CN111261573A - Support frame, vacuum drying device, drying system and substrate drying method - Google Patents
Support frame, vacuum drying device, drying system and substrate drying method Download PDFInfo
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- CN111261573A CN111261573A CN202010066591.8A CN202010066591A CN111261573A CN 111261573 A CN111261573 A CN 111261573A CN 202010066591 A CN202010066591 A CN 202010066591A CN 111261573 A CN111261573 A CN 111261573A
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- 239000000758 substrate Substances 0.000 title claims abstract description 162
- 238000001035 drying Methods 0.000 title claims abstract description 79
- 238000001291 vacuum drying Methods 0.000 title claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims description 82
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 46
- 229910052742 iron Inorganic materials 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 21
- 238000005086 pumping Methods 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 29
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- 239000002904 solvent Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
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- 238000001179 sorption measurement Methods 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000754 Wrought iron Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Solid Materials (AREA)
- Liquid Crystal (AREA)
Abstract
The application provides a support frame, a vacuum drying device, a drying system and a substrate drying method, relates to the technical field of display, and can reduce the occurrence probability of the phenomenon that the display brightness of a display panel is uneven due to support pins. The support frame includes: supporting seat and a plurality of bracing piece. The bracing piece extends along first direction, and a plurality of bracing pieces are along second direction interval and parallel arrangement to be fixed in on the supporting seat. The first direction and the second direction are perpendicular. The plurality of support bars includes a first support bar and two second support bars. The second bracing piece is located the outside of a plurality of bracing pieces, and the interval of first bracing piece and two second bracing pieces equals. The first supporting rod is provided with a plurality of first supporting pins, the second supporting rod is provided with a plurality of second supporting pins, and the first supporting pins and the second supporting pins are used for supporting the substrate. The substrate comprises a plurality of sub-substrates with the same structure. And the area between the first support pin and the second support pin is used for enabling a plurality of sub-substrates in the substrate to be positioned in the area.
Description
Technical Field
The application relates to the technical field of display, in particular to a support frame, a vacuum drying device, a drying system and a substrate drying method.
Background
In the manufacturing process of the display panel, a photolithography process is generally used to form a desired pattern. The photoetching process is to coat photoresist on a substrate deposited with a film, the photoresist forms an anti-etching pattern through the process steps of drying, exposing, developing, baking and the like, and then the film on the substrate forms a required pattern through the processes of etching, stripping the photoresist and the like.
Disclosure of Invention
Embodiments of the present application provide a support frame, a vacuum drying apparatus, a drying system, and a substrate drying method, which can reduce the occurrence probability of the uneven brightness phenomenon of a display panel caused by support pins in a photoresist drying process.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:
in a first aspect of embodiments of the present application, a support frame is provided. This support frame includes: supporting seat and a plurality of bracing piece. Every bracing piece extends along first direction in a plurality of bracing pieces, and a plurality of bracing pieces are along second direction interval and parallel arrangement to be fixed in on the supporting seat. The first direction and the second direction are perpendicular. The plurality of support bars includes a first support bar and two second support bars. The second bracing piece is located the outside of a plurality of bracing pieces, and the interval of first bracing piece and two second bracing pieces equals. A plurality of first supporting pins are arranged on the first supporting rod, and a plurality of second supporting pins are arranged on each second supporting rod. The height direction of the first support pins and the second support pins is the direction of the surface of the support rod arranged on the vertical support seat, and the first support pins and the second support pins are used for supporting the substrate. The substrate includes a plurality of structurally identical sub-substrates. And the area between the plurality of first supporting pins on the first supporting rod and the plurality of second supporting pins on the second supporting rod is used for enabling the plurality of sub-substrates in the substrate to be positioned in the area.
Optionally, a plurality of first fixing grooves are formed in the first support rod along the first direction, the number of the first fixing grooves in the first support rod is greater than that of the first support pins in the first support rod, and each of the plurality of first support pins is fixed in one of the first fixing grooves.
Optionally, a plurality of first fixing grooves on the first supporting rod are arranged at equal intervals, and the interval between any two adjacent first fixing grooves is 0.5-2 cm.
Optionally, a first iron block is arranged in the first fixing groove, a first magnetic block is embedded in the bottom, close to the supporting seat, of the first supporting needle, and the bottom of the first supporting needle is in surface contact with the first iron block, far away from the supporting seat.
Optionally, a groove is provided on the first support rod, and the groove extends along the first direction. The portion of the first support pin is located within the recess. The fixing piece is correspondingly arranged at the position close to each first supporting needle and used for fixing the first supporting needle, so that the first supporting needle is perpendicular to the first supporting rod.
