CN1113589C - 电子插件的表面安装插座及其中使用的触头 - Google Patents
电子插件的表面安装插座及其中使用的触头 Download PDFInfo
- Publication number
- CN1113589C CN1113589C CN96198692A CN96198692A CN1113589C CN 1113589 C CN1113589 C CN 1113589C CN 96198692 A CN96198692 A CN 96198692A CN 96198692 A CN96198692 A CN 96198692A CN 1113589 C CN1113589 C CN 1113589C
- Authority
- CN
- China
- Prior art keywords
- contact
- lead
- socket
- electronic package
- receiving unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
- H01R13/2478—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point spherical
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
- H01R13/2485—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point for contacting a ball
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
- H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connecting Device With Holders (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
用于电子插件(2)的一种插座(6)包括一个绝缘外壳(10),外壳内的触头(20)各自具有一个沿着外壳的底面(14)下面延伸的表面安装部分(50),用于与一个电路板上各自的电路轨迹啮合。每个触头的表面安装部分(50)具有一个凸出的底面(52),其形状至少模拟一个焊球的下表面部分,从而使插座模仿一个球栅格阵列插件的座落点。
Description
本发明涉及一种插座,其中的触点各自具有一个表面安装脚,其形状模仿了一个球栅格阵列电子插件上的焊球。
球栅格阵列(BGA)是一种商业用途越来越广的电子插件。这种BGA包括一个装在塑料或是陶瓷基片内部的集成电路芯片,并且在基片的整个底面上具有布置成阵列的焊球引线。可以用回流焊接工艺直接将BGA连接到电路板上,其中,使引线局部熔化并且随后凝固,以将引线实际焊接在电路板上对应的焊盘阵列上。然而,这种直接连接会造成难以拆卸已损坏的BGA,并且价格昂贵,为了便于BGA的更换或是升级,有些厂商宁愿将BGA安装在电路板上的一个插座中。BGA插件的好处是引线可以排列成比较接近中心线,并且焊球与焊盘一类的其他结构相比具有较大的共面公差。如果要通过插座将BGA插件连接到电路板上,非常希望能够保持这些优点。另外,其他形式的电子插件也应该具备BGA插件的上述优点,例如具有独立插头式引线的插头栅格阵列(PGA)。为了获得BGA插件的优点,插座应该尽量模仿BGA插件的座落点。
本发明的目的是提供一种插座,它可以模仿球栅格阵列插件的座落点。
本发明的另一目的是提供一种具有触头的插座,这种触点特别适用于电路板上的表面安装连接。
本发明的插座包括一个绝缘外壳,其顶面上可以接收一个电子插件,一个底面,在底面和顶面之间延伸的多个空腔,以及分别装在一个空腔内的触头;每个触头包括一个导电的主体,其固位部分可以固定在空腔中,一个向上延伸并且可以和电子插件上各自的引线啮合的引线接收部分,以及一个在底面下面延伸并且可以和电路板上各自的电路轨迹啮合的表面安装部分;该插座的特征在于每个触头的表面安装部分具有一个凸出的底面,其形状至少模拟一个球面焊球的下表面部分,并且每个触头的引线接收部分包括一对分开布置的臂,以利用弹性作用将各个上述引线夹在两臂之间。
以下要参照附图用举例的方式来解释本发明,在附图中:
图1是按照本发明装在一个电子插件和电子插件使用的一个电路板之间的一个插座的垂直分解剖面图;
图2是按照本发明的插座的顶部平面图;
图3是图2中阴影线内部那一部分插座的一个放大图;
图4是沿着图3中的4-4线提取的一个截面图;
图5是可以用在上述插座中的一个本发明的触头的立体图;
图6-8分别是按照本发明一个实施例的触头的正视图,侧视图和底视图;以及
图9-11分别是按照本发明另一实施例的触头的正视图,侧视图和底视图。
参见图1,按照本发明的一个插座6可以将一个电子插件2连接到电路板8上。本发明可以使用的这种电子插件2具有布置成阵列并且悬挂在其底面上的多个引线4。商用的各种插件2包括一种球栅格阵列(BGA)的插件,其中的引线4采用了焊球的形式,以及一种插头栅格阵列(PGA)的插件,其中的引线4采用了延长插头的形式。
插座6包括一个绝缘外壳10,其顶面12上可以接收电子插件,并且其底面14被布置成正对着电路板8。外壳10可以具有支座16,它可以使底面14比电路板8高出一个小距离,以免在通过螺纹紧固件将插座固定到电路板上时挤压插座中的触头的表面安装引线7。作为选择方式,制成的插座上也可以没有支座16。
如图2,3和4所示,外壳10具有多个布置成阵列的空腔18,该阵列对应着电子插件2的引线阵列。每个空腔18包括一对径向相对的槽或是沟19。空腔18和沟19在顶面12和底面14之间延伸通过外壳。每个空腔18将一个单独的触头20夹持在相对的沟19中。
参见图4和5,按照本发明的触头20包括一个导电的主体22,它最好是用金属板材冲压而成的,例如一种铜的合金。主体22包括一个固位部分30,一个引线接收部分40,和一个表面安装部分50。固位部分30的结构设置得可以固定在外壳中的一个空腔之内,例如采用不规则或是倒刺的端部34卡住沟19中径向相对的壁。一个狭窄的顺从部分36允许引线接收部分40相对于固位部分30存在一些角度偏差。
引线接收部分40可以和电子插件的引线啮合。一个引线接收部分40的最佳结构包括一对分离间置的臂42。臂42的悬空端44是向外扩张分开的,以便使一个引线4容易进入两臂之间的区域。在插入引线时,两臂被偏转分开,因此,在臂中产生的变形力对引线形成弹性卡锁作用,将其夹在两臂之间。
如图4所示,焊球5形式的引线被夹在臂42之间的两臂最接近的区域附近。由于两臂的弹性偏转,可以容纳直径稍有变化的焊球。由两臂42提供的变形力使两臂造成焊球的表面发生变形,并且嵌入该表面,从而实现良好的电气连接。
为了容纳PGA插件的一个插头引线,两臂42可以布置成分开一个选定的距离,以便在插头使两臂偏转分开时在插头上施加所需的正交力。引线接收部分也可以采用其他的结构,只要能与插头形成可靠的电连接。
表面安装部分50具有一个凸出形的底面52,其至少模拟一个球面的下表面部分。这样,凸圆的底面52至少模仿了一个球形焊球底表面部分。凸圆的底面52可以用一块金属板材通过尺寸逐步增大的一系列模具逐步冲压而成。这种凸圆形状使得底面正好适合通过表面安装焊接到电路板上。为了便于实现表面安装焊接,凸圆的底面上具有锡,铅锡合金,或是焊料的覆层。
