC composite deposites.Prepare the process of Ni-SiC composite deposites in said device, have deposition rate it is fast (83 μm/
30min) and the high feature of SiC content, but the binding force of composite deposite and matrix is poor, illustrates to use in said device
The method effect for preparing prime coat improvement binding force is not obvious.In addition, when flowing into plating chamber to workpiece progress composite plating
When the amount of required composite plating solution is less than the amount of the composite plating solution exported when electroplate liquid circulating pump works normally, conveyance conduit
Interior hydraulic pressure is larger easily to be caused to damage or destroy to conveyance conduit.
Therefore, research can safely and efficiently hollow work-piece inner surface prepare SiC content it is high and be evenly distributed, binding force it is good
The electroplanting device circulated with the electroplate liquid of the complete Ni-SiC composite deposites in surface, for solving revolving body or irregular chamber
It the problem of hollow work-pieces inner surface mechanical property such as body cannot meet application request, is of great significance.
Invention content
To overcome, the binding force of composite deposite and matrix existing in the prior art is poor, easily causes to damage to conveyance conduit
Or the deficiency destroyed, the present invention propose the device that a kind of hollow work-piece inner surface prepares Ni-SiC composite deposites.
The present invention includes the flow channel that composite plating solution circulates main channel and nickel-plating bath；The compound electric
It includes composite plating solution reservoir, diaphragm pump, electromagnetic flowmeter, sealing plating station, composite plating that plating solution, which circulates main channel,
Liquid main line and composite plating solution reflux main channel, wherein one end of composite plating solution main line and the outlet of the diaphragm pump connect
Logical, the other end of the composite plating solution main line is connected to the sealing plating station water inlet of the lower fixture in sealing plating station；Electricity
Magnetic flowmeter is serially connected on the composite plating solution main line；Between the electromagnetic flowmeter and the sealing plating station water inlet
It is serially connected with composite plating path manual valve.The flow channel of the nickel-plating bath includes nickel-plating bath reservoir, self-priming
Leakage fluid dram under pump and sealing plating station.It is circulated between the diaphragm pump of main channel and electromagnetic flowmeter in the composite plating solution
It is parallel with composite plating solution reflux bypass passage.One end access diaphragm pump and electromagnetism of the composite plating solution reflux bypass passage
On composite plating solution main line between flowmeter entrance, the other end and the compound electric at the top of composite plating solution reservoir
Inlet connection in plating solution reservoir capping.
There is plating chamber water outlet in the upper surface of upper fixture in the sealing plating station, the water outlet by pipeline be located at
Inlet connection in the composite plating solution reservoir capping forms composite plating solution reflux main channel.
The flow channel of the nickel-plating bath includes being arranged under nickel-plating bath reservoir, self priming pump and sealing plating station
Liquid mouth.Pore is provided on the head cover of the nickel-plating bath reservoir, the pore, nickel plating are accessed in one end of nickel-plating bath pipeline
The other end that liquid pipe is electroplated accesses composite plating solution main line.Be connected in turn on the nickel-plating bath pipeline self priming pump and
Nickel preplating path manual valve, and the inlet of the self priming pump is made to be connected to nickel-plating bath reservoir, make the self priming pump goes out liquid
Mouth is connected to the inlet of the nickel preplating path manual valve.
One section of nickel-plating bath drain pipe, nickel plating electricity are connected with by three-way connection on the nickel-plating bath pipeline
The other end of plating solution drain pipe is connected to the nickel-plating bath leakage fluid dram of lower fixture；It is installed on the nickel-plating bath drain pipe
There is sealing plating station drain hand-operated valve.
There is liquid outlet in the bottom of composite plating solution reservoir side and middle part, goes out respectively with lower discharging tube and above
Water pipe connects, and the arrival end of the lower discharging tube is made to be connected to the liquid outlet of liquid storage trench bottom, makes the arrival end of upper water-out pipe
It is connected to the liquid outlet in the middle part of reservoir；The outlet end of the upper water-out pipe is connected to lower discharging tube.The lower discharging tube goes out
Mouth end is connected to the entrance of diaphragm pump.
