CN111007069B - Aging and optical inspection device and method for organic light emitting diode panel - Google Patents
Aging and optical inspection device and method for organic light emitting diode panel Download PDFInfo
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- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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Abstract
The invention relates to an aging and optical inspection device and method for an organic light emitting diode panel. The invention aims to provide an aging and optical inspection device and method for an organic light-emitting diode panel, which can reduce production cost and improve production efficiency by performing an aging and optical inspection process immediately after a deposition process, omitting the subsequent processes when defects or abnormalities are found and feeding back the defects or abnormalities to a deposition device. Another object of the present invention is to provide an apparatus and method for aging and optical inspection of an organic light emitting diode panel, which can accurately and automatically align (align) a plurality of devices for inspection so that the aging and optical inspection processes can be smoothly and automatically performed in a nitrogen chamber in order to prevent deterioration due to contact with the outside air during the aging and optical inspection processes immediately after the deposition process.
Description
Technical Field
The present invention relates to an aging and optical inspection apparatus and method (Device and method for aging and vision-inspecting OLED) for an organic light emitting diode panel, which is used to easily and smoothly perform an aging (imaging) process for artificially aging a manufactured organic light emitting diode panel to a certain degree before it is shipped out, and an optical inspection process for inspecting the stabilized organic light emitting diode panel for image quality, color characteristics, color abnormality, and the like after the aging process.
Background
Organic Light Emitting Diodes (OLEDs) are self-luminous Organic substances that emit Light from the row by utilizing the electroluminescence phenomenon in which Light is emitted when a current flows through a fluorescent Organic compound. The organic light emitting diode has advantages of being capable of being driven at a low voltage, being made thin, having a wide viewing angle, having a fast response speed, and the like. Due to such a number of advantages, the organic light emitting diode is now widely used as a display panel for various electronic products, and its range of use is gradually expanding.
It is known that a general organic light emitting diode has a characteristic of being stabilized after being rapidly deteriorated during initial driving. Due to such characteristics, when the organic light emitting diode panel is directly shipped out of the warehouse immediately after being manufactured, there is a risk that the quality or reliability of the product is greatly reduced immediately after the shipment. Therefore, in general, after the organic light emitting diode panel is manufactured, an aging (aging) step is essentially performed before the organic light emitting diode panel is shipped, and in the aging step, a high voltage is applied to the organic light emitting diode for a predetermined time (generally, about 10 to 30 minutes) to cause the organic light emitting diode to emit light globally, thereby artificially aging the organic light emitting diode panel to sufficiently stabilize the organic light emitting diode.
Generally, in manufacturing an organic light emitting diode panel, a pattern is deposited using an organic substance on a large mother substrate formed of glass (glass). At this time, when the size of the product to be manufactured is smaller than that of the mother substrate, a plurality of products may be manufactured using one mother substrate, in which case a plurality of organic material patterns, which correspond to one product, may be generally referred to as cells (cells), may be deposited on one mother substrate. After the plurality of steps such as drying the mother substrate deposition unit, the step of bonding the bonded substrate to the mother substrate to seal the space where the unit is formed from the outside is referred to as the sealing step as described above. After such a sealing process, the substrate is cut into a size corresponding to each unit to complete the manufacture of the organic light emitting diode panel product.
In addition, organic substances constituting the organic light emitting diode are very sensitive to moisture and oxygen, and thus are immediately deteriorated when exposed to air. Therefore, the aging process is usually performed only after the product is in a drivable state through a manufacturing process including a plurality of steps such as the sealing process described above. On the other hand, in the optical inspection process, image quality, color characteristics, color abnormality, and the like are inspected, and it is obvious that such inspection results can be obtained accurately only in a state where the organic light emitting diode panel is stabilized through the aging process. That is, the optical inspection step must be performed after the aging step, and as a result, the optical inspection step is also performed after the sealing step. Korean patent application No. 1149055 ("aging apparatus for OLED panels", 2012.05.16, hereinafter referred to as "prior art document") discloses a technique for reducing the scale of a device and increasing the throughput by performing a continuous aging process on a plurality of organic light emitting diode panels cut from a mother substrate in units of panels, and it is also well documented in this technique that an aging process is performed after a sealing process is completed and the panels are cut from the mother substrate.
However, when a defect is detected in a certain product as a result of inspection, all products produced simultaneously with the defective product are determined to have a defect, and therefore, there are problems such as an increase in manufacturing cost loss and a significant reduction in production efficiency. Therefore, there is a need to perform an aging process and an optical inspection process after the deposition process and before performing other processes. However, as described above, if the organic substance constituting the organic light emitting diode is rapidly deteriorated when exposed to air, it is necessary to improve equipment for performing the aging process and the optical inspection process to the maximum extent rapidly and accurately without causing exposure to air after the deposition process.
Documents of the prior art
Patent document
Patent document 1: korean patent application No. 1149055 ("aging apparatus for OLED panels", 2012.05.16)
Disclosure of Invention
(problems to be solved by the invention)
Accordingly, the present invention has been made to solve the above-mentioned problems of the conventional art, and an object of the present invention is to provide an apparatus and a method for aging and optical inspection of an organic light emitting diode panel, which can reduce production costs and improve production efficiency by omitting the subsequent processes and feeding them back to a deposition facility when defects or abnormalities are found in the aging and optical inspection processes performed immediately after a deposition process. Another object of the present invention is to provide an apparatus and method for aging and optical inspection of an organic light emitting diode panel, which can accurately and automatically align (align) a plurality of devices for inspection so that the aging and optical inspection processes can be smoothly and automatically performed in a nitrogen chamber in order to prevent deterioration due to contact with the outside air during the aging and optical inspection processes immediately after the deposition process.
