CN102330125B - Array electrode cavity for jet electrodeposition - Google Patents

Array electrode cavity for jet electrodeposition Download PDF

Info

Publication number
CN102330125B
CN102330125B CN 201110269330 CN201110269330A CN102330125B CN 102330125 B CN102330125 B CN 102330125B CN 201110269330 CN201110269330 CN 201110269330 CN 201110269330 A CN201110269330 A CN 201110269330A CN 102330125 B CN102330125 B CN 102330125B
Authority
CN
Grant status
Grant
Patent type
Prior art keywords
array
electrode
cavity
jet
electrodeposition
Prior art date
Application number
CN 201110269330
Other languages
Chinese (zh)
Other versions
CN102330125A (en )
Inventor
沈理达
邱明波
高雪松
王桂峰
刘志东
田宗军
黄因慧
Original Assignee
南京航空航天大学
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Abstract

一种喷射电沉积加工用阵列电极腔,其特征是它包括顶盖、腔体、套管、阵列电极、密封环、刚性挡环及收紧螺母,其中:顶盖与腔体螺纹连接,套管夹持阵列电极,阵列电极上依次串联弹性密封圈、挡环,腔体和螺帽之间设有螺纹连接。 A spray electrodeposition process chamber with an electrode array, characterized in that it comprises a cap, the cavity, the sleeve, the electrode array, the sealing ring, the retaining ring and the rigid tightening nut, wherein: a threaded connection with the cavity roof, sleeve tube clamp electrode array, the electrode array series in this order on an elastic sealing ring, snap ring, it is provided with a threaded connection between the cavity and the nut. 通过旋紧腔体和螺帽,使套管顶端收紧,实现对阵列电极的夹紧以及对弹性密封圈和挡环压紧,并通过挡环限制阵列电极伸出的截面形状。 By screwing a nut cavity and the top of the sleeve to tighten, to achieve the clamping of an array of electrodes, and an elastic pressing ring and the retaining ring, the retaining ring and by limiting the cross-sectional shape of the projecting electrode array. 本发明可以在电极腔的底部形成任意截面形状和轮廓的阵列电极喷头,从而能够获得均匀的喷射电沉积加工电场和流场,提高电沉积电流密度,提高金属离子的局部浓度,防止电沉积中的氧化,最终提高电沉积效率和质量,通过设计不同形状的阵列电极腔及控制电极的导通,可以实现特殊结构电沉积零件加工。 The present invention may be formed of an array of electrode head arbitrary cross-sectional shape and contours of the bottom of the electrode chamber, it is possible to obtain a uniform spray electrodeposition process field and the flow field, improving the electrodeposition current density, increase the local concentration of metal ions to prevent electrodeposition oxidation, and ultimately improve the quality and efficiency of electrodeposition, by designing an array of different shapes of electrodes and a control electrode chamber, can achieve special structural parts electrodeposition process.

Description

喷射电沉积加工用阵列电极腔 Injection electrodeposition electrode array processing chamber

技术领域 FIELD

[0001] 本发明涉及一种特种加工技术领域,尤其是一种电沉积技术,具体地说是一种喷射电沉积加工用阵列电极腔。 [0001] The present invention relates to a special processing technology, and in particular an electrodeposition techniques, in particular to an electrodeposition process with an array of the ejection electrode chamber.

背景技术 Background technique

[0002] 传统电沉积技术(电铸和电镀)由于浓差极化、电场分布不均匀和析氢等因素的影响,往往会导致可用电流密度和电流效率低、加工时间长、电沉积层均匀性差,且易出现针孔、麻点、铸层烧焦等缺陷。 [0002] The conventional electrodeposition (electroforming and electroplating) due to the factors of concentration polarization, the electric field distribution non-uniform and hydrogen evolution and the like, often resulting in a low available current density and current efficiency, long processing time, deposits a uniform electrical difference and prone to pinholes, pitting, casting defects such as burning layer. 喷射电沉积技术是将含有金属离子的电解液以高速射流的形式,在计算机的控制下高速冲向阴极,并进行区域选择性电沉积。 Electrodeposition is injected an electrolyte solution containing metal ions in the form of high velocity jets, under computer control the high speed toward the cathode, electrodeposition and regioselectivity.

