CN1113111C - 印刷线路板用铜箔、其制法及其电解装置 - Google Patents

印刷线路板用铜箔、其制法及其电解装置

Info

Publication number
CN1113111C
CN1113111C CN96121815A CN96121815A CN1113111C CN 1113111 C CN1113111 C CN 1113111C CN 96121815 A CN96121815 A CN 96121815A CN 96121815 A CN96121815 A CN 96121815A CN 1113111 C CN1113111 C CN 1113111C
Authority
CN
China
Prior art keywords
anode
copper foil
electrolysis
mentioned
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN96121815A
Other languages
English (en)
Chinese (zh)
Other versions
CN1156190A (zh
Inventor
大原宗治
平泽裕
宫崎智弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of CN1156190A publication Critical patent/CN1156190A/zh
Application granted granted Critical
Publication of CN1113111C publication Critical patent/CN1113111C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/12—Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0635—In radial cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN96121815A 1995-12-06 1996-11-25 印刷线路板用铜箔、其制法及其电解装置 Expired - Fee Related CN1113111C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP344344/95 1995-12-06
JP344344/1995 1995-12-06
JP34434495A JP3281783B2 (ja) 1995-12-06 1995-12-06 プリント配線板用銅箔、その製造法及び電解装置

Publications (2)

Publication Number Publication Date
CN1156190A CN1156190A (zh) 1997-08-06
CN1113111C true CN1113111C (zh) 2003-07-02

Family

ID=18368516

Family Applications (1)

Application Number Title Priority Date Filing Date
CN96121815A Expired - Fee Related CN1113111C (zh) 1995-12-06 1996-11-25 印刷线路板用铜箔、其制法及其电解装置

Country Status (8)

Country Link
US (2) US5833819A (enExample)
EP (1) EP0778361B1 (enExample)
JP (1) JP3281783B2 (enExample)
KR (1) KR100195603B1 (enExample)
CN (1) CN1113111C (enExample)
DE (1) DE69627971T2 (enExample)
MY (1) MY119378A (enExample)
TW (1) TW370578B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102534696A (zh) * 2011-11-21 2012-07-04 灵宝华鑫铜箔有限责任公司 一种改进型生箔机

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3281783B2 (ja) * 1995-12-06 2002-05-13 三井金属鉱業株式会社 プリント配線板用銅箔、その製造法及び電解装置
JP3742144B2 (ja) * 1996-05-08 2006-02-01 ソニー株式会社 非水電解液二次電池及び非水電解液二次電池用の平面状集電体
US6183607B1 (en) 1999-06-22 2001-02-06 Ga-Tek Inc. Anode structure for manufacture of metallic foil
JP3458781B2 (ja) * 1999-07-06 2003-10-20 ダイソー株式会社 金属箔の製造方法
US6270648B1 (en) * 1999-10-22 2001-08-07 Yates Foil Usa, Inc. Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foil
JP4632272B2 (ja) * 2000-01-06 2011-02-16 日立マクセル株式会社 リチウム二次電池および電解銅箔
LU90532B1 (en) * 2000-02-24 2001-08-27 Circuit Foil Luxembourg Trading Sarl Comosite copper foil and manufacturing method thereof
WO2003096776A1 (en) * 2002-05-13 2003-11-20 Mitsui Mining & Smelting Co.,Ltd. Flexible printed wiring board for chip-on-film
WO2004070087A1 (ja) * 2003-02-04 2004-08-19 Furukawa Circuit Foil Co., Ltd 複合銅箔、その製造方法及び該複合銅箔を用いた高周波伝送回路
US8263225B2 (en) * 2004-06-01 2012-09-11 Isola Usa Corp. Laminate composition for producing reduced curl flat thin core laminate
EP2168148B1 (en) 2007-07-18 2012-05-16 Ricoh Company, Ltd. Laminate structure, electronic device, and display device
JP5386852B2 (ja) 2008-05-07 2014-01-15 株式会社リコー 積層構造体、半導体装置、積層構造体の製造方法及び半導体装置の製造方法
JP5116047B2 (ja) * 2010-03-09 2013-01-09 日立マクセルエナジー株式会社 リチウム二次電池および電解銅箔
JP2012107266A (ja) * 2010-11-15 2012-06-07 Jx Nippon Mining & Metals Corp 電解銅箔の製造方法及び製造装置
JP5329697B1 (ja) * 2012-05-14 2013-10-30 Ｊｘ日鉱日石金属株式会社 ２次電池集電体用電解銅箔
JP5329696B1 (ja) * 2012-05-14 2013-10-30 Ｊｘ日鉱日石金属株式会社 ２次電池集電体用電解銅箔
TWI515342B (zh) * 2013-09-05 2016-01-01 三井金屬鑛業股份有限公司 表面處理銅箔、使用該表面處理銅箔所得之貼銅積層板以及印刷配線板
KR101478464B1 (ko) * 2013-10-14 2015-01-02 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지
KR101502373B1 (ko) * 2013-10-14 2015-03-16 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지
KR101449342B1 (ko) * 2013-11-08 2014-10-13 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지
US9899683B2 (en) * 2015-03-06 2018-02-20 Iljin Materials Co., Ltd. Electrolytic copper foil, electric component and battery including the same
KR102136784B1 (ko) * 2015-07-24 2020-07-22 케이씨에프테크놀로지스 주식회사 리튬 이차전지용 전해동박 및 이를 포함하는 리튬 이차전지
JP6190980B2 (ja) 2015-09-25 2017-08-30 古河電気工業株式会社 電解銅箔、その電解銅箔を用いた各種製品
CN108649183B (zh) * 2018-05-14 2021-01-22 山东金宝电子股份有限公司 一种锂离子电池负极集流体用微孔铜箔的制备方法
CN112301382B (zh) * 2020-09-07 2021-11-26 浙江花园新能源股份有限公司 一种高延展性低轮廓电解铜箔的制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3483113A (en) * 1966-02-11 1969-12-09 United States Steel Corp Apparatus for continuously electroplating a metallic strip
US3567595A (en) * 1967-09-25 1971-03-02 Circuit Foil Corp Electrolytic plating method
US3901785A (en) * 1972-05-09 1975-08-26 Antonina Vladimiro Buzhinskaya Apparatus for producing a metal band
BR8607061A (pt) * 1985-12-24 1988-02-23 Gould Inc Processo e aparelho para eletrogalvanizacao de folha de cobre
JPS63282288A (ja) * 1987-05-15 1988-11-18 Furukawa Saakitsuto Fuoiru Kk 電解金属箔の製造方法とそれに用いる装置
JPH01198495A (ja) 1988-02-02 1989-08-10 Furukawa Saakitsuto Fuoiru Kk 電解金属箔の製造方法とそれに用いる装置
JPH031391A (ja) 1989-05-29 1991-01-08 Nec Ibaraki Ltd 磁気ディスク装置
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5326455A (en) * 1990-12-19 1994-07-05 Nikko Gould Foil Co., Ltd. Method of producing electrolytic copper foil and apparatus for producing same
JP3281783B2 (ja) * 1995-12-06 2002-05-13 三井金属鉱業株式会社 プリント配線板用銅箔、その製造法及び電解装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102534696A (zh) * 2011-11-21 2012-07-04 灵宝华鑫铜箔有限责任公司 一种改进型生箔机
CN102534696B (zh) * 2011-11-21 2015-05-27 灵宝华鑫铜箔有限责任公司 一种改进型生箔机