(means for solving the problems)
The aging and optical inspection apparatus for an organic light emitting diode panel according to the present invention for achieving the above-described object is an aging and optical inspection apparatus 100 for an organic light emitting diode panel, which performs aging and optical inspection on a substrate 500, wherein at least one unit 550 formed of an organic material pattern for forming the organic light emitting diode panel and a plurality of connection portions 555 formed of a circuit pattern for supplying power to the unit 550 and formed at an outer peripheral portion of the unit 550 are deposited on an upper surface of the substrate 500, and the aging and optical inspection apparatus for an organic light emitting diode panel may include: a vacuum adsorption unit 110 disposed on a lower surface of the substrate 500 to lift the substrate 500 or adsorb and fix the substrate 500; a plurality of mechanical alignment units 120 which are dispersedly disposed at a plurality of positions on the lower surface of the substrate 500, and which align the substrate 500 to a fixed position on the vacuum adsorption unit 110 by directly moving the substrate 500; an optical alignment unit 130 which is disposed at a plurality of positions under the substrate 500 in a dispersed manner and optically recognizes alignment marks formed on the substrate 500; a UVW stage 140 disposed above the substrate 500, and capable of driving along X, Y and θ in a horizontal direction by 3 axes and driving along a Z axis in a vertical direction by Z axes; a probe card 150 moved by the UVW stage 140, including a plurality of probe pins 155 connected to the connection portion 555 to supply power; a probe alignment unit 160 which is disposed at a plurality of positions on the upper side of the probe card 150 in a dispersed manner and optically recognizes alignment pins formed on the probe card 150; a signal generating unit 170 electrically connected to the probe card 150 to supply power according to a set signal pattern; and an optical inspection unit 180 movably disposed under the substrate 500, for optically inspecting the substrate 500.
At this time, the burn-in and optical inspection apparatus 100 may transmit the power applied from the signal generation unit 170 through the connection between the probe pin 155 and the connection portion 555, thereby lighting the unit 550 and performing the burn-in process of the unit 550, and scan the region of the unit 550 by the optical inspection unit 180 in a state where the unit 550 is lighted, and performing the optical inspection process of the unit 550.
In the burn-in and optical inspection apparatus 100, the vacuum suction unit window 111, the UVW stage window 141, and the probe card window 151 having a through hole shape having a position and an area corresponding to the area of the unit 550 may be formed in each of the vacuum suction unit 110, the UVW stage 140, and the probe card 150 so that light can pass through the area corresponding to the area of the unit 550 in each of the vacuum suction unit 110, the UVW stage 140, and the probe card 150.
In the burn-in and optical inspection apparatus 100, the vacuum suction unit 110 may be formed with an alignment unit disposition path 112 having a through-passage shape, and the mechanical alignment unit 120 may be disposed to directly move the substrate 500 so as to pass through the alignment unit disposition path 112.
In addition, the optical inspection unit 180 includes: a color abnormality checking unit 181 which includes a camera and a lens, can adjust a resolution, and checks an image quality and a color abnormality of the unit 550 in a lighting state; and a color characteristic inspection part 182 for inspecting color characteristics including brightness, gradation, and efficiency of the cells 550 in a lit state.
In this case, the optical inspection unit 180 further includes a zoom range unit 183, the zoom range unit 183 including a zoom lens and being adjustable in magnification, and being disposed in the color abnormality inspection unit 181, and the color abnormality inspection unit 181 performs a zoom-in operation on a selected region of the unit 550 in a lit state so as to cause the color abnormality inspection unit 181 to inspect the selected region again.
In the optical inspection unit 180, the color abnormality inspection unit 181 and the color characteristic inspection unit 182 may be respectively movable in a horizontal direction to scan and inspect the entire area of the unit 550.
At this time, the optical inspection unit 180 may include a guide bar 185, the guide bar 185 extending along one axis selected from X, Y and being movable along the other axis, the color abnormality inspection part 181 and the color characteristic inspection part 182 being movable with the guide bar 185.
In addition, the aging and optical inspection apparatus 100 may be isolated from the outside by the chamber 200 in which a gas atmosphere of an inert gas is formed.
In addition, the lower portion of the aging and optical inspection apparatus 100 may be supported by a vibration attenuating portion 250 that attenuates external vibrations.
In addition, the method for aging and optically inspecting an organic light emitting diode panel according to the present invention may include the steps of using the apparatus 100 for aging and optically inspecting an organic light emitting diode panel as described above: a substrate arranging step of attaching and fixing the substrate 500 to the vacuum attaching unit 110 after arranging the substrate 500 to a set fixing position by the mechanical aligning unit 120 and the optical aligning unit 130; an alignment and contact step of contacting the substrate 500 and the probe card 150 with each other after aligning the substrate 500 and the probe card 150 by the probe alignment unit 160 and the UVW stage 140; and a burn-in and optical inspection step of performing a burn-in process by lighting the unit 550 by the signal generation unit 170 and the probe card 150, and performing an optical inspection process of the lighted unit 550 by the optical inspection unit 180.
In this case, the substrate disposing step may include: introducing the substrate 500 into the burn-in and optical inspection apparatus 100; a step of raising the substrate 500 by the vacuum adsorption unit 110; a step of moving the substrate 500 by the mechanical alignment unit 120 to be disposed at a set initial position in a state where the substrate 500 is lifted; a step of first sucking and fixing the substrate 500 by the vacuum sucking unit 110; a step of optically recognizing the alignment mark formed on the substrate 500 by the optical alignment unit 130; a step of, when the alignment mark recognized by the optical alignment unit 130 is misaligned, lifting the substrate 500 by the vacuum suction unit 110 and moving the substrate 500 again by the mechanical alignment unit 120 to correct the position, thereby disposing the substrate 500 to a set fixed position; and a step of finally adsorbing and fixing the substrate 500 by the vacuum adsorption unit 110.
