CN112787119A - 电路板的导电连接装置 - Google Patents
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Abstract
本发明涉及一种在第一电路板(12)和第二电路板(14)之间的接触连接装置(10),其特征在于,第一电路板(12)在接触连接装置(10)的区域中包括连接销(18)并且第二电路板(14)在接触连接装置(10)的区域中包括贯通插孔(16),其中,第一电路板(12)的连接销(18)穿过第二电路板(14)的贯通插孔(16)插接,其中,连接销(18)在通过第二电路板(14)的贯通插孔(16)伸出到第二电路板(14)以外的区段(24)中通过变形过程(尤其是弯曲过程或铆接过程)变形,使得在第一电路板(12)和第二电路板(14)之间形成形状配合的连接。
Description
技术领域
本发明涉及一种在第一电路板和第二电路板之间的导电的接触连接装置。
本发明还涉及一种用于在第一电路板和第二电路板之间建立导电的接触连接装置的方法。
背景技术
根据现有技术,在组件(例如电路板)之间的导电的接触连接装置是已知的。由DE41 32 995 A1例如已知将刚性电路板的触点与柔性电路板的触点焊接。例如还已知两个电路板,尤其是一刚性的电路板和一柔性的电路板,其经由安装在电路板上的所谓的插接连接条和电路板插座、连接带或插座板彼此连接。
发明内容
本发明的目的是提供一种相对于现有技术而言更加成本有利的、能以较少工作建立的导电的接触连接装置和一种用于建立导电的接触连接装置的方法。
根据本发明提出,第一电路板在接触连接装置的区域中包括连接销并且第二电路板在接触连接装置的区域中包括贯通插孔其中,第一电路板的连接销至少部分地由导电材料形成并且穿过第二电路板的贯通插孔插接,其中,连接销在通过第二电路板的贯通插孔伸出到第二电路板以外的区段上通过变形过程(尤其是弯曲过程或铆接过程)变形(umgeformt),使得在第一电路板和第二电路板之间形成形状配合的连接。
根据本发明的接触连接装置无需进一步的焊接过程就可建立。与插接连接装置相比,根据本发明的接触连接装置需要的材料消耗较少。
连接销特别包括圆柱形形状并且至少在通过第二电路板的贯通插孔伸出到第二电路板以外的区段中是可塑性变形的。
连接销例如由金属和/或合金和/或部分地由塑料与导电材料组合制成。
连接销在通过第二电路板的贯通插孔伸出到第二电路板以外的区段中借助合适的工具在力作用下变形,该变形的区段保持第二电路板部分地突出于第一电路板上。
有利地,第二电路板的贯通插孔的内壁包括导电材料。第一电路板的穿过第二电路板的贯通插孔插接的连接销至少部分地(优选整个周面地)接触所述内壁,由此形成导电连接。
根据优选的实施方式,连接销借助通孔金属化(Durchkontaktierung),尤其是通孔回流(Pin-in-Paste)焊接方法,与第一电路板连接。连接销被引导穿过第一电路板中的开口(所谓的安装孔)并且与第一电路板焊接。例如,连接销在第一电路板的后侧上或在通孔回流焊接方法的情况下在开口中与第一电路板焊接。在通孔回流焊接方法中,将焊膏压入开口中,然后插接连接销。在焊膏熔化时,液态焊料回到开口中并且形成焊接连接部。也可想到的是,连接销在位于第一电路板的后侧上伸出超过第一电路板的区段中包括预制的铆钉头,从而通过伸出到第二电路板以外的区段的变形来完成铆接连接。
根据另一优选的实施方式,连接销借助表面安装,尤其是SMT(Surface-Mounting-Technologie:表面安装技术)焊接方法与第一电路板连接。然后将连接销借助可焊接的连接面直接地焊接到第一电路板上。
根据另一优选实施方式,第一电路板是刚性的电路板和/或第二电路板是柔性的电路板。第一电路板包括例如用环氧树脂浸渍的玻璃纤维垫作为非导电的载体材料,该载体材料也作为材料标识FR4得知。第二电路板例如是基于聚酰亚胺薄膜的、尤其是薄的电路板。这种电路板可有利节省空间地(尤其通过折叠以最紧密的结构)例如应用在照明装置中,和/或用于例如在照明装置中连接两个刚性的电路板。