[0003] 射流电沉积技术可以有效克服上述传统电沉积存在的一些缺陷和局限性,并具有其无法比拟的优势,如:(1)电解液高速喷射到阴极表面,以强烈的紊流形式流动,使阴极表面的金属离子得到迅速地补充,提高了极限电流密度,为金属离子的迁移提供了强大的动力,其电流密度可以远高于其它电沉积工艺,使单位沉积速率提高几十倍至上百倍,从而克服了传统电沉积技术存在的单位加工时间长以及析氢带来的沉积层缺陷等问题;(2)喷射电沉积技术较高的电流密度可以产生更高的电化学极化,有利于获得组织致密、晶粒细化的沉积层;(3)在高速射流的冲击下,电沉积产生的氢气泡难以吸附在阴极表面,降低了沉积层产生氢脆、针孔和麻点等缺陷的可能。 [0003] Jet electrodeposition technique can overcome some of the aforementioned drawbacks and limitations of conventional electrodeposited and has its incomparable advantages, such as: (1) to the cathode surface of the electrolytic solution high-speed jet flow to form a strong turbulence the metal ions of the cathode surface is rapidly replenished, improved limiting current density, provide a strong impetus for the transition metal ions, the current density may be much higher than other electrodeposition processes, the deposition rate increases the unit several times supremacy times, thereby overcoming the problems of conventional electrodeposition techniques and long processing times per unit of hydrogen evolution deposited layer defects caused problems; (2) a high injection current density electrodeposition technique can produce a higher electrochemical polarization, is conducive obtaining dense grain refinement of the deposited layer; (3) the impact of the jet at high speed, electrodeposition is difficult to adsorb the hydrogen bubbles generated on the cathode surface, reducing the hydrogen embrittlement of the deposited layer defects, such as pinholes and pock may.

[0004] 但是,目前喷射电沉积技术同样存在较多的不足之处,如:(I)在喷射液流径向截面上的电场和流场分布不均匀,使得喷射电沉积沉积过程不均匀,表现为厚度不一致、表面凹凸不平等;(2)在喷射电沉积高电流密度条件下,会扩大结晶过程的择优生长特点,会加剧喷射电沉积的沉积不均匀性;(3)现有喷射电沉积技术在阳极腔上使用非金属材料(工程塑料、树脂等)作为喷嘴材料,这种具有瓶颈(喷射口)的细长结构不仅会极大的增加阴阳两极的间距,而且会极大的提高喷射口处的电阻;(4)为了提高射流电场和流场分布均匀性而采用细小喷嘴方式时,总体的电沉积加工效率会极大降低。 [0004] However, there also exists the ejection electrodeposition techniques more deficiencies, such as: (I) in the radial cross-section of the spouted streams and the electric field distribution non-uniform flow, so that the injection during the deposition uneven electrodeposition, It showed inconsistent thickness, uneven surface and the like; (2) at a high injection current density electrodeposition, preferential growth characteristics expand the crystallization process, will exacerbate the deposition non-uniformity of the electrodeposition injection; (3) conventional electric injection deposition techniques using non-metallic materials (plastics, resins, etc.) on the anode chamber as the material of the nozzle, which has a neck (ejection port) of the elongated structure not only greatly increases the pitch of the poles of Yin and Yang, and will greatly increase the resistance at the ejection port; (4) in order to improve the distribution of the electric field and the jet flow field uniformity and the use of fine nozzles embodiment, the overall electrical efficiency of the deposition process will greatly reduce. 上述因素严重制约了射流电沉积技术的应用与发展。 These factors severely restricted the application and development of jet electrodeposition technology. ` `

发明内容 SUMMARY

[0005] 本发明的目的是针对现有的喷射电沉积加工效率低,沉积质量差的问题,提供一种能够均匀喷射电沉积加工的电场和流场,提高其电流密度和沉积速度,并使其可以用于复杂曲面的电沉积加工的喷射电沉积加工用阵列电极腔。 [0005] The object of the present invention is directed to a low electrical current injection efficiency of the deposition process, the difference of the deposition quality problems, to provide a uniform injection electrodeposition processing field and the flow field, the current density and increase the deposition rate, and which can be used in the electrodeposition process complex surfaces spray electrodeposition process chamber with an array of electrodes.