Additionally, the aligning and contacting steps may include: a step of assembling the probe card 150 on the UVW stage 140; a step of optically recognizing the alignment pins formed on the probe card 150 by the probe alignment unit 160; a step of calculating a correction value between the substrate 500 and the probe card 150 using the alignment pin position recognized by the probe alignment unit 160; a step of aligning the substrate 500 with the probe card 150 by the UVW stage 140 according to the corrected value; and a step of connecting the probe pins 155 and the connection portion 555 by lowering the probe card 150 through the UVW stage 140.
At this time, the aging and optical inspection step may include: a step of transmitting the power applied from the signal generating unit 170 through the connection of the probe pin 155 and the connection portion 555, thereby lighting the unit 550 and performing a burn-in process of the unit 550; and a step of performing an optical inspection process of the cell 550 by scanning an area of the cell 550 by the optical inspection unit 180 in a state where the cell 550 is lit.
In this case, the step of performing the optical inspection process may include: a step of checking the image quality and color abnormality of the unit 550 in a lit state by the color abnormality checking section 181; and a step of checking color characteristics including brightness, gradation, and efficiency of the cell 550 in a lit state by the color characteristic checking section 182.
In addition, the step of performing the optical inspection process may include: a step of capturing a selected region of the unit 550 in a lit state by a zoom range unit 183 disposed in the color abnormality inspection unit 181; and a step of checking the pushed region again by the color abnormality checking unit 181.
In addition, the aging and optical inspection method of the organic light emitting diode panel may include a step of correcting a process condition of a deposition apparatus that performs deposition on the substrate 500 by feeding back an inspection result derived in the aging and optical inspection step.
(effect of the invention)
According to the present invention, the aging and optical inspection process can be performed immediately after the deposition process. As a result, according to the present invention, when a defect or abnormality is found as a result of inspection, the subsequent process can be omitted and fed back to the deposition equipment, and as a result, there is a significant effect that the production cost can be reduced and the production efficiency can be improved.
Further, according to the present invention, it is possible to automatically and smoothly perform both the aging process and the optical inspection process in the nitrogen chamber by accurately automatically aligning (align) a plurality of inspection devices for performing the aging process and the optical inspection process. Thus, according to the present invention, the deterioration due to contact with the outside atmosphere is fundamentally prevented in the aging and optical inspection process immediately after the deposition process.
Drawings
FIG. 1 is a detailed view of a substrate of the burn-in and optical inspection apparatus of the present invention.
FIG. 2 is an external view of the burn-in and optical inspection apparatus of the present invention.
FIG. 3 is a perspective view of the degradation and optical inspection apparatus of the present invention.
FIG. 4 is an exploded side view of the burn-in and optical inspection apparatus of the present invention.
Fig. 5 is an exploded perspective view of the aging and optical inspection apparatus of the present invention.
Fig. 6 is a detailed view of the vacuum suction unit of the aging and optical inspection apparatus of the present invention.
Fig. 7 is a detailed view of the UVW stage of the weathering and optical inspection apparatus of the present invention.
Fig. 8 is a detailed view of a probe card of the burn-in and optical inspection apparatus of the present invention.
Fig. 9 is a perspective view of a UVW stage-probe card-substrate configuration.
Fig. 10 is a detailed view of a probe alignment unit of the aging and optical inspection apparatus of the present invention.
Fig. 11 is a detailed view of an optical inspection unit of the aging and optical inspection apparatus of the present invention.
Detailed Description
The aging and optical inspection apparatus and method for an organic light emitting diode panel according to the present invention having the above-described structure will be described in detail with reference to the accompanying drawings.
The invention relates to an aging and optical inspection device for organic light emitting diode panel
The aging and optical inspection apparatus 100 of the present invention is basically used for performing aging and optical inspection in the manufacturing process of an organic light emitting diode panel. As described above, conventionally, the aging and optical inspection is performed after the completion of the production of the organic light emitting diode panel, that is, after the sealing step and the dicing step are completely completed, but the present invention discloses a technique capable of performing the aging and optical inspection in a step before the completion of the sealing step. That is, in the present invention, the object to be subjected to the aging and optical inspection is not the organic light emitting diode panel that has been manufactured, but the substrate 500 in a state in which the organic light emitting diode panel is being manufactured. Fig. 1 is a detailed view of a substrate of the burn-in and optical inspection apparatus of the present invention, which is described in more detail below with reference to fig. 1. As shown in fig. 1, at least one unit 550 and a plurality of connection portions 555 are deposited on the upper surface of the substrate 500. The unit 550 is an organic material pattern forming an organic light emitting diode panel, and the connection portion 555 is a circuit pattern supplying power to the unit 550 and is formed at a peripheral portion of the unit 550.
Fig. 2 is an external view of the aging and optical inspection apparatus of the present invention, and fig. 3 is a perspective view of the aging and optical inspection apparatus of the present invention. As described above, the aging and optical inspection apparatus 100 according to the present invention is used for an apparatus that performs an aging and optical inspection process on the substrate 500 during a manufacturing process, and since the organic substance forming the cell 550 has a characteristic of being immediately changed in quality when it comes into contact with oxygen, moisture, or the like, such a process needs to be completed in a state of being blocked from the external atmosphere. For this, as shown in fig. 2, the aging and optical inspection apparatus 100 of the present invention is preferably isolated from the outside by a chamber 200 in which a gas atmosphere of inert gas (e.g., nitrogen) is formed. In order to smoothly perform the burn-in and optical inspection processes in the chamber 200 completely isolated from the outside, it is necessary to automatically, precisely, and accurately perform operations such as alignment in the chamber 200. In order to prevent noise from being caused by the influence of external vibration or the like in this process, as shown in fig. 3, the aging and optical inspection apparatus 100 of the present invention is preferably supported at a lower portion thereof by a vibration attenuating portion 250 that attenuates external vibration.
