CN106637362A - Device for preparing Ni-SiC composite coating on internal surface of hollow workpiece - Google Patents
Device for preparing Ni-SiC composite coating on internal surface of hollow workpiece Download PDFInfo
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- CN106637362A CN106637362A CN201610828514.5A CN201610828514A CN106637362A CN 106637362 A CN106637362 A CN 106637362A CN 201610828514 A CN201610828514 A CN 201610828514A CN 106637362 A CN106637362 A CN 106637362A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
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- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Abstract
The invention relates to a device for preparing a Ni-SiC composite coating on the internal surface of a hollow workpiece. A composite electroplating liquid circulation flow main channel is composed of a composite electroplating liquid storage tank, a diaphragm pump, an electromagnetic flowmeter, a sealing electroplating table, a composite electroplating liquid main pipe and a composite electroplating liquid backflow main channel; and a nickel plating electroplating liquid flow channel is composed of a nickel plating electroplating liquid storage tank, a self-priming pump and a sealing electroplating table lower liquid discharge opening. According to the device, a water outlet is formed in the top of an upper clamp, a complete composite coating can be prepared under small-volume flow, the bonding force with a base is good, the SiC content in the coating is high, and distribution is even.
Description
Technical field
The present invention relates to metal surface properties modification technology and apparatus field, specifically a kind of to be used in revolving body or do not advise
The circulation electroplating device of Ni-SiC composite deposites is then prepared on the inner surface of the hollow work-piece such as cavity.
Background technology
Using circulation electroplanting device when hollow work-piece inner surface prepares Ni-SiC composite deposites, following asking is primarily present
Topic：(1) delivery port is arranged on lower clamp bottom, and easily causing composite plating solution can not be interior by work piece inner surface full of sealing plating station
The plating chamber formed with anode outer surface, causes workpiece upper end not deposit composite deposite；(2) SiC particulates divide in electroplate liquid
Scattered property is poor, causes SiC fraction of particle in composite deposite low, lack of homogeneity；(3) knot between Ni-SiC composite deposites and workpiece substrate
It is poor with joint efforts.
The device of patent JPA1995188990 is provided with air stirring branch road on circulation canal, on air stirring branch road
Compressed air pump air is mixed into in composite plating solution, and then air stirring is carried out to composite plating solution.But, circulation canal
The flow velocity of interior composite plating solution is bigger, and the pressure being mixed into in electroplate liquid needed for air provided from compressed air pump is bigger,
Air is more difficult to be mixed into.When the flow velocity of electroplate liquid exceedes a certain critical value, the pressure that compressed air pump is provided not only is insufficient to allow
Air is mixed into composite plating solution, and on the contrary, composite plating solution can be flowed back in air suspended body flowmeter and air pressure pump, even if
Being provided with double branch stop valve on the air stirring branch road can not prevent the backflow of composite plating solution.Thus, if in plating dress
Setting air stirring branch road is put, then can not select excessive plating flow velocity, limit the choosing of composite plating solution volume flow
Select scope, and the stirring efficiency and the sedimentation rate of composite plating of the direct determination device of selection of composite plating solution volume flow.
Therefore, the structure of appropriate design electroplanting device, makes the agitating mode that device is provided to realize SiC in composite plating solution fully
Suspension, homodisperse effect, can improve stirring efficiency again, significant.
The plating chamber delivery port of device is arranged at lower clamp bottom in patent JPA1999350195 and US5647967.Its
Advantage is that plating liquid energy is back under gravity in reservoir, is flowed back without the pressure by water pump, is had
The effect of energy-conserving and environment-protective；Its inferior position is that, when composite plating solution volume flow is relatively low, composite plating solution enters the speed of plating chamber
Degree is less than the speed for flowing out plating chamber, thus composite plating solution can not be full of all the time plating chamber, cause workpiece upper end not deposit
Composite deposite.But, composite plating solution volume flow is less, i.e. the flow velocity of composite plating solution is less, SiC content in composite deposite
Higher, coating sedimentation rate is faster.Therefore, appearance when solving to carry out composite plating using relatively low composite plating solution volume flow
Composite plating solution can not be full of the problem of plating chamber, the Ni-SiC composite deposite tool high for SiC content is efficiently and rapidly prepared
It is significant.