Optionally, the fixing member comprises a square clip. The square card includes two massive grip blocks, is provided with the semi-cylindrical opening on the side that two grip blocks are close to each other respectively, forms and extends along first supporting pin direction of height, and is used for the holding hole of the first supporting pin of holding.
Optionally, a plurality of second fixing grooves are formed in the second supporting rod in the first direction at intervals, the number of the second fixing grooves in the second supporting rod is the same as that of the second supporting pins in the second supporting rod, and the second supporting pins correspond to the second fixing grooves in a one-to-one manner. A second iron block is arranged in the second fixing groove, a second magnetic block is embedded at the bottom, close to the supporting seat, of the second supporting needle, and the bottom of the second supporting needle is in surface contact with the second iron block far away from the supporting seat.
Optionally, the plurality of support rods further include a plurality of third support rods, and the plurality of third support rods are respectively disposed on two sides of the first support rod. The third support rod is provided with two second support needles, at least one first support needle and a plurality of third support needles. Two second supporting needles on the third supporting rod are positioned at two ends of the third supporting rod. A first supporting pin on the third supporting rod is positioned in the middle of the third supporting rod. The surface of the supporting rod is arranged opposite to the supporting seat, and the height of one end, far away from the surface, of the third supporting needle is lower than the height of one end, far away from the plane, of the first supporting needle and the second supporting needle.
Optionally, a plurality of third fixing grooves are formed in the third support rod along the first direction, and each of the first support pins, each of the second support pins and each of the third support pins are located in one of the third fixing grooves. The third supporting needle comprises a screw rod, and threads matched with the screw rod are arranged on the inner wall of the third fixing groove corresponding to the third supporting needle.
A second aspect of embodiments of the present application provides a vacuum drying apparatus. The vacuum drying device comprises a first chamber, wherein a support frame for supporting a substrate is arranged in the first chamber. The support frame is the support frame provided by the first aspect of the embodiment of the application. The first chamber is communicated with a vacuum pumping pipe and an air inlet pipe.
A third aspect of embodiments of the present application provides a drying system. The drying system comprises a vacuum drying device and a heating drying device. The vacuum drying device is the vacuum drying device provided by the second aspect of the embodiments of the present application.
Optionally, the heating and drying device includes a second chamber, and a heating plate, a plurality of fourth supporting pins and a plurality of fifth supporting pins penetrating through the heating plate are disposed in the second chamber. The plurality of fourth support pins and the plurality of fifth support pins are used to support the substrate. The plurality of fourth supporting pins are arranged in a line along the first direction. The plurality of fifth supporting needles are arranged in a plurality of rows, the plurality of rows of fifth supporting needles are distributed along the second direction, part of the rows of the fifth supporting needles and the rest of the rows of the fifth supporting needles are respectively arranged on two sides of one row of the fourth supporting needles, and the height of one end, far away from the heating plate, of each fifth supporting needle is 3-4mm higher than that of one end, far away from the heating plate, of each fourth supporting needle. The heating and drying device further comprises a fixing device, the fixing device is located below the heating plate and used for fixing the fourth supporting needle and the fifth supporting needle, and the fixing device is not in contact with the heating plate.
Optionally, the heating and drying device further comprises a lifting device, and the lifting device is used for driving the fixing device to lift.
A fourth aspect of the embodiments of the present application provides a substrate drying method. The method is used for drying the substrate by using the drying system provided by the third aspect of the embodiment of the application. The drying method comprises the following steps: and placing the substrate on a support frame of a first cavity in a vacuum drying device, and drying the substrate at low pressure. And transferring the substrate from the first chamber to the second chamber, placing the substrate on the fifth support pin, and keeping the substrate for a certain time. Wherein, the fifth support needle is kept away from the hot plate one end and is 65 ~ 70mm apart from the height of hot plate. And synchronously descending the fifth supporting needle and the fourth supporting needle until the height of the end, away from the heating plate, of the fifth supporting needle is 4-6 mm away from the heating plate, keeping the height for 50-80 s, and preheating the substrate. And synchronously descending the fifth supporting needle and the fourth supporting needle until the substrate is placed on the heating plate, keeping the temperature for 80-110 s, and heating and drying the substrate.