Fig. 4 is an exploded side view of the aging and optical inspection apparatus of the present invention, and fig. 5 is an exploded perspective view of the aging and optical inspection apparatus of the present invention, and the detailed configuration of the aging and optical inspection apparatus 100 of the present invention will be described with reference to these drawings. As shown in fig. 4 and 5, the burn-in and optical inspection apparatus 100 of the present invention may include a vacuum adsorption unit 110, a mechanical alignment unit 120, an optical alignment unit 130, a UVW stage 140, a probe card 150, a probe alignment unit 160, a signal generation unit 170, and an optical inspection unit 180.
The vacuum suction unit 110 is disposed on a lower surface of the substrate 500, and raises or sucks and fixes the substrate 500. Specifically, during the operation of aligning the substrate 500, the substrate 500 is lifted by a blower (airlow) to smoothly move the substrate 500, and when the alignment of the substrate 500 is completed, the substrate 500 is adsorbed and fixed to stably support the substrate 500 in the process of performing other processes. Fig. 6 is a detailed view of the vacuum suction unit of the burn-in and optical inspection apparatus according to the present invention, and as shown in the drawing, the vacuum suction unit 110 is formed with a vacuum suction unit window 111 having a through hole shape having a position and an area corresponding to the region of the cell 550 so that light can pass through the region corresponding to the region of the cell 550. In addition, an alignment unit arrangement path 112 is formed in the vacuum suction unit 110, and a detailed description will be given of the mechanical alignment unit 120.
The mechanical alignment unit 120 is disposed at a plurality of positions on the lower surface of the substrate 500 in a dispersed manner, and functions to directly move the substrate 500 to align the substrate 500 at a fixed position on the vacuum adsorption unit 110. At this time, as shown in fig. 6, the vacuum suction unit 110 is formed with the aligning unit disposing path 112 having a through passage shape, and the mechanical aligning unit 120 is disposed to penetrate the aligning unit disposing path 112. Accordingly, the upper ends of the vacuum suction unit 110 and the mechanical alignment unit 120 can be disposed at substantially the same position, and thus, the mechanical alignment unit 120 can smoothly perform an operation such as a gripping movement of the substrate 500 in a state where the vacuum suction unit 110 slightly raises the substrate 500.
The optical alignment unit 130 is disposed at a plurality of positions under the substrate 500 in a dispersed manner, and functions to optically recognize an alignment mark formed on the substrate 500. In consideration of the position of the optical alignment unit 130, an alignment mark for substrate-vacuum suction unit alignment may be formed at an inner position of the area of the unit 550 of the lower surface of the substrate 500. This is merely an example, and the shape, position, number, arrangement, and the like of the alignment marks can be implemented by various modifications for more efficient alignment. The optical alignment unit 130 does not directly perform alignment of the substrate 500, but by optically recognizing the alignment mark using the optical alignment unit 130, it is possible to determine whether or not correction of alignment of the substrate 500 is necessary. Accordingly, the vacuum adsorption unit 110 and the mechanical alignment unit 120 can be operated again as necessary to more precisely and correctly correct the alignment of the substrate 500.
The UVW stage 140 is disposed above the substrate 500, and is configured to be driven along the horizontal direction X, Y and θ along the 3-axis direction and along the vertical direction Z-axis direction. The UVW stage 140 serves to align or contact the probe card 150, which will be described below, to the substrate 500, where movement in a horizontal direction (X, Y, θ 3 axes) is used for alignment and movement in a vertical direction (Z axis) is used for contact. Fig. 7 is a detailed view of the UVW stage of the burn-in and optical inspection apparatus according to the present invention, and as shown in the drawing, in the UVW stage 140, a UVW stage window 141 having a through hole shape having a position and an area corresponding to the area of the cell 550 is formed so that light can pass through the area corresponding to the area of the cell 550, as in the vacuum suction unit 110.
As described above, the probe card 150 is moved by the UVW stage 140, and includes a plurality of probe pins 155 connected to the connection portion 555 for power supply. As described above, the connection portions 555 are circuit patterns connected to the unit 550 to supply power to the unit 550, and the probe pins 155 need to be properly connected to the entire connection portions 555 in order to apply signals to the entire unit 550. Fig. 8 is a detailed view of the probe card of the burn-in and optical inspection apparatus according to the present invention, and as shown in the drawing, in the probe card 150, as well as the vacuum suction unit 110, a probe card window 151 having a through hole shape with a position and an area corresponding to the area of the unit 550 is formed so that light can pass through the area corresponding to the area of the unit 550. Fig. 9 is a perspective view showing a UVW stage-probe card-substrate configuration, and as shown, even though the UVW stage 140 and the probe card 150 are disposed above the substrate 500, each unit 555 on the substrate 500 can be optically observed through the UVW stage window 141 and the probe card window 151.
