CN208121225U - Electroplating tank structure - Google Patents

Abstract

A kind of electroplating tank structure, including a groove body, at least a jet flow module, at least an electroplate liquid recycling module and one recycle supplying module, and electroplate liquid can be accommodated in the groove body, and middle section is that a wafer puts area；The jet flow module is set to the intracorporal side wall of slot, from bottom to top sequentially it is dispersed with multiple spurt holes, it can put area in face of the wafer and connect and gush out electroplate liquid, which is set in the groove body and puts the periphery region in area in the wafer, to lasting recycling electroplate liquid；The circulation supplying module includes an at least liquid supply pipe, at least a recovery tube and pump, the liquid supply pipe is connected to the jet flow module, the recovery tube is connected to the electroplate liquid recycling module, which is connected to the recovery tube and liquid supply pipe and persistent loop recycles and supply electroplate liquid to the groove body；The utility model can maintain electroplate liquid electric field in preferable flow direction as a result, keep field distribution more average, promote the efficiency, reliability and the uniformity of plating.

Description

Electroplating tank structure

Technical field

The utility model relates to the technical fields of a kind of electroplating bath more particularly to a kind of for crystal column surface electroplating processes Equipment.

Background technique

For semiconductor wafer carry out electroplating processes, according to the electroplating technology of use can be classified into cup type electroplating technology and Latent immersion (dipping-type) electroplating technology, wherein cup type electroplating technology is that electroplating solution is penetrated to half in horizontal location upwards Semiconductor wafer substrate, and the substrate surface being electroplated is downwards；And latent immersion electroplating technology is to be supplied from plating in electroplating solution When trench bottom and overflow go out electroplating bath, substrate is erectly dived in the electroplating solution being dipped in electroplating bath.It is general to determine electroplate Qualitative factor essentially consists in：Efficiency, reliability and the uniformity, in above-mentioned technique, its uniformity of cup type electroplating technology and reliable Degree is high, but efficiency is poor.Latent immersion electroplating technology efficiency is preferable, but wafer is placed in vertical, is easy to influence lower layer and upper layer Electroplating thickness, therefore reliability and the uniformity are poor.Another plating mode is taken in the utility model people thinking thus, makes its effect Rate, reliability and uniformity etc. all can get good promotion.

Utility model content

The main purpose of the utility model is to provide a kind of electroplating tank structure, the stream of electroplate liquid mainly in change electroplating bath Dynamic direction is intended to the wafer of plating in the latent electroplate liquid being dipped in electroplating bath of vertical type, and the utility model separately provides one group and is in The jet flow module of vertical, the continuous surface that is plated in face of the wafer gush out electroplate liquid, are additionally provided with an electroplate liquid recycling module Electroplate liquid is recycled in the periphery regional sustained of wafer, on the one hand maintains electroplate liquid electric field in preferable flow direction, makes electricity Field distribution is more average, and another aspect sustainable utilization water flow, which is changed, to be replaced close to being plated the electroplate liquid after surface has been reacted, and allows crystalline substance Circular surfaces electroplating thickness is more uniform, and reliability is good, improves production efficiency.

In order to achieve the above object, the utility model includes a groove body, at least a jet flow module, at least electroplate liquid recycling mould Block and a circulation supplying module can accommodate electroplate liquid in the groove body, and middle section is that wafer puts area, make wafer in plating It is dipped in electroplate liquid in vertical type is latent；The jet flow module is set to the intracorporal side wall of the slot, the jet flow module include a cavity and Multiple spurt holes on its surface are distributed in, multiple spurt holes are from bottom to top sequentially distributed and put facing to the wafer crystalline substance in area Circle surface to be plated, the electroplate liquid recycling module are set in the groove body and put the periphery region in area in the wafer, to Persistently recycle electroplate liquid；The circulation supplying module includes an at least liquid supply pipe, at least a recovery tube and pump, liquid supply pipe connection In the jet flow module, which is connected to the electroplate liquid recycling module, which is connected to the recovery tube and liquid supply pipe and continues Circulation and stress and the electroplate liquid is supplied to the groove body.

In the present invention, which includes an outer tank body and an inner tank body, the inner tank body be located at the outer tank body it is interior and It is highly lower, at least one first slot room is formed between the outer tank body and the inner tank body and at least one second slot room, the inner tank body are Solid rectangular slot made of being surrounded as aspectant two the first side walls and two second sidewalls, the first slot room are in close proximity to this The first side wall, the second slot room is then close to the second sidewall.Wherein the outer tank body separately has a fluid reservoir, which has hole Hole is connected with the first slot room, is initially placed in the electroplate liquid overflowed in slot to store wafer.

