CN111299188A

CN111299188A - Sorter for testing electronic components

Info

Publication number: CN111299188A
Application number: CN201911146750.9A
Authority: CN
Inventors: 金善真; 金峻秀
Original assignee: Techwing Co Ltd
Current assignee: Techwing Co Ltd
Priority date: 2018-12-11
Filing date: 2019-11-21
Publication date: 2020-06-19
Anticipated expiration: 2039-11-21
Also published as: CN113926722A; KR20200071357A; CN111299188B; TWI737060B; CN114192441A; CN113926738A; TW202026068A

Abstract

The present invention relates to a handler for testing electronic components. The handler for testing electronic components according to the present invention is provided with a test chamber having an access hole opened to one side, and the electronic component is brought into or out of the test chamber from the same access hole by an access device, and the access hole is closed by an opening/closing device when a test is performed on the electronic component. According to the present invention, it is possible to realize automated processing of electronic components while isolating the inside of the test chamber from the outside temperature environment or light.

Description

Sorter for testing electronic components

Technical Field

The present invention relates to a handler for testing electronic components.

Background

The produced electronic parts are divided into good products and defective products after being tested by the tester, and only the good products can be delivered out of the warehouse.

The electrical connection between the tester and the electronic parts is performed by an automated device called a sorter for electronic part testing (hereinafter, simply referred to as "sorter").

Since the handler needs to be able to accurately connect the electronic parts and the tester, it can be manufactured in various forms according to the kinds of the electronic parts.

Of course, an important technology basically required for the handler is a technology of electrically connecting the electronic parts and the tester, but there is also a technology selectively required depending on the test conditions and the kind of the electronic parts to be tested.

Generally, the electronic component and the tester are connected by pressing the electronic component toward the tester. At this time, in order to accurately press the electronic component, it is necessary to form a precise position setting between the pressing member (pusher) and the electronic component or between the electronic component and the test socket of the tester. Particularly, electronic parts such as semiconductor elements have a tendency that the size of terminals and the pitch between the terminals are more and more miniaturized due to higher and higher integration rates thereof, and thus precise electrical connection between the electronic parts and a tester is becoming more important. For this reason, it is necessary to consider various variables such as structural deviation of relevant components, operation error, and vibration due to operation of the equipment.

Further, one of the technologies selectively required may be a technology that sets harsh temperature conditions. Since electronic components may be used in a variety of temperature environments, it is necessary to test the electronic components in a purposely created harsh temperature environment. Therefore, a handler that requires a severe temperature environment is provided with a test chamber that can be sealed as closely as possible in a test state, and the electronic component is tested in the test chamber that creates the severe temperature environment.

Further, another of the plurality of technologies that are selectively required may be required for an electronic component for optics that can be used in a digital camera or the like. Since the electronic component for optical use needs to be tested in a state where light from the photographic subject can be sensed by the lens, illumination for irradiating light to the photographic subject should be used in testing the electronic component for optical use. Further, in order to obtain a satisfactory test result, it is necessary to use illumination in a state where stray light that may cause disturbance is blocked, and therefore, it is necessary to perform a test of an electronic component for optical use in a state where the incidence of stray light to a lens is suppressed to the maximum.

The present invention relates to a technique of a handler which can be suitably applied to a test of an optical electronic component, and therefore, a technique related to a test of an optical electronic component has been intensively studied.

At present, it is difficult to automate the electrical connection between the optical electronic component integrated with the photosensitive lens and the tester. This is because a test for an electronic component for optical use is to be performed in a dead bug (dead bug) state (a state in which a terminal of the electronic component is turned upward as if the insect turns over to die) in order to block the incidence of stray light through the lens.

Fig. 1 schematically shows a conceptual structure of a test in a dead insect state.

Referring to fig. 1, it is seen that the optical electronic component D is in contact with the TESTER below in a dead insect state. Further, since the TESTER is provided with the illumination hole LH for irradiating the light to the photosensitive lens SL via the illumination element LE positioned below, the illumination element LE is configured to irradiate the light to the photosensitive lens SL via the illumination hole LH. At this time, the electrical connection between the TESTER and the optical electronic component D is made through the terminal T of the test socket TS of the interface board SB (may also be referred to as socket board) of the TESTER located above the optical electronic component D₁Terminal T for optical electronic component D₂Contact is made.

In this manner, since the electronic component D is placed in the tester in a dead state, the terminal T of the electronic component D is connected to the terminal T₂It is substantially difficult to pick up and position the electronic component by vacuum suction using an automated robot. Therefore, the optical electronic component D is put in place by manual work, but such a way of putting the optical electronic component D in place by manual work of a worker is absolutely unsatisfactory in terms of processing time and cost, and leaves a trace caused by manual work on the surface of the electronic component D, so it is necessary to propose a technique of automatically supplying the optical electronic component D by a handler.

As mentioned previously, the sorter can be manufactured in various forms according to the electronic components to be tested, but can be mainly classified into a sorter for a form for mass production of a small variety such as a memory semiconductor element and a sorter for a form for mass production of a large variety such as a sensor.

Since the electronic device for optical use is an image sensing semiconductor element, a sorter of a form used in the latter multi-variety small-volume production can be considered as a sorter for automated processing of the electronic device for optical use.

As a separator manufactured in a form suitable for mass production of a plurality of varieties, Korean patent laid-open Nos. 10-2015-0064904, 10-2017-0068174 and 10-2017-0111497 (hereinafter referred to as "prior art") can be referred to.

With reference to the prior art, in order to bring electronic components into or out of the test chamber, a shuttle table is provided which is movable between the interior and the exterior of the test chamber. Therefore, transfer holes for arranging various mechanical members for passing or moving the shuttle table are formed in the wall surfaces of the left and right sides of the test chamber.

However, since the interior of the test chamber of the handler according to the related art communicates with the outside through the transfer hole, the accuracy of temperature control is accordingly lowered.

Also, external light may affect the inside of the test chamber through the transfer hole. Of course, even if the area through which the shuttle table passes in the area occupied by the transfer hole can be blocked to some extent by applying the opening and closing structure of the door, it is actually impossible to open and close the area through which the guide rail guiding the movement of the shuttle table, the transfer shaft for transferring the shuttle table, and the like pass. Therefore, if the sorter according to the related art is applied for testing the electronic components for optics, there is a possibility that the incidence of disturbance light causes a test error to occur, which is obvious. Therefore, it is difficult to directly follow the sorter according to the related art for testing the electronic parts for optics.

Further, in order to block stray light, the optical electronic component and the tester are electrically connected in a dead state (the photosensitive lens is located below and the terminal is located above), and in the prior art, the electronic component is electrically connected in a live bug state (the terminal of the electronic component is located below) to the tester in consideration of the pickup performance of the automated electronic component, so that it is more difficult to directly continue the test of the optical electronic component by using the sorting machine according to the prior art.

Also, if the electronic component for optical use is picked up in a live insect state like the related art, a pickup mark may be generated on the surface of the photosensitive lens due to the contact of the pad of the pickup (the element that can pick up the electronic component) with the surface of the photosensitive lens. Such pickup marks eventually reduce the recognition rate of the photosensitive lens and may cause a decrease in reliability of test results and product damage.

Further, there is a possibility that the glass material of the surface vulnerable to impact may be broken by a pressure impact of the pusher due to the pressure operation or an instantaneous impact due to an operation of another member during the test, and further, there is a possibility that the electric connection between the electronic component and the test socket may be defective due to a vibration generated by an operation of another member. In particular, since the electronic component for optics shows a difference in the recognition rate of light only from minute vibrations, it may be difficult to secure reliability with respect to the test result if the test is performed in a case where vibrations are generated.