The utility model provides a support frame, the region between a plurality of second supporting pins on a plurality of first supporting pins and the second bracing piece on the first bracing piece, a plurality of sub-base plates that are arranged in the base plate are located this region, a region outside the sub-base plate that first supporting pin and the second supporting pin that is used for supporting to the base plate all are located the base plate, so, in the drying process, first supporting pin and second supporting pin can not cause the influence to the photoresist on the sub-base plate, thereby can reduce the emergence probability of the inhomogeneous phenomenon of display panel demonstration luminance that leads to because of the supporting pin.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1a is a schematic view of a substrate in the related art;
FIG. 1b is a diagram illustrating a non-uniform brightness of a display panel caused by a supporting pin in the related art;
fig. 2 is a schematic view of a vacuum drying apparatus provided in an embodiment of the present application;
fig. 3a is a schematic view of a supporting frame according to an embodiment of the present disclosure;
fig. 3b is a schematic view illustrating a corresponding relationship between a supporting frame and a substrate according to an embodiment of the present disclosure;
fig. 3c is a schematic view of a supporting pin on a supporting frame according to an embodiment of the present disclosure;
fig. 4a is a schematic view of a first support rod according to an embodiment of the present disclosure;
FIG. 4b is a cross-sectional view A-A' of FIG. 4 a;
FIG. 4c is a schematic view of a support stand according to the related art;
FIG. 4d is a schematic view of another first support bar according to an embodiment of the present disclosure;
FIG. 5a is a schematic view of a first support bar according to another embodiment of the present application;
FIG. 5b is a schematic view of another first support bar according to another embodiment of the present application;
FIG. 5c is a front view of the first support bar shown in FIG. 5 b;
FIG. 5d is a schematic view of another first support bar according to another embodiment of the present disclosure;
FIG. 5e is a cross-sectional view of B-B' of FIG. 5 d;
fig. 6a is a schematic view of a second support rod according to an embodiment of the present disclosure;
FIG. 6b is a cross-sectional view of C-C' of FIG. 6 a;
fig. 7a is a schematic view of a third support bar according to an embodiment of the present disclosure;
FIG. 7b is a cross-sectional view of D-D' of FIG. 7 a;
fig. 8a is a schematic view of a heating and drying device provided in an embodiment of the present application;
FIG. 8b is a schematic view of a heating plate according to an embodiment of the present application;
fig. 8c is a schematic view illustrating an improvement effect of the heating and drying device on the mura of the display panel according to the embodiment of the present application;
fig. 9 is a flowchart of a substrate drying method according to an embodiment of the present disclosure;
fig. 10 is a schematic diagram of a substrate heating and drying process according to an embodiment of the present disclosure.
Reference numerals:
100-a substrate; 101-a submount; 01-a first chamber; 2-vacuumizing the tube; 3, an air inlet pipe; 4-a support frame; 5-a drive device; 40-support rods; 41-a support seat; 410-a first support bar; 411-a first supporting pin; 420-a second support bar; 421-a second supporting needle; 430-a third support bar; 431-a third support pin; 4311-screw; 4301-thread; 412-a first fixation slot; 4111-a first magnetic block; 4121-first iron block; 4122-ejection hole; 413-groove; 414-a fixture; 4141-a clamping block; 4142-first screw; 4131-bar iron block; 4143 fixing block; 4144-second screw; 422-a second fixing groove; 4211-a second magnetic block; 4221-a second iron block; 432-a third fixation groove; 02-a second chamber; 6-heating plate; 7-a fixing device; 8-a lifting device; 641-a fourth supporting pin; 651-fifth supporting pin; 661-sixth support needle.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
Further, in the present application, directional terms such as "upper", "lower", and the like may include, but are not limited to, being defined relative to a schematically-disposed orientation of components in the drawings, it being understood that these directional terms may be relative concepts that are intended for relative description and clarification, and that will vary accordingly depending on the orientation of the components in the drawings in which they are disposed.
In the present application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, e.g., "coupled" may be a fixed connection, a removable connection, or an integral part; may be directly connected or indirectly connected through an intermediate.
In order to reduce the production cost and improve the production efficiency in the manufacturing process of the display panel, as shown in fig. 1a, a plurality of sub-substrates 101 having the same structure and spaced from each other are generally simultaneously formed on one large substrate 100, and then cut to form a plurality of display substrates. It will be appreciated that each submount 101 has one display area. Each of the sub-substrates 101 includes a plurality of functional structures, such as a switching transistor, a pixel electrode, and a common electrode in a liquid crystal display (TFT-LCD). Or, for example, a switching transistor, a driving transistor, a Pixel Definition Layer (PDL), a Planarization Layer (PLN), a light emitting device, and the like in an organic light emitting diode display panel (OLED).