在图6,7和8所示的一个实施例的触头中,固位部分30具有一个小孔32,而表面安装部分50是通过一对基本上形成直角弯头58的支柱56连接到固位部分的。弯头58使表面安装部分基本上垂直于主体10的平面延伸,因此,当触头20被安装到插座外壳中时,凸圆的底面52可以和电路板上的一个焊盘啮合。
在图9,10和11所示的另一实施例的触头中,表面安装部分50是通过具有直角弯头64和反向弯头66的单个支柱62连接到固位部分30的。弯头64和66共同促进了固位部分30和表面安装部分50之间的柔性配合,从而使具有这些触头的插座能够更好地适应底面52和电路板焊盘之间的共面偏差,并且更好地解决插座和电路板之间的热膨胀偏差。
按照本发明的插座具有多种优点。这种插座和实际的球栅格阵列插件具有相同的电路板座落点,并且可以获得许多相同的优点,例如可以降低对共面性的要求。触头上的模拟焊球比其他的表面安装引线结构更容易焊接,并且可以用同样的工艺将插座或是BGA插件焊接在电路板上。
Claims (8)
1.用于将电子插件连接到电路板上的一种插座,该插座包括一个绝缘外壳,外壳上具有一个可以接收电子插件的顶面,一个底面,以及在底面和顶面之间延伸的多个空腔,分别装在一个空腔内的触头,每个触头包括一个导电的主体,它具有可以固定在上述空腔中的一个固位部分,一个向上延伸并且可以和电子插件上各自的引线啮合的引线接收部分,以及一个在底面下面延伸并且可以和电路板上各自的电路轨迹啮合的表面安装部分,其特征在于:
表面安装部分具有一个凸出的底面,其形状至少模拟一个球面的下表面部分,并且上述引线接收部分包括一对分开布置的臂,以利用弹性作用将上述各个引线夹在两臂之间。
2.按照权利要求1的插座,其特征是,每个上述主体包括设在引线接收部分和固位部分之间的一个顺从部分,以允许二者之间存在相对的角度偏差。
3.在用来将电子插件连接到电路板上的插座中使用的一种触头,该触头包括一个导电的主体,该主体具有一个可以固定在插座的空腔内的固位部分,一个可以和电子插件的引线啮合的引线接收部分,以及一个可以和电路板上的电路轨迹啮合的表面安装部分,其特征是:
表面安装部分具有一个凸出的底面,其形状至少模拟一个球面的下表面部分,并且上述引线接收部分包括一对分开布置的臂,以利用弹性作用将引线夹在两臂之间。
4.按照权利要求3的触头,其特征是,上述导电主体是用一种板材制成的。
5.按照权利要求4的触头,其特征是,在上述主体的固位部分和表面安装部分之间具有一个直角弯头。
6.按照权利要求5的触头,其特征是上述主体具有一个与直角弯头共同起作用的反向弯头,以用来促进固位部分和表面安装部分之间的适应性。
7.按照权利要求3的触头,其特征是,上述主体包括设在引线接收部分和固位部分之间的一个顺从部分,以允许二者之间存在相对的角度偏差。
8.按照权利要求3的触头,其特征是,在凸圆的底面上进一步包括一个铅锡合金覆层。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/565,539 | 1995-11-30 | ||
US08/565,539 US5746608A (en) | 1995-11-30 | 1995-11-30 | Surface mount socket for an electronic package, and contact for use therewith |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1203732A CN1203732A (zh) | 1998-12-30 |
CN1113589C true CN1113589C (zh) | 2003-07-02 |
Family
ID=24259070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN96198692A Expired - Fee Related CN1113589C (zh) | 1995-11-30 | 1996-11-13 | 电子插件的表面安装插座及其中使用的触头 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5746608A (zh) |
EP (1) | EP0864249A1 (zh) |
JP (1) | JP3590410B2 (zh) |
KR (1) | KR100432860B1 (zh) |
CN (1) | CN1113589C (zh) |
WO (1) | WO1997020454A1 (zh) |
Families Citing this family (140)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW267265B (en) | 1995-06-12 | 1996-01-01 | Connector Systems Tech Nv | Low cross talk and impedance controlled electrical connector |
US6045416A (en) * | 1996-04-02 | 2000-04-04 | Aries Electronics, Inc. | Universal production ball grid array socket |
US5730606A (en) * | 1996-04-02 | 1998-03-24 | Aries Electronics, Inc. | Universal production ball grid array socket |
US6093035A (en) * | 1996-06-28 | 2000-07-25 | Berg Technology, Inc. | Contact for use in an electrical connector |
US6024584A (en) | 1996-10-10 | 2000-02-15 | Berg Technology, Inc. | High density connector |
US6042389A (en) * | 1996-10-10 | 2000-03-28 | Berg Technology, Inc. | Low profile connector |
US6241535B1 (en) | 1996-10-10 | 2001-06-05 | Berg Technology, Inc. | Low profile connector |
TW406454B (en) | 1996-10-10 | 2000-09-21 | Berg Tech Inc | High density connector and method of manufacture |
EP1311029B1 (en) * | 1996-10-10 | 2006-09-13 | Fci | High density connector and method of manufacture |