For the above-described various reasons, it is impossible to simply apply the sorter according to the related art directly to the test of the electronic component for optical use.

Disclosure of Invention

The present invention has the following objects.

First, a technique is provided that can isolate the inside of a test chamber from the outside temperature environment, particularly, for an electronic optical component, and can realize automated processing while isolating the inside of the test chamber from the outside light.

Second, a technique is provided that can maximally suppress the transmission of vibration due to the operation of the apparatus to the electronic component under test.

Third, a technique is provided that can make the mutual position between a pusher that presses an electronic component and the electronic component accurate.

Fourth, a technique is provided which can minimize the pressure impact on the electronic component particularly in the test of the electronic component for optical use.

Fifth, there is provided a technique for preventing a mark due to the work of picking up the pickup from being generated in the region of the photosensitive lens even when the optical component is picked up.

The sorter for testing the electronic components comprises a testing cavity, a sorting device and a sorting module, wherein the testing cavity is provided with an access hole which is opened towards one side; an opening/closing device that opens the access hole when the electronic component is brought into or out of the test chamber through the access hole, and closes the access hole when a test for the electronic component is performed; an access device for picking up an electronic component to be tested and bringing it into the test chamber through the access hole or picking up an electronic component completed with testing and bringing it out of the test chamber through the access hole; and a pressurizing device for pressurizing the electronic component to be tested at the testing position and electrically connecting to the tester.

The above separator further includes: a carrier table having a carrier groove capable of carrying an electronic component; an application stacker equipped to carry a tray loaded with electronic parts to be tested to be moved to the stage; a recovery stacker equipped to carry a tray loaded with the tested electronic components to be recovered from the carrier table; a loading device moving the electronic parts to be tested from the supply stacker to the stage; and an unloading device for moving the tested electronic components from the bearing table to the reclaiming stacker, wherein the in-out device brings the electronic components to be tested on the bearing table into the testing chamber, and brings the tested electronic components out of the testing chamber and moves the tested electronic components to the bearing table.

The carrier stage is divided into a loading stage for loading electronic parts to be tested and an unloading stage for loading electronic parts to be tested, and is equipped with the following components: and a mover for selectively positioning the loading stage at a loading position for carrying the electronic parts and an access position for bringing the electronic parts into and out of the test chamber by moving the loading stage and the unloading stage, selectively positioning the unloading stage at the access position and an unloading position for unloading the electronic parts, wherein the loading device carries the electronic parts to be tested to the loading stage positioned at the loading position, the unloading device unloads the tested electronic parts from the unloading stage positioned at the unloading position, and the access device brings the tested electronic parts from the loading stage positioned at the access position into the test chamber, and takes the tested electronic parts out of the test chamber to move to the unloading stage positioned at the access position.

The access hole is formed to open to the front of the test chamber, the access position is located in front of the test chamber to correspond to the access hole, and the loading position and the unloading position are divided into both sides apart from the access position.

At least one of the pickers, which is provided to the loading device, the unloading device, or the in-out device to pick up the electronic part by suction, has a quadrangular suction pad capable of contacting the electronic part between the outermost contour of the electronic part and the contour of the photosensitive area in the electronic part.

The test chamber has an illumination window for incorporating an illumination device for illuminating light to the electronic component on the opposite side of the electronic component from the pressurizing device, the light of the illumination device being capable of illuminating the electronic component electrically connected to the test socket through the pressurizing device.

The illumination device is provided in a test chamber in combination with the illumination window in an arrangement form in which the lens barrel of the illumination device passes through, and the test chamber is provided with four opening and closing members for opening and closing a portion where the lens barrel is inserted into the illumination window.

The pressurizing device includes: a pressure plate equipped to be movable; and a pusher provided on the pressing plate side and configured to press or release the electronic component in accordance with movement of the pressing plate, wherein the pressing plate is formed with a first through hole through which light of the illumination device can pass, and the pusher is formed with a second through hole through which light passing through the first through hole can pass and be irradiated to the electronic component, at a position corresponding to the first through hole.

By equipping the inner wall surface of the test chamber or the constituent members arranged inside the test chamber with a black material or coating the surface with black, the darkening of the inside of the test chamber is enhanced.

The present invention has the following effects.

First, the inside of the test chamber is maximally darkened by isolating the inside from the external temperature environment or light, whereby the electronic component can be tested in an optimal test environment, thereby improving the reliability of the test.

Second, by maximally suppressing the vibration due to the operation of the apparatus from being transmitted to the electronic component under test, the electrical connection and the optical recognition between the electronic component under test and the tester are stably maintained.

Thirdly, since the movement of the pusher by the correction can be performed, the mutual position between the pusher and the electronic part becomes accurate, and the accuracy of the electrical connection between the electronic part and the tester is secured.

Fourth, by means of the action of the damping member, a pressure shock applied to the electronic component by the pusher or a vibration or instantaneous shock accompanying the operation of the apparatus is minimized, thereby preventing the electronic component from being damaged by the shock and vibration.

Fifth, although the optical electronic component is picked up, a trace due to the work of picking up the piece does not occur in the region of the photosensitive lens, thereby preventing damage to the product or improving the reliability of the test. Sixth, since the optical electronic device can be optically tested in a live insect state, it is possible to perform automated processing for the optical electronic device.

Drawings

Fig. 1 is a diagram for explaining a test structure of a conventional optical electronic component.

Fig. 2 is a plan view for explaining the concept of movement of electronic parts in the handler according to the present invention.

Fig. 3 is a reference diagram for explaining an electrical connection structure of an electronic component and a tester according to the present invention.

Fig. 4 is a conceptual plan view for explaining the constitution of the sorter according to an embodiment of the present invention.

Fig. 5 is an exploded view of the shuttle device of fig. 4 for an application.

Fig. 6 is a conceptual cut-out view of a loading pick-up robot applied to the sorter of fig. 4.

Fig. 7 is a diagram for explaining an adsorption pad applied to the loading pickup robot.

Fig. 8 is a reference view schematically showing a test chamber applied to the handler of fig. 4.

Fig. 9 and 10 are conceptual diagrams for explaining the configuration of the test chamber of fig. 8.

Fig. 11 is a diagram for explaining a vibration preventing member applied to the sorter of fig. 4.

Fig. 12 is a schematic sectional view of an entrance and exit device applied to the sorting machine of fig. 4.

Fig. 13 is a diagram for explaining an arrangement structure of a pressing device applied to the sorter of fig. 4.

Fig. 14 and 15 are schematic diagrams of a pressing device applied to the sorter of fig. 4.

Fig. 16 is a view for explaining a structure in which the pressurizing plate and the pusher are provided in the pressurizing device of fig. 14.

Fig. 17 and 18 are views for explaining an arrangement structure of a pusher applied to the pressurizing device of fig. 14.

Fig. 19 and 20 are views for explaining the pressurizing operation of the pusher by the pressurizing device of fig. 14.

Fig. 21 is a schematic perspective view of an illumination device applied to the sorter of fig. 4.

Fig. 22 and 23 are diagrams for explaining an arrangement structure of the illumination device of fig. 21.

Fig. 24 is a schematic diagram for explaining the structure of a pressurizing device according to another example of the present invention.

Fig. 25 is a diagram for explaining a technique for inspecting a mounting state of an electronic component applied to a loading stage and an unloading stage of the handler of fig. 4.

Description of the symbols

HR: the handler 100 for electronic component test: shuttle device

110: the loading table 120: unloading platform

130: the mover 210: loading device

211 a: the pickup GP: adsorption pad

220: the unloading device 300: test chamber

10: access hole 400: opening and closing device

500: the access device 600: pressure device

610: pressure adding disk TH₁: first through hole

620: pusher TH₂: second through hole

660: pressurizing drive source 700: lighting device

And SS: for application stacker RS: stacker for recycling

Detailed Description

Preferred embodiments according to the present invention are described with reference to the accompanying drawings, and descriptions of substantially the same constituent elements are omitted as much as possible for the sake of simplicity of description.

