CN106555221B

CN106555221B - Spray head device

Info

Publication number: CN106555221B
Application number: CN201510621750.5A
Authority: CN
Inventors: 贾照伟; 王坚; 王晖
Original assignee: ACM Research Shanghai Inc
Current assignee: ACM Research Shanghai Inc
Priority date: 2015-09-25
Filing date: 2015-09-25
Publication date: 2023-03-07
Anticipated expiration: 2035-09-25
Also published as: CN106555221A

Abstract

The invention discloses a spray head device which comprises a spray head body, wherein the spray head body comprises an inner wall and an outer wall from inside to outside, the spray head body is provided with an emergent port, and the spray head body is also provided with an electrode; the flow distribution plate is arranged at the position of the emergent hole and is provided with a plurality of through holes. The spray head device disclosed by the invention can achieve the purpose of uniform polishing in a semiconductor process.

Description

Spray head device

Technical Field

The invention relates to the field of semiconductor processing equipment, in particular to a spray head device used in a semiconductor processing technology.

Background

In the stress-free polishing process, the polishing solution is sprayed out through a spray head. The conventional showerhead is shown in fig. 1 and includes a showerhead body 103. The polishing solution 102 flows through the head body 103 and is sprayed onto the surface of the wafer 101 to react with the metal layer on the surface of the wafer 101, so as to remove the metal layer on the surface of the wafer 101 during the continuous polishing process.

For polishing, the polishing liquid 102 needs to be charged, and for this purpose, an electrode may be provided inside the head body 103, or the outer wall of the head body 103 may be charged by communicating with the electrode. However, both of these methods of charging the polishing liquid 102 have a problem of non-uniform electric field distribution, which affects the polishing effect. Referring to fig. 1 and 2, taking the manner that the outer wall of the nozzle body 103 is communicated with the electrode as an example, since the outer wall is connected with the electrode, the amount of charge carried by the polishing solution 102 near the outer wall is large, and the formed electric field is strong; the polishing liquid 102 closer to the center of the head body 103 has a smaller charge amount, and the electric field formed is weaker. This results in that the thickness removed at the center of the showerhead body 103 is small and the thickness removed at the position of the showerhead body 103 near the outer wall is large per unit time, thereby affecting the uniformity of polishing.

Disclosure of Invention

The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

The present invention is directed to solve the above problems, and provides a nozzle assembly, which is additionally provided with a splitter plate to change the distribution of an electric field, so as to achieve the purpose of uniform polishing.

The technical scheme of the invention is as follows: the invention discloses a spray head device which comprises a spray head body, wherein the spray head body comprises an inner wall and an outer wall from inside to outside, the spray head body is provided with an emergent port, and the spray head body is also provided with an electrode; the splitter plate is arranged at the position of the emergent opening and is provided with a plurality of through holes.

According to an embodiment of the nozzle device of the present invention, the electrode is disposed in a space surrounded by an inner wall of the nozzle body, or the electrode is disposed outside the nozzle body and electrically connected to the outer wall, and an insulating case is coated outside the outer wall.

According to an embodiment of the showerhead device of the present invention, the flow distribution plate is an insulating plate.

According to an embodiment of the spray head device according to the invention, the inner wall and the outer wall have a spacing therebetween.

According to an embodiment of the nozzle arrangement of the present invention, the inner wall is provided with blocking wings outwardly at the exit opening.

According to an embodiment of the inventive showerhead arrangement, the blocking wing opens between the outer wall and the insulating housing.

In an embodiment of the spray head device according to the invention, the electrode is negatively charged.

According to an embodiment of the nozzle assembly of the present invention, the plurality of through holes are distributed to diffuse outward from the center of the manifold.

According to an embodiment of the nozzle device of the present invention, the electrode is disposed in a space surrounded by an inner wall of the nozzle body, and the hole diameters of the plurality of through holes are gradually increased outward from the center of the flow distribution plate.

According to an embodiment of the nozzle device of the present invention, the electrode is disposed outside the nozzle body and electrically connected to the outer wall, and an insulating casing is wrapped around the outer side of the outer wall, and the aperture of the plurality of through holes is gradually reduced from the center of the flow distribution plate to the outside.