Also Published As

Publication number Publication date
JP3281783B2 (ja) 2002-05-13
EP0778361A2 (en) 1997-06-11
EP0778361B1 (en) 2003-05-07
MY119378A (en) 2005-05-31
US5997710A (en) 1999-12-07
JPH09157883A (ja) 1997-06-17
CN1156190A (zh) 1997-08-06
DE69627971T2 (de) 2004-05-19
TW370578B (en) 1999-09-21
KR970043311A (ko) 1997-07-26
EP0778361A3 (enExample) 1997-06-18
DE69627971D1 (de) 2003-06-12
KR100195603B1 (ko) 1999-06-15
US5833819A (en) 1998-11-10

Similar Documents

Publication Publication Date Title
CN1113111C (zh) 印刷线路板用铜箔、其制法及其电解装置
US4898647A (en) Process and apparatus for electroplating copper foil
CN101622380B (zh) 表面粗化铜板的制造方法和装置、以及表面粗化铜板
WO1987005182A1 (fr) Procede de fabrication de cartes de circuits electro-conducteurs
CN1337475A (zh) 电沉积铜箔的制造方法和电沉积铜箔
CN1404535A (zh) 复合铜箔及其制备方法
HK1039968A1 (zh) 帶載體箔的電解銅箔及其製造方法和使用該帶載體箔的電解銅箔的敷銅層壓板
TWI382799B (zh) 貫孔之填充方法
CN1164798C (zh) 生产电解铜箔的方法和设备
CN1076154C (zh) 铜箔及采用该铜箔制作内层电路的高密度多层印刷电路板
CN1831203A (zh) 电沉积铜箔
EP0250195A2 (en) Double matte finish copper foil
CN1335898A (zh) 带载体的电沉积铜箔及其制造方法
CN1068155A (zh) 改善了与基片的结合程度的金属箔以及制造这种金属箔的方法
CN111118582B (zh) 一种具有(220)高择优取向的Ni-SiC复合镀层的制备装置及方法
CN1276131C (zh) 用以形成做电池电极用的条带的连续电成型工艺及在所述电成型工艺中使用的心轴
CN1068154A (zh) 具有提高了的撕裂能度的金属箔以及制造这种金属箔的方法
CN112176366A (zh) 一种高延展性电解铜箔的电解液与应用
CN1636083A (zh) 沉积无光泽铜镀层的铜浴及方法
JPH1143797A (ja) ビアフィリング方法
CN1714176A (zh) 涂覆有包含聚合物的锌或锌合金的裸露钢板或镀锌钢板和通过电镀制造所述钢板的方法
CN1012688B (zh) 高性能电镀铬
JPH0149794B2 (enExample)
JP7408566B2 (ja) フラックスを用いずに付与されるはんだにおけるボイドを減少させるまたは除去するためのメッキ方法
JPH118469A (ja) ビアフィリング方法

Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20030702

Termination date: 20151125