A kind of method of raising composite deposite adhesion is provided in patent US005540829A：Before composite plating
Plating flow velocity and current density are respectively set to 48m/s and 14A/dm in 90s2, obtain the low composite deposite of one layer of SiC content
As prime coat；After 90s, plating flow velocity and current density are respectively set to 15m/s and 28A/dm2, prepare one layer of SiC high
Ni-SiC composite deposites.But this mode is difficult to realize in practical operation, because the time for preparing prime coat only has 90s,
And obtain after prime coat that the flow velocity of electroplate liquid is time-consuming longer by the process that 48m/s is adjusted to 15m/s, because in order to protect plating dress
Put, need to progressively adjust the flow velocity of electroplate liquid, and due to manually operated cannot precise control regulating time cause composite plating
Process has nonrepeatability, causes the Ni-SiC composite deposites for preparing also to have unstability, thus can not effectively solving
The problem of composite deposite adhesion difference.At present, for the Composite Coatings for improving the preparation on the electroplanting device that electroplate liquid is circulated
The research of the adhesion of layer still belongs to blank.
Northwestern Polytechnical University proposes one kind in the innovation and creation of Application No. 201610810698.2 and prepares hollow work
The device of part inner surface Ni-SiC composite deposites, the device is considered to go out plating chamber using gravity, the advantage of energy-conserving and environment-protective
The mouth of a river is arranged on lower clamp bottom, occurs in that when composite plating solution volume flow is 1.6h/m3When workpiece upper end do not deposit Ni-
The phenomenon of SiC composite deposites.Prepare the process of Ni-SiC composite deposites in said device, with sedimentation rate it is fast (83 μm/
30min) high with SiC content the characteristics of, but composite deposite is poor with the adhesion of matrix, illustrates what is adopted in said device
Prepare prime coat improve adhesion method effect it is unobvious.In addition, when inflow plating chamber carries out composite plating to workpiece
When the amount of required composite plating solution is less than the amount of the composite plating solution exported during electroplate liquid circulating pump normal work, conveyance conduit
Interior hydraulic pressure is larger easily to be caused to damage or destroys to conveyance conduit.
Therefore, research can safely and efficiently hollow work-piece inner surface prepare SiC content it is high and be evenly distributed, adhesion it is good
The electroplanting device that the electroplate liquid of the Ni-SiC composite deposite complete with surface is circulated, for solution revolving body or irregular chamber
The hollow work-piece inner surface mechanical property such as body can not meet the problem of application request, significant.
The content of the invention
To overcome, composite deposite present in prior art is poor with the adhesion of matrix, easily damage is caused to conveyance conduit
Or the deficiency of destruction, it is of the invention to propose the device that a kind of hollow work-piece inner surface prepares Ni-SiC composite deposites.
The present invention circulates the flow channel of main channel and nickel-plating bath including composite plating solution；Described compound electric
Plating solution circulates main channel including composite plating solution reservoir, membrane pump, electromagnetic flowmeter, sealing plating station, composite plating
Liquid main line and composite plating solution backflow main channel, wherein one end of composite plating solution main line connect with the outlet of the membrane pump
Logical, the other end of the composite plating solution main line is connected with the sealing plating station water inlet of the lower clamp in sealing plating station；Electricity
Magnetic flowmeter is serially connected on the composite plating solution main line；Between the electromagnetic flowmeter and the sealing plating station water inlet
It is serially connected with composite plating path manual valve.The flow channel of described nickel-plating bath includes nickel-plating bath reservoir, self-priming
Leakage fluid dram under pump and sealing plating station.Circulate between the membrane pump of main channel and electromagnetic flowmeter in the composite plating solution
It is parallel with composite plating solution backflow bypass passage.Access membrane pump and electromagnetism in one end of the composite plating solution backflow bypass passage
On composite plating solution main line between flowmeter entrance, the other end be located at composite plating solution reservoir at the top of compound electric
Inlet connection in plating solution reservoir groove lid.
There is plating chamber delivery port the upper surface of the upper fixture in the sealing plating station, and the delivery port passes through pipeline and is located at
Inlet connection in the composite plating solution reservoir groove lid, defines composite plating solution backflow main channel.