US6139336A (en) * | 1996-11-14 | 2000-10-31 | Berg Technology, Inc. | High density connector having a ball type of contact surface |
JP3996668B2 (ja) * | 1997-05-27 | 2007-10-24 | 富士通株式会社 | 半導体装置用ソケット |
US5895281A (en) * | 1997-08-27 | 1999-04-20 | The Whitaker Corporation | High density board to board connector |
US5877554A (en) * | 1997-11-03 | 1999-03-02 | Advanced Interconnections Corp. | Converter socket terminal |
TW383955U (en) * | 1998-08-31 | 2000-03-01 | Hon Hai Prec Ind Co Ltd | Module apparatus for slot connector |
US6099326A (en) * | 1998-09-18 | 2000-08-08 | Hon Hai Precision Ind. Co., Ltd. | Contact for use with matrix type connector |
US6394822B1 (en) * | 1998-11-24 | 2002-05-28 | Teradyne, Inc. | Electrical connector |
US6530790B1 (en) | 1998-11-24 | 2003-03-11 | Teradyne, Inc. | Electrical connector |
TW389436U (en) * | 1998-12-28 | 2000-05-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
TW430142U (en) * | 1999-02-02 | 2001-04-11 | Hon Hai Prec Ind Co Ltd | Connector of zero-insertion-force connector |
IL128997A (en) * | 1999-03-15 | 2002-12-01 | Aprion Digital Ltd | Install electrical connection |
KR100675703B1 (ko) * | 1999-03-25 | 2007-02-01 | 커넥터 시스템즈 테크놀로지 엔.브이. | 커넥터 세트 |
JP2000277885A (ja) * | 1999-03-25 | 2000-10-06 | Berg Technol Inc | 電気コネクタおよびその製造方法 |
TW422458U (en) * | 1999-04-09 | 2001-02-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
TW465815U (en) * | 1999-04-09 | 2001-11-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
JP3120377B2 (ja) * | 1999-04-28 | 2000-12-25 | モレックス インコーポレーテッド | ピングリッドアレイパッケージ用ソケット及び端子 |
US6433564B1 (en) | 1999-06-14 | 2002-08-13 | St Assemby Test Services Pte. Ltd | BGA device positioner kit |
US6464513B1 (en) * | 2000-01-05 | 2002-10-15 | Micron Technology, Inc. | Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same |
US6848942B1 (en) * | 2000-01-12 | 2005-02-01 | Molex Incorporated | Connectors having supportive barrier components |
US6758702B2 (en) * | 2000-02-24 | 2004-07-06 | Fci Americas Technology, Inc. | Electrical connector with compression contacts |
US6866521B1 (en) * | 2000-09-14 | 2005-03-15 | Fci Americas Technology, Inc. | High density connector |
SE519385C2 (sv) * | 2000-10-02 | 2003-02-25 | Allgon Mobile Comm Ab | Kontaktdonsanordning, antennanordning samt bärbar radiokommunikationsanordning innefattande sådana |
JP4713014B2 (ja) * | 2001-05-16 | 2011-06-29 | モレックス インコーポレイテド | Bgaコネクタ |
JP2002367746A (ja) * | 2001-05-31 | 2002-12-20 | Molex Inc | 半導体パッケージの試験評価用ソケット、および、コンタクト |
US7045889B2 (en) * | 2001-08-21 | 2006-05-16 | Micron Technology, Inc. | Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
US7049693B2 (en) * | 2001-08-29 | 2006-05-23 | Micron Technology, Inc. | Electrical contact array for substrate assemblies |
US6529365B1 (en) * | 2001-09-28 | 2003-03-04 | Intel Corporation | Multiple terminal SMT BGA-style wound capacitor |
US6485313B1 (en) * | 2001-12-17 | 2002-11-26 | Hon Hai Precision Ind. Co., Ltd. | BGA socket with improved contacts |
US20030168738A1 (en) * | 2002-03-08 | 2003-09-11 | Intel Corporation | Socketable IC package and associated methods |