Fig. 2 is a conceptual plan view for explaining the movement of electronic parts in the sorter HR according to the present invention.

The electronic components are unloaded in groups of four from the tray T and moved from the supply position SP to the bring-in position IP after being moved from the supply stacker SS to the supply position SP in a state of being mounted on the tray T. And, if the electronic part moves from the carry-in position IP to the test position TP in the test chamber 300, the pressurizing means 600 operates to electrically connect the electronic part to the tester, and then the electronic part is tested. Here, a test socket for electrically connecting the electronic component and the tester is provided at the test position TP.

After the electronic component subjected to the test is moved from the test position TP to the carry-out position OP, the electronic component is moved from the carry-out position OP to the recovery position RP and loaded on the tray T at the recovery position RP. Then, the electronic components are sorted according to the test result in the process of being loaded on the tray T at the recovery position RP. Thereafter, if the tray T located at the recovery position RP is filled with the tested electronic components, the electronic components are moved to the recovery stacker RS in a state of being mounted on the tray T. Of course, the bring-in position IP and the bring-out position OP may be bound as the in-out position, and further, according to the embodiment, the bring-in position IP and the bring-out position OP may be the same position as each other.

Here, the carry-in position IP and the carry-out position OP constituting the carry-in and carry-out positions are both in front of the test chamber 300.

During the movement as described above, the electronic parts maintain the live insect state, and the test is also performed in the live insect state.

According to the present invention, the electrical connection structure of the electronic component and the tester is referred to as a conceptual configuration diagram of fig. 3.

The socket board SB of the tester is arranged below the electronic component D at the test position TP and at the terminal T of the test socket TS of the socket board SB₁Upward facing terminal T of electronic component D₂The live insect state is maintained in a downward mode. Then, the pressing device 600 presses the electronic component D downward, and at this time, the illumination element LE is disposed so as to be directed downward above the electronic component D, and irradiates light onto the upper surface of the electronic component D. Of course, the light irradiated by the illumination element LE is incident on the electronic component D through the pressurizing device 600 after passing through the condenser lens 650 irradiated by condensing the light on the electronic component D side.

Further, in the present invention, it is considered that the test chamber 300 for blocking the external interference light is configured to allow only the light irradiated from the illumination device LE to enter the electronic component D and to maintain the interior of the test chamber 300 in a darkroom state to the maximum extent in the test of the electronic component D for optical use.

Next, the main configuration of the sorter HR according to the present invention will be explained. The following description of the configuration is as follows: the main components constituting the sorter HR will be described briefly by function, and the main components will be selected and described in more detail.

The sorter HR according to the present embodiment includes a shuttle 100, a supply stacker SS, a loading device 210, an unloading device 220, three recovery stacker RS, a test chamber 300, an opening and closing device 400, an access device 500, a pressurizing device 600, an illumination device 700, a conveyor 800, a vibration-proof member 900, and a control device CA.

The shuttle 100 moves the electronic component D to be tested received from the loading device 210 from the loading position LP to the bring-in position IP or moves the electronic component subjected to the test from the bring-out position OP to the unloading position UP. To this end, the shuttle 100 is provided in front of the test chamber 300 and includes a loading stage 110, an unloading stage 120, and a mover 130 as shown in fig. 5.

The loading platform 110 has four bearing grooves G₁To carry four electronic components D at a time.

The unloading stage 120 is provided to be spaced apart from the loading stage 110 in the right direction of the loading stage 110, and similarly, has four loading grooves G₂To carry four electronic components D.

The loading stage 110 and the unloading stage 120 described above are arranged to move together in the left-right direction in conjunction with one moving part ME, and may be both located in front of the test chamber 300.

The mover 130 moves the moving member ME in the left-right direction, thereby finally moving the loading table 110 and the unloading table 120 in the left-right direction. Accordingly, the loading stage 110 may be selectively located at the loading position LP or the carrying-in position IP by the operation of the mover 130, and the unloading stage 120 may be selectively located at the carrying-out position OP or the unloading position UP.

For reference, "loading" in the present embodiment means that the electronic component D is carried to the loading stage 110, and "unloading" means that the electronic component is unloaded from the unloading stage 120.

The loading position LP is a position where the electronic component is loaded on the loading stage 110, and the unloading position UP is a position where the electronic component is unloaded from the unloading stage 120.

Also, the bring-in position IP is a position where the electronic component is brought into the test chamber 300, and the bring-out position OP is a position where the electronic component is brought out from the test chamber 300. Here, as mentioned above, the carry-in position IP and the carry-out position OP may be positioned as an in-out position in front of the test chamber 300, and the loading position LP and the unloading position UP are divided on both sides apart from the in-out position.

The present embodiment intends to achieve smooth movement of the electronic component D by the shuttle device 100 equipped with the loading stage 110 and the unloading stage 120 that can move in the left-right direction. However, according to actual implementation, the electronic component D may be moved by providing a fixed loading stage and unloading stage and extending the operation range of the loading device 210, the unloading device 220, and the access device 500, which will be described later.

Also, in the present invention, the loading table 110 and the unloading table 120 are provided independently of each other for the sake of processing speediness, but as mentioned earlier, in the case where the carry-in position and the carry-out position are in accordance with the same modification, a case where only one carrier table that is compatible with the carrier table and the unloading table is provided may be preferably considered. Similarly, although one carrier table may be configured to be movable, it is entirely possible to consider a fixedly equipped case, in which case the process of separately passing through the loading position and the unloading position may be omitted.

That is, although the present embodiment to which the shuttle 100 of fig. 5 is applied realizes smooth movement of the electronic component D by the

movable stages

110, 120, the present invention does not exclude any movement manner for bringing the electronic component D out of or into the test chamber 300, which is modified from or different from the above-described example.

The application stacker SS is equipped for carrying a tray T loaded with electronic components D to be tested. Here, according to an actual embodiment, the job of carrying the tray T with the supply stacker SS may be implemented to be manually completed by a worker or automatically completed by an automated server.

The loading device 210 loads the electronic component D to be tested to the loading table 110 at the loading position LP. To this end, the loading device 210 includes a pick-up robot 211 for loading and a transporter 212 for supply.

The loading pickup robot 211 unloads the electronic components D from the tray T located at the supply position SP and mounts them to the loading table 110 at the loading position LP in a set of four.

The supply transporter 212 takes out the trays T located in the supply stacker SS one by one and moves them to the supply position SP.

The unloading device 220 unloads the electronic component D, which has completed the test, from the unloading stage 120 and mounts it on the tray T located at the recovery position RP, and moves the tray T located at the recovery position RP to the stacker RS for recovery. For this, the unloading device 220 includes an unloading pickup robot 221 and a recovery transporter 222.

The unloading pickup robot 221 may have the same configuration as the loading pickup robot 211, and may unload the tested electronic component D moved from the carry-out position OP to the unloading position UP from the unloading stage 120 and mount it on the tray T located at the recovery position RP. In this process, the electronic components D are sorted according to the test results thereof and moved to the tray T located at the respective recovery positions RP.

The recycle conveyor 222 moves the tray T filled with the tested electronic components D from the recycle position RP to the recycle stacker RS.

The recovery stacker RS is provided for carrying the trays T from each corresponding recovery position RP.