[0006] 本发明的技术方案是: [0006] aspect of the present invention is:

[0007] 一种喷射电沉积加工用阵列电极腔,其特征是它包括: [0007] An injector electrodeposition machining array electrode chamber, characterized in that it comprises:

[0008] 一顶盖1,该顶盖I的一端与输送电解液的进液管相连,另一端带有外螺纹,它的中心设有供电解液通过的通孔; [0008] a cover 1, an end of the cap to the conveying I electrolytic solution inlet tube and the other end with an external thread, its center a through hole for passing the electrolyte;

[0009] 一腔体2,该腔体2的一端设有与前述的顶盖I的外螺纹相配的内螺纹,它的另一端的外部设有连接外螺纹,内部设有一个正锥台形内腔;[0010] 一套管3,该套管3的上端外表面呈锥形结构,该锥形结构插入前述腔体2的正锥台形内腔中,所述锥形结构的管壁上开有沿径向的收紧用槽口8 ; [0009] a chamber 2, one end of the chamber 2 is provided with an external thread of the cap mating internal thread I, which is outside the other end is provided with an externally threaded connection, provided with a positive internal frustum chamber; [0010] a sleeve 3, an upper end of the outer surface is tapered configuration of the sleeve 3, which is inserted into the tapered cavity structure n frustum inner chamber 2, the opening of the tapered tube wall structure there radially tightened with slot 8;

[0011] 一阵列电极4,该阵列电极4由多根中空的薄壁棒状结构组成,中空的薄壁棒状结构的中间设有供电解液通过的通孔,所述阵列电极4的主体被夹紧于前述的套管3中; [0011] a 4 electrode array, the electrode array 4 by a plurality of hollow thin-walled structure consisting of a rod, an intermediate thin-walled hollow rod-like structure is provided with through holes for the electrolytic solution, the electrode array body 4 is sandwiched tightly to the sleeve 3;

[0012] 一密封环5,该密封环5安装在套管3的端部及刚性挡环6之间,所述的密封环5和刚性挡环6的中心均设有供阵列电极4伸出的通孔,阵列电极的截面形状与刚性挡环6中心的通孔的形状相配; [0012] a sealing ring 5, the seal ring 5 is mounted between the end sleeve 3 and the rigidity of the slinger 6, the center of the seal ring 5 and the rigid retaining ring 6 are provided for projecting an array of electrodes 4 through-holes, an electrode array sectional shape of the through hole of the rigid central ring gear 6 match;

[0013] 一收紧螺母7,该收紧螺母7的一端通过内螺纹与腔体2上的外螺纹相连,它的另一端通过台阶体与前述刚性挡环6的台阶面相抵,从而将刚性台阶体6、密封环5和套管3固定在腔体2中。 [0013] 7 a tightening nut, the tightening of the nut 7 is connected to one end of the external thread on the screw 2 and through the inner chamber, the other end by the rigid body and the stepped retaining ring against the stepped surface 6, whereby the rigid step 6, and the sealing ring 5 fixed to the sleeve 3 in the cavity 2.

[0014] 所述的阵列电极4由中空的薄壁棒状结构的电极集束而成,中空的薄壁棒状的通孔的截面可以为圆形、三角形、四边形、五边形、六边形等形式中的一种或几种的组合。 [0014] The electrode 4 is an electrode array of rod-like bundle of thin walled hollow structures together, a thin-walled section of the through-hole of the hollow rod-shaped may be circular, triangular, quadrangular, pentagonal, hexagonal and other forms of a combination of one or more.

