CN111262069A - 导电端子 - Google Patents
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
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- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
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Abstract
本发明公开了一种导电端子,其由一片状金属材料弯折形成,所述导电端子包括沿上下方向延伸的主体部、自所述主体部的上缘向上倾斜延伸的辅助臂、自所述主体部的下缘向上弯折延伸的弹性臂以及自所述主体部延伸的接脚,所述弹性臂延伸有倾斜部以及自所述倾斜部向上弯折延伸的接触部,当所述接触部受压后,所述倾斜部向下抵接于所述辅助臂以形成端子内接触区,所述接脚包括自所述主体部的一侧缘弯折延伸的弯折部以及自所述弯折部的下缘沿水平弯折延伸的焊接片,可借由调节弯折部的折弯角度以使导电端子适应不同的使用需求。
Description
【技术领域】
本发明有关一种导电端子,尤其涉及一种组装于电连接器上以电性连接一电路板与一芯片模组的导电端子。
【背景技术】
相关现有技术请参中国实用新型专利第CN201285852Y号所揭示的一种用于安装在电连接器上以电性连接电路板和芯片模组的导电端子,该导电端子包括第一主体部、与所述第一主体部呈一定角度弯折设置的第二主体部、自所述第一主体部下缘向下延伸的焊脚以及自所述第二主体部上缘向上弯折延伸的接触部,所述焊脚用于焊接至电路板,所述接触部用于与芯片模组连接,使用时,该芯片模组会向下抵压所述接触部;由于不同的电路板焊接点与芯片模组的连接片之间往往存在不同的位置关系,可能使所述导电端子在被芯片模组抵压时产生不必要的变形,容易损坏导电端子。虽然弯折设置的第一、第二主体部可在一定程度上调节所述接脚与所述接触部的相对位置以适应不同的连接需求,但是该接触部通常被设置为长臂状以保证其具有较好的机械性能,因此在设计时往往难以在接触部的机械性能与导电端子的灵活使用之间找到平衡,给设计带来困难。
因此,有必要设计一种新的导电端子,以克服上述缺陷。
【发明内容】
本发明的目的在于提供一种导电端子,能够适应不同接触环境且结构稳定的导电端子。
本发明的目的通过以下技术方案来实现:一种导电端子,其由一片状金属材料弯折形成,所述导电端子包括沿上下方向延伸的主体部、自所述主体部的上缘向上倾斜延伸的辅助臂、自所述主体部的下缘向上弯折延伸的弹性臂以及自所述主体部延伸的接脚,所述弹性臂延伸有倾斜部以及自所述倾斜部向上弯折延伸的接触部,当所述接触部受压后,所述倾斜部向下抵接于所述辅助臂以形成端子内接触区,所述接脚包括自所述主体部的一侧缘弯折延伸的弯折部以及自所述弯折部的下缘沿水平弯折延伸的焊接片。
进一步地,所述主体部包括向下延伸的竖直部,所述竖直部与所述弹性臂彼此分离设置,所述弯折部自所述竖直部的侧缘弯折延伸。
进一步地,所述弹性臂位于所述主体部的一侧,所述辅助臂朝主体部的另一侧倾斜延伸,所述弯折部自所述竖直部的侧缘朝着所述弹性臂的方向弯折延伸。
进一步地,所述弯折部包括与所述主体部的侧缘相连接的弧形连接部以及与弧形连接部相连接的垂直部,所述垂直部与主体部相互垂直设置。
进一步地,所述焊接片延伸至所述弹性臂的正下方。
进一步地,所述主体部、垂直部及焊接片三者相互垂直设置。
进一步地,所述主体部具有横向的左右两侧,所述弹性臂紧靠所述主体部的右侧设置,所述竖直部紧靠所述主体部的左侧设置,所述垂直部自所述竖直部的左侧边缘弯折延伸。