FR2846343B1 (fr) * | 2002-10-25 | 2004-12-17 | Staubli Lyon | Mecanisme de formation de la foule et metier a tisser equipe d'un tel mecanisme |
US20040147169A1 (en) | 2003-01-28 | 2004-07-29 | Allison Jeffrey W. | Power connector with safety feature |
US6769924B1 (en) * | 2003-05-13 | 2004-08-03 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector having a releasable cover |
US7297003B2 (en) * | 2003-07-16 | 2007-11-20 | Gryphics, Inc. | Fine pitch electrical interconnect assembly |
EP1645173A2 (en) * | 2003-07-16 | 2006-04-12 | Gryphics, Inc. | Electrical interconnect assembly with interlocking contact system |
JP4021457B2 (ja) * | 2003-07-29 | 2007-12-12 | 株式会社アドバンテスト | ソケット、及び試験装置 |
US6881074B1 (en) * | 2003-09-29 | 2005-04-19 | Cookson Electronics, Inc. | Electrical circuit assembly with micro-socket |
US20050101190A1 (en) * | 2003-11-12 | 2005-05-12 | Ong Mei L. | Terminal with flexible tail |
US7059873B2 (en) * | 2003-12-09 | 2006-06-13 | Fci Americas Technology, Inc. | LGA-BGA connector housing and contacts |
US7458839B2 (en) | 2006-02-21 | 2008-12-02 | Fci Americas Technology, Inc. | Electrical connectors having power contacts with alignment and/or restraining features |
JP2007517373A (ja) | 2003-12-31 | 2007-06-28 | エフシーアイ | 電力接点およびこれを有するコネクタ |
US7214104B2 (en) | 2004-09-14 | 2007-05-08 | Fci Americas Technology, Inc. | Ball grid array connector |
US7476108B2 (en) | 2004-12-22 | 2009-01-13 | Fci Americas Technology, Inc. | Electrical power connectors with cooling features |
US7226296B2 (en) * | 2004-12-23 | 2007-06-05 | Fci Americas Technology, Inc. | Ball grid array contacts with spring action |
US7384289B2 (en) * | 2005-01-31 | 2008-06-10 | Fci Americas Technology, Inc. | Surface-mount connector |
US7303427B2 (en) * | 2005-04-05 | 2007-12-04 | Fci Americas Technology, Inc. | Electrical connector with air-circulation features |
DE102005062420A1 (de) * | 2005-12-27 | 2007-07-05 | Vega Grieshaber Kg | Elektronikeinsatz-Anordnung für ein Messgerätegehäuse |
US8044502B2 (en) | 2006-03-20 | 2011-10-25 | Gryphics, Inc. | Composite contact for fine pitch electrical interconnect assembly |
US7226298B1 (en) | 2006-03-29 | 2007-06-05 | Fci Americas Technology, Inc. | Electrical connector with segmented housing |
US7425145B2 (en) * | 2006-05-26 | 2008-09-16 | Fci Americas Technology, Inc. | Connectors and contacts for transmitting electrical power |
US7726982B2 (en) | 2006-06-15 | 2010-06-01 | Fci Americas Technology, Inc. | Electrical connectors with air-circulation features |
US7695287B2 (en) * | 2006-07-06 | 2010-04-13 | Harris Corporation | Ball grid array (BGA) connection system and related method and ball socket |
US7267558B1 (en) * | 2006-08-24 | 2007-09-11 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector with contact |
JP4851290B2 (ja) * | 2006-10-03 | 2012-01-11 | 株式会社オートネットワーク技術研究所 | 接続端子 |
US7553170B2 (en) * | 2006-12-19 | 2009-06-30 | Fci Americas Technology, Inc. | Surface mount connectors |
US7905731B2 (en) | 2007-05-21 | 2011-03-15 | Fci Americas Technology, Inc. | Electrical connector with stress-distribution features |
JP2009036679A (ja) * | 2007-08-02 | 2009-02-19 | Yamaichi Electronics Co Ltd | 半導体装置用ソケット |