[0015] 所述的组成阵列电极4的管状体的电解液进口端能根据沉积体的形状开或闭。 [0015] The composition of the electrolytic solution inlet end of the tubular electrode array body 4 can be open or closed depending on the shape of the deposited body.

[0016] 本发明的有益效果: [0016] Advantageous effects of the invention:

[0017] (I)本发明采用阵列电极直接形成喷射电沉积的喷嘴,提高了喷射电沉积加工时电场和流场的均匀性,同时可以极大缩短阴阳两级的间距,提高喷嘴处的电沉积液通过能力,提高电沉积加工的速度和质量。 [0017] (I) of the present invention employs an array of electrodes directly formed on electrodeposition injection nozzle, the injection electrodeposition improving processing field and the flow field uniformity, and can greatly shorten the pitch of two yin and yang, to improve the electrical nozzle capacity bath, electrodeposition improving processing speed and quality.

[0018] (2)本发明通过挡环能够限制阵列电极伸出的截面形状,可以根据加工所需喷头截面的形状,设计具有相同内侧轮廓的弹性密封圈和挡环,获得选择性更好的流场和电场。 [0018] (2) The present invention can be restricted by the snap ring cross-sectional shape of the protruding electrode array, cross-sectional shape of the head may be processed according to the desired design having the same inner contour of the elastic sealing ring and the retaining ring, to obtain a better selectivity flow field and electric field.

[0019] (3)本发明通过腔体、套管和螺帽的配合,使套管顶端收紧,可以实现对阵列电极可靠、稳定的装夹,并可以形成任意截面轮廓的喷嘴。 [0019] (3) through the chamber of the present invention, with the sleeve and nut, tightening the top of the sleeve, the electrode array can be realized clamping reliable and stable, and can be formed of any cross-sectional profile of the nozzle.

[0020] (4)本发明可以在电极腔的底部形成任意截面形状和轮廓的阵列电极喷头,从而能够获得均匀的喷射电沉积加工电场和流场,提高电沉积电流密度,提高金属离子的局部浓度,防止电沉积中的氧化,最终提高电沉积效率和质量,通过设计不同形状的阵列电极腔及控制电极的导通,可以实现特殊结构电沉积零件加工。 [0020] (4) The present invention may be formed of an array of electrode head arbitrary cross-sectional shape and contours of the bottom of the electrode chamber, it is possible to obtain a uniform spray electrodeposition process field and the flow field, improving the electrodeposition current density, improve the local metal ion concentration, to prevent oxidation of the electrodeposition, the electrodeposition ultimately improve the efficiency and quality, by designing an array of different shapes of electrodes and a control electrode chamber, can achieve special structural parts electrodeposition process.

附图说明 BRIEF DESCRIPTION

[0021] 图1是本发明的立体分解结构示意图。 [0021] FIG. 1 is an exploded perspective view of the structure of the present invention.

[0022] 图2是本发明的剖视结构示意图。 [0022] FIG. 2 is a schematic cross-sectional view of the structure of the present invention.

[0023] 图3是本发明的回形阵列电极的端面示意图。 [0023] FIG. 3 is an end schematic view of an array-shaped back electrode of the present invention.

[0024] 图4是利用图3所述的阵列电极加工的沉积体的结构示意图。 [0024] FIG. 4 is a schematic view of an array of electrodes deposited body 3 of the processing using FIG.

具体实施方式 detailed description

[0025] 下面结合附图和实施例对本发明作进一步的说明。 Drawings and embodiments of the present invention will be further described [0025] below in conjunction.

[0026]如图 1、2、3、4 所示。 [0026] FIG 1,2,3,4 FIG.