进一步地,所述弹性臂包括自所述主体部下缘向斜上方朝远离主体部的方向弯折延伸的第一弯折部、自所述第一弯折部向上弯折并竖直延伸的直立部、自所述直立部朝主体部方向倾斜延伸并位于所述辅助臂上方的第二弯折部、自所述第二弯折部弯折延伸的所述倾斜部及自所述倾斜部继续延伸的所述接触部。
进一步地,所述接触部设置为向上凸起的圆弧状,所述接触部包括两个平行延伸且彼此间隔设置的弧形接触条。
进一步地,所述倾斜部与所述辅助臂相互抵接的表面区域均涂覆有镀金层。
与现有技术相比,本发明具有如下有益效果:通过设置独立的可侧向调节弯折角度的接脚来达成导电端子能够在不同使用环境中建立电性连接的目的,同时,弹性臂与弯折设置的接脚相互独立,该弹性臂被芯片模组抵压后产生的端子形变不易使导电端子被损坏。
【附图说明】
图1是本发明之导电端子的立体图。
图2是图1另一角度的立体图。
图3是图1另一角度的立体图。
图4是图1另一角度的立体图。
【主要元件符号说明】
主体部 1 第一弯折部 33
导电端子 100 直立部 34
竖直部 11 第二弯折部 35
倒刺 12 接脚 4
辅助臂 2 弯折部 40
弹性臂 3 焊接片 41
倾斜部 31 弧形连接部 42
接触部 32 垂直部 43
弧形接触条 320
如下具体实施方式将结合上述附图进一步说明本发明。
【具体实施方式】
以下,将结合图1至图4介绍本发明的导电端子的具体实施方式。
如图1至图4所示,本发明提供了一种导电端子100,其由一片状金属材料弯折形成,所述导电端子100包括沿上下方向延伸的主体部1、自所述主体部1的上缘向上倾斜延伸的辅助臂2、自所述主体部1的下缘向上弯折延伸的弹性臂3以及自所述主体部1延伸的接脚4,所述弹性臂3延伸有倾斜部31以及自所述倾斜部31向上弯折延伸的接触部32,当所述接触部32受压后,所述倾斜部31向下抵接于所述辅助臂2以形成端子内接触区(未标示),所述接脚4包括自所述主体部1的一侧缘弯折延伸的弯折部40以及自所述弯折部40的下缘沿水平弯折延伸的焊接片41。本发明之导电端子100可组装于一电连接器(未图示)上以电性连接一电路板(未图示)与一芯片模组(未图示)。所述芯片模组的连接片(未图示)向下抵接于所述接触部32,所述焊接片41用于焊接至所述电路板的焊接点(未图示)上,借由调整导电端子100之弯折部40的折弯角度,可在不同位置关系的连接片与焊接点之间建立电连接,有利于将所述导电端子100安装于不同规格的使用环境中。
所述倾斜部31与所述辅助臂2相互抵接的表面区域(即端子内接触区)均涂覆有金属层(未图示)以降低其接触阻抗,可以提高导电端子的电气性能。在本实施例中,所述端子内接触区涂覆有镀金层。
如图2至图3所示,在本实施例中,所述主体部1包括向下延伸的竖直部11,所述竖直部11与所述弹性臂3彼此分离设置,所述弯折部40自所述竖直部11的侧缘弯折延伸。继续参阅图1至图4,所述主体部1设有位于所述片状金属材料延展平面的相对两侧,所述弹性臂3位于所述主体部1的一侧,所述辅助臂2朝主体部1的另一侧倾斜延伸,所述弯折部40自所述竖直部11的侧缘朝着所述弹性臂3的方向弯折延伸。所述弯折部40包括与所述主体部1的侧缘相连接的弧形连接部42以及与弧形连接部42相连接的垂直部43,所述垂直部43与主体部1相互垂直设置。所述焊接片41延伸至所述弹性臂3的正下方,所述主体部1、垂直部43及焊接片41三者相互垂直设置。
所述主体部1具有横向的左右两侧,所述主体部1的左右两侧均设有凸伸的倒刺12,所述倒刺12用于将所述导电端子100组装至所述电连接器。
在本实施例中,所述弹性臂3紧靠所述主体部1的右侧设置,所述竖直部11紧靠所述主体部1的左侧设置,所述垂直部43自所述竖直部11的左侧边缘弯折延伸,借由调整导竖直部11与垂直部43之间的折弯角度,可在不同位置关系的芯片模组的连接片与电路板的焊接点之间建立电连接,有利于将所述导电端子100安装于不同规格的使用环境中。