The probe alignment units 160 are disposed at a plurality of positions on the upper side of the probe card 150 in a distributed manner, and function to optically recognize alignment pins formed on the probe card 150. In consideration of the position of the probe alignment unit 160, an alignment pin for substrate-vacuum suction unit alignment can be formed at a diagonal portion of the probe card 150. This is merely an example, and the shape, position, number, arrangement, and the like of the alignment pins can be implemented by various modifications for more efficient alignment. By optically recognizing whether the alignment pins are correctly aligned with the edge (edge) of the substrate 500 by the probe alignment unit 160, it is possible to calculate a degree of change required for the probe card 150 required for alignment, and to move the probe card 150 in a horizontal direction by the UVW stage 140 according to the thus calculated value, thereby enabling accurate and correct alignment of the substrate 500 and the probe card 150. Also, fig. 10 shows a detailed view of a probe alignment unit of the burn-in and optical inspection apparatus of the present invention, and as shown, the probe alignment unit 160 may include a microlens 161 for capturing an image, and a CCD camera 162 for recognizing the captured image.
The signal generating unit 170 is electrically connected to the probe card 150 to supply power according to a set signal pattern. For example, in the case of performing the burn-in process, the signal generation unit 170 transmits a signal for a time (e.g., 10 to 30 minutes) required to burn-in all the areas of the unit 550. Alternatively, in the case of performing the optical inspection process of the R element, the signal generation unit 170 transmits a signal for lighting only the R element in the unit 550. This enables a desired lighting state to be freely realized by the signal generating unit 170.
The optical inspection unit 180 is movably disposed under the substrate 500, and performs optical inspection of the substrate 500. As described above, after the substrate-probe plates are aligned correctly by the plurality of alignment units, the unit 550 is turned on and the burn-in process of the unit 550 is performed by transmitting the power applied from the signal generating unit 170 through the connection between the probe pins 155 and the connection portions 555, and the optical inspection process of the unit 550 is performed by scanning the area of the unit 550 by the optical inspection unit 180 in a state where the unit 550 is turned on after the burn-in process is completed.
The optical inspection unit 180 will be described in more detail as follows. The optical inspection unit 180 may basically include a color abnormality inspection part 181 and a color characteristic inspection part 182. The color abnormality checking unit 181 includes a camera and a lens, and is formed to adjust a resolution to check an image quality and a color abnormality of the unit 550 in a lighting state. The color characteristic inspection section 182 inspects the color characteristics including brightness, gradation, and efficiency of the cell 550 in a lit state. On the other hand, the optical inspection unit 180 may further include a zoom range unit 183, wherein the zoom range unit 183 includes a zoom lens and is adjustable in magnification, and is disposed in the color abnormality inspection unit 181, and functions to push a selected region of the unit 550 in a lit state so that the color abnormality inspection unit 181 inspects the selected region again.
The optical inspection unit 180 configured as described above is required to be configured such that the color abnormality inspection unit 181 and the color characteristic inspection unit 182 can be moved in the horizontal direction, respectively, to scan and inspect the entire area of the unit 550. Such a moving structure can be implemented in various ways, an example of which is shown in fig. 11. Fig. 11 shows a detailed view of the optical inspection unit of the burn-in and optical inspection apparatus of the present invention, and in the embodiment of fig. 11, the optical inspection unit 180 includes a guide bar 185, the guide bar 185 extending along a certain axis selected from X, Y, and being movable along the remaining axis. In this case, the color abnormality checking unit 181 and the color characteristic checking unit 182 can move along the guide bar 185. For example, in the case where the guide bar 185 extends in the X-axis direction, the color abnormality inspection unit 181 and the color characteristic inspection unit 182 can perform scanning while the guide bar 185 moves in the X-axis direction. However, since the guide bar 185 itself can move in the Y-axis direction at this time, the color abnormality inspection unit 181 and the color characteristic inspection unit 182 can scan all directions including the X and Y axes as a result.
The aging and optical inspection method of the organic light emitting diode panel
Next, the aging of the organic light emitting diode panel and the optical inspection method of the organic light emitting diode panel of the present invention using the organic light emitting diode panel aging and optical inspection apparatus 100 of the present invention configured as described above will be described in steps.
The aging and optical inspection method of the organic light emitting diode panel of the present invention generally includes a substrate arrangement step, an alignment and contact step, and an aging and optical inspection step. As described above, since the optical inspection step is performed after the sealing step and the dicing step are completed through a plurality of steps in the deposition, unnecessary process time is wasted in the process of discarding all the panels manufactured in the same step when a defect or an abnormality occurs. In contrast, in the present invention, by performing the aging and optical inspection process before the sealing process, more specifically, by performing the aging and optical inspection process immediately after the deposition process on the substrate 500, the corresponding product is immediately discarded without performing the subsequent process when a defect or abnormality is found, thereby greatly reducing the waste of process time. In addition, feedback to the deposition apparatus is performed in this process, so that it is possible to take measures against defects or abnormal occurrence more quickly and accurately. However, in order to perform the aging and optical inspection processes before the sealing process, it is necessary to automatically perform all the processes in the chamber 200 isolated from the external atmosphere. Only if the proper alignment between the substrate 500 and the probe card 150 is achieved in this process can the burn-in and optical inspection process be properly performed. Therefore, the aging and optical inspection method of the organic light emitting diode panel of the present invention can accurately and correctly realize the fixed position arrangement and alignment to the maximum extent by including the substrate arranging step of correctly arranging the substrate at the fixed position first and the aligning and contacting step of correctly aligning the substrate-probe card.
In the substrate disposing step, after the substrate 500 is disposed at the set fixed position by the mechanical aligning unit 120 and the optical aligning unit 130, the substrate 500 is sucked and fixed to the vacuum sucking unit 110. More specifically, the description is as follows.
First, as shown in fig. 2, the substrate 500 is introduced into the burn-in and optical inspection apparatus 100 through a door portion formed in the chamber 200. The substrate 500 is generally moved by a robot, a conveyor as shown in fig. 2 and 3 is disposed below the burn-in and optical inspection apparatus 100, and when an end of the substrate 500 is placed on the conveyor by a robot arm through the gate portion, the conveyor is operated to dispose the substrate 500 in the vicinity of a substantially fixed position.