[0027] 一种喷射电沉积加工用阵列电极腔,如图1至图2所示,它顶盖1、腔体2、套管3、阵列电极4、密封环5、刚性挡环6及收紧螺母7。 [0027] An injector electrodeposition machining array electrode chamber, as shown in FIG. 1 to FIG. 2, the cap 1 it is, the cavity 2, the sleeve 3, an array of electrodes 4, 5 the sealing ring, the retaining ring 6 and the rigid closed nut 7. 其中:顶盖I与腔体2螺纹连接,套管3夹持阵列电极4,阵列电极4上依次串联密封环5、刚性挡环6,腔体2和收紧螺母7之间通过螺纹连接。 Wherein: I is connected to the cap 2 threaded cavity, the clamping sleeve 3 array electrode 4, the electrode array 5 are sequentially connected in series on the sealing ring 4, the rigid retaining ring 6, and the chamber 2 by a threaded connection between the tightening nut 7. 通过旋紧腔体2和收紧螺母7,使套管3顶端收紧,实现对阵列电极4的夹紧以及对密封环5和刚性挡环6的压紧,并通过挡环6限制阵列电极伸出的截面形状,如图2所示。 2 by screwing and tightening the nut cavity 7, to tighten the sleeve 3 to the top, to achieve the clamping electrode arrays 4 and 6 an array of electrodes limits the sealing ring 5 and a rigid retaining ring 6 is pressed, and by retaining ring projecting the cross-sectional shape, as shown in FIG. 详述如下: Detailed below:

[0028] 所述的顶盖I内部开有中心孔以压入电解液,顶盖I外侧一端设有与输送电解液的进液管相匹配的环形接口;顶盖I外侧中间段为外六角结构,便于扳手对顶盖I的旋紧;顶盖I外侧另一端设有螺纹结构以连接腔体。 I inside the top cover [0028] according to opening a central hole pressed into the electrolyte, the outer end cap I is provided with liquid inlet tube conveying electrolyte interfaces annular matched; I outer cover intermediate section of hex structure, easy to tighten the cap wrench I; the other end of the outer cover is provided with the thread structure I is connected to the chamber.

[0029] 所述的腔体2内部开有中心孔以传输电解液,腔体2外侧一端为外六角结构,其内部设有与顶盖I相连接的内螺纹;另一端设有外螺纹结构以连接螺帽7,其内部设有与套管3相配合的锥面。 [0029] The internal cavity 2 has a central bore open to transfer the electrolytic solution, one end of the cavity 2 outside of outer hexagonal structure, inside which an internal thread and the cap is connected to I; the other end is provided with an external thread structure 7 is connected to the nut, which is provided inside the sleeve 3 cooperating tapered surfaces.

[0030] 所述的套管3外侧面设有锥面,沿外侧面圆周方向设有均匀分布的收紧用槽口8,以实现对阵列电极4的夹紧,其内侧截面为圆形,如图1所示。 3 the sleeve outer surface [0030] of the tapered surface is provided with notches uniformly distributed tightened with an outer side surface 8 along the circumferential direction, in order to achieve a clamping electrode array 4, which is inside a circular cross section, As shown in Figure 1.

[0031] 所述的阵列电极4由中空的薄壁棒状结构的电极集束而成,其截面可以为圆形、三角形、四边形、五边形、六边形中的一种或几种的组合。 [0031] The electrode 4 is an electrode array of rod-like bundle of thin-walled hollow structure formed, which cross-section may be circular, triangular, quadrangular, pentagonal, hexagonal one or a combination of several.

[0032] 所述的密封环5内侧截面形状与阵列电极4伸出的截面形状相匹配,其外侧轮廓为圆形。 [0032] The sectional shape of protruding cross-sectional shape of the array electrodes 4 inside the seal ring 5 matches its outside contour is circular.

[0033] 所述的刚性挡环6为中空环状结构,用以限制阵列电极4伸出的截面形状,其外侧轮廓为圆形凸台结构。 [0033] The retaining ring 6 is rigid hollow annular structure, to limit the cross-sectional shape projecting electrode array 4, which is a circular outer profile boss structure. 可以根据所需要喷头截面的形状设计具有相同内侧轮廓的挡环6,只有完全处于挡环6内轮廓范围中的阵列电极4才会伸出来,形成喷射电沉积的喷头。 Retaining ring may have the same inner contour shape of the design according to the desired cross section of the nozzle 6, only the electrode array is fully within the scope of the contour of the retaining ring 6 4 will be extended, form the injection nozzle electrodeposition.