The test chamber 300 is configured to be able to test the electronic component D housed at the test position TP in a desired environment during a test, and to enclose the inside thereof. Such a test chamber 300 includes an access hole 10 opening to the front. Here, the entrance/exit hole 10 functions as a passage for moving the electronic component D brought into the position IP to the test position TP or moving the electronic component D at the test position TP to the carry-out position OP. Therefore, the bring-in position IP and the bring-out position OP are located in front of the manhole 10 to correspond to the manhole 10.

The opening and closing means 400 opens and closes the access hole 10 located in the test chamber 300. Accordingly, if the access hole 10 is opened, the electronic component D may be brought into the inside of the test chamber 300 or brought out of the test chamber 300, and if the access hole 10 is closed, the inside of the test chamber 300 is sealed, and since the inside of the test chamber 300 is sealed, the inside of the test chamber 300 may be maintained in a suitable test environment. In particular, a dark room is formed in which the test of the electronic component D produced for optical use can be suitably performed. Of course, even if the electronic component D to be tested is not for optical use, in a case where a temperature environment of a specific range is required for testing, the inside of the test chamber 300 can be isolated from the outside temperature environment due to the closing of the access hole 10, and it becomes easy to manage the inside of the test chamber 300 to a specific temperature environment.

The access device 500 moves the electronic component D carried on the loading stage 110 located at the carry-in position IP to the test position TP in the test chamber 300 or moves the electronic component D located at the test position TP to the unloading stage 120 located at the carry-out position OP. That is, the electronic component is brought into or out of the test chamber by the shuttle table in the related art, but in the present invention, the electronic component D is brought into or out of the test chamber 300 through the access hole 10 opened forward by the access device 500 which can pick up or release the electronic component D.

The pressing device 600 presses the electronic component D to be tested located at the test position TP downward to electrically connect the electronic component D to the test socket TS of the socket board SB located below.

The lighting device 700 is provided to irradiate light onto the upper surface of the electronic component D located at the test position TP.

The conveyor 800 may transfer the tray T from which all the electronic components D are discharged at the supply position SP to the recovery position RP or the like. For reference, if a storage stacker capable of storing empty trays is provided between the supply stacker SS and the recovery stacker RS, the conveyor 800 also plays a role of transferring empty trays transferred rearward from the storage stacker to the recovery position RP or a role of moving trays emptied at the supply position SP to the rear of the stacker.

The four vibration preventing members 900 support the test chamber 300 and suppress transmission of vibration accompanying the operation of the handler HR to the test chamber 300.

The control device CA controls the above respective configurations.

Next, the loading pickup robot 211, the test chamber 300, the access device 500, the pressurizing device 600, and the illumination device 700, which have the main features of the present invention in the above-described configuration, will be described in more detail.

The loading pickup robot 211 picks up the electronic components D in groups of four from the tray T located at the supply position SP, and then moves and carries them to the loading table 110. For this purpose, as schematically shown in the cut-out view of fig. 6, the loading pickup robot 211 includes four pickers 211a, an elevator 211b, an X-axis mover 211c, and a Y-axis mover 211 d.

The four pickers 211a are provided in a 2 × 2 array form, and can pick up the electronic components D or release the picking of the electronic components D by vacuum pressure suction. Unlike the circular suction pad provided as the suction pickup unit in the conventional sorting machine, the pickup 211a of the present invention has the suction pad GP having a quadrangular shape. Here, the reason will be described in more detail.

As long as a part of the suction pad GP in contact with the electronic component D is located in a region separated from the surface of the electronic component D, a pickup failure is generated, which is obvious. Therefore, the position where the adsorption pad GP contacts the electronic component D needs to take various structural tolerances or operational errors into consideration. Also, in the case of the electronic component D produced for optical use, the adsorption pad GP in contact with the electronic component D should be separated from the light sensing area. Therefore, the suction pad GP is to be in contact with the electronic component D between the outer edge of the electronic component D and the photosensitive region, not only to be within the allowable range of various tolerances and operation errors without exceeding the edge of the electronic component D, but also to be spaced from the photosensitive region to the maximum extent.

Fig. 7 (a) and 7 (b) show a quadrangular adsorption pad GP currently in contact with the electronic component D₁And the existing circular adsorption pad GP₂。

With quadrangular adsorption pads GP₁Differently, circular absorbent pads GP₂Has a narrow spacing from the photosensitive area SA. Thus, there is a suction pad GP due to various construction tolerances and operational errors₂There is a risk of contacting the photosensitive area SA, so that a pickup mark may remain in the photosensitive area SA. If the pickup mark remains in the photosensitive area SA, it may not only cause a reduction in the merchantability of the product or require a special washing process, but also cause a test error due to the pickup mark. However, if the circular absorption pad GP is increased accordingly₂Has a radius of radius (GP) which may result from various construction tolerances or operational errors₂The risk of the partial portion of (a) coming off the edge of the electronic component (D).

Therefore, as shown in fig. 7 (a), the pickup 211a of the sorter HR according to the present invention is to be the adsorption pad GP which is the pickup site contacting the surface of the electronic component D₁Designed to have a quadrangular shape. By making the adsorption pad GP in this way₁With a quadrangular form, the suction pad GP can be adjusted to various constructional tolerances or operating tolerances₁The electronic component D is contacted between the outermost contour of the electronic component D and the contour of the photosensitive area SA.

The lifter 211b lowers the four pickers 221a by lifting them, thereby lowering the pickers 211a to a position where the electronic component D can be picked up or released from the pickup, or raising the pickers 211a to a position where the electronic component D can be moved.

The X-axis shifter 211c finally moves the pickup 211a to a position in the X-axis direction where the electronic component can be picked up or the pickup can be released by moving the pickup 211a in the X-axis direction (left-right direction).

The Y-axis shifter 211d moves the pickup 211a to a position in the Y-axis direction where the electronic component can be picked up or the pickup can be released by moving the pickup 211a in the Y-axis direction (front-rear direction).

The unloading pickup robot 221 differs only in moving the electronic component D from the unloading stage 120 to the tray T, and has substantially the same configuration as the loading pickup robot 211, and therefore, description thereof is omitted.

As shown in a schematic sectional view of fig. 8, the test chamber 300 has an access hole 10 opened forward. The access hole 10 functions as a passage for bringing the electronic component into the inside of the test chamber 300 or bringing the electronic component D out of the inside of the test chamber 300.

In the prior art, the left side wall of the test chamber is provided with a carry-in hole for carrying in the electronic component, and the right side wall of the test chamber is provided with a carry-out hole for carrying out the electronic component. However, the present invention is formed with one access hole 10 for taking in and out the electronic component D only at the front sidewall of the test chamber 300, and the access hole 10 is also equipped to be completely closed by the opening and closing means 400. Here, the entrance/exit hole 10 has a left-right width compatible with both the carry-in position IP and the carry-out position OP.

As described above, according to the present invention, even if the entry/exit hole 10 is formed only in the front side wall of the test chamber 300, the loading stage 110 and the unloading stage 120 are positioned at the carry-in position IP and the carry-out position OP in front of the entry/exit hole 10, respectively, whereby the appropriate logistics of the electronic components D can be realized.

That is, in the case of the sorter HR according to the present embodiment, as in most existing sorters, the loading structure is also arranged in the left area and the unloading structure is arranged in the right area. Therefore, the electronic component D has a flow of moving to the right area of the handler HR after the left area of the handler HR passes through the test position TP. Therefore, by forming the access hole 10 at the front side wall of the test chamber 300 and arranging the shuttle 100 in front of the test chamber 300, the loading stage 110 and the unloading stage 120 can be located in front of the access hole 10, thereby achieving efficient movement of the electronic components. Of course, the present invention is mainly characterized in that the electronic component D is brought into the inside of the test chamber 300 or out of the test chamber 300 through one access hole 10, and thus the present invention does not exclude a case where the flow of moving the electronic component D is changed to form the access hole in one of the left and right sides of the test chamber.