The flow channel of described nickel-plating bath includes being arranged under nickel-plating bath reservoir, self priming pump and sealing plating station
Liquid mouth.Pore is provided with the top cover of the nickel-plating bath reservoir, the pore, nickel plating are accessed in one end of nickel-plating bath pipeline
The other end of plating liquid pipe accesses composite plating solution main line.Be connected with turn on the nickel-plating bath pipeline self priming pump and
Nickel preplating path manual valve, and the inlet of the self priming pump is connected with nickel-plating bath reservoir, make the self priming pump goes out liquid
Mouth is connected with the inlet of the nickel preplating path manual valve.
One section of nickel-plating bath discharging tube is connected with by three-way connection on the nickel-plating bath pipeline, the nickel plating electricity
The other end of plating solution discharging tube is connected with the nickel-plating bath leakage fluid dram of lower clamp；Install on the nickel-plating bath discharging tube
There is sealing plating station discharge opeing hand-operated valve.
There is liquid outlet in the bottom and middle part of the composite plating solution reservoir side, go out with lower discharging tube and above respectively
Water pipe connects, and the arrival end of the lower discharging tube is connected with the liquid outlet of liquid storage trench bottom, makes the arrival end of upper water-out pipe
Connect with the liquid outlet in the middle part of reservoir；The port of export of the upper water-out pipe is connected with lower discharging tube.The lower discharging tube goes out
Mouth end connects with the entrance of membrane pump.
The present invention can prepare complete composite deposite under small volume flow, good with basal body binding force, and SiC contains in coating
Amount is high, is evenly distributed.
If the delivery port of sealing plating station is arranged on lower clamp bottom, during using less volume flow, composite plating solution
The speed of the speed less than outflow plating chamber of plating chamber is flowed into, then composite plating solution can not be full of whole plating chamber, cause to fail
In hollow work-piece inner surface overburden Ni-SiC composite deposites.In order to solve this problem, the present invention is arranged on delivery port
Upper fixture top.Within the specific limits, the volume flow of composite plating solution is less, and SiC content is higher in Ni-SiC composite deposites,
Coating sedimentation rate is bigger, and hardness is higher, and surface quality is better.Therefore, after improvement, as little as 0.5m can be adopted3The body of/h
Product flow carries out composite plating.
The present invention takes following measures to improve stirring efficiency and the effect that composite plating solution is circulated.
First：One backflow bypass passage is set on circulation canal.Before carrying out composite plating, close and sealing plating station phase
Hand-operated valve even, composite plating solution is returned in composite plating solution reservoir in the presence of membrane pump along backflow branch road, completes one
Secondary to circulate, persistently carrying out this stirring action power for circulating generation, SiC particulates is quickly and evenly dispersed in compound
In electroplate liquid.The volume flow that composite plating solution is circulated is bigger, the number of times that composite plating solution is circulated in the unit interval
More, SiC particulates are dispersed in that the time needed for composite plating solution is shorter, and the stirring efficiency for circulating is higher.Preferably,
When being stirred to composite plating solution before composite plating, volume flow as big as possible is adopted, improve operating efficiency.In addition,
When carrying out composite plating, the required compound electric when the amount of the composite plating solution exported by membrane pump is more than to workpiece composite plating
During plating solution, unnecessary composite plating solution is back in composite plating solution reservoir via composite plating solution backflow bypass passage, with
The pressure in composite plating solution main line is reduced, there is protective effect to composite plating device；Meanwhile, composite plating solution is along backflow
Main channel and backflow bypass passage are circulated, and can play a part of to stir and disperse SiC, and this stirring action continues to again
Till conjunction plating is completed.Preferably, from the membrane pump of larger volume flow, the mixing effect of generation is preferable.
Second：Two delivery ports are provided with composite plating solution reservoir.Composite plating liquid recycle stream can be made full use of
The stirring action of movable property life, the SiC particulates for making levels in composite plating solution reservoir are sufficiently mixed, and realize in composite plating solution
In be uniformly distributed.