[0034] 所述的收紧螺母7外侧一端为外六角结构,其内侧设有与腔体2相连的内螺纹结构;另一端设有和刚性挡环6凸台结构相配合的阻挡面。 Tightening the nut [0034] 7, the outer end of the outer hexagonal structure, inside which an internal thread is connected to the structure of the cavity 2; and the other end of the rigid retaining ring 6 is provided with a boss structure cooperating blocking surface.

[0035] 本发明的工作原理是: [0035] The working principle of the present invention are:

[0036] 顶盖I和腔体2之间通过螺母进行连接,顶盖I的一端与输送电解液的进液管相连,强迫电解液进入阵列电极腔。 [0036] I and the cavity between the cap 2 is connected by a nut, with one end connected to the I conveying the electrolytic solution inlet tube cap, forcing the electrolyte into the electrode chamber array. 套管3非夹紧端端面与密封环5、刚性挡环6顶触,而其夹紧端外侧开槽锥面与腔体2的内侧锥面相配合。 3 non-clamping sleeve-side end face of the sealing ring 5, the rigidity of the slinger 6 touch, while the grooved end of the outer clamping cone and the cavity inner tapered surface cooperating 2. 通过螺纹连接旋进收紧螺母7和腔体2,腔体2通过其内侧锥面对套管3收紧端提供径向收紧力来实现对阵列电极4的可靠装夹,同时套管3非夹紧端端面对刚性挡环6和弹性密封环5提供轴向压紧力,实现对电解液喷射加工时的密封。 By screwing the tightening nut 7 is screwed into the cavity 2 and the sleeve 3 provide a radial tightening force to tighten the end to achieve reliable clamping of the electrode array 2 facing the cavity 4 through which the inner cone, while the sleeve 3 non-rigid clamping end to end facing the retaining ring 6 and the elastic sealing ring 5 to provide an axial clamping force, at the time of sealing the electrolyte injection process. 其中弹性密封环5及刚性挡环6的内侧截面形状根据实际需要喷头的截面形状进行设计。 Wherein the elastic sealing ring 5 and the inner sectional shape of the rigid ring gear 6 is designed according to the actual needs of the sectional shape of the nozzle. 图3是一种通过控制阵列电极的开闭形成的回形阵列电极的示意图,图中黑色部分表示流场通,白色部分表示流场关闭。 3 is a schematic meandering electrode array formed by an array of electrodes to control the opening and closing, and the black portion of a flow field through the white part represents the flow field off. 图3所示的阵列电极可以电沉积形成如图4所示回形金属结构。 The electrode array shown in FIG. 3 may be formed by electrodeposition meander-shaped metal structure shown in Figure 4. 由此可见,具体实施时只需控制阵列电极中每根电极的通断就可设计出复杂形杂的喷嘴结构,从而沉积出复杂形状的结构体。 Thus, only the control electrode array off each electrode of the specific embodiments can be devised complex nozzle structure complicated shape, thereby depositing the structure complicated shape.

[0037] 以上仅给出了一种较为详细的实施方式和具体的操作过程,但本发明的保护范围不限于下述的实施例。 [0037] The above gives a more detailed and specific embodiments of operation only, but the scope of the present invention is not limited to the following examples.

[0038] 本发明未涉及部分均与现有技术相同或可采用现有技术加以实现。 [0038] The present invention relates to non-parts are to be employed to achieve the same prior art or prior art.

Claims (3)