Inside the test chamber 300 as described above, a pressing device 600 for pressing the electronic component D downward is disposed, and a socket board SB of the test socket TS equipped with the TESTER is coupled to a lower side thereof.

An illumination window SW required for irradiating the electronic component D with light is formed on an upper side wall of the test chamber 300. In the illumination window SW, an illumination device 700 is provided in the test chamber 300 in combination in such a form that a lens barrel thereof passes through and is arranged. As referred to in the plan view of fig. 9, in a state where the lens barrel 720 is provided with a quadrangular closing portion 721, the illumination apparatus 700 is combined with the test chamber 300 in a state where the closing portion 721 is inserted into the illumination window SW. However, even if the quadrangular closing portion 721 exists in the lens barrel, the planar area of the closing portion 721 needs to be smaller than that of the illumination window SW in order to easily dispose the illumination device 700 as described later or to easily perform maintenance by rotating the lift lens barrel 720. Therefore, the entire illumination window SW cannot be closed in a state where the closing portion 721 is inserted into the illumination window SW. For this reason, the test chamber 300 is equipped with four opening and closing members 311 to 314 for four directions of front, rear, left, and right for closing a quadrangular closing portion 721 as a portion to be inserted into the illumination window SW. As shown in fig. 10, the opening/closing members 311 to 314 rotate to close the region where the closing portion 721 is opened in the front-rear left-right direction. Of course, although the present embodiment shows the opening and closing members 311 to 314 being folded and rotated, according to actual implementation, the opening and closing members may be completely closed in the region opened in the front-rear and left-right directions by a sliding method, a detachable combination method, or the like, and the opening and closing operations of the opening and closing members 311 to 314 may be selectively performed by an automatic operation or a manual operation using an electric driving force.

Further, the bottom plate DP of the test chamber 300 may be provided with a vibration preventing member 900 and coupled to the base plate BP of the handler HR. The provision of the vibration preventing member 900 serves to suppress the transmission of vibration accompanying the operation of the sorter HR to the test chamber 300. Such a vibration preventing member 900 may be equipped to be capable of contracting and expanding. Therefore, when the vibration isolation member 900 contracts as shown in fig. 11 (a), the test chamber 300 is integrally fixed to the substrate BP, and when the vibration isolation member expands as shown in fig. 11 (b), the test chamber 300 is slightly movable up and down with respect to the substrate BP. For this reason, the vibration preventing member 900 may be prepared as a mechanism capable of contracting and expanding (for example, a spring or other elastic member such as rubber), but in consideration of design interference with other constituent members and the like, it may be preferably considered to be equipped with a hydraulic cylinder that can elastically contract and expand by self-driving of the pressure of a fluid such as air or liquid (water or oil or the like).

The contraction and expansion of the vibration preventing member 900 will be further described below.

When the electronic component D is carried into the test chamber 300 or carried out of the test chamber 300, since the relative positional change between the in-out device 500 and the test chamber 300 can be suppressed, the vibration-proof member 900 shown in fig. 11 (a) should be kept contracted to lower the test chamber 300 and fix the substrate BP and the test chamber 300 to each other in an integrated state. This is because the access device 500 is directly or indirectly fixedly provided on the substrate BP side, and therefore, only when the substrate BP and the test chamber 300 are integrally fixed, the relative positional change between the access device 500 and the test chamber 300 is prohibited, and the picking up of the electronic component D in the test chamber 300 by the access device 500 can be accurately performed.

However, it is necessary to prevent the electrical connection between the electronic component D and the test socket TS from being defective due to vibration that may be transmitted to the test chamber 300 by the substrate BP along with the operation of the handler HR during the test. Therefore, since it is necessary to suppress transmission of an operation shock of another configuration to the test chamber 300 to the maximum, the vibration preventing member 900 is expanded as in (b) of fig. 11 to raise the test chamber 300, thereby bringing the test chamber 300 into a state in which it can slightly move with respect to the substrate BP. That is, the vibration prevention member 900 is expanded to elastically support the test chamber 300 with respect to the substrate BP in the vibration prevention member 900.

Of course, since the pressurizing means 600, the illuminating means 700, and the socket plate SB combined with the test chamber 300 move together with the test chamber 300, the relative positions of the test chamber 300, the pressurizing means 600, the illuminating means 700, and the socket plate SB with respect to each other are fixed even if the test chamber 300 moves with respect to the substrate BP. With such a coupling structure, even if vibration occurs in association with the operation of another structure, most of the vibration is absorbed by the vibration-proof member 900 when it reaches the test chamber 300 side, and thus the electrical connection between the electronic component D and the test socket TS can be stably maintained. In addition to such a function, the vibration preventing member 900 has a function of preventing in advance a loss of reliability of a test result due to optical distortion by vibration.

As described above, the handler HR according to the present invention can integrally fix the test chamber 300 to the substrate BP when an operation of bringing in or out the electronic component D is required, and can realize stability of the operation and the test by providing the vibration prevention member 900 capable of moving the test chamber 300 with respect to the substrate BP when the electronic component D is tested.

In order to accurately pick up or release the electronic component D by the access device 500 inside the test chamber 300, it is necessary to integrally join the test chamber 300 and the substrate BP at an accurate position when the vibration-proof member 900 is contracted, and to prevent the test chamber 300 from vibrating horizontally relative to the substrate BP. For this, as referred to in fig. 11, in the present embodiment, an insertion hole H is formed in the bottom plate DP of the test chamber 300, and a correction protrusion CP is provided on the base plate BP. Accordingly, when the vibration preventing member 900 is contracted, the correction protrusion CP is inserted into the insertion hole H to achieve accurate positioning of the test chamber 300. Of course, according to actual implementation, the calibration projections may be provided in the test chamber, and the insertion holes may be formed in the substrate, but other different calibration means capable of calibrating the position of the test chamber when the test chamber moves downward may be considered.

In the present embodiment as described above, when the vibration isolating member 900 is configured by using the hydraulic cylinder as the vibration isolating member 900 and the vibration isolating member 900 is expanded, the exact elevation height of the test chamber 300 becomes blurred. Therefore, as referred to in fig. 11, the rising height of the test chamber 300 is restricted by constituting a separate stopper S at the base plate BP, so that the test chamber 300 is raised only by a predetermined height.

The access device 500 brings the electronic component D into the interior of the test chamber 300 or out of the interior of the test chamber 300. To this end, as shown in fig. 12, the access device 500 includes a take-in picker bar 510, a take-out picker bar 520, a first lifter 530, a second lifter 540, an X-axis mover 550, a Z-axis mover 560, and a Y-axis mover 570.

The bring-in pick lever 510 has four pickers 511 for moving the four electronic components D of the loading stage 110 located at the bring-in position IP to the test socket TS after picking them.

The take-out pickup lever 520 has four pickers 521 for the loading table 120 that moves to the take-out position OP after picking up the four electronic components D located in the test sockets TS.

Similarly, the

pickers

511, 521 respectively provided at the carry-in pickup lever 510 and the carry-out pickup 520 should preferably be provided with quadrangular adsorption pads for preventing contact with the photosensitive areas of the electronic component D.

Further, the carry-in pickup lever 510 and the carry-out pickup lever 520 are configured to have a shape elongated rearward and have a very narrow vertical width, so that they can be appropriately inserted between the pressurizing device 600 and the socket plate SB in the test chamber 300.

The first lifter 530 and the second lifter 540 are provided for the two picking

levers

510, 520 to pick up or de-pick the electronic component D at an appropriate height, the first lifter 530 lifts the bring-in picking lever 510, and the second lifter 540 lifts the bring-out picking lever 520. Such first and

second lifts

530 and 540 are preferably implemented such that the two

pick bars

510 and 520 can pick up or release the electronic components D independently of each other by operating independently of each other.