US7762857B2 (en) | 2007-10-01 | 2010-07-27 | Fci Americas Technology, Inc. | Power connectors with contact-retention features |
JP5083327B2 (ja) * | 2007-12-27 | 2012-11-28 | 山一電機株式会社 | 半導体装置用ソケット |
US7976319B2 (en) * | 2008-06-30 | 2011-07-12 | Tyco Electronics Corporation | Surface mount electrical connector having flexible solder tails |
US8062051B2 (en) | 2008-07-29 | 2011-11-22 | Fci Americas Technology Llc | Electrical communication system having latching and strain relief features |
US7857631B2 (en) * | 2008-12-30 | 2010-12-28 | Cascade Microtech, Inc. | Socket with a housing with contacts with beams of unequal lengths |
USD610548S1 (en) | 2009-01-16 | 2010-02-23 | Fci Americas Technology, Inc. | Right-angle electrical connector |
USD608293S1 (en) | 2009-01-16 | 2010-01-19 | Fci Americas Technology, Inc. | Vertical electrical connector |
USD606497S1 (en) | 2009-01-16 | 2009-12-22 | Fci Americas Technology, Inc. | Vertical electrical connector |
USD640637S1 (en) | 2009-01-16 | 2011-06-28 | Fci Americas Technology Llc | Vertical electrical connector |
USD664096S1 (en) | 2009-01-16 | 2012-07-24 | Fci Americas Technology Llc | Vertical electrical connector |
USD619099S1 (en) | 2009-01-30 | 2010-07-06 | Fci Americas Technology, Inc. | Electrical connector |
US8323049B2 (en) | 2009-01-30 | 2012-12-04 | Fci Americas Technology Llc | Electrical connector having power contacts |
US8366485B2 (en) | 2009-03-19 | 2013-02-05 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate |
US8969734B2 (en) | 2009-04-01 | 2015-03-03 | Advanced Interconnections Corp. | Terminal assembly with regions of differing solderability |
US8119926B2 (en) * | 2009-04-01 | 2012-02-21 | Advanced Interconnections Corp. | Terminal assembly with regions of differing solderability |
USD618181S1 (en) | 2009-04-03 | 2010-06-22 | Fci Americas Technology, Inc. | Asymmetrical electrical connector |
USD618180S1 (en) | 2009-04-03 | 2010-06-22 | Fci Americas Technology, Inc. | Asymmetrical electrical connector |
US9276336B2 (en) | 2009-05-28 | 2016-03-01 | Hsio Technologies, Llc | Metalized pad to electrical contact interface |
US8955215B2 (en) * | 2009-05-28 | 2015-02-17 | Hsio Technologies, Llc | High performance surface mount electrical interconnect |
WO2014011232A1 (en) | 2012-07-12 | 2014-01-16 | Hsio Technologies, Llc | Semiconductor socket with direct selective metalization |
WO2010147939A1 (en) | 2009-06-17 | 2010-12-23 | Hsio Technologies, Llc | Semiconductor socket |
US9930775B2 (en) | 2009-06-02 | 2018-03-27 | Hsio Technologies, Llc | Copper pillar full metal via electrical circuit structure |
US9277654B2 (en) | 2009-06-02 | 2016-03-01 | Hsio Technologies, Llc | Composite polymer-metal electrical contacts |
US9184527B2 (en) | 2009-06-02 | 2015-11-10 | Hsio Technologies, Llc | Electrical connector insulator housing |
US8928344B2 (en) | 2009-06-02 | 2015-01-06 | Hsio Technologies, Llc | Compliant printed circuit socket diagnostic tool |
US9196980B2 (en) * | 2009-06-02 | 2015-11-24 | Hsio Technologies, Llc | High performance surface mount electrical interconnect with external biased normal force loading |