The present invention can prepare complete composite deposite under small volume flow, good with basal body binding force, and SiC contains in coating
Amount is high, is evenly distributed.
If sealing the water outlet setting of plating station in lower clamp base, when the smaller volume flow of use, composite plating solution
The rate for flowing into plating chamber is less than the rate of outflow plating chamber, then composite plating solution cannot be full of entire plating chamber, cause to fail
In hollow work-piece inner surface overburden Ni-SiC composite deposites.In order to solve this problem, water outlet is arranged the present invention
At the top of upper fixture.In a certain range, the volume flow of composite plating solution is smaller, and SiC content is higher in Ni-SiC composite deposites,
Coating deposition rate is bigger, and hardness is higher, and surface quality is better.Therefore, it after improvement, can be used down to 0.5m3The body of/h
Product flow carries out composite plating.
The present invention takes following measures to improve the stirring efficiency and effect that composite plating solution circulates.
First：The one reflux bypass passage of setting on circulation canal.Before carrying out composite plating, close and sealing plating station phase
Hand-operated valve even, composite plating solution are returned to along reflux branch in composite plating solution reservoir under the action of diaphragm pump, complete one
Secondary to circulate, persistently carrying out this stirring action power for circulating generation, so that SiC particles is quickly and evenly dispersed in compound
In electroplate liquid.The volume flow that composite plating solution circulates is bigger, the number that composite plating solution circulates in the unit interval
More, SiC particles are shorter the time required to being dispersed in composite plating solution, and the stirring efficiency circulated is higher.Preferably,
When being stirred to composite plating solution before composite plating, using volume flow as big as possible, working efficiency is improved.In addition,
When carrying out composite plating, the required compound electric when the amount of the composite plating solution exported by diaphragm pump is more than to workpiece composite plating
When plating solution, extra composite plating solution is back to via composite plating solution reflux bypass passage in composite plating solution reservoir, with
The pressure in composite plating solution main line is reduced, there is protective effect to composite plating device；Meanwhile composite plating solution is along reflux
Main channel and reflux bypass passage circulate, and can play the role of stirring and dispersion SiC, and this stirring action continues to multiple
Until closing plating completion.Preferably, select the diaphragm pump of larger volume flow, the mixing effect of generation preferable.
Second：There are two water outlets for setting on composite plating solution reservoir.Composite plating liquid recycle stream can be made full use of
The stirring action of movable property life, makes the SiC particles of levels in composite plating solution reservoir be sufficiently mixed, and realizes in composite plating solution
In be uniformly distributed.
Present invention offer one kind being carried out continuously nickel plating in the electroplanting device and Ni-SiC composite platings are compound to improve
The operating method of binding force between coating and matrix：The hand-operated valve being located between sealing plating station and electromagnetic flowmeter is closed, is opened
Two hand-operated valves on the flow channel of the nickel-plating bath of sealing plating station bottom；Start self priming pump, seals plating station
Self priming pump is closed after being full of nickel-plating bath in interior plating chamber；Impactive nickel plating, the table in workpiece are carried out using high current density
Face prepares pure nickel prime coat；Nickel-plating bath is electroplated under Gravitative Loads along nickel-plating bath flow channel total reflux to nickel plating
After liquid reservoir, two hand-operated valves on the flow channel of nickel-plating bath are turned off, opens and is located at sealing plating station and electromagnetism
Hand-operated valve between flowmeter；Then composite plating is proceeded by.
Nickel plating is carried out according to immersion type electro-plating method, after the completion of nickel plating, by workpiece transfer and composite plating need to be mounted on
On device.This process nickel coating surface easy to pollute, and composite plating should be carried out as early as possible after obtaining pure nickel prime coat, it should not be
Stay longer in air, because the residence time is longer, it is more to be adsorbed on the pollutants such as dust or the oxygen of bottoming layer surface,
It is unfavorable for forming the good composite deposite of binding force.Method provided by the invention need not be shifted after completing nickel plating and erector
Part is also shortened and is stopped in air before carrying out composite plating to the pollution being avoided that during this to pure nickel prime coat
Time.Before carrying out Ni-SiC composite platings, one layer of nickel coating is first prepared on matrix as prime coat, can effectively improve
Binding force problem between Ni-SiC composite deposites and matrix.