  1. 1.一种喷射电沉积加工用阵列电极腔,其特征是它包括: 一顶盖(1),该顶盖(I)的一端与输送电解液的进液管相连,另一端带有外螺纹,它的中心设有供电解液通过的通孔; 一腔体(2),该腔体(2)的一端设有与前述的顶盖(I)的外螺纹相配的内螺纹,它的另一端的外部设有连接外螺纹,内部设有一个正锥台形内腔; 一套管(3),该套管(3)的上端外表面呈锥形结构,该锥形结构插入前述腔体(2)的正锥台形内腔中,所述锥形结构的管壁上开有沿径向的收紧用槽口(8);一阵列电极(4),该阵列电极(4)由多根中空的薄壁棒状结构组成,中空的薄壁棒状结构的中间设有供电解液通过的通孔,所述阵列电极(4)的主体被夹紧于前述的套管(3)中;一密封环(5 ),该密封环(5 )安装在套管(3 )的端部及刚性挡环(6 )之间,所述的密封环(5)和刚性挡环(6)的中心均设有供阵列电极(4)伸出的 An electrodeposition machining jet array electrode chamber, characterized in that it comprises: a cap (1), the cover (I) and the delivery end of the electrolytic solution inlet tube connected to the other end of the externally threaded its center a through hole for passing the electrolyte; a cavity (2), one end of the cavity (2) is provided with an external thread of the cap (I) of the matching internal threads, its other one end of the external connector is provided with an external thread, provided with a positive internal frustoconical lumen; a sleeve (3), the sleeve (3) of the upper outer surface is tapered structure, the tapered structure is inserted into the cavity ( 2) positive frustoconical inner chamber, the tapered tube wall structure is opened radially tightened with a notch (8); an array of electrodes (4), the electrode array (4) by a plurality of a rod-shaped hollow thin-walled structures, the intermediate thin-walled hollow rod-like structure is provided with through holes for the electrolytic solution, the electrode array body (4) is clamped in the sleeve (3); and a seal ring (5), the seal ring (5) is mounted between the sleeve (3) and the rigid end portion of the slinger (6), the center of the sealing ring (5) and a rigid retaining ring (6) are located overhang for the electrode array (4) 孔,阵列电极的截面形状与刚性挡环(6)中心的通孔的形状相配; 一收紧螺母(7),该收紧螺母(7)的一端通过内螺纹与腔体(2)上的外螺纹相连,它的另一端通过台阶体与前述刚性挡环(6)的台阶面相抵,从而将刚性台阶体(6)、密封环(5)和套管(3)固定在腔体(2)中。 Hole, and the cross-sectional shape of the array shape of the through-hole electrodes of a rigid retaining ring (6) matched to the center; a tightening nut (7), one end of the tightening nut (7) through the internal threads of the cavity (2) external thread connected, by its other end against the rigid body and the stepped retaining ring (6) of the stepped surface, whereby the rigidity of the step (6), the sealing ring (5) and the sleeve (3) is fixed in the cavity (2 )in.
  2. 2.据权利要求1所述的喷射电沉积加工用阵列电极腔,其特征是所述的阵列电极(4)由中空的薄壁棒状结构的电极集束而成,中空的薄壁棒状的通孔的截面为圆形、三角形、四边形、五边形和六边形中的一种或几种的组合。 Injection electrodeposition process according to an array of electrodes with a thin-walled chamber through hole 2. It is a rod-shaped hollow claim, wherein said electrode array (4) of the electrode bundle of the rod-shaped hollow thin-walled structure together, the combination of circular cross-section as a triangle, quadrangle, pentagon and hexagon or of several.
  3. 3.根据权利要求1或2所述的喷射电沉积加工用阵列电极腔,其特征是所述的组成阵列电极(4)的管状体的电解·液进口端能根据沉积体的形状开或闭。 The injection electrodeposition process of claim 1 or claim 2 with an array of electrode chamber, wherein said electrode array composed of (4) an electrolytic liquid inlet · end of the tubular body can be open or closed depending on the shape of the deposited body .
CN 201110269330 2011-09-13 2011-09-13 Array electrode cavity for jet electrodeposition CN102330125B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201110269330 CN102330125B (en) 2011-09-13 2011-09-13 Array electrode cavity for jet electrodeposition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201110269330 CN102330125B (en) 2011-09-13 2011-09-13 Array electrode cavity for jet electrodeposition

Publications (2)

Publication Number Publication Date
CN102330125A true CN102330125A (en) 2012-01-25
CN102330125B true CN102330125B (en) 2013-08-14

Family

ID=45482083

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201110269330 CN102330125B (en) 2011-09-13 2011-09-13 Array electrode cavity for jet electrodeposition