WO2013036565A1 (en) | 2011-09-08 | 2013-03-14 | Hsio Technologies, Llc | Direct metalization of electrical circuit structures |
WO2012061008A1 (en) | 2010-10-25 | 2012-05-10 | Hsio Technologies, Llc | High performance electrical circuit structure |
WO2012078493A1 (en) | 2010-12-06 | 2012-06-14 | Hsio Technologies, Llc | Electrical interconnect ic device socket |
WO2010141297A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Compliant printed circuit wafer level semiconductor package |
US8988093B2 (en) | 2009-06-02 | 2015-03-24 | Hsio Technologies, Llc | Bumped semiconductor wafer or die level electrical interconnect |
US9613841B2 (en) | 2009-06-02 | 2017-04-04 | Hsio Technologies, Llc | Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection |
US8618649B2 (en) | 2009-06-02 | 2013-12-31 | Hsio Technologies, Llc | Compliant printed circuit semiconductor package |
US9054097B2 (en) | 2009-06-02 | 2015-06-09 | Hsio Technologies, Llc | Compliant printed circuit area array semiconductor device package |
WO2010141266A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Compliant printed circuit peripheral lead semiconductor package |
US8912812B2 (en) | 2009-06-02 | 2014-12-16 | Hsio Technologies, Llc | Compliant printed circuit wafer probe diagnostic tool |
US9184145B2 (en) | 2009-06-02 | 2015-11-10 | Hsio Technologies, Llc | Semiconductor device package adapter |
WO2011002709A1 (en) | 2009-06-29 | 2011-01-06 | Hsio Technologies, Llc | Compliant printed circuit semiconductor tester interface |
WO2010141303A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Resilient conductive electrical interconnect |
WO2014011226A1 (en) | 2012-07-10 | 2014-01-16 | Hsio Technologies, Llc | Hybrid printed circuit assembly with low density main core and embedded high density circuit regions |
WO2012074963A1 (en) | 2010-12-01 | 2012-06-07 | Hsio Technologies, Llc | High performance surface mount electrical interconnect |
US9414500B2 (en) | 2009-06-02 | 2016-08-09 | Hsio Technologies, Llc | Compliant printed flexible circuit |
US9276339B2 (en) | 2009-06-02 | 2016-03-01 | Hsio Technologies, Llc | Electrical interconnect IC device socket |
US8970031B2 (en) | 2009-06-16 | 2015-03-03 | Hsio Technologies, Llc | Semiconductor die terminal |
US9318862B2 (en) | 2009-06-02 | 2016-04-19 | Hsio Technologies, Llc | Method of making an electronic interconnect |
US8981568B2 (en) | 2009-06-16 | 2015-03-17 | Hsio Technologies, Llc | Simulated wirebond semiconductor package |
US8984748B2 (en) | 2009-06-29 | 2015-03-24 | Hsio Technologies, Llc | Singulated semiconductor device separable electrical interconnect |
US10159154B2 (en) | 2010-06-03 | 2018-12-18 | Hsio Technologies, Llc | Fusion bonded liquid crystal polymer circuit structure |
US9689897B2 (en) | 2010-06-03 | 2017-06-27 | Hsio Technologies, Llc | Performance enhanced semiconductor socket |
US9350093B2 (en) | 2010-06-03 | 2016-05-24 | Hsio Technologies, Llc | Selective metalization of electrical connector or socket housing |
TWM402514U (en) * | 2010-09-09 | 2011-04-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US8197264B1 (en) * | 2011-03-02 | 2012-06-12 | Lear Corporation | Electrical connector |