In the present invention, be additionally provided with the overflow notch of multiple recess at the top of the second sidewall, the overflow notch be In electroplating process, extra electroplate liquid is allowed to flow in the second slot room, and maintain liquid level close to the inner tank body apical margin but It does not overflow.

In the present invention, which is affixed on the first side wall of the inner tank body, is distributed in the cavity Multiple spurt holes on surface are the radial distributions in concentric, and distributed areas and position correspond to the wafer size, by This maintains electroplate liquid in preferable electrical field-flow direction.

In the present invention, which is located at wafer and puts the periphery region in area and can recycle electricity Plating solution；If being recycled by two side directions, which includes multiple first return ports and at least one first delivery pipe, more A first return port is from bottom to top sequentially distributed in the second sidewall, which is set in the second slot room, should One delivery pipe surface longitudinal also has multiple first return ports.Water flow of this recycling, which helps persistently to replace to approach, is plated surface Electroplate liquid after having reacted promotes electroplating quality.

In the present invention, which is located at the wafer and puts the periphery region in area and can recycle Electroplate liquid；If being recycled by bottom direction, which includes multiple second recovery holes and at least one second delivery pipe, Multiple second return ports are distributed in the inner tank body bottom, and position corresponds to the lower zone that the wafer puts area's circumference, this is outer Groove body separately has closed three groove chamber, which is connected to the inner tank body close to the inner tank body bottom, second return port Interior space and the three groove chamber, second delivery pipe are located in the third slot room, and the indoor electroplate liquid of third slot can be discharged.

In order to improve the production efficiency, can be in the electroplating activity for once carrying out two wafers in groove body, therefore the utility model The jet flow module has two groups, is respectively arranged in the inner tank body on two aspectant the first side walls, electroplate liquid recycling Also there are module few two groups to be distributed in the groove body.

The beneficial effects of the utility model are that the one group provided by the utility model jet flow module in vertical faces The continuous surface that is plated of the wafer gushes out electroplate liquid, is additionally provided with an electroplate liquid recycling module and holds in the periphery region of wafer Continuous recycling electroplate liquid, on the one hand maintains electroplate liquid electric field in preferable flow direction, keeps field distribution more average, on the other hand Sustainable utilization water flow, which is changed, to be replaced close to the electroplate liquid after surface has been reacted is plated, and makes crystal column surface electroplating thickness more uniform, Reliability is good, improves production efficiency.

Attached drawing and component symbol is cooperated to do more detailed description to the embodiments of the present invention below, so as to be familiar with this Item those skilled in the art can implement accordingly after studying this specification carefully.

Detailed description of the invention

Fig. 1 is the perspective view of the utility model；

Fig. 2 is the partial cutaway perspective view of the groove body of the utility model

Fig. 3 is the top view of the groove body of the utility model：

Fig. 4 is the AA figure cross-sectional view of Fig. 3.

Fig. 5 is diagrammatic cross-section (one) of the utility model electroplating tank structure in running；

Fig. 6 is diagrammatic cross-section (two) of the utility model electroplating tank structure in running

Appended drawing reference is as follows：

1 groove body

11 outer tank bodies

12 inner tank bodys

121 the first side walls

122 second sidewalls

13 first slot rooms

14 second slot rooms

15 fluid reservoirs

16 three groove chamber

2 jet flow modules

21 cavitys

211 inlet openings

22 spurt holes

3 electroplate liquid recycling modules

31 first return ports

311 holes

32 second recovery holes

33 first delivery pipes

34 second delivery pipes

4 circulation supplying modules

41 liquid supply pipes

42 recovery tubes

43 pumps

5 wafer jigs

Specific embodiment

As shown in Figure 1, the perspective view of respectively the utility model electroplating tank structure.The utility model electroplating tank structure includes One groove body 1, at least jet flow module 2 being set in slot, at least an electroplate liquid recycling module 3 and is arranged outside the groove body 1 Recycle supplying module 4.The utility model focuses on the loop structure of the flowing of the electroplate liquid in electroplating bath, and needs in the plating process With the cathode electrode that wafer to be plated is connected and in the dependency structures such as anode electrode in electroplating bath all with it is existing identical, therefore no longer Elaborate.