The X-axis shifter 550 moves the two

pickup levers

510 and 520 in the left-right direction, which is the X-axis direction.

The Z-axis mover 560 simultaneously moves the two

pick bars

510, 520 in the up-down direction. In the present embodiment, the reason why the Z-axis mover 570 is formed separately from the first lifter 530 and the second lifter 540 is to minimize the height of the portion passing through the access hole 10, thereby preventing interference with other structures. Therefore, without such a limitation, the Z-axis mover 570 may be omitted by adjusting the lifting distance of the two pick-up

bars

510, 520 by means of the first lifter 530 and the second lifter 540.

The Y-axis shifter 570 moves the two

pickup levers

510 and 520 in the front-rear direction, which is the Y-axis direction. According to such an operation of the Y-axis mover 570, the pickers 511 and 522 of the two

picker bars

510 and 520 may enter the inside of the test chamber 300 by moving backward through the access hole 10 or may be separated from the test chamber 300 by moving forward.

The pressing device 600 presses the electronic component D placed in the test socket TS downward to electrically connect the electronic component D to the tester. For this, as referred to in the schematic diagram of fig. 13, a pressurizing means 600 is provided to be disposed inside the test chamber 300, an illumination means 700 is disposed on an upper side of such pressurizing means 600, and a socket plate SB is disposed on a lower side of the pressurizing means 600.

As shown in the bottom perspective view of fig. 14 and the plan perspective view of fig. 15, the pressing device 600 includes a pressing disk 610, four pushers 620, a setting lever 630, a damping member 640, a light collecting lens 650, and a pressing drive source 660.

The pressurizing plate 610 is equipped to be movable up and down. A pusher 620 and a damping member 640 are provided under the pressure plate 610, and the pusher 620 and the damping member 640 are lifted and lowered together with the lifting and lowering of the pressure plate 610. The pressure plate 610 has first through holes TH through which light from the illumination device 700 can pass₁。

When the pressing plate 610 moves down, the pusher 620 presses the electronic component D downward while the pressing portion P protruding downward from the lower surface thereof comes into contact with the electronic component D, and electrically connects the electronic component D to the test socket TS by pressing the electronic component D downward, and presses the electronic component DWhen the tray 610 moves upward, the pressing of the electronic component D is released. Such a pusher 620 has a function of passing through the first passing holes TH₁Can be irradiated to the second through holes TH of the electronic component D by the pusher 620₂. And, at the second through hole TH₂A pair of correction holes CH for correcting the position of the pusher 620 are formed on the outer side of the electronic component D side. TH passing through such second through hole₂And the aforementioned first through holes TH₁The light of the lighting device 700 may be irradiated to the electronic component D electrically connected to the test socket TS by the pressurizing device 600.

The setting lever 630 is provided as a setting member for movably coupling the pusher 620 to the pressing disk 610.

Unlike existing sorters, the sorter HR according to the present invention has the pusher 620 movably disposed on the pressing plate 610 as an important feature. The structure in which the pusher 620 is provided on the pressure plate 610 will be described with reference to the schematic conceptual diagram of fig. 16.

As is apparent from the exaggeratedly schematic diagram of fig. 16, the pressing plate 610 is provided with an installation hole IH having a shape in which the width thereof gradually becomes narrower downward in the direction in which the electronic component D is located.

Also, in the setting bar 630, a head portion of an upper portion, which is one side thereof, has a shape corresponding to the form of the setting hole IH and is inserted into the setting hole IH, and a body portion of a lower portion, which is the other side thereof, passes through the setting hole IH, so that a lower end thereof is fixedly coupled to the pusher 620. That is, in order for the present invention to be preferably applied, the outer diameter of the head portion of the setting stem 630 is gradually enlarged along the upper side unlike the body portion of the setting stem 630, and the inclination angle according to the shape of such head portion is at least partially coincident with the inclination angle of the setting hole IH. Also, more preferably, the head of the setting bar 630 may have an inclined surface having a length longer than that formed by the inclined surface of the setting hole IH.

Therefore, as shown in fig. 17, if the pusher 620 receives an external force F directed upward, the pusher 620 and the set rod 630 are arranged to be able to move slightly upward relative to the platen 610 in a direction opposite to the direction in which the electronic component D is located. Of course, if the external force F applied upward is removed, the pusher 620 may descend due to its own weight. As described above, the pusher 620 is coupled to the pressurizing disk 610 so as to be movable up and down by the setting lever 630. That is, it is known that such a feature can be effectively applied to a vertical type handler in which a pressing force applied to an electronic component acts in the up-down direction, in particular.

As shown in fig. 17, in a state where the pusher 620 is lifted, a gap is generated between an inner surface of the setting hole IH and an upper portion of the setting rod 630, so that the pusher 620 can slightly move in a horizontal direction. Of course, in order to move the pusher 620 in the horizontal direction, the minimum inner diameter of the setting hole IH is larger than the outer diameter of the setting rod 630 passing through the setting hole IH. That is, in the main body portion of the setting bar 630, the outer diameter of the region inserted into the setting hole IH is smaller than the minimum inner diameter of the setting hole IH. As described above, the setting lever 630 is a setting member for setting the pusher 620 to the pressure plate 610, and when the pusher 620 receives the external force F, the pusher 620 is moved upward relative to the pressure plate 610 in a direction opposite to the direction in which the electronic component D is located (first direction), and after the upward movement, the pusher 620 is moved in a state of being movable in a second direction perpendicular to the first direction (horizontal direction).

As described above, according to the present invention, the pusher 620 is provided on the pressing plate 610 so as to be lifted up and down with respect to the pressing plate 610 and to be slightly horizontally movable in a lifted state. Also, this structure makes two kinds of appropriate operations possible, which will be described later. One is to protect the electronic component D (especially, a glass component of the electronic component D) from an excessive pressing force of the pusher 60, and the other is to press the electronic component D at a correct position by the pusher 620, thereby precisely achieving an electrical connection between the electronic component D and the test socket TS.

The damping member 640 is configured to organically function with the above-mentioned structure in which the pusher 620 is movable up and down, and thus can protect the electronic component D from various impacts and vibrations. That is, the damping part 640 functions to absorb shock and vibration that may be transmitted to the electronic part D.

The damping part 640 supports the pusher 620 with appropriate elasticity with respect to the pressurizing disk in such a manner that the pusher 620 does not pressurize the electronic component D with excessive pressurizing force. For this, the damping part 640 may be equipped with a hydraulic cylinder capable of instantaneously performing elastic compression and expansion. Such a damping part 640 slightly elastically supports the pusher 620 with respect to the pressurizing disk 610 by the pressure of the flow. Therefore, when the electronic component D is subjected to an excessive pressing force due to the lowering of the pressing platen 610, the pusher 620 may be raised (actually, stopped) relative to the pressing platen 610 by the compression of the damping member 640, thereby eliminating a part of the impact force and the pressing force applied to the electronic component D. Therefore, as long as such a function can be achieved, the damping member 640 may be provided with an elastic member such as a spring that can be elastically compressed or restored, but since excessive compression reduces the pressing force, it is more preferable to employ a mechanism such as a hydraulic cylinder (a cylinder that can be operated by a fluid such as air or liquid) having a small compression ratio. Of course, the damping part 640 avoids the first passing holes TH located at positions corresponding to each other₁And a second through hole TH₂Are mutually blocked and are arranged at the first through holes TH₁And a second through hole TH₂Staggered position. Therefore, in the present embodiment, as shown in the schematic view of fig. 18, a pair of damping members 640 are provided in the second through holes TH₂Supports the structure of one pusher 620 on both sides. Also, in the present embodiment, it is implemented that one side (upper side) of the damping part 640 is combined under the pressing disk 610, and the other side (lower side) is in contact with and not in contact with the upper surface of the pusher 620 at a position corresponding to the upper surface according to circumstances. Therefore, the damping member 640 and the pusher 620 may contact in case the pusher 620 ascends, and the damping member 640 and the pusher 620 may be spaced apart in case the pusher 620 descends.

