CN111376566B - 层压基板制造装置、层压基板生产线以及层压基板的制造方法 - Google Patents

层压基板制造装置、层压基板生产线以及层压基板的制造方法 Download PDF

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Publication number
CN111376566B
CN111376566B CN201910800593.2A CN201910800593A CN111376566B CN 111376566 B CN111376566 B CN 111376566B CN 201910800593 A CN201910800593 A CN 201910800593A CN 111376566 B CN111376566 B CN 111376566B
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China
Prior art keywords
tray
laminated substrate
manufacturing apparatus
substrate manufacturing
workpiece
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CN201910800593.2A
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English (en)
Chinese (zh)
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CN111376566A (zh
Inventor
新垣绫介
河东和彦
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Beac Co Ltd
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Beac Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN201910800593.2A 2018-12-27 2019-08-28 层压基板制造装置、层压基板生产线以及层压基板的制造方法 Active CN111376566B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018246069A JP7298864B2 (ja) 2018-12-27 2018-12-27 ラミネート基板製造装置、ラミネート基板製造ライン及びラミネート基板の製造方法
JP2018-246069 2018-12-27

Publications (2)

Publication Number Publication Date
CN111376566A CN111376566A (zh) 2020-07-07
CN111376566B true CN111376566B (zh) 2022-03-15

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CN201910800593.2A Active CN111376566B (zh) 2018-12-27 2019-08-28 层压基板制造装置、层压基板生产线以及层压基板的制造方法

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Country Link
JP (1) JP7298864B2 (ko)
KR (1) KR102280160B1 (ko)
CN (1) CN111376566B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113246580A (zh) * 2021-05-31 2021-08-13 深圳市合扬智能卡科技有限公司 一种将电子墨水屏与按键结合的智能卡封装设备及其封装方法
CN115214155B (zh) * 2022-07-20 2023-05-23 重庆长安汽车股份有限公司 一种汽车内饰透光表皮包覆件成型工艺

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1301994A (zh) * 1999-08-25 2001-07-04 希普雷公司 传送带式真空施加器及将抗蚀干膜施加于一印刷线路板上的方法
JP2002271021A (ja) * 2001-03-07 2002-09-20 Shiizu:Kk 真空積層装置と積層方法
CN1501148A (zh) * 2002-11-16 2004-06-02 Lg.菲利浦Lcd株式会社 液晶显示装置的基板粘合设备
CN1526534A (zh) * 2003-03-04 2004-09-08 三荣技研股份有限公司 层压装置以及层压方法
US20050064100A1 (en) * 2003-09-23 2005-03-24 Robert Burkle Gmbh Method and device for coating structural parts
CN1869778A (zh) * 2005-05-25 2006-11-29 株式会社日立工业设备技术 基板组装装置和基板组装方法
CN101622183A (zh) * 2007-11-05 2010-01-06 丰田自动车株式会社 输送部定位方法、以及输送装置
CN103347681A (zh) * 2011-02-07 2013-10-09 平田机工株式会社 层压装置及使用它的层压处理系统
CN203831924U (zh) * 2014-04-08 2014-09-17 武汉文林科技有限公司 层压机物料托盘定位块

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63169238A (ja) * 1986-12-29 1988-07-13 Mazda Motor Corp 加工または組立ラインの作業装置
JPH0588920A (ja) 1991-09-27 1993-04-09 Nec Corp メツセージ待ち行列制御方法
KR100290152B1 (ko) * 1997-11-14 2001-10-24 윤종용 제품생산시스템
JP3418680B2 (ja) 1999-05-21 2003-06-23 株式会社タンケンシールセーコウ 加熱プレス用チャンバ
IT1313118B1 (it) 1999-08-25 2002-06-17 Morton Int Inc Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello
JP3937129B2 (ja) * 2001-04-06 2007-06-27 ソニー株式会社 熱プレス装置及びカード製造装置
JP3984578B2 (ja) 2003-08-20 2007-10-03 日精樹脂工業株式会社 ラミネート装置用ワークトレー
KR100630784B1 (ko) * 2004-09-02 2006-10-09 이문규 반도체기판 자동 이송장치
JP4548239B2 (ja) * 2005-06-21 2010-09-22 パナソニック株式会社 基板接合方法および基板接合装置
JP2012051338A (ja) * 2010-09-03 2012-03-15 Nisshinbo Mechatronics Inc ラミネート装置及びラミネート方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1301994A (zh) * 1999-08-25 2001-07-04 希普雷公司 传送带式真空施加器及将抗蚀干膜施加于一印刷线路板上的方法
JP2002271021A (ja) * 2001-03-07 2002-09-20 Shiizu:Kk 真空積層装置と積層方法
CN1501148A (zh) * 2002-11-16 2004-06-02 Lg.菲利浦Lcd株式会社 液晶显示装置的基板粘合设备
CN1526534A (zh) * 2003-03-04 2004-09-08 三荣技研股份有限公司 层压装置以及层压方法
US20050064100A1 (en) * 2003-09-23 2005-03-24 Robert Burkle Gmbh Method and device for coating structural parts
CN1869778A (zh) * 2005-05-25 2006-11-29 株式会社日立工业设备技术 基板组装装置和基板组装方法
CN101622183A (zh) * 2007-11-05 2010-01-06 丰田自动车株式会社 输送部定位方法、以及输送装置
CN103347681A (zh) * 2011-02-07 2013-10-09 平田机工株式会社 层压装置及使用它的层压处理系统
CN203831924U (zh) * 2014-04-08 2014-09-17 武汉文林科技有限公司 层压机物料托盘定位块

Also Published As

Publication number Publication date
KR20200081209A (ko) 2020-07-07
KR102280160B1 (ko) 2021-07-20
CN111376566A (zh) 2020-07-07
JP2020107761A (ja) 2020-07-09
JP7298864B2 (ja) 2023-06-27

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