The utility model function mode is：When the groove body 1 fills electroplate liquid, wafer to be plated can be by a wafer jig in upright Shape is latent to be dipped in the electroplate liquid in the groove body 1, which gushes out electroplate liquid in face of the continuous surface to be plated of the wafer, then Due to being distributed in the electroplate liquid recycling module 3 of the periphery of the wafer, electroplate liquid is persistently recycled, this can maintain electroplate liquid electric field In preferable flow direction, and keep field distribution more uniform, the water flow in addition generated while can change is replaced close to being plated table Face reacted after electroplate liquid, this makes crystal column surface electroplating thickness more uniform, and reliability is good, also can be reduced your gold in electroplate liquid The usage amount of category.The circulation supplying module 4 then there is pipeline to be connected with the jet flow module 2 and electroplate liquid recycling module 3, to return It receives electroplate liquid recycling output to use, which can also filter or persistently add new electroplate liquid, to maintain to be electroplated Liquid is in preferable concentration.

The structure of each component makees a detailed description with that：

To accommodate electroplate liquid in the groove body 1, it is that wafer puts area 10 in middle section, only indicates brilliant in figure with imaginary line Circle puts area 10, is actually additionally provided with wafer jig to clamp wafer, and wafer is made to be dipped in the slot in vertical is latent in plating In electroplate liquid in body 1.In Fig. 1, actually the groove body 1 can accommodate one group of wafer jig simultaneously in each clamping of left and right sides difference One wafer, and the surface of each wafer Naked dew is electroplated, to improve production efficiency, therefore the utility model electroplating bath knot Structure is to adopt bilateral symmetry mode to design, as soon as actually also only a wafer can be electroplated, subsequent only single side structure is said It is bright.Please join Fig. 2, Fig. 3 and Fig. 4, the respectively partial cutaway perspective view of the utility model groove body, top view and sectional view together.

The groove body 1 includes an outer tank body 11 and an inner tank body 12, and the height of the inner tank body 12 lower than outer tank body 11 and is located at In its slot.At least one first slot room 13 and at least one second slot room 14 are formed between the outer tank body 11 and inner tank body 12.In this reality It applies and is respectively provided with position opposite two the first slot rooms 13 and two the second slot rooms 14 in example.In addition the inner tank body 12 is by facing Solid rectangular slot made of two the first side walls 121 in face and two second sidewalls 122 are surrounded, the first slot room 13 are in close proximity to The first side wall 121, the second slot room 14 is then close to the second sidewall 122.The outer tank body 11 separately has a fluid reservoir 15, the storage There is liquid chamber 15 hole 151 to be connected with the first slot room 13.The first slot room 13 and the fluid reservoir 15 are to put in wafer Enter 12 initial stage of the inner tank body, the electroplate liquid of overflow is allowed to be stored in two Room spaces, prevents electroplate liquid from overflowing the outer tank body 11.In figure Though the wall adjacent with the fluid reservoir 15 has a hole, it is additionally provided with pipe fitting in actual structure or valve is installed on this, with Sharp subsequent recovery electroplate liquid.

In addition the overflow notch 1221 of multiple recess is additionally provided at the top of the second sidewall 122, which is In the plating process, it can be flow in the second slot room 14 for extra electroplate liquid, and maintain liquid level close to the inner tank body 12 Apical margin but not spilling.In addition the outer tank body 11 separately has a closed three groove chamber 16, and the three groove chamber 16 is close to the inside groove 12 bottom of body.

The jet flow module 2 is mainly persistently to gush out electroplate liquid towards wafer direction.The jet flow module 2 is installed on the groove body 1 An inner vertical walls, be specifically affixed to the first side wall 121, which includes a cavity 21 and being distributed in it Multiple spurt holes 22 on surface, the cavity 21 be in hollow and liquid can be accommodated, top have water inlet 211 can connecting pipe supply Electroplate liquid injection.Multiple spurt holes 22, which are from bottom to top sequentially dispersed with and face the wafer, puts the surface to be plated of area 10, Multiple spurt holes 22 are in the radial distribution of concentric in the present embodiment, and distributed areas and position correspond to wafer size. Wherein the spurt hole 22 distribution concentric circles circle number and hole number and unlimited figure in form, can demand adjust again, such as Enclose that number is more, and hole count and aperture are smaller etc., in addition the distribution mode of spurt hole 22 also unlimited concentric circles.The cavity 21 and spurt hole 22 all must be specially designed, and the flow velocity and direction for spraying the electroplate liquid for injecting the cavity 21 most through the spurt hole 22 afterwards all meet Actual demand, though such as electroplate liquid persistently pour into the wafer and put area 10, water flow will not disturb excessively, it is ensured that electroplate liquid electricity Field is in preferable flow direction, and field distribution is more uniform, promotes electroplating quality.