When preparing Ni-SiC composite deposites, open with seal the hand-operated valve that is connected of plating station water inlet and respectively with it is compound
Two hand-operated valves that two water outlets of electroplate liquid reservoir are connected make in sealing plating station composite plating solution flow backward to compound
In electroplate liquid reservoir, until without remaining composite plating solution in sealing plating station, you can unclamp seal assembly, remove and be completed again
Close the workpiece of plating.
In conclusion the present invention can realize three functions：(1) before carrying out composite plating, start diaphragm pump, make compound electric
Plating solution is circulated along the close passage formed by composite plating solution reservoir, diaphragm pump and affluent channel, until SiC particles exist
Even suspension in composite plating solution does not need auxiliary air stirring or other mechanical agitations；(2) after installing hollow work-piece, first
Impactive nickel plating is carried out in work piece inner surface, pure nickel prime coat is prepared, then carry out Ni-SiC composite platings, improves composite deposite and work
Binding force between part matrix；(3) water outlet for sealing plating station is arranged at the top of upper fixture, smaller volume flow can be used
Carry out composite plating.
The stirring of cycle electroplate liquid and air stirring phase are proposed in the innovation and creation application No. is 201610810698.2
In conjunction with mode, and agitating mode provided by the invention is then by the way of single cycle electroplate liquid stirring.The present invention uses
The agitating mode has many advantages.First, cancel air stirring branch, both reduce installation cost, energy conservation and environmental protection, and reduce
Noise pollution caused by air compressor, to solve setting air stirring branch caused by a series of problems.Secondly, no
Need to consider the problems of the composite plating solution because of the excessive generation of the volume flow of composite plating solution to compressed air pump reflux, thus
Before composite plating, volume flow as big as possible can be used to carry out circulation stirring to composite plating solution, to improve working efficiency.
Third can select the diaphragm pump of larger volume flow, because during composite plating, either enter sealing plating station and complete
The composite plating solution of composite plating solution reservoir is returned to along main return flow line or extra edge reflux branch leads to after composite plating
The composite plating solution of road reflux composite plating solution reservoir, can play stirring action to the SiC in composite plating solution reservoir,
And the volume flow of diaphragm pump is bigger, mixing effect is better with efficiency.
Description of the drawings
Fig. 1 is the structural schematic diagram of electroplanting device provided by the invention.
Fig. 2 is the method schematic diagram for improving composite deposite binding force, wherein：I indicates electronickelling process；II indicates Ni-SiC
Composite plating process.In figure：
1. composite plating solution reservoir；2. diaphragm pump；3. electromagnetic flowmeter；4. sealing plating station；5. rectifier power source is electroplated；
The main channel 6. composite plating solution flows back；The bypass passage 7. composite plating solution flows back；8. control panel；9. composite plating solution reservoir
Capping；10.pH is counted；11. liquid level gauge；12. thermocouple；13. heating tube；14. composite plating solution；15. upper water-out mouth；Go out under 16.
The mouth of a river；17. composite plating path manual valve；18. sealing plating station water inlet；19. lower fixture；20. hollow work-piece；It is pressed from both sides on 21.
Tool；22. sealing plating station upper water-out mouth；23. seal assembly；24. conductive anode rod；25. nickel-plating bath reservoir；26. plating
Nickel plating solution；27. self priming pump；28. nickel preplating path manual valve；29. sealing plating station drain hand-operated valve；30. sealing plating station
Lower leakage fluid dram；31. composite plating solution main line；32.Ni-SiC composite deposites；33. pure nickel prime coat.
Specific implementation mode
The present embodiment is that a kind of Q235 steel revolving body is the dress that hollow work-piece inner surface to be plated prepares Ni-SiC composite deposites
It sets, including composite plating solution circulates the flow channel of main channel and nickel-plating bath.
It includes composite plating solution reservoir 1, diaphragm pump 2, Electromagnetic Flow that the composite plating solution, which circulates main channel,
Meter 3, sealing plating station 4 and composite plating solution reflux main channel 6.The flow channel of the nickel-plating bath includes nickel plating plating
Leakage fluid dram 30 under liquid reservoir 25, self priming pump 27 and sealing plating station.The composite plating solution circulate main channel every
Composite plating solution reflux bypass passage 7 is parallel between membrane pump 2 and electromagnetic flowmeter 3.