The functional structures such as a gate electrode, an active pattern, a source electrode, a drain electrode, a pixel electrode, a common electrode, a pixel defining layer, a planarization layer, and the like, which constitute a switching transistor and/or a driving transistor, are generally formed using a photolithography process. The photoetching process comprises the following steps: first, a corresponding film layer is deposited on the substrate 100, then an anti-etching pattern identical to the required functional pattern is formed through the process steps of photoresist coating, exposure, development, baking and the like, and then the required functional pattern is formed on the film on the substrate 100 through the processes of etching, photoresist stripping and the like. After the photoresist is coated, the photoresist needs to be dried, a solvent in the photoresist is removed, the adhesive force between the photoresist and the substrate is enhanced, and preparation is made for subsequent exposure and development.
Since the photoresist is coated on the substrate 100 and has high fluidity, it is generally dried under low pressure in a vacuum environment to remove most of the solvent. The substrate 100 is then heated and dried in a heating chamber to further remove the photoresist solvent and enhance the adhesion of the photoresist to the substrate 100.
In the low pressure drying and heating drying processes, a support pin (pin) is usually used to support the substrate 100, and the stress and the heating degree of the portion of the substrate 100 in contact with the support pin and the other portions not in contact with the support pin are not consistent, which may cause the thickness of the photoresist at the corresponding position of the support pin to be inconsistent with the thickness of the photoresist at other positions, and after etching and other processes, the thickness of the film at the corresponding position is not uniform. Thus, the produced display panel is prone to have brightness unevenness (mura) at corresponding positions, and the schematic diagram thereof is shown in fig. 1b, which shows a dirty and dark defect on the display panel. Particularly, under the superimposed influence of low-pressure drying and heating drying, the mura phenomenon is more obvious, and the loss of the product yield is caused.
Accordingly, some embodiments of the present disclosure provide a drying system, which can reduce the occurrence probability of the uneven brightness of the display panel caused by the supporting pins during the photoresist drying process. Some embodiments of the present application provide a drying system including a vacuum drying device and a heat drying device for performing low pressure drying and heat drying processes, respectively, on a substrate coated with a photoresist.
As shown in fig. 2, in some embodiments of the present application, the vacuum drying apparatus includes a first chamber 01, and the first chamber 01 communicates with an evacuation tube 2 and an intake tube 3. The evacuation tube 2 is used for evacuating the first chamber 01 to make the substrate 100 coated with the photoresist in a low pressure environment, thereby facilitating the volatilization of the solvent in the photoresist. The air inlet pipe 3 is used for inflating the first chamber 01 after the low-pressure drying is completed, so that the pressure in the first chamber 01 is restored to an atmospheric pressure state, and the substrate 100 is conveniently transferred out of the first chamber 01.
It should be noted that, the number of the vacuum tubes 2 and the air inlet tubes 3 and the communication position of the first chamber 01 are not specifically limited in the present application, as long as the photoresist on the substrate 100 can be uniformly dried, and the first chamber 01 can be restored to the atmospheric pressure state without affecting the substrate 100. The evacuation tube 2 may be connected to an evacuation pump, such as a dry pump (drypump), for evacuation. The inlet line 3 can be connected to a gas source, for example, Clean Dry Air (CDA) or nitrogen (N)2) Etc. for supplying gas to the first chamber 01.
In addition, a support frame 4 is disposed in the first chamber 01, and the support frame 4 is used to support the substrate 100 during the drying process of the substrate 100.
In some embodiments, as shown in fig. 2, the supporting frame 4 is further connected with a driving device 5, which may be a motor or a cylinder, for example. The driving device 5 is located below the supporting frame 4 and can drive the supporting frame 4 to ascend and descend in the vertical direction.
As shown in fig. 2, the support frame 4 includes: a plurality of support rods 40 and a support base 41. A plurality of support rods 40 are fixed to the support base 41.
As shown in fig. 3a, each of the plurality of support bars 40 extends along a first direction (e.g., X-direction in fig. 3 a), and the plurality of support bars 40 are spaced and arranged in parallel along a second direction (e.g., Y-direction in fig. 3 a), wherein the first direction and the second direction are perpendicular.
As shown in fig. 3a, the plurality of support rods 40 includes a first support rod 410 and two second support rods 420. Wherein, the two second support bars 420 are respectively located at the outermost sides of the plurality of support bars 40. The first support bar 410 is spaced apart from the two second support bars 420 equally, i.e., the first support bar 410 is located at a middle position of the plurality of support bars 40.
As shown in fig. 3a, a plurality of first supporting pins 411 are disposed on the first supporting rod 410, and a plurality of second supporting pins 421 are disposed on each second supporting rod 420.
As shown in fig. 2, the height direction of the first supporting pins 411 and the second supporting pins 421 is the direction perpendicular to the surface of the supporting base 41 where the supporting rod 40 is disposed. It can be understood that the ends of the first supporting pin 411 and the second supporting pin 421, which are far away from the supporting seat 41, are located on the same plane, which is parallel to the surface of the supporting seat 41 where the supporting rod 40 is located, i.e. the first supporting pin 411 and the second supporting pin 421 have the same height. The plurality of first support pins 411 and the plurality of second support pins 421 are used to support the substrate 100.