Compared with the prior art, the invention has the following beneficial effects: the spray head device disclosed by the invention is additionally provided with the splitter plate capable of adjusting the electric field, and through holes with different shapes and sizes are formed in the splitter plate according to the distribution requirement of the electric field, so that the aim of changing the electric field can be fulfilled, and the polishing uniformity is ensured.

Drawings

Fig. 1 shows a schematic structural view of a conventional head apparatus.

Fig. 2 shows a graph of the removal thickness of each region per unit time versus the distance from the center of the nozzle using the conventional head apparatus.

Fig. 3 shows a schematic structural diagram of the first embodiment of the present invention.

Fig. 4 shows a schematic structural diagram of a second embodiment of the present invention.

Fig. 5 shows a schematic structural view of a specific embodiment of the diverter plate of the present invention.

Detailed Description

The above features and advantages of the present disclosure will be better understood upon reading the detailed description of embodiments of the disclosure in conjunction with the following drawings. In the drawings, components are not necessarily drawn to scale, and components having similar relative characteristics or features may have the same or similar reference numerals.

Fig. 3 shows a schematic structural diagram of the first embodiment of the present invention. Fig. 4 shows a schematic structural diagram of a second embodiment of the present invention. Fig. 5 shows a schematic structural view of a preferred embodiment of the diverter plate of the present invention.

In the showerhead device shown in fig. 3, the showerhead device includes a showerhead body 303, the showerhead body 303 includes an inner wall 304 and an outer wall 305 from inside to outside, an exit port is formed above the showerhead body 303 for the polishing liquid 302 to exit, and an electrode 306 is disposed in a space surrounded by the inner wall 304 of the showerhead body 303. In accordance with electrochemical polishing principles, the electrode 306 should be negatively charged for polishing purposes. Since the electrode 306 is disposed inside the showerhead body 303 without being connected to the outer wall 305, the outer wall 305 may not be covered with an insulating case.

The nozzle device further comprises a flow distribution plate 307, wherein the flow distribution plate 307 is arranged at the position of the exit, and a through hole is formed in the flow distribution plate 307. The flow distribution plate 307 is an insulating plate. Since the shunt plate 307 is insulated, the electric field generated after the polishing liquid 302 passes through the shunt plate 307 is changed, and the specific form of the electric field is related to the shape and distribution of the through holes on the surface of the shunt plate 307, so that the specific form of the electric field can be controlled to make the electric field uniformly distributed. In one embodiment, the through holes on the flow distribution plate 307 may be distributed diffusely from the center of the flow distribution plate 307.

In the present embodiment, since the electrode 306 is located inside the showerhead body 303, the electric field in the polishing liquid 302 exhibits a strong distribution pattern at the center of the showerhead body 303 and a weak distribution pattern at the inner wall 304 of the showerhead body 303 before passing through the flow distribution plate 307. Therefore, in order to make the electric field energy of the polishing liquid 302 passing through the flow distribution plate 307 uniform, the through holes formed in the flow distribution plate 307 are preferably arranged to be sparse in the middle and dense in the periphery, and the aperture of the through holes gradually increases from the center of the flow distribution plate 307 to the outside.

The inner wall 304 and outer wall 305 of the showerhead body 303 are spaced from each other such that the polishing fluid 302 can flow within the inner wall 304 and between the inner wall 304 and the outer wall 305. In addition, the inner wall 304 is provided with blocking wings 309 outward at the exit, and the blocking wings 309 and the outer wall 305 are open. After the polishing liquid 302 between the inner wall 304 and the outer wall 305 moves to the opening, the polishing liquid is discharged outwards from the opening, so that the foam content in the polishing liquid 302 is reduced, and the polishing uniformity is improved; the polishing liquid 302 within the inner wall 304 is continuously sprayed onto the surface of the wafer 301 through the flow distribution plate 307, and an electrochemical reaction occurs to remove the metal layer on the surface of the wafer 301.

Fig. 4 shows a schematic structural diagram of a second exemplary embodiment of the invention. In the showerhead device shown in fig. 4, the showerhead device includes a showerhead body 403, the showerhead body 403 includes an inner wall 404 and an outer wall 405 from inside to outside, an exit port is formed above the showerhead body 403 for the polishing liquid 402 to exit, an electrode 406 is disposed outside the showerhead body 403, attached to the outer wall 405 of the showerhead body 403 and electrically connected to the outer wall 405, and an insulating housing 408 is covered outside the outer wall 405. In accordance with electrochemical polishing principles, the electrode 406 should be negatively charged for polishing purposes, while the insulating housing 408 covers the outer wall 405 to prevent electrical shock to the operator.