其他的有利实施方式涉及一种用于在第一电路板和第二电路板之间建立导电的接触连接装置的方法,其中,第一电路板在接触连接装置的区域中包括连接销并且第二电路板在接触连接装置的区域中包括贯通插孔,其中,第一电路板的连接销至少部分地由导电材料形成,其特征在于,第一电路板的连接销穿过第二电路板的贯通插孔插接,然后连接销的通过第二电路板的贯通插孔伸出到第二电路板以外的区段在一个变形过程(尤其是弯曲过程或铆接过程中)变形,使得在第一电路板和第二电路板之间形成形状配合的连接。
在变形过程中,连接销在通过第二电路板的贯通插孔伸出到第二电路板以外的区段中借助合适的工具在力作用下变形,变形的区段随后保持第二电路板部分地突出于第一电路板上。
变形例如包括:所谓的压平连接销;和/或,预成型(尤其通过用球头锤循环冲击)铆钉头;和/或,(尤其借助铆钉头墩锻器)最终成型铆钉头的形状。
根据优选的实施方式,在先前的步骤中,连接销借助通孔金属化,尤其是通孔回流焊接方法,与第一电路板连接。
根据优选的实施方式,在先前的步骤中,连接销借助表面安装,尤其是SMT(表面安装技术)焊接方法与第一电路板连接。
附图说明
本发明的实施例在附图中示出并且在下面的说明中详细阐述。在此,不同附图中的相同的附图标记分别表示相同的元件或至少其功能相同的元件。其中分别以示意性的形式示出:
图1示出了根据第一优选实施方式的、根据本发明的导电的接触连接装置;
图2示出了根据另一优选实施方式的、根据本发明的导电的接触连接装置;
图3示出了借助根据本发明的接触连接装置彼此连接的电路板。
具体实施方式
图1示出了根据第一优选实施方式的、根据本发明的导电的接触连接装置的剖视图,接触连接装置整体用附图标记10表示。接触连接装置10连接第一电路板12与第二电路板14。第二电路板14包括贯通插孔16并且第一电路板12包括连接销18,该连接销穿过第二电路板14的贯通插孔16插接。
连接销18至少部分地由导电材料形成。
根据图1中示出的实施方式,连接销18安装在第一电路板12的表面20上。连接销18例如借助SMT(表面安装技术)焊接方法与第一电路板12的表面20连接。
第二电路板14的贯通插孔16的内壁22包括导电材料。连接销18至少部分地(优选整个周面地)接触内壁22,由此形成导电的连接装置,其形成在第一电路板12和第二电路板14之间。
连接销18在通过第二电路板14的贯通插孔16伸出到第二电路板14以外的区段24中通过变形过程(尤其是弯曲过程或铆接过程)变形,使得在第一电路板12和第二电路板14之间形成形状配合的连接。变形的区段24保持第二电路板14部分地突出于第一电路板12上。
借助合适的工具在力作用下进行变形。该变形例如包括:所谓的压平连接销18;和/或,将区段24预成型(尤其通过用球头锤循环冲击)为铆钉头的形式;和/或,(尤其借助铆钉头墩锻器)将区段24最终成型为铆钉头的形状。
图2示出了根据另一实施方式的接触连接装置10的剖视图。第一电路板的连接销18借助通孔金属化与第一电路板12连接。
为此,第一电路板12包括开口26(所谓的安装孔)。连接销18被引导穿过第一电路板12的开口26,并且与第一电路板12焊接。根据示出的实施方式,借助通孔回流焊接方法使连接销18在开口26中与第一电路板12焊接。为此,首先将焊膏压入开口26中,然后插接连接销18。在焊膏熔化时,液态焊料回到开口26中并且形成焊接连接部28。根据未示出的实施方式也可想到的是,连接销18焊接在第一电路板12的后侧30上。还可想到的是,连接销在位于后侧30上伸出超过第一电路板12的区段中包括预制的铆钉头,从而通过伸出到第二电路板14以外的区段24的变形来完成铆接连接。
图3示出了借助根据本发明的接触连接装置10彼此连接的多个电路板12、14的侧视图。第一电路板12是刚性的电路板并且第二电路板14是柔性的电路板。此外还设有另一刚性的电路板12’。第一电路板12包括例如用环氧树脂浸渍的玻璃纤维垫作为非导电的载体材料,该载体材料也作为材料标识FR4得知。第二电路板14例如是基于聚酰亚胺薄膜的、尤其是薄的电路板。根据示出的实施方式,第二电路板14用于连接两个刚性电路板12、12’。这种应用例如可想到在照明装置中特别用于连接LED电路板。在此,LED电路板包括一个或多个LED,其中,尤其在具有多腔反射器或/或具有多个馈入点的照明装置中应用多个电路板。