If, as shown in the exaggerated conceptual view (a) of fig. 19, the pressing disk 610 still needs to be lowered in a state where the pusher 620 sufficiently presses the electronic component D, the pusher 620 is lifted by a corresponding degree with respect to the pressing disk 610 as shown in (b) of fig. 19 by the damping member 640 being compressed. That is, in a state where the protruding pressing portion P of the pusher 620 comes into contact with the electronic component D on the way of the pressing disk 610 descending, the pusher 620 receives an upward force, whereby the damping member 640 is compressed to raise the pusher 620 relative to the pressing disk 610. Therefore, an excessive pressing force applied when the pusher 620 contacts the electronic component D is absorbed by the damping member 640 to protect the electronic component D.

Further, the shock which may be instantaneously generated due to the vibration during the test is also absorbed by the damping member 640, so that the electronic component D can be safely protected. Here, the damping member 640 absorbs most of the remaining vibration or shock that the vibration preventing member 900 cannot absorb, thereby achieving stable electrical connection between the electronic component D and the test socket TS. In this way, the aforementioned vibration preventing member 900 functions as a first vibration transmission preventing member and the damping member 640 functions as a second vibration transmission preventing member from the viewpoint of absorbing vibration or shock that can be transmitted to the electronic component D.

Viewing the damping member 640 in the other direction, the damping member 640 also has a function of a restricting member that restricts the movement pitch of the pusher 620 when the pusher 610 moves upward relative to the pressurizing disk 610 due to the external force F, and therefore the pusher 620 can be made to pressurize the electronic component D with an appropriate pressurizing force.

Further, referring to fig. 19, as for the correction hole CH of the pusher 620 formed thereon, a correction pin PP is provided at a position of the test socket TS of the socket plate SB corresponding to the correction hole CH of the pusher 620. The correction hole CH and the correction pin PP organically act together with the structure in which the pusher 620 can be lifted, and the position between the pusher 620 and the test socket TS is accurately set.

In order to achieve accurate positioning of the pusher 620, the upper portion of the correction pin PP has a generally pointed shape whose width gradually narrows along the upper side. If the pressurizing plate 610 is lowered in a state where the position between the pusher 620 and the test socket TS is not accurately aligned, as shown in (a) of fig. 20 exaggeratedly shown, when the correction pin PP is inserted into the correction hole CH from the upper end thereof while the pusher 620 is lowered, only the upper end of the correction pin PP is slightly inserted into the correction hole CH in a state where it does not exactly coincide with the correction hole CH. At this time, the pusher 620 is slightly lifted due to the resistance of the correction pin PP, so that the horizontal movement of the pusher 620 can be achieved. That is, if the upper end of the correction pin PP is inserted into the correction hole CH in a state where the position between the pusher 620 and the test socket TS (or between the pusher and the electronic component) is inaccurate, the pusher 620 is lifted up with respect to the pressurizing disk 610 by the resistance of the correction pin PP, and then the pusher 620 is moved in the horizontal direction by the horizontal moving force received from the inclined surface of the pointed shape of the upper end of the correction pin PP. Therefore, as shown in fig. 20 (b), the position between the pusher 620 and the test socket TS is accurately set, and in this state, the pusher 620 further descends to press the electronic component D.

As described above, the present invention has been made in consideration of the optical electronic component D having a brittle glass material on the surface, and has been proposed to realize a precise electrical connection by a precise pressing while avoiding the generation of pressing marks by a precise positioning between the pusher 620 and the electronic component D, and further to suppress the application of a contact impact or a vibration impact applied through the pusher 620 to the electronic component D to the maximum. Of course, even if the configuration according to the present invention is not applied to only the handler HR for testing the electronic component D for optical use, the desired configuration can be selectively applied to all other handlers as necessary.

The condenser lens 650 condenses light from the illumination device 700 and irradiates the electronic component D with the condensed light, and is disposed above the pressure plate 610.

The pressurizing drive source 660 raises and lowers the pressurizing plate 610, thereby pressurizing or depressurizing the electronic component D by the pusher 620.

The illumination device 700 is coupled to the test chamber 300 in a structure in which the lens barrel 720 is inserted into the illumination window SW on the upper side of the test chamber 300 in order to irradiate light onto the upper surface of the electronic component D.

As shown in the sectional view of fig. 21, illumination device 700 is provided in a form in which illumination unit 710 and lens barrel 720 are integrated.

The illumination section 710 is a section provided with an illumination element as a light source for irradiating light.

The lens barrel 720 induces light irradiated through the illumination element to be intensively irradiated in the electronic component D side direction. For this, the lower portion of the lens barrel 720 is located inside the test chamber 300 and above the pressurizing disk 610. Also, as mentioned earlier, the lens barrel 720 has the closing portion 721 inserted into the illumination window SW.

Such a lighting device 700 should be configured to move up and down as well as rotationally. This is because it is necessary to easily incorporate the illumination apparatus 700 into the test chamber 300 or to lift the lower portion of the lens barrel 720 for maintenance of the illumination element or the lens barrel 720. For this, the lighting device 700 is provided with a support frame SF which is configured to be divided into a fixed portion fP and a rotating portion rP and coupled to the test chamber 300.

The fixed portion fP is fixed to the bottom plate DP of the test chamber 300, and the rotating portion fP is configured to rotate about a left and right horizontal axis as a rotation axis so that the lower side can be lifted.

It is apparent that the lighting device 700 is configured to be coupled to the rotating portion rP and the lighting device 700 is rotated together if the rotating portion rP is rotated, whereby the lower portion of the lighting device 700 is lifted. The lighting device 700 is coupled to the rotation portion rP so as to be movable up and down.

Therefore, when the lighting device 700 is detached from the test chamber 300, the opening and closing members 311 to 314 are first operated to open the lighting window SW to the maximum. Then, as shown in fig. 22, the illumination device 700 is raised to avoid interference of the illumination device 700 with the upper portion of the test chamber 300 during rotation, and then as shown in fig. 23, the illumination device 700 is rotated to completely lift the lower portion of the lens barrel 720. Similarly, the operation is performed in the reverse process described above when the lighting device 700 is combined and disposed to the test chamber 300.

As described above, the lighting device 700 according to the present invention has a structure in which light is irradiated to the electronic component D above the opposite side of the electronic component D located below at a distance from the pressurizing device 600.

For reference, although the rotation and elevation of the lighting device 700 are preferably implemented to be automatically accomplished, it is also fully contemplated to be accomplished manually by a worker.

The supply mover 212 takes out the tray T from the stacker SS and moves it to the supply position SP. Thus, the loading pickup robot 211 picks up the four electronic components D from the tray T located at the supply position SP and loads the electronic components D on the loading stage 110 located at the loading position LP. Then, the shuttle device 100 is operated to move the loading stage 110 to the bring-in position IP, and the unloading stage 120 is moved to the bring-out position OP. Meanwhile, the take-out pickup lever 520 of the access device 500 stands by in a state where the electronic component D having been tested is taken out from the test socket TS, and then when the unloading stage 120 reaches the take-out position OP, the picked-up electronic component D is loaded on the unloading stage 120. And, the access device 500 picks up the electronic component D to be tested of the loading stage 110 using the bring-in pick-up lever 520 and supplies the picked-up electronic component to the test socket.