The spray head device further comprises a flow distribution plate 407, wherein the flow distribution plate 407 is arranged at the position of the exit port, and the flow distribution plate 407 is provided with a through hole 410. The flow distribution plate 407 is an insulating plate. Since the diversion plate 407 is insulated, the electric field generated after the polishing liquid 402 passes through the diversion plate 407 is changed, and the specific form of the electric field is related to the shape and distribution of the through holes 410 on the surface of the diversion plate 407, so that the specific form of the electric field can be controlled to make the electric field distribution uniform. In one embodiment, the through holes 410 on the flow distribution plate 407 may be distributed divergently from the center of the flow distribution plate 407.

In this embodiment, since the electrode 406 is connected to the outer wall 405, the electric field in the polishing liquid 402 is distributed weakly at the center of the head body 403 and strongly at the inner wall 404 of the head body 403 before passing through the flow distribution plate 407. Therefore, in order to make the electric field of the polishing slurry 402 passing through the flow distribution plate 407 uniform, the through holes formed in the flow distribution plate 407 are preferably dense at the center and sparse at the periphery, and have a large diameter at the center and a small diameter at the periphery. Fig. 5 shows an embodiment of a flow distribution plate 407 in which the aperture of the through-holes 410 is gradually reduced from the center of the flow distribution plate 407 to the outside.

Inner wall 404 and outer wall 405 of showerhead body 403 are spaced apart such that polishing fluid 402 can flow within inner wall 404 and between inner wall 404 and outer wall 405. In addition, the inner wall 404 is provided with a blocking wing 409 outward at the exit, and an opening is formed between the blocking wing 409 and the outer wall 405. After the polishing solution 402 between the inner wall 404 and the outer wall 405 moves to the opening, the polishing solution is discharged from the opening to the outside, so as to reduce the foam content in the polishing solution 402 and improve the polishing uniformity; the polishing liquid 402 inside the inner wall 404 is continuously sprayed to the surface of the wafer 401 through the diversion plate 407, and an electrochemical reaction occurs to remove the metal layer on the surface of the wafer 401.

By adopting the technical scheme of the invention, the splitter plate is added to change the electric field distribution of the polishing solution, so that the electric charge quantity carried by the polishing solution sprayed to different positions on the surface of the wafer is basically consistent, the thicknesses of metal layers removed by the polishing solution at different positions in unit time are basically the same, and the aim of uniform polishing is finally fulfilled.

The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A spray head apparatus, comprising:

the nozzle body comprises an inner wall and an outer wall from inside to outside, the nozzle body is provided with an exit port, and the nozzle body is also provided with an electrode;

the flow distribution plate is arranged at the exit, a plurality of through holes are formed in the flow distribution plate, the through holes are distributed in an outward diffusion mode from the center of the flow distribution plate, and an electric field of the polishing solution passing through the flow distribution plate is uniformly distributed;

the flow distribution plate is an insulating plate, and the electrodes are negatively charged.

2. The showerhead device according to claim 1, wherein the electrode is disposed in a space surrounded by an inner wall of the showerhead body, or the electrode is disposed outside the showerhead body and electrically connected to the outer wall and an outer side of the outer wall is covered with an insulating case.

3. The spray head device of claim 1, wherein the inner wall and the outer wall have a spacing therebetween.

4. A spray head device according to claim 3, wherein the inner wall is provided with blocking wings outwardly of the exit opening.

5. The spray head device of claim 4, wherein the blocking wing opens to the outer wall and the insulating housing.

6. The head apparatus according to claim 1, wherein the electrode is provided in a space surrounded by an inner wall of the head body, and the hole diameters of the plurality of through holes are gradually increased outward from a center of the flow distribution plate.

7. The showerhead device of claim 1, wherein the electrode is disposed outside the showerhead body and electrically connected to the outer wall and an outer side of the outer wall is coated with an insulating case, and apertures of the plurality of through holes are gradually reduced from a center of the manifold plate outward.