Nickel plating is carried out continuously in the electroplanting device for present invention offer one kind and Ni-SiC composite platings are compound to improve
The method of operating of adhesion between coating and matrix：The hand-operated valve being located between sealing plating station and electromagnetic flowmeter is closed, is opened
Two hand-operated valves on the flow channel of the nickel-plating bath of sealing plating station bottom；Start self priming pump, seal plating station
It is full of in interior plating chamber after nickel-plating bath and closes self priming pump；Impactive nickel plating is carried out using high current density, the table in workpiece
Face prepares pure nickel prime coat；Nickel-plating bath is electroplated in Gravitative Loads lower edge nickel-plating bath flow channel total reflux to nickel plating
After liquid reservoir, two hand-operated valves on the flow channel of nickel-plating bath are turned off, open and be located at sealing plating station and electromagnetism
Hand-operated valve between flowmeter；Then composite plating is proceeded by.
Nickel plating is carried out according to immersion type electro-plating method, after the completion of nickel plating, need to be by workpiece transfer and installed in composite plating
On device.This process easily pollutes nickel coating surface, and to obtain and should as early as possible carry out composite plating after pure nickel prime coat, should not be
Stay longer in air, because the time of staying is longer, adsorbs more in the pollutant such as dust or oxygen of bottoming layer surface,
It is unfavorable for forming the good composite deposite of adhesion.The method that the present invention is provided need not be shifted and erector after nickel plating is completed
Part, so as to be avoided that this during pollution to pure nickel prime coat, also shortening carries out being stopped in atmosphere before composite plating
Time.Before carrying out Ni-SiC composite platings, one layer of nickel coating is first prepared on matrix as prime coat, can be effectively improved
Adhesion problem between Ni-SiC composite deposites and matrix.
When preparing Ni-SiC composite deposites, open with the hand-operated valve that is connected of sealing plating station water inlet and respectively be combined
Two hand-operated valves that two delivery ports of electroplate liquid reservoir are connected, flow backward to composite plating solution in sealing plating station compound
In electroplate liquid reservoir, until without remaining composite plating solution in sealing plating station, you can unclamp black box, remove and complete multiple
Close the workpiece of plating.
In sum, the present invention can realize three functions：(1) carry out before composite plating, start membrane pump, make compound electric
Plating solution is circulated along the close passage formed by composite plating solution reservoir, membrane pump and affluent channel, until SiC particulates exist
Even suspension in composite plating solution, it is not necessary to which auxiliary air is stirred or other mechanical agitations；(2) install after hollow work-piece, first
Impactive nickel plating is carried out in work piece inner surface, pure nickel prime coat is prepared, then carries out Ni-SiC composite platings, improve composite deposite and work
Adhesion between part matrix；(3) delivery port of sealing plating station is arranged on into upper fixture top, less volume flow can be adopted
Carry out composite plating.
The stirring of circulation electroplate liquid and air stirring phase are proposed in the innovation and creation of Application No. 201610810698.2
With reference to mode, and by the way of the agitating mode that the present invention is provided then is stirred using single circulation electroplate liquid.The present invention is adopted
The agitating mode has many advantages.First, cancel air stirring branch road, both reduced installation cost, energy-conserving and environment-protective are reduced again
The noise pollution that air compressor is caused, so as to solve the series of problems that air stirring branch road causes is arranged.Secondly, no
Need consider because the excessive generation of the volume flow of composite plating solution problem from composite plating solution to compressed air pump reflux, thus
Before composite plating, stirring can be circulated to composite plating solution using volume flow as big as possible, to improve operating efficiency.
3rd, the membrane pump of larger volume flow can be selected, because during composite plating, either completing into sealing plating station
The composite plating solution of composite plating solution reservoir is returned to after composite plating along main return flow line, or unnecessary edge backflow branch road leads to
The composite plating solution of road backflow composite plating solution reservoir, can play stirring action to the SiC in composite plating solution reservoir,
And the volume flow of membrane pump is bigger, mixing effect is better with efficiency.
Description of the drawings
The structural representation of the electroplanting device that Fig. 1 is provided for the present invention.
Fig. 2 is the method schematic diagram for improving composite deposite adhesion, wherein：I represents electronickelling process；II represents Ni-SiC
Composite plating process.In figure：
1. composite plating solution reservoir；2. membrane pump；3. electromagnetic flowmeter；4. plating station is sealed；5. rectifier power source is electroplated；
6. composite plating solution backflow main channel；7. composite plating solution backflow bypass passage；8. control panel；9. composite plating solution reservoir
Groove lid；10.pH is counted；11. liquid level gauges；12. thermocouples；13. heating tubes；14. composite plating solutions；15. upper water-out mouths；Go out under 16.