There is liquid outlet respectively in the bottom of composite plating solution reservoir side and middle part, it is mixed to form electroplate liquid stirring
Close access.Being stirred access by the electroplate liquid can make full use of composite plating solution to circulate the stirring action of generation, make
It is respectively at composite plating solution reservoir to be sufficiently mixed with the SiC particles of lower layer at the middle and upper levels, realize in composite plating solution uniformly
Distribution.Specifically：It is externally connected with the lower discharging tube 16 being mutually parallel and upper water-out pipe 15 in the composite plating solution reservoir, and is made
The arrival end of the lower discharging tube is connected to the liquid outlet of liquid storage trench bottom, is made in the middle part of the arrival end and reservoir of upper water-out pipe
Liquid outlet is connected to；The outlet end of the upper water-out pipe 15 is connected to lower discharging tube.The outlet end of the lower discharging tube 16 and diaphragm
The entrance connection of pump 2.
The outlet of one end of composite plating solution main line 31 and the diaphragm pump 2, the composite plating solution main line
The other end is connected to the sealing plating station water inlet 18 of the lower fixture in sealing plating station 4；In the composite plating solution main line
Electromagnetic flowmeter 3 is serially connected on 31；It is serially connected with composite plating between the electromagnetic flowmeter and the sealing plating station water inlet
Path manual valve 17.
Between one end access diaphragm pump 2 and 3 entrance of electromagnetic flowmeter of the composite plating solution reflux bypass passage 7
On composite plating solution main line, on the other end and the composite plating solution reservoir capping 9 being located at the top of composite plating solution reservoir 1
Inlet connection.There are pH meter 10, liquid level gauge 11, thermocouple 12 and heating tube 13 in the composite plating solution reservoir,
Middle liquid level gauge 11, thermocouple 12 and heating tube 13 are connect by conducting wire with control panel 8.
The sealing plating station 4 is improved to obtain to the prior art.The sealing plating station includes lower fixture 19, upper fixture
21, conductive anode rod 24；For placing hollow work-piece 20 between the lower fixture 19 and upper fixture 21；The lower fixture lower end it is close
Envelope plating station water inlet 18 and the outlet of the electromagnetic flowmeter 3 pass through pipeline connection.Conductive anode rod 24 is located at upper fixture
Upper surface, and connect with the anode of plating rectifier power source 5 by conducting wire, the cathode of the plating rectifier power source 5 and the hollow work
Part connects.Hollow work-piece 20 is between lower fixture and upper fixture, to make the composite plating solution circulate main channel
It is penetrated through with the inner cavity of the hollow work-piece.The plating chamber water outlet of upper fixture passes through pipeline and the composite plating solution reservoir 1
Water inlet is connected to.
There is plating chamber water outlet in the upper surface of the upper fixture, the water outlet is by pipeline and is located at the composite plating
Inlet connection in liquid reservoir capping forms composite plating solution reflux main channel 6.
The flow channel of the nickel-plating bath includes nickel-plating bath reservoir 25, self priming pump 27 and sealing plating station
Lower leakage fluid dram 30.Pore is provided on the head cover of the nickel-plating bath reservoir 25, one end access of nickel-plating bath pipeline should
Pore, the other end access composite plating solution main line 31 of nickel-plating bath pipe.Connect successively on the nickel-plating bath pipeline
It is connected to self priming pump 27 and nickel preplating path manual valve 28, and the inlet of the self priming pump 27 is made to connect with nickel-plating bath reservoir 25
It is logical, so that the liquid outlet of the self priming pump 27 is connected to the inlet of the nickel preplating path manual valve.
One section of nickel-plating bath drain pipe, nickel plating electricity are connected with by three-way connection on the nickel-plating bath pipeline
The other end of plating solution drain pipe is connected to the nickel-plating bath leakage fluid dram of lower fixture 19；Pacify on the nickel-plating bath drain pipe
Equipped with sealing plating station drain hand-operated valve 29.