At this time, the substrate 500 is only arranged at a substantially fixed position, and is likely to be arranged at a position greatly deviated from a position required for the aging and optical inspection. Therefore, the position of the substrate 500 needs to be changed, and the substrate 500 needs to be raised by the vacuum suction unit 110 in order to freely and smoothly change the position of the substrate 500.
In this way, the substrate 500 is moved by the mechanical aligning unit 120 in a state where the substrate 500 is lifted up, and is disposed at a predetermined initial position, and the substrate 500 is first sucked and fixed by the vacuum sucking unit 110. In this case, the initial position at which the substrate 500 is disposed by the mechanical alignment unit 120 depends on initial setting values set for the motors included in the mechanical alignment unit 120. The mechanical alignment unit 120 can roughly control a large error in the position of the substrate 500 by moving the mechanical alignment of the substrate 500, but it is difficult to achieve a precise fixed position arrangement, and thus the optical alignment unit 130 also performs optical alignment as described below.
Next, the alignment mark formed on the substrate 500 is optically recognized by the optical alignment unit 130. At this time, when the alignment mark recognized by the optical alignment unit 130 is misaligned, the substrate 500 is lifted up by the vacuum suction unit 110, and the substrate 500 is moved again by the mechanical alignment unit 120 to correct the position. By performing both the mechanical alignment and the optical alignment in this way, the substrate 500 can be perfectly arranged at a desired set position on the vacuum suction unit 110.
In this way, if the substrate 500 is perfectly arranged at a desired fixing position on the vacuum adsorption unit 110, the substrate 500 is finally adsorbed and fixed by the vacuum adsorption unit 110, thereby completing the substrate arranging step.
In the aligning and contacting step, the substrate 500 and the probe card 150 are brought into contact with each other after being aligned by the probe aligning unit 160 and the UVW stage 140. More specific details are as follows.
First, the probe card 150 is assembled to the UVW stage 140 disposed on the upper side of the substrate 500. At the present time, the substrate 500 is in a state of being correctly disposed at a desired fixing position on the vacuum adsorption unit 500 through the substrate disposing step. On the other hand, the process of assembling the probe card 150 on the UVW stage 140 is generally performed manually, and errors such as several deviations must occur in the process. Therefore, the alignment between the substrate and the probe plate is not completed at this time.
Next, the alignment pins formed on the probe card 150 are optically recognized by the probe alignment unit 160, and a correction value between the substrate 500 and the probe card 150 is calculated using the alignment pin positions recognized by the probe alignment unit 160. Based on the correction values thus calculated, the UVW stage 140 moves the probe card 150 in the horizontal direction, i.e., 3-axis directions X, Y and θ, thereby enabling correct alignment between the substrate 500 and the probe card 150.
Finally, the probe card 150 is lowered by the UVW stage 140 to connect the probe pins 155 with the connection portions 555, thereby completing the alignment and contact steps.
In the burn-in and optical inspection step, the burn-in process is performed by lighting the unit 550 by the signal generating unit 170 and the probe card 150, and the optical inspection process of the lighted unit 550 is performed by the optical inspection unit 180. More specific details are as follows.
In order to obtain a correct optical inspection result of the cell 550, an aging process is first required. Therefore, first, the burn-in process of the unit 550 is performed by transmitting the power applied from the signal generating unit 170 through the connection between the probe pin 155 and the connection portion 555, and lighting the unit 550.
Next, in a state where the cell 550 is lit, the optical inspection process of the cell 550 is performed by the optical inspection unit 180 scanning the region of the cell 550, which will be described in more detail as follows. The image quality and color abnormality of the cell 550 in a lit state are checked by the color abnormality checking section 181, and the color characteristics including the brightness, gradation, and efficiency of the cell 550 in a lit state are checked by the color characteristic checking section 182. In this case, since the aging process is completed, it is sufficient to perform either color abnormality inspection or color characteristic inspection, and for example, it is obvious that optical inspection can be performed in a free order according to the purpose and convenience of a user, such as performing image quality inspection (belonging to color abnormality inspection) first, then performing brightness inspection (belonging to color characteristic inspection), and then performing color abnormality inspection (belonging to color abnormality inspection). In the case where a portion determined to require a particularly more accurate recheck is found in such a process, a process may be performed in which the selected region of the unit 550 in the lit state is captured by the zoom range unit 183 disposed in the color abnormality checking unit 181, and the captured region is checked again by the color abnormality checking unit 181.
As described above, the method for aging and optically inspecting an organic light emitting diode panel according to the present invention has an advantage that the aging and optically inspecting processes are performed on the substrate immediately after the deposition process, thereby fundamentally eliminating the subsequent processes performed on the substrate when a defect or abnormality occurs, and thus significantly reducing unnecessary processes and time waste. Furthermore, in the aging and optical inspection method of an organic light emitting diode panel according to the present invention, the process conditions of the deposition equipment for depositing the substrate 500 can be corrected by feeding back the inspection result derived in the aging and optical inspection step. In this way, when a defect or an abnormality occurs in the process, a more rapid and accurate measure can be taken than in the conventional case, and as a result, the production efficiency can be further improved.
The present invention is not limited to the above-described embodiments, and it is obvious that the present invention has various application ranges, and those skilled in the art can carry out various modifications without departing from the spirit of the present invention claimed in the claims.