The mouth of a river；17. composite plating path manual valves；18. sealing plating station water inlets；19. lower clamps；20. hollow work-pieces；Press from both sides on 21.
Tool；22. sealing plating station upper water-out mouths；23. black boies；24. conductive anode rods；25. nickel-plating bath reservoirs；26. platings
Nickel plating solution；27. self priming pumps；28. nickel preplating path manual valves；29. sealing plating station discharge opeing hand-operated valves；30. sealing plating stations
Lower leakage fluid dram；31. composite plating solution main lines；32.Ni-SiC composite deposites；33. pure nickel prime coats.
Specific embodiment
It is dress that hollow work-piece inner surface to be plated prepares Ni-SiC composite deposites that the present embodiment is a kind of Q235 steel revolving body
Put, including composite plating solution circulates the flow channel of main channel and nickel-plating bath.
Described composite plating solution circulates main channel including composite plating solution reservoir 1, membrane pump 2, Electromagnetic Flow
Meter 3, sealing plating station 4 and composite plating solution backflow main channel 6.The flow channel of described nickel-plating bath is electroplated including nickel plating
Leakage fluid dram 30 under liquid reservoir 25, self priming pump 27 and sealing plating station.The composite plating solution circulate main channel every
Composite plating solution backflow bypass passage 7 is parallel between membrane pump 2 and electromagnetic flowmeter 3.
There is liquid outlet respectively in the bottom and middle part of the composite plating solution reservoir side, define electroplate liquid stirring mixed
Close path.By the electroplate liquid stirring mixing path composite plating solution can be made full use of to circulate the stirring action of generation, be made
It is respectively at composite plating solution reservoir to be sufficiently mixed with the SiC particulates of lower floor at the middle and upper levels, realizes uniform in composite plating solution
Distribution.Specifically：The lower discharging tube 16 and upper water-out pipe 15 being parallel to each other is externally connected with the composite plating solution reservoir, and is made
The arrival end of the lower discharging tube is connected with the liquid outlet of liquid storage trench bottom, is made in the middle part of the arrival end and reservoir of upper water-out pipe
Liquid outlet is connected；The port of export of the upper water-out pipe 15 is connected with lower discharging tube.The port of export and barrier film of the lower discharging tube 16
The entrance connection of pump 2.
The outlet of one end of composite plating solution main line 31 and the membrane pump 2, the composite plating solution main line
The other end is connected with the sealing plating station water inlet 18 of the lower clamp in sealing plating station 4；In the composite plating solution main line
Electromagnetic flowmeter 3 is serially connected with 31；Composite plating is serially connected between the electromagnetic flowmeter and the sealing plating station water inlet
Path manual valve 17.
Access between membrane pump 2 and the entrance of electromagnetic flowmeter 3 one end of the composite plating solution backflow bypass passage 7
On composite plating solution main line, the other end be located in the composite plating solution reservoir groove lid 9 at the top of composite plating solution reservoir 1
Inlet connection.There are pH meter 10, liquid level gauge 11, thermocouple 12 and heating tube 13 in the composite plating solution reservoir, its
Middle liquid level gauge 11, thermocouple 12 and heating tube 13 are connected by wire with control panel 8.
The sealing plating station 4 is improved prior art and obtained.The sealing plating station includes lower clamp 19, upper fixture
21st, conductive anode rod 24；It is used to lay hollow work-piece 20 between the lower clamp 19 and upper fixture 21；The lower clamp lower end it is close
Envelope plating station water inlet 18 passes through pipeline connection with the outlet of the electromagnetic flowmeter 3.Conductive anode rod 24 is located at upper fixture
Upper surface, and be connected with the positive pole of plating rectifier power source 5 by wire, the negative pole of the plating rectifier power source 5 and the hollow work
Part connects.Hollow work-piece 20 is located between lower clamp and upper fixture, so that described composite plating solution circulates main channel
With the inner chamber insertion of the hollow work-piece.The plating chamber delivery port of upper fixture is by pipeline and the composite plating solution reservoir 1
Water inlet is connected.
There is plating chamber delivery port in the upper surface of the upper fixture, the delivery port is by pipeline and is located at the composite plating
Inlet connection in liquid reservoir groove lid, defines composite plating solution backflow main channel 6.