所述弹性臂3包括自所述主体部1下缘向斜上方朝远离主体部1的方向弯折延伸的第一弯折部33、自所述第一弯折部33向上弯折并竖直延伸的直立部34、自所述直立部34朝主体部1方向倾斜延伸并位于所述辅助臂2上方的第二弯折部35、自所述第二弯折部35弯折延伸的所述倾斜部31及自所述倾斜部31继续延伸的所述接触部32。将所述弹性臂3自所述主体部1的下端向上弯折延伸,当所述芯片模组向下抵压所述接触部32时,所述弹性臂3具有足够的向下变形的空间,可保证所述弹性臂3的机械性能良好,有利于所述导电端子100与所述芯片模组达成稳定的电性连接,同时,所述弹性臂3与弯折设置的所述接脚4相互独立,所述弹性臂3被所述芯片模组抵压后产生的端子形变不易使导电端子100被损坏,可使所述导电端子100具有较佳的稳定性。在本实施例中,所述接触部32设置为向上凸起的圆弧状,所述接触部32包括两个平行延伸且彼此间隔设置的弧形接触条320,相比于仅包括一个接触条的导电端子,如此设置有利于所述弧形接触条320与所述芯片模组的稳定接触。
以上所述仅为本发明的部分实施方式,不是全部的实施方式,本领域普通技术人员通过阅读本发明说明书而对本发明技术方案采取的任何等效的变化,均为本发明的权利要求所涵盖。
Claims (10)
1.一种导电端子,其由一片状金属材料弯折形成,所述导电端子包括沿上下方向延伸的主体部、自所述主体部的上缘向上倾斜延伸的辅助臂、自所述主体部的下缘向上弯折延伸的弹性臂以及自所述主体部延伸的接脚,所述弹性臂延伸有倾斜部以及自所述倾斜部向上弯折延伸的接触部,当所述接触部受压后,所述倾斜部向下抵接于所述辅助臂以形成端子内接触区,其特征在于:所述接脚包括自所述主体部的一侧缘弯折延伸的弯折部以及自所述弯折部的下缘沿水平弯折延伸的焊接片。
2.如权利要求1所述的导电端子,其特征在于:所述主体部包括向下延伸的竖直部,所述竖直部与所述弹性臂彼此分离设置,所述弯折部自所述竖直部的侧缘弯折延伸。
3.如权利要求2所述的导电端子,其特征在于:所述弹性臂位于所述主体部的一侧,所述辅助臂朝主体部的另一侧倾斜延伸,所述弯折部自所述竖直部的侧缘朝着所述弹性臂的方向弯折延伸。
4.如权利要求3所述的导电端子,其特征在于:所述弯折部包括与所述主体部的侧缘相连接的弧形连接部以及与弧形连接部相连接的垂直部,所述垂直部与主体部相互垂直设置。
5.如权利要求4所述的导电端子,其特征在于:所述焊接片延伸至所述弹性臂的正下方。
6.如权利要求5所述的导电端子,其特征在于:所述主体部、垂直部及焊接片三者相互垂直设置。
7.如权利要求6所述的导电端子,其特征在于:所述主体部具有横向的左右两侧,所述弹性臂紧靠所述主体部的右侧设置,所述竖直部紧靠所述主体部的左侧设置,所述垂直部自所述竖直部的左侧边缘弯折延伸。
8.如权利要求7所述的导电端子,其特征在于:所述弹性臂包括自所述主体部下缘向斜上方朝远离主体部的方向弯折延伸的第一弯折部、自所述第一弯折部向上弯折并竖直延伸的直立部、自所述直立部朝主体部方向倾斜延伸并位于所述辅助臂上方的第二弯折部、自所述第二弯折部弯折延伸的所述倾斜部及自所述倾斜部继续延伸的所述接触部。
9.如权利要求8所述的导电端子,其特征在于:所述接触部设置为向上凸起的圆弧状,所述接触部包括两个平行延伸且彼此间隔设置的弧形接触条。
10.如权利要求1-9任一项所述的导电端子,其特征在于:所述倾斜部与所述辅助臂相互抵接的表面区域均涂覆有镀金层。
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