When carrying out nickel plating, composite plating path manual valve 17 is first closed, opens nickel preplating path manual valve 28 and sealing
Plating station drain hand-operated valve 29 starts self priming pump 27, and nickel-plating bath is simultaneously from leakage fluid dram 30 under sealing plating station and sealing electricity
It plates platform water inlet 18 and enters sealing plating station 4.Full of after nickel-plating bath in plating chamber in the sealing plating station 4, close
Self priming pump 27, nickel preplating path manual valve 28 and sealing plating station drain hand-operated valve 29 allow nickel-plating bath to be retained in plating chamber
Carry out impactive nickel plating.After the completion of nickel plating, nickel preplating path manual valve 28 and sealing plating station drain hand-operated valve 29 are opened, allows nickel plating
Electroplate liquid is flowed out from leakage fluid dram 30 under sealing plating station and sealing plating station water inlet 18 simultaneously, returns to nickel-plating bath reservoir
In 25, nickel preplating path manual valve 28 and sealing plating station drain hand-operated valve 29 are turned off, composite plating path manual valve is opened
17, start normal composite plating.The coating that plating acquisition is carried out using the process is answered by pure nickel prime coat 32 and Ni-SiC
It closes coating 33 to form, the binding force of coating and matrix can be significantly improved.
It is provided by the invention cycle electroplanting device operation principle be：First the composite plating solution 14 in reservoir 1 is carried out
Preliminary treatment before plating, preliminary treatment include mainly heating electroplate liquid, adjust pH and add new electroplate liquid, the ginseng of electroplate liquid
After number reaches qualified electroplating technology requirement, under the driving of diaphragm pump 2, lower discharging tube of the composite plating solution 14 from 1 bottom of reservoir
16 and/or upper water-out pipe 15 exit into liquid-transport pipe-line and start the cycle over, after diaphragm pump 2 electroplate liquid flow into sealing plating station
4, complete composite plating.The composite plating solution after composite plating is completed from the sealing plating station upper water-out mouth positioned at upper fixture upper end
22 are back to by composite plating solution reflux main channel 6 in composite plating solution reservoir 1, and the cycle electricity of composite plating solution is completed
Plating process.After sealing composite plating solution total reflux to the composite plating solution reservoir in plating station 4, seal assembly is unclamped
23, remove the workpiece that composite plating is completed.
The required composite plating solution when the amount of the composite plating solution exported by diaphragm pump 2 is more than to workpiece composite plating
When, extra composite plating solution is back to via composite plating solution reflux bypass passage 7 in composite plating solution reservoir 1, with drop
Pressure in low composite plating solution main line 31.
Claims (5)
1. a kind of hollow work-piece inner surface prepares the device of Ni-SiC composite deposites, including composite plating solution circulates main lead to
Road, which is characterized in that further include the flow channel of nickel-plating bath；It includes multiple that the composite plating solution, which circulates main channel,
Close electroplate liquid reservoir, diaphragm pump, electromagnetic flowmeter, sealing plating station, composite plating solution main line and composite plating solution reflux
Main channel, the wherein outlet of one end of composite plating solution main line and the diaphragm pump, the composite plating solution main line
The other end is connected to the sealing plating station water inlet of the lower fixture in sealing plating station；Electromagnetic flowmeter is serially connected in the compound electric
On plating solution main line；It is serially connected with nickel-plating bath reservoir hand between the electromagnetic flowmeter and the sealing plating station water inlet
Dynamic valve；The flow channel of the nickel-plating bath include nickel-plating bath reservoir, self priming pump and sealing plating station under drain
Mouthful；It is circulated in the composite plating solution and is parallel with composite plating solution reflux between the diaphragm pump of main channel and electromagnetic flowmeter
Bypass passage；Answering between one end access diaphragm pump and electromagnetic flowmeter entrance of the composite plating solution reflux bypass passage
Close on electroplate liquid main line, the other end in the composite plating solution reservoir capping at the top of the composite plating solution reservoir into
Liquid mouth is connected to.
2. hollow work-piece inner surface as described in claim 1 prepares the device of Ni-SiC composite deposites, which is characterized in that described close
There is plating chamber water outlet in the upper surface of upper fixture in envelope plating station, and the water outlet is by pipeline and is located at the composite plating solution
Inlet connection in reservoir capping forms composite plating solution reflux main channel.