The flow channel of described nickel-plating bath includes nickel-plating bath reservoir 25, self priming pump 27 and sealing plating station
Lower leakage fluid dram 30.Pore is provided with the top cover of the nickel-plating bath reservoir 25, one end of nickel-plating bath pipeline is accessed should
Pore, the other end of nickel-plating bath pipe accesses composite plating solution main line 31.Connect successively on the nickel-plating bath pipeline
Self priming pump 27 and nickel preplating path manual valve 28 are connected to, and connect the inlet of the self priming pump 27 and nickel-plating bath reservoir 25
Logical, the liquid outlet for making the self priming pump 27 is connected with the inlet of the nickel preplating path manual valve.
One section of nickel-plating bath discharging tube is connected with by three-way connection on the nickel-plating bath pipeline, the nickel plating electricity
The other end of plating solution discharging tube is connected with the nickel-plating bath leakage fluid dram of lower clamp 19；Pacify on the nickel-plating bath discharging tube
Equipped with sealing plating station discharge opeing hand-operated valve 29.
When nickel plating is carried out, composite plating path manual valve 17 is first closed, open nickel preplating path manual valve 28 and sealing
Plating station discharge opeing hand-operated valve 29, starts self priming pump 27, and nickel-plating bath is simultaneously from leakage fluid dram 30 under sealing plating station and sealing electricity
Plating platform water inlet 18 enters sealing plating station 4.Full of after nickel-plating bath in plating chamber in the sealing plating station 4, close
Self priming pump 27, nickel preplating path manual valve 28 and sealing plating station discharge opeing hand-operated valve 29 allow nickel-plating bath to be retained in plating chamber
Carry out impactive nickel plating.After the completion of nickel plating, nickel preplating path manual valve 28 and sealing plating station discharge opeing hand-operated valve 29 are opened, allow nickel plating
Electroplate liquid flows out from leakage fluid dram 30 under sealing plating station and sealing plating station water inlet 18 simultaneously, returns to nickel-plating bath reservoir
In 25, nickel preplating path manual valve 28 and sealing plating station discharge opeing hand-operated valve 29 are turned off, open composite plating path manual valve
17, start normal composite plating.The coating for carrying out electroplating acquisition using the process is answered by pure nickel prime coat 32 and Ni-SiC
Close coating 33 to constitute, the adhesion of coating and matrix can be significantly improved.
The present invention provide circulation electroplanting device operation principle be：First the composite plating solution 14 in reservoir 1 is carried out
Preliminary treatment before plating, preliminary treatment mainly includes heating electroplate liquid, adjusts pH, adds new electroplate liquid, air stirring etc.
Preparation, the parameter of electroplate liquid is reached after qualified electroplating technology requirement, and in the case where membrane pump 2 drives, composite plating solution 14 is from storage
The lower discharging tube 16 and/or upper water-out pipe 15 of the bottom of liquid bath 1 is exited into liquid-transport pipe-line and started the cycle over, after membrane pump 2
Electroplate liquid flows into sealing plating station 4, completes composite plating.The composite plating solution after composite plating is completed from positioned at upper fixture upper end
Sealing plating station upper water-out mouth 22 by composite plating solution flow back main channel 6 be back in composite plating solution reservoir 1, complete
The circulation electroplating process of composite plating solution.When the composite plating solution total reflux in sealing plating station 4 is stored up to composite plating solution
After liquid bath, black box 23 is unclamped, remove the workpiece for completing composite plating.
The required composite plating solution when the amount of the composite plating solution exported by membrane pump 2 is more than to workpiece composite plating
When, unnecessary composite plating solution is back in composite plating solution reservoir 1 via composite plating solution backflow bypass passage 7, to drop
Pressure in low composite plating solution main line 31.