Claims (14)
1.一种在第一电路板(12)和第二电路板(14)之间的导电的接触连接装置(10),其特征在于,所述第一电路板(12)在所述接触连接装置(10)的区域中包括连接销(18)并且所述第二电路板(14)在所述接触连接装置(10)的区域中包括贯通插孔(16),其中,所述第一电路板(12)的连接销(18)至少部分地由导电材料形成并且穿过所述第二电路板(14)的贯通插孔(16)插接,其中,所述连接销(18)在通过所述第二电路板(14)的贯通插孔(16)伸出到所述第二电路板(14)以外的区段(24)中通过变形过程变形,使得在所述第一电路板(12)和所述第二电路板(14)之间形成形状配合的连接。
2.根据权利要求1所述的接触连接装置(10),其特征在于,所述变形过程是弯曲过程或铆接过程。
3.根据权利要求1所述的接触连接装置(10),其特征在于,所述第二电路板(14)的贯通插孔(16)的内壁(22)包括导电材料。
4.根据前述权利要求中任一项所述的接触连接装置(10),其特征在于,所述连接销(18)借助通孔金属化与所述第一电路板(12)连接。
5.根据权利要求4所述的接触连接装置(10),其特征在于,所述连接销(18)借助通孔回流焊接方法与所述第一电路板(12)连接。
6.根据权利要求1至3中任一项所述的接触连接装置(10),其特征在于,所述连接销(18)借助表面安装与所述第一电路板(12)连接。
7.根据权利要求6所述的接触连接装置(10),其特征在于,所述连接销(18)借助表面安装技术(SMT)焊接方法与所述第一电路板(12)连接。
8.根据前述权利要求中任一项所述的接触连接装置(10),其特征在于,所述第一电路板(12)是刚性的电路板和/或所述第二电路板(14)是柔性的电路板。
9.一种用于在第一电路板(12)和第二电路板(14)之间建立导电的接触连接装置(10)的方法,其中,所述第一电路板(12)在所述接触连接装置(10)的区域中包括连接销(18)并且所述第二电路板(14)在所述接触连接装置(10)的区域中包括贯通插孔(16),其中,所述第一电路板(12)的连接销(18)至少部分地由导电材料形成,其特征在于,所述第一电路板(12)的连接销(18)穿过所述第二电路板(14)的贯通插孔(16)插接,然后所述连接销(18)的通过所述第二电路板(14)的贯通插孔(16)伸出到所述第二电路板(14)以外的区段(24)在变形过程中变形,使得在所述第一电路板(12)和第二电路板(14)之间形成形状配合的连接。
10.根据权利要求9所述的方法,其特征在于,所述变形过程是弯曲过程或铆接过程。
11.根据权利要求9或10所述的方法,其特征在于,在先前的步骤中,所述连接销(18)借助通孔金属化与所述第一电路板(12)连接。
12.根据权利要求11所述的方法,其特征在于,所述连接销(18)借助通孔回流焊接方法与所述第一电路板(12)连接。
13.根据权利要求11或12所述的方法,其特征在于,在先前的步骤中,所述连接销(18)借助表面安装与所述第一电路板(12)连接。
14.根据权利要求13所述的方法,其特征在于,所述连接销(18)借助表面安装技术(SMT)焊接方法与所述第一电路板(12)连接。
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US3980367A (en) * | 1975-03-19 | 1976-09-14 | Sealectro Corporation | Electrical connector for joining conductors attached to printed circuit boards |
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