Country Status (1)

Country Link
CN (1) CN102330125B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104947172A (en) * 2014-03-28 2015-09-30 通用电气公司 Electroplating tool and use method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4762135A (en) 1985-08-30 1988-08-09 Puije P D V D Cochlea implant
CN2173791Y (en) 1993-09-30 1994-08-10 李可瑞 Fast replacing type total enclosed tube electrode device
US5928143A (en) 1996-03-29 1999-07-27 Arizona Board Of Regents On Behalf Of The University Of Arizona Implantable multi-electrode microdrive array
CN1341166A (en) 1999-12-24 2002-03-20 株式会社荏原制作所 Semiconductor wafer electroplating and electrolyzing apparatus and method
DE10055722A1 (en) 2000-11-10 2002-05-29 Eder Bernd Swimming pool water purified by submerged direct current electrodes with periodically reversed polarity

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030236562A1 (en) * 2000-10-10 2003-12-25 Kuzma Janusz A. Band type multicontact electrode and method of making the same
US8116886B2 (en) * 2005-10-14 2012-02-14 The Trustees Of Columbia University In The City Of New York Electrode arrays and systems for inserting same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4762135A (en) 1985-08-30 1988-08-09 Puije P D V D Cochlea implant
CN2173791Y (en) 1993-09-30 1994-08-10 李可瑞 Fast replacing type total enclosed tube electrode device
US5928143A (en) 1996-03-29 1999-07-27 Arizona Board Of Regents On Behalf Of The University Of Arizona Implantable multi-electrode microdrive array
CN1341166A (en) 1999-12-24 2002-03-20 株式会社荏原制作所 Semiconductor wafer electroplating and electrolyzing apparatus and method
DE10055722A1 (en) 2000-11-10 2002-05-29 Eder Bernd Swimming pool water purified by submerged direct current electrodes with periodically reversed polarity

Also Published As

Publication number Publication date Type
CN102330125A (en) 2012-01-25 application

Similar Documents

Publication Publication Date Title
US5026462A (en) Method and apparatus for electrochemical machining of spray holes in fuel injection nozzles
US3065153A (en) Electroplating method and apparatus
US3461045A (en) Method of plating through holes
CN2807699Y (en) Heavy current plasma welding gun
CN103317196A (en) Electrochemical machining method for auxiliary anode tube electrode
CN102009391A (en) Process for manufacturing high precise electroplating CBN (Cubic Boron Nitride) grinding wheel
JP2008291302A (en) Anodizing apparatus
CN103920953A (en) Universal ultrasonic-assisted inner jetted dielectric electric discharge machining (EDM) milling tool head and manufacturing method thereof
CN103331516A (en) Combined adjustable stir-welding head of friction stir welding
CN201817561U (en) Opening shape-adjustable electroplate anode baffle
JP2006336050A (en) Anodization apparatus for metallic component
CN201144293Y (en) Rapid electrical brush plating device
CN202688478U (en) Fine-tube shaped working piece inner hole chroming device
CN203245474U (en) Guiding wire water spraying device for linear cutting machine tool
CN201437880U (en) Tee joint for pulse deduster
CN103255452A (en) Selective metal electro-deposition device and application thereof
CN101508047A (en) Multi-electrode spiral feeding integral blade wheel inter-blade passage electrolytic machining method
CN203899800U (en) Mixed gas injector
CN203546169U (en) Separated continuous plating bath for composite plating of long shaft pieces
CN2743696Y (en) Liquid distributor for falling film type tubulation evaporator
CN101003908A (en) Electrophoresis painting dressing technical method for pipe fitting type metal, and metal piece with deep hole, and deep concave
CN103103591A (en) Chromalizing device and process for small hole of driving device for control rod of nuclear reactor
CN203625508U (en) Improved electroplating apparatus
CN2839303Y (en) Jet-flow floaing electroplating tank
CN201446018U (en) Water-saving shower head

Legal Events

Date Code Title Description
C06 Publication
C10 Request of examination as to substance
C14 Granted