3. hollow work-piece inner surface as described in claim 1 prepares the device of Ni-SiC composite deposites, which is characterized in that the plating
Pore is provided on the head cover of nickel plating solution reservoir, the pore, nickel-plating bath pipeline are accessed in one end of nickel-plating bath pipeline
The other end access composite plating solution main line；It is connected with self priming pump in turn on the nickel-plating bath pipeline and nickel preplating is logical
Road hand-operated valve, and the inlet of the self priming pump is made to be connected to nickel-plating bath reservoir, make the liquid outlet of the self priming pump with it is described
The inlet of nickel preplating path manual valve is connected to.
4. hollow work-piece inner surface as claimed in claim 3 prepares the device of Ni-SiC composite deposites, which is characterized in that described
One section of nickel-plating bath drain pipe is connected with by three-way connection on nickel-plating bath pipeline, the nickel-plating bath drain pipe it is another
One end is connected to the nickel-plating bath leakage fluid dram of lower fixture；Sealing plating station row is installed on the nickel-plating bath drain pipe
Liquid hand-operated valve.
5. hollow work-piece inner surface as described in claim 1 prepares the device of Ni-SiC composite deposites, which is characterized in that described
Liquid outlet is arranged at the bottom and middle part of composite plating solution reservoir side, is connect respectively with lower discharging tube and upper water-out pipe, and make
The arrival end of the lower discharging tube is connected to the liquid outlet of liquid storage trench bottom, is made in the middle part of the arrival end and reservoir of upper water-out pipe
Liquid outlet is connected to；The outlet end of the upper water-out pipe is connected to lower discharging tube；The outlet end of the lower discharging tube and diaphragm pump
Entrance is connected to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610828514.5A CN106637362B (en) | 2016-09-18 | 2016-09-18 | Hollow work-piece inner surface prepares the device of Ni-SiC composite deposites |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610828514.5A CN106637362B (en) | 2016-09-18 | 2016-09-18 | Hollow work-piece inner surface prepares the device of Ni-SiC composite deposites |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106637362A CN106637362A (en) | 2017-05-10 |
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| CN107130232B (en) * | 2017-05-25 | 2018-10-19 | 山西北方机械制造有限责任公司 | A kind of method of large and medium-sized pipe part inner wall topical nickel galvanization phosphorus alloy |
| CN110344104A (en) * | 2019-08-21 | 2019-10-18 | 山东新海表面技术科技有限公司 | Engine cylinder intracoelomic cavity electroplating device |
| CN111593381B (en) * | 2020-05-09 | 2022-04-19 | 西北工业大学 | Anode device for preparing Ni-SiC composite coating on inner wall of hollow part |
| CN111441073B (en) * | 2020-05-11 | 2022-03-25 | 西北工业大学 | Plating cavity capable of improving uniformity of Ni-SiC composite plating layer on inner wall of hollow part |
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| CN204474786U (en) * | 2015-01-19 | 2015-07-15 | 河南理工大学 | A kind of circulation of elecrolyte piping system for electrodeposition technology |
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| US5540829A (en) * | 1993-12-27 | 1996-07-30 | Honda Giken Kogyo Kabushiki Kaisha | Composite plating method for hollow member |
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| US5647967A (en) * | 1993-09-02 | 1997-07-15 | Yamaha Hatsudoki Kabushiki Kaisha | Plating method for cylinder |
| JP2011122205A (en) * | 2009-12-10 | 2011-06-23 | Suzuki Motor Corp | Plating processing device for cylinder block |
| CN102828220A (en) * | 2012-09-18 | 2012-12-19 | 绍兴锋龙电机有限公司 | Perfusion type electronickelling and silicon carbide device for air cylinder |
| CN203855675U (en) * | 2014-04-30 | 2014-10-01 | 确信乐思化学（上海）有限公司 | Electroplating device |
| CN204474786U (en) * | 2015-01-19 | 2015-07-15 | 河南理工大学 | A kind of circulation of elecrolyte piping system for electrodeposition technology |
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