(description of reference numerals)
100 burn-in and optical inspection apparatus 110 vacuum suction unit
111 vacuum suction unit window 112 alignment unit arrangement path
120 mechanical alignment unit 130 optical alignment unit
140 UVW platform 141 UVW platform window
150 probe board 151 probe board window
155 Probe pin 160 Probe alignment Unit
161 microlens 162 CCD camera
170 signal generating unit 180 optical inspection unit
181 color abnormality inspection unit 182 color characteristic inspection unit
183 zoom range portion 185 guide lever
200 chamber 250 vibration damping section
500 substrate 550 unit
555 connecting part.
Claims (17)
1. An aging and optical inspection device for OLED panel,
an apparatus (100) for aging and optically inspecting an organic light emitting diode panel, which ages and optically inspects a substrate (500), wherein at least one unit (550) formed with an organic material pattern and forming the organic light emitting diode panel and a plurality of connection portions (555) formed with a circuit pattern for supplying power to the unit (550) and formed at the outer peripheral portion of the unit (550) are deposited on the upper surface of the substrate (500),
the aging and optical inspection device for an organic light emitting diode panel is characterized by comprising:
a vacuum suction unit (110) which is disposed on the lower surface of the substrate (500) and which raises the substrate (500) or sucks and fixes the substrate (500);
a plurality of mechanical alignment units (120) dispersedly disposed at a plurality of positions on a lower surface of the substrate (500), and directly moving the substrate (500) to align the substrate (500) to a fixed position on the vacuum adsorption unit (110);
an optical alignment unit (130) which is disposed at a plurality of positions on the lower side of the substrate (500) in a dispersed manner and optically recognizes alignment marks formed on the substrate (500);
a UVW stage (140) which is disposed above the substrate (500), can be driven along X, Y and theta in the horizontal direction by a 3-axis drive, and can be driven along a Z-axis in the vertical direction by a drive motor;
a probe card (150) moved by the UVW stage (140) and including a plurality of probe pins (155) connected to the connection part (555) to supply power;
a probe alignment unit (160) which is disposed at a plurality of positions on the upper side of the probe card (150) in a dispersed manner and optically recognizes alignment pins formed on the probe card (150);
a signal generation unit (170) electrically connected to the probe card (150) to supply power according to a set signal pattern; and
and an optical inspection unit (180) which is movably disposed below the substrate (500) and optically inspects the substrate (500).
2. The device for aging and optical inspection of an organic light emitting diode panel according to claim 1,
in the burn-in and optical inspection apparatus (100),
the power applied from the signal generation unit (170) is transmitted by the connection of the probe pin (155) and the connection part (555), thereby the unit (550) is lighted and the aging process of the unit (550) is performed,
the optical inspection process of the cell (550) is performed by scanning the area of the cell (550) by the optical inspection unit (180) in a state where the cell (550) is lit.
3. The apparatus for aging and optical inspection of an organic light emitting diode panel according to claim 1,
in the burn-in and optical inspection apparatus (100),
in such a manner that light can pass through the respective regions of the vacuum adsorption unit (110), the UVW stage (140) and the probe card (150) corresponding to the region of the unit (550),
vacuum suction unit windows (111), UVW platform windows (141), and probe plate windows (151) having through hole shapes respectively having positions and areas corresponding to the areas of the units (550) are formed in the vacuum suction unit (110), the UVW platform (140), and the probe plate (150).
4. The apparatus for aging and optical inspection of an organic light emitting diode panel according to claim 1,
in the burn-in and optical inspection apparatus (100),
an alignment unit arrangement path (112) having a through-passage shape is formed in the vacuum suction unit (110),
the mechanical alignment unit (120) is configured to directly move the substrate (500) so as to pass through the alignment unit configuration path (112).
5. The device for aging and optical inspection of an organic light emitting diode panel according to claim 1,
the optical inspection unit (180) comprises:
a color anomaly checking unit (181) which includes a camera and a lens, can adjust the resolution, and checks the image quality and color anomaly of the unit (550) in the lighting state; and
and a color characteristic inspection unit (182) for inspecting the color characteristics including brightness, gradation, and efficiency of the cells (550) in the lit state.
6. The device for aging and optical inspection of an organic light emitting diode panel according to claim 5,
the optical inspection unit (180) further includes a zoom range unit (183), wherein the zoom range unit (183) includes a zoom lens and is capable of adjusting magnification, is disposed in the color abnormality inspection unit (181), and shoots a selected region of the unit (550) in a lit state so that the color abnormality inspection unit (181) inspects the selected region again.
7. The apparatus for aging and optical inspection of an organic light emitting diode panel according to claim 5,
in the optical inspection unit (180),
the color abnormality inspection unit (181) and the color characteristic inspection unit (182) are each movable in a horizontal direction to scan and inspect the entire area of the cell (550).
8. The apparatus for aging and optical inspection of an organic light emitting diode panel according to claim 7,
the optical inspection unit (180) includes a guide bar (185), the guide bar (185) extending along one axis selected from X, Y and being movable along another axis,
the color abnormality checking unit (181) and the color characteristic checking unit (182) are movable with the guide bar (185).
9. The apparatus for aging and optical inspection of an organic light emitting diode panel according to claim 1,
the aging and optical inspection apparatus (100) is isolated from the outside by a chamber (200) in which a gas atmosphere of an inert gas is formed.
10. The apparatus for aging and optical inspection of an organic light emitting diode panel according to claim 1,
the lower part of the aging and optical inspection device (100) is supported by a vibration damping part (250) for damping external vibration.