The electroplate liquid recycling module 3 is to recycle the electroplate liquid after reacting, and position is located in the groove body 1 and is distributed in The wafer puts the periphery region in area 10, because can be there are many different modes, the utility model is only just one of to be made Explanation.The electroplate liquid recycling module 3 includes multiple taps and an at least delivery pipe, in the present embodiment includes two groups of not Tongfangs To discharge mode.In the present embodiment, which includes multiple first return ports 31, multiple second recycling Hole 32, at least one first delivery pipe 33 and at least one second delivery pipe 34.Wherein the first discharging modes be in two sides position, Multiple first return ports 31 are from bottom to top sequentially distributed in the second sidewall 122, which is set to the second slot In room 14,33 surface longitudinal of the first delivery pipe have multiple first return ports 331, the shape of first return port 331 and point Mode for cloth is not limited, for example, hole shape can for circular hole, strip hole, square hole etc., though in addition first delivery pipe 33 is only in figure See a longitudinal row first return port 331, is indeed provided with longitudinal four rows, and be distributed in first delivery pipe in angularly part 33 tube wall, but be also not limited thereto, the hole count of longitudinal number of rows and distribution, all it can adjust and change according to actual demand. The position of first delivery pipe 33 corresponds to multiple first return ports 31, using first comb 33 through multiple first return ports 31, the electroplate liquid after reaction is put the side direction discharge of 10 liang of area by the wafer by multiple first return ports 331.

In addition in the other embodiments of the utility model, the structure of the second sidewall 122 can be omitted, utilizes the first row It puts pipe 33 and is distributed first return port 331 on its surface and be expelled directly out electroplate liquid.

Second of discharging modes is bottom discharge mode, and multiple second return ports 32 are distributed in 12 bottom of inner tank body, position Set the lower zone for corresponding to the periphery that the wafer puts area 10.Second return port 32 is connected to space in the inner tank body 12 And three groove chamber 16, second delivery pipe 34 are located in the second slot room 16, one end has opening 341, thus using this Electroplate liquid is discharged by lower section through multiple second return ports 32 for two combs 34.

As shown in Figure 1, the Xun ring supplying module 4 is set to outside the groove body 1, to recycle supply electroplate liquid to the groove body 1, which includes an at least liquid supply pipe 41, at least a recovery tube 42 and pump 43, which is to be connected to At the cavity 21 of the jet flow module 2, with lasting injection electroplate liquid.41 end of liquid supply pipe is to be connected to the cavity in this embodiment 2 tops, but be not limited thereto, it also may connect to 2 side wall of cavity or bottom position, then extend out by the wall of groove body 1, This mode is notably sealed effect, facilitates and closes the 2 top surface space of groove body.The recovery tube 42 is to be connected to electroplate liquid recycling module 3 the first delivery pipe 33 and the second delivery pipe 34, to recycle the electroplate liquid.In figure and it is not drawn into pipeline structure interconnected, Because such pipeline connecting mode to it is existing similar, such as connected by three-dimensional communicating pipe and multiple pipe fittings, therefore no longer in detail It describes in detail bright.The pump 43 is connected to the recovery tube 42 and liquid supply pipe 41 can be continuously circulated recycling and supply electroplate liquid to the groove body 1.? Independent control is additionally provided in the pipeline that the first delivery pipe 33 of this in the present embodiment, the second delivery pipe 34 are connected with recovery tube 42 Valve, more accurately to control the flow velocity in removal process.The pipeline that the liquid supply pipe 41 is connect with the cavity 21 in the same manner also has solely Vertical control valve, accurately to control pressure and flow during feed flow, and then when ensuring to be electroplated, electroplate liquid field distribution is more It is uniform.In addition the Xun ring supplying module 4 can also be equipped with filter device, filtering the impurity in electroplate liquid, or include electric Liquid supplementing device is plated, is adjusted in due course according to the concentration of electroplate liquid to optimum state.