Further, if the electronic component D to be tested is emptied from the loading stage 110 and the unloading stage 120 is filled with the tested electronic component D, the shuttle 100 operates to move the unloading stage 120 to the unloading position UP. Accordingly, the unloading pickup robot 221 operates to move the electronic component from the unloading stage 120 to the empty tray T located at the recovery position RP. At this time, the electronic component D is classified according to the test result. Finally, if the tray T located at the recovery position is filled with the electronic components D whose testing is completed, the recovery conveyer 222 operates to transfer the tray T filled with the electronic components D whose testing is completed from the recovery position RP to the recovery stacker RS.

In the above process, when the electronic component D is carried into the test chamber 300 or carried out from the test chamber 300, the vibration preventing member 900 is contracted to maintain a state in which the test chamber 300 is integrally fixed to the substrate BP, and when the electronic component D is tested, the vibration preventing member 900 is expanded to become a state in which the test chamber 300 is movably coupled to the substrate BP.

In addition, the elevating structure of the pusher 620, the damping member 640, and the like are operated in the process of pressurizing the electronic component D, thereby achieving accurate and stable pressurization with respect to the electronic component D.

1. Additional description for the pusher

It may also be preferably considered to further protect the electronic component D from contact shock or vibration shock by providing an adsorption pad for connection under the pressing portion P of the pusher 620 or coating or adhering a resin substance softer than metal such as a film.

2. Additional description of the pressurizing device

Although the above-described embodiment is implemented such that the pusher 620 can be lifted and horizontally moved, only the lifting movement of the pusher 620 may be considered as long as it is ensured that the position of the pusher 620 is accurately set at all times.

Fig. 24 shows a structure in which a damping member 640 is provided between the pressurizing disk 610 and the pusher 620 such that the damping member 640 elastically supports the pusher 620 with respect to the pressurizing disk 610. As described above, if the pusher 620 is provided on the side of the pressing plate 610 with the damping member 640 therebetween, the pusher 620 does not horizontally move, but the electronic component D can be elastically lifted and lowered, and thus the electronic component D can be prevented from being pressed or impacted by the pusher 620 or the pusher 620.

3. Camera for testing slot inspection

In practice, a camera for checking whether the electronic component is accurately mounted in the test socket TS or whether a defect occurs in the test socket TS may be additionally configured.

4. Slot cleaner

The sorting machine HR according to the present invention may be equipped with a slot cleaner in the shape of the electronic component D. In the case of being equipped with the socket cleaner, if the test for the electronic component D is completed a predetermined number of times, the handler HR supplies the socket cleaner to the test socket TS and operates the pressurizing means 600. Accordingly, the foreign matter in the test socket TS may be stuck to the sticking surface of the socket cleaner and fall off, so that the test socket TS is cleaned.

5. Loading table and unloading table inspection device

As shown in FIG. 25, the sorter HR according to the present invention may be equipped withIs prepared for checking the loading table 110 or the unloading table 120 carrying groove G₁/G₂And an inspection device for inspecting whether or not the electronic component D is mounted. Here, the inspection apparatus may be configured as a light emitting sensor LS that irradiates light and a light receiving sensor RS that senses light.

6. Darkroom of test chamber

The present invention particularly relates to a technique that can be suitably applied to a test of an optical electronic component D. Therefore, the optical electronic component D to be tested should be prevented from being exposed to the disturbance light other than the light of the lighting device 700 to the maximum.

Therefore, in the handler HR according to the present invention, the inside of the test chamber 300 should maintain the darkroom state to the maximum extent when performing the test for the electronic component D. For this reason, the present invention enables the access hole 10 to be closed by the opening and closing means 400 and the illumination window SW to be completely closed by the opening and closing members 311 to 314 in order to isolate the inside of the test chamber 300 from external light.

Further, in order to ensure a dark room of the test chamber 300, it is preferable to consider that the inner wall surface of the test chamber 300 or the constituent members disposed inside the test chamber 300 is provided with a black material that can absorb light to the maximum, or at least the surface thereof is coated with black. Accordingly, it is designed to maximally absorb light by black, thereby preventing scattering or transmission due to a small amount of disturbance light.

As described above, the present invention is explained in detail by referring to the embodiments of the drawings, but the above embodiments are only preferred embodiments of the present invention and thus it should not be construed that the present invention is limited to the above embodiments, and the scope of the claims of the present invention is to be construed as the claims and the equivalents thereof.

Claims

1. A handler for testing electronic parts, comprising:

a test chamber having an access hole opened to one side;

an opening/closing device that opens the access hole when the electronic component is brought into or out of the test chamber through the access hole, and closes the access hole when a test for the electronic component is performed;

an access device for picking up an electronic component to be tested and bringing it into the test chamber through the access hole or picking up an electronic component completed with testing and bringing it out of the test chamber through the access hole; and

and a pressurizing device for pressurizing the electronic component to be tested at the testing position and electrically connecting to the tester.

2. The handler for testing electronic parts according to claim 1, further comprising:

a carrier table having a carrier groove capable of carrying an electronic component;

an application stacker equipped to carry a tray loaded with electronic parts to be tested to be moved to the stage;

a recovery stacker equipped to carry a tray loaded with the tested electronic components to be recovered from the carrier table;

a loading device moving the electronic parts to be tested from the supply stacker to the stage; and

an unloading device for moving the tested electronic components from the bearing table to the stacker for recovery,

the access device brings the electronic component to be tested on the bearing table into the testing cavity, and brings the tested electronic component out of the testing cavity and moves the tested electronic component to the bearing table.

3. The handler for testing electronic parts according to claim 2, wherein,

the carrier stage is divided into a loading stage for loading electronic parts to be tested and an unloading stage for loading tested electronic parts,

wherein, still include: a mover for selectively positioning the loading stage at a loading position for carrying the electronic parts and an access position for bringing the electronic parts into and out of the test chamber by moving the loading stage and the unloading stage, selectively positioning the unloading stage at the access position and an unloading position for unloading the electronic parts,

the loading device carries electronic parts to be tested to the loading station located at the loading position, the unloading device unloads the tested electronic parts from the unloading station located at the unloading position,

the access device brings the electronic component of the loading table located at the access position into the test chamber, and brings the tested electronic component out of the test chamber to move to the unloading table located at the access position.

4. The handler for testing electronic parts according to claim 3, wherein,

the access hole is formed to open to the front of the test chamber,

the access position is positioned in front of the test chamber to correspond to the access hole,

the loading position and the unloading position are separated on both sides by the access position.

5. The handler for testing electronic parts according to claim 2, wherein,

6. The handler for testing electronic parts according to claim 1,

the test chamber has an illumination window for incorporating an illumination device arranged to illuminate the electronic component on opposite sides of the electronic component apart from the pressurizing device,

the light of the lighting device can be irradiated to the electronic component electrically connected to the test socket through the pressurizing device.

7. The handler for testing electronic parts according to claim 6, wherein,

the lighting device is arranged in the testing cavity in combination with the arrangement form of the lighting window for the lens cone of the lighting device to pass through,

the test chamber is equipped with four opening and closing members for opening and closing a portion where the lens barrel is inserted into the illumination window.

8. The handler for testing electronic parts according to claim 6, wherein,

the pressurizing device includes:

a pressure plate equipped to be movable;

a pusher provided on the pressure plate side and configured to press or release the electronic component in accordance with movement of the pressure plate; and

a pressurizing drive source that moves the pressurizing plate,

a first through hole capable of passing light of the illumination device is formed in the pressurizing plate,

the pusher has a second through hole formed at a position corresponding to the first through hole, the second through hole being capable of allowing light passing through the first through hole to pass therethrough and irradiate the electronic component.

9. The handler for testing electronic parts according to claim 1,