As shown in fig. 3b, the substrate 100 includes a plurality of sub-substrates 101 having the same structure, and after a desired functional pattern is formed, the sub-substrates 101 are cut along the region therebetween to obtain a display substrate having a desired size, which can be used for preparing a display panel.
As shown in fig. 3b, a region between the plurality of first supporting pins 411 on the first supporting rod 410 and the plurality of second supporting pins 421 on the second supporting rod 420 is used for positioning the plurality of sub-substrates 101 in the substrate 100 in the region. In some embodiments, the first supporting pins 411 are located in the region between the sub-substrates 101, and the second supporting pins 421 are located outside the region where all the sub-substrates 101 are located. That is, the first and second supporting pins 411 and 421 for supporting the substrate 100 each correspond to a region other than the sub-substrate 101.
The support frame 4 provided by the present application is used for the first support pins 411 and the second support pins 421 for supporting the substrate 100 to be located in the region outside the sub-substrate 101 on the substrate 100, so that, in the drying process, the first support pins 411 and the second support pins 421 will not affect the photoresist on the sub-substrate 101, thereby reducing the occurrence probability of the uneven display brightness of the display panel caused by the support pins.
In addition, as shown in fig. 3c, the first supporting pins 411 and the second supporting pins 421 may have tapered ends near the substrate 100, so that the contact area with the substrate 100 may be reduced, and the influence of the supporting pins on the substrate 100 may be reduced.
Alternatively, the first supporting pin 411 and the second supporting pin 421 may be made of Polyetheretherketone (PEEK), have high mechanical strength, and are not easy to scratch the substrate.
The specific structure of the first support rod 410 in the present application will be described in detail below.
Example 1
In some embodiments of the present application, as shown in fig. 4a, a plurality of first fixing grooves 412 are disposed at intervals along the first direction on the first support rod 410, and the number of the first fixing grooves 412 is greater than the number of the first support pins 411 on the first support rod 410, and each of the plurality of first support pins 411 is fixed in one first fixing groove 412.
As shown in fig. 4c, each of the first supporting pins 411 is correspondingly located in one of the first fixing slots 412, and the installation position of the first supporting pin 411 on the first supporting rod 410 is fixed, which cannot be flexibly adjusted according to the size of the sub-substrate 101 on the substrate 100. When the sub-substrate 101 is changed in size, a portion of the first supporting pins 411 may be located within the sub-substrate 101, thereby causing mura defects in the product.
A plurality of first fixing grooves 412 are formed in the first support rod 410 at intervals, and the number of the first fixing grooves 412 is greater than that of the first support pins 411. Thus, the position of the first supporting pin 411 on the first supporting rod 410 can be adjusted to other first fixing grooves 412 as required, so that the position of the first supporting pin 411 on the first supporting rod 410 can be adjusted according to the size of the sub-substrate 101 on the substrate 100, and the position of the first supporting pin 411 can avoid the area where the sub-substrate 101 is located, thereby avoiding the mura phenomenon of the display panel caused by the influence of the first supporting pin 411.
On this basis, in some embodiments of the present application, the plurality of first fixing grooves 412 on the first supporting rod 410 are arranged at equal intervals, and the interval between any two adjacent first fixing grooves 412 is 0.5-2 cm. For example, the distance between the first fixing grooves 412 may be 0.7 to 1.6 cm. For example, the pitch of the first fixing grooves 412 may be 0.5cm, 1cm, 1.5cm, 2 cm.
Therefore, more first fixing grooves 412 can be formed in the first support rod 410, so that the adjustable positions of the first support pin 411 on the first support rod 410 are more, more product design requirements can be met, and higher flexibility is achieved.
In some embodiments of the present application, the first support rod 410 is made of an aluminum alloy material.
In some embodiments of the present application, as shown in fig. 4b (a cross-sectional view of a-a' in fig. 4 a), a first iron block 4121 is disposed in the first fixing groove 412 of the first support rod 410.
On the basis, as shown in fig. 4b, a first magnetic block 4111 is embedded in the bottom of the first supporting pin 411 close to the supporting base 41. The bottom of the first supporting pin 411 contacts with the surface of the first iron block 4121 away from the supporting seat 41. In this way, the first supporting pin 411 is fixed to the first supporting rod 410 by a magnetic attraction method, and the position of the first supporting pin 411 can be easily changed.
In some embodiments of