Claims (5)
1. a kind of hollow work-piece inner surface prepares the device of Ni-SiC composite deposites, including composite plating solution circulates main leading to
Road, it is characterised in that also including the flow channel of nickel-plating bath；Described composite plating solution circulates main channel to be included again
Close electroplate liquid reservoir, membrane pump, electromagnetic flowmeter, sealing plating station, composite plating solution main line and composite plating solution backflow
The outlet of main channel, wherein one end of composite plating solution main line and the membrane pump, the composite plating solution main line
The other end is connected with the sealing plating station water inlet of the lower clamp in sealing plating station；Electromagnetic flowmeter is serially connected in the compound electric
On plating solution main line；Nickel-plating bath reservoir hand is serially connected between the electromagnetic flowmeter and the sealing plating station water inlet
Dynamic valve；The flow channel of described nickel-plating bath includes discharge opeing under nickel-plating bath reservoir, self priming pump and sealing plating station
Mouthful；Circulate in the composite plating solution and be parallel between the membrane pump of main channel and electromagnetic flowmeter composite plating solution backflow
Bypass passage；Access answering between membrane pump and electromagnetic flowmeter entrance in one end of the composite plating solution backflow bypass passage
Close electroplate liquid main line on, the other end be located at composite plating solution reservoir at the top of composite plating solution reservoir groove lid on entering
Liquid mouth is connected.
2. hollow work-piece inner surface as claimed in claim 1 prepares the device of Ni-SiC composite deposites, it is characterised in that described close
There is plating chamber delivery port the upper surface of the upper fixture in envelope plating station, and the delivery port is by pipeline and is located at the composite plating solution
Inlet connection in reservoir groove lid, defines composite plating solution backflow main channel.
3. hollow work-piece inner surface as claimed in claim 1 prepares the device of Ni-SiC composite deposites, it is characterised in that described
The flow channel of nickel-plating bath includes leakage fluid dram under nickel-plating bath reservoir, self priming pump and sealing plating station；The nickel plating
Be provided with pore on the top cover of electroplate liquid reservoir, the pore is accessed in one end of nickel-plating bath pipeline, nickel-plating bath pipe it is another
Access composite plating solution main line in one end；It is connected with self priming pump and nickel preplating passage hand in turn on the nickel-plating bath pipeline
Dynamic valve, and the inlet of the self priming pump is connected with nickel-plating bath reservoir, make the liquid outlet of the self priming pump and the preplating
The inlet connection of nickel path manual valve.
4. hollow work-piece inner surface as claimed in claim 1 prepares the device of Ni-SiC composite deposites, it is characterised in that described
One section of nickel-plating bath discharging tube is connected with by three-way connection on nickel-plating bath pipeline, the nickel-plating bath discharging tube it is another
One end connects with the nickel-plating bath leakage fluid dram of lower clamp；Sealing plating station row is installed on the nickel-plating bath discharging tube
Liquid hand-operated valve.
5. hollow work-piece inner surface as claimed in claim 1 prepares the device of Ni-SiC composite deposites, it is characterised in that described
Liquid outlet is arranged at the bottom and middle part of composite plating solution reservoir side, is connected with lower discharging tube and upper water-out pipe respectively, and makes
The arrival end of the lower discharging tube is connected with the liquid outlet of liquid storage trench bottom, is made in the middle part of the arrival end and reservoir of upper water-out pipe
Liquid outlet is connected；The port of export of the upper water-out pipe is connected with lower discharging tube；The port of export of the lower discharging tube and membrane pump
Entrance is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN107130232A (en) * | 2017-05-25 | 2017-09-05 | 山西北方机械制造有限责任公司 | A kind of method of big-and-middle-sized pipe part inwall topical nickel galvanization phosphorus alloy |
| CN110344104A (en) * | 2019-08-21 | 2019-10-18 | 山东新海表面技术科技有限公司 | Engine cylinder intracoelomic cavity electroplating device |
| CN111441073A (en) * | 2020-05-11 | 2020-07-24 | 西北工业大学 | Plating cavity capable of improving uniformity of Ni-SiC composite plating layer on inner wall of hollow part |
| CN111593381A (en) * | 2020-05-09 | 2020-08-28 | 西北工业大学 | Anode device for preparing Ni-SiC composite coating on inner wall of hollow part |
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| CN107130232A (en) * | 2017-05-25 | 2017-09-05 | 山西北方机械制造有限责任公司 | A kind of method of big-and-middle-sized pipe part inwall topical nickel galvanization phosphorus alloy |
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| CN111441073B (en) * | 2020-05-11 | 2022-03-25 | 西北工业大学 | Plating cavity capable of improving uniformity of Ni-SiC composite plating layer on inner wall of hollow part |
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