The mode of the utility model overall operation is described with that, as shown in Figures 5 and 6, respectively longitudinal different The diagrammatic cross-section of angle, the jet flow module 2 are not drawn with sectional view, other two wafer is to be fixed in a wafer respectively Two opposite faces of fixture 5, are described as follows：

Inner tank body 12 in the groove body 1 fills electroplate liquid, which is dipped in the inner tank body 12 in vertical is latent In electroplate liquid, the extra first overflow of electroplate liquid meeting to the first slot room 13.In addition related electrode all with connection after the completion of, the jet flow Module 2 gushes out electroplate liquid in face of the continuous surface to be plated of wafer.It can be via first reflux in the electroplate liquid of wafer two side areas Hole 31 is persistently recycled with first delivery pipe 33, is then discharged by the second of the second return port 32 in the electroplate liquid of wafer lower zone Pipe 34 persistently recycles, and the direction of electroplate liquid electrical field-flow is thus kept, to keep field distribution more average.In addition the water generated Stream also can be changed persistently for close to the electroplate liquid after surface has been reacted is plated, this makes crystal column surface electroplating thickness more uniform, subtracts The usage amount of few noble metal, raising reliability is good, and production efficiency is also synchronous to be improved.In addition the circulation supplying module 4 then has pipe Road is connected with the jet flow module 2 and electroplate liquid recycling module 3, is used with recycling electroplate liquid recycling output, ensures electricity at any time The concentration of plating solution.Therefore the electroplating activity carried out with the utility model electroplating bath, high production efficiency, the uniformity and reliable It spends good, hence it is evident that be better than existing mode, meet the application important document of patent.

As described above is only the preferred embodiment to explain the utility model, is not intended to accordingly to the utility model Limitation in any form is done, it is therefore, all to there is make under identical utility model spirit in relation to the utility model any to repair Decorations or change all should include being intended to the scope of protection in the utility model.

Claims (9)

1. a kind of electroplating tank structure, which is characterized in that the electroplating tank structure includes:

One groove body can accommodate electroplate liquid in slot, and middle section is that wafer puts area, be dipped in wafer in vertical type is latent In electroplate liquid；

An at least jet flow module, is installed on the inner vertical walls of the groove body, and the jet flow module is including a cavity and is distributed in its surface Multiple spurt holes, multiple spurt holes from bottom to top sequentially distribution and facing to the wafer put area；

One electroplate liquid recycling module is installed in the groove body and puts the periphery region in area, lasting recycling electricity in the wafer Plating solution；

One circulation supplying module, is set to outside the groove body, which includes an at least liquid supply pipe, at least a recovery tube And pump, the liquid supply pipe connect the jet flow module, which connects the electroplate liquid recycling module, which is connected to the recovery tube And the liquid supply pipe can be continuously circulated recycling and supply electroplate liquid to the groove body.

2. electroplating tank structure as described in claim 1, which is characterized in that the electroplate liquid recycling module includes multiple first reflux Hole and the first delivery pipe, first delivery pipe are from top to bottom dispersed with more first return ports.

3. electroplating tank structure as described in claim 1, which is characterized in that the groove body includes an outer tank body and an inner tank body, is somebody's turn to do Inner tank body is located in the outer tank body and height is lower, and at least one first slot room and at least one is formed between the outer tank body and inner tank body Second slot room, the inner tank body are solid slots made of being surrounded as aspectant two the first side walls and two second sidewalls, this One slot room is in close proximity to the first side wall, and the second slot room is then close to the second sidewall.

4. electroplating tank structure as claimed in claim 3, which is characterized in that the outer tank body separately has a fluid reservoir, the fluid reservoir It is connected with hole with the first slot room.

5. electroplating tank structure as claimed in claim 3, which is characterized in that separately excessive with multiple recess at the top of the second sidewall Flow gap.

6. electroplating tank structure as claimed in claim 3, which is characterized in that the jet flow module is affixed to the first side wall, more A spurt hole is the radial distribution in concentric, and distributed areas and position correspond to wafer size.

7. electroplating tank structure as claimed in claim 3, which is characterized in that the electroplate liquid recycling module includes multiple first reflux Hole and at least one first delivery pipe, multiple first return ports are from bottom to top sequentially distributed in the second sidewall, first discharge Pipe is set in the second slot room, and the first discharge pipe surface is longitudinal also with multiple first return ports.

8. electroplating tank structure as claimed in claim 3, which is characterized in that the electroplate liquid recycling module includes multiple second recycling Hole and at least one second delivery pipe, multiple second return ports are distributed in the inner tank body bottom, and position corresponds to the wafer and puts area The lower zone of periphery, the outer tank body separately have a closed three groove chamber, which is in close proximity to the inner tank body bottom Portion, second return port are connected to space and the three groove chamber in the inner tank body, which is located in the second slot room, energy The indoor electroplate liquid of third slot is discharged.

9. electroplating tank structure as claimed in claim 3, which is characterized in that the jet flow module has two groups, is respectively arranged at this On inside groove intracorporal two face-to-face the first side walls.