11. A method of aging and optical inspection of an organic light emitting diode panel using the aging and optical inspection apparatus (100) of an organic light emitting diode panel according to claim 1,
the aging and optical inspection method of the organic light emitting diode panel is characterized by comprising the following steps:
a substrate arranging step of arranging the substrate (500) to a predetermined fixed position by the mechanical alignment unit (120) and the optical alignment unit (130), and then sucking and fixing the substrate (500) to the vacuum sucking unit (110);
an alignment and contact step of contacting the substrate (500) and the probe card (150) with each other after aligning the substrate (500) and the probe card (150) by the probe alignment unit (160) and the UVW stage (140); and
and a burn-in and optical inspection step of performing a burn-in process by lighting the unit (550) by the signal generation unit (170) and the probe card (150), and performing an optical inspection process of the lighted unit (550) by the optical inspection unit (180).
12. The method of claim 11, wherein the step of performing a burn-in and optical inspection on the OLED panel,
the substrate disposing step includes:
introducing the substrate (500) into the burn-in and optical inspection apparatus (100);
a step of raising the substrate (500) by the vacuum adsorption unit (110);
a step of moving the substrate (500) by the mechanical alignment unit (120) to be disposed at a set initial position in a state where the substrate (500) is lifted;
a step of first sucking and fixing the substrate (500) by the vacuum sucking unit (110);
a step of optically recognizing an alignment mark formed on the substrate (500) by the optical alignment unit (130);
a step of, when the alignment mark recognized by the optical alignment unit (130) is misaligned, lifting the substrate (500) by the vacuum suction unit (110) and moving the substrate (500) again by the mechanical alignment unit (120) to correct the position, thereby disposing the substrate (500) to a set fixed position; and
and a step of finally sucking and fixing the substrate (500) by the vacuum sucking unit (110).
13. The method of claim 11, wherein the step of inspecting the panel for aging and optics comprises,
the aligning and contacting steps include:
a step of assembling the probe card (150) at the UVW stage (140);
a step of optically recognizing alignment pins formed on the probe card (150) by the probe alignment unit (160);
a step of calculating a correction value between the substrate (500) and the probe card (150) using the alignment pin position recognized by the probe alignment unit (160);
a step of aligning the substrate (500) with the probe card (150) according to the corrected value by the UVW stage (140); and
a step of connecting the probe pins (155) with the connection parts (555) by lowering the probe card (150) by the UVW stage (140).
14. The method of claim 11, wherein the step of inspecting the panel for aging and optics comprises,
the aging and optical inspection step comprises:
a step of transmitting the electric power applied from the signal generation unit (170) by connecting the probe pin (155) and the connection unit (555), thereby lighting the unit (550) and performing a burn-in process of the unit (550); and
and a step of performing an optical inspection process of the cell (550) by scanning an area of the cell (550) by the optical inspection unit (180) in a state where the cell (550) is lit.
15. The method of claim 14, wherein the step of inspecting the panel for aging and optics comprises,
the step of performing the optical inspection process includes:
checking an image quality and a color abnormality of the unit (550) in a lighting state by a color abnormality checking section (181) of the optical checking unit (180); and
and a step of inspecting the color characteristics including brightness, gradation, and efficiency of the unit (550) in a lit state by a color characteristic inspection unit (182) of the optical inspection unit (180).
16. The method of claim 15, wherein the step of inspecting the panel for aging and optics comprises,
the step of performing the optical inspection process includes:
a step of capturing a selected region of the unit (550) in a lit state by a zoom range unit (183) disposed in the color abnormality detection unit (181); and
and a step of checking the shot region again by the color abnormality checking unit (181).
17. The method of claim 11, wherein the step of inspecting the panel for aging and optics comprises,
the aging and optical inspection method of the organic light emitting diode panel comprises the following steps:
and a step of correcting the process conditions of the deposition equipment for performing deposition on the substrate (500) by feeding back the inspection results derived in the aging and optical inspection steps.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180118757A KR101952926B1 (en) | 2018-10-05 | 2018-10-05 | Device and method for aging and vision-inspecting OLED |
| KR10-2018-0118757 | 2018-10-05 |
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| CN111007069A CN111007069A (en) | 2020-04-14 |
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| JP4163435B2 (en) * | 2002-03-29 | 2008-10-08 | 株式会社日本マイクロニクス | Substrate inspection equipment |
| JP4319068B2 (en) * | 2004-03-01 | 2009-08-26 | 株式会社日鉄エレックス | Light emitting panel aging inspection device |
| JP2008066003A (en) * | 2006-09-04 | 2008-03-21 | Sanyo Electric Co Ltd | Defect inspection method of electroluminescent display, defect correction method, and method of manufacturing electroluminescent display |
| KR101279656B1 (en) * | 2008-12-22 | 2013-06-27 | 엘지디스플레이 주식회사 | Probe inspection apparatus |
| KR20110073318A (en) * | 2009-12-22 | 2011-06-29 | 가부시키가이샤 히다치 하이테크놀로지즈 | Lighting inspection equipment and method of organic el display substrate, defect inspection correction apparatus and method of organic el display substrate, organic el display panel correction equipment and method, and organic el display manufacturing system and method |
| KR101149055B1 (en) * | 2010-05-25 | 2012-05-24 | 주식회사 영우디에스피 | Aging apparatus for organic light emitting display panel |
| CN101986376B (en) * | 2010-09-28 | 2012-07-25 | 彩虹显示器件股份有限公司 | Wiring method for checking crossing in process of lighting and ageing whole sheet of OLED substrate glass |
| JP2012146529A (en) * | 2011-01-12 | 2012-08-02 | Hitachi High-Technologies Corp | Thin film display device inspection/correction method and inspection/correction apparatus |
| KR101573459B1 (en) * | 2013-11-29 | 2015-12-01 | (주) 루켄테크놀러지스 | Aging system |
| CN108594494B (en) * | 2018-06-14 | 2023-08-29 | 广东速美达自动化股份有限公司 | Automatic detection assembly line without FPC (flexible printed circuit) liquid crystal display |
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