US8183155B1 (en) * | 2011-03-30 | 2012-05-22 | Hon Hai Precision Ind. Co., Ltd. | Lower profile connector assembly |
US8449307B2 (en) * | 2011-09-23 | 2013-05-28 | Hon Hai Precision Industry Co., Ltd. | Socket connector having contact with multiple beams jointly grasping ball of IC package |
US8449306B2 (en) * | 2011-09-23 | 2013-05-28 | Hon Hai Precision Industry Co., Ltd. | Contact terminal unit and socket connector incorporated with the same |
EP2624034A1 (en) | 2012-01-31 | 2013-08-07 | Fci | Dismountable optical coupling device |
JP5868239B2 (ja) * | 2012-03-27 | 2016-02-24 | 株式会社日本マイクロニクス | プローブ及びプローブカード |
US9257778B2 (en) | 2012-04-13 | 2016-02-09 | Fci Americas Technology | High speed electrical connector |
USD718253S1 (en) | 2012-04-13 | 2014-11-25 | Fci Americas Technology Llc | Electrical cable connector |
USD727268S1 (en) | 2012-04-13 | 2015-04-21 | Fci Americas Technology Llc | Vertical electrical connector |
USD727852S1 (en) | 2012-04-13 | 2015-04-28 | Fci Americas Technology Llc | Ground shield for a right angle electrical connector |
US8944831B2 (en) | 2012-04-13 | 2015-02-03 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate with engagement members |
US9761520B2 (en) | 2012-07-10 | 2017-09-12 | Hsio Technologies, Llc | Method of making an electrical connector having electrodeposited terminals |
USD751507S1 (en) | 2012-07-11 | 2016-03-15 | Fci Americas Technology Llc | Electrical connector |
US9543703B2 (en) | 2012-07-11 | 2017-01-10 | Fci Americas Technology Llc | Electrical connector with reduced stack height |
JP5454646B1 (ja) * | 2012-09-25 | 2014-03-26 | 第一精工株式会社 | 電気コネクタ |
USD745852S1 (en) | 2013-01-25 | 2015-12-22 | Fci Americas Technology Llc | Electrical connector |
USD720698S1 (en) | 2013-03-15 | 2015-01-06 | Fci Americas Technology Llc | Electrical cable connector |
US10506722B2 (en) | 2013-07-11 | 2019-12-10 | Hsio Technologies, Llc | Fusion bonded liquid crystal polymer electrical circuit structure |
US10667410B2 (en) | 2013-07-11 | 2020-05-26 | Hsio Technologies, Llc | Method of making a fusion bonded circuit structure |
KR101544499B1 (ko) | 2014-04-02 | 2015-08-17 | 리노공업주식회사 | 검사장치 |
US9755335B2 (en) | 2015-03-18 | 2017-09-05 | Hsio Technologies, Llc | Low profile electrical interconnect with fusion bonded contact retention and solder wick reduction |
CN109244765A (zh) * | 2018-09-26 | 2019-01-18 | 绵阳市广达精密五金制造有限公司 | 一种转接头装配支架 |
US11626677B2 (en) * | 2020-05-13 | 2023-04-11 | Semiconductor Components Industries, Llc | Bonding module pins to an electronic substrate |
US11735879B2 (en) | 2021-03-09 | 2023-08-22 | Atl Technology, Llc | Adaptor for converting a ball grid array interface into a pin interface |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2287364A (en) * | 1994-03-07 | 1995-09-13 | Ibm | Dual substrate package assembly for being electrically coupled to a conductive member |
US5459287A (en) * | 1994-05-18 | 1995-10-17 | Dell Usa, L.P. | Socketed printed circuit board BGA connection apparatus and associated methods |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1051988A (en) * | 1975-05-30 | 1979-04-03 | William S. Scheingold | Electrical connector for leadless integrated circuit package |
US4447109A (en) * | 1982-06-04 | 1984-05-08 | Western Electric Company, Inc. | Connector pin |
JPS6293964A (ja) * | 1985-10-21 | 1987-04-30 | Dai Ichi Seiko Co Ltd | Ic検査用ソケツト |
US4948030A (en) * | 1989-01-30 | 1990-08-14 | Motorola, Inc. | Bond connection for components |
US5562462A (en) * | 1994-07-19 | 1996-10-08 | Matsuba; Stanley | Reduced crosstalk and shielded adapter for mounting an integrated chip package on a circuit board like member |
-
1995
- 1995-11-30 US US08/565,539 patent/US5746608A/en not_active Expired - Lifetime
-
1996
- 1996-11-13 EP EP96940424A patent/EP0864249A1/en not_active Ceased
- 1996-11-13 CN CN96198692A patent/CN1113589C/zh not_active Expired - Fee Related
- 1996-11-13 KR KR10-1998-0704032A patent/KR100432860B1/ko not_active IP Right Cessation
- 1996-11-13 WO PCT/US1996/018206 patent/WO1997020454A1/en active IP Right Grant
- 1996-11-13 JP JP52052097A patent/JP3590410B2/ja not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2287364A (en) * | 1994-03-07 | 1995-09-13 | Ibm | Dual substrate package assembly for being electrically coupled to a conductive member |
US5459287A (en) * | 1994-05-18 | 1995-10-17 | Dell Usa, L.P. | Socketed printed circuit board BGA connection apparatus and associated methods |
Also Published As
Publication number | Publication date |
---|---|
WO1997020454A1 (en) | 1997-06-05 |
JP3590410B2 (ja) | 2004-11-17 |
US5746608A (en) | 1998-05-05 |
KR19990071754A (ko) | 1999-09-27 |
JP2000501241A (ja) | 2000-02-02 |
EP0864249A1 (en) | 1998-09-16 |
CN1203732A (zh) | 1998-12-30 |
KR100432860B1 (ko) | 2004-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1113589C (zh) | 电子插件的表面安装插座及其中使用的触头 | |
US5427535A (en) | Resilient electrically conductive terminal assemblies | |
US4621880A (en) | Electrical contact elements, connectors and assemblies | |
EP2139079B1 (en) | Through board inverted connector | |
CN1144323C (zh) | 一种电连接器 | |
CN100468872C (zh) | 导电插塞连接器 | |
CN1205702C (zh) | 有凹进的焊球脚的电连接器 | |
US6957987B2 (en) | Socket connector for integrated circuit | |
CN102790332A (zh) | Led连接器及照明器具 | |
US4964806A (en) | Surface-mounting connector | |
JP2003197299A (ja) | 表面実装型直角電気コネクタ | |
WO2000045467A1 (en) | Direct circuit to circuit stored energy connector | |
US5250759A (en) | Surface mount component pads | |
US5873739A (en) | Direct circuit to circuit stored energy connector | |
JP2009503784A (ja) | 基板界面における電気コネクタの圧力逃げ | |
CN112787119A (zh) | 电路板的导电连接装置 | |
US7097517B2 (en) | Socket connector for integrated circuit | |
US6083045A (en) | Electrical connector | |
CN1417893A (zh) | 球栅阵列插座 | |
CN100459303C (zh) | 具有适应性端接引线的电子插座 | |
US6575791B1 (en) | Electrical connector providing reliable electrical interconnection with mated devices | |
WO2004068640A1 (en) | Conductive terminal and the electrical connector using the conductive terminal | |
CN101316023B (zh) | 端子料带结构和端子料带的料带去除的方法 | |
CN1155141C (zh) | 电连接器 | |
CN200972988Y (zh) | 电连接器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20030702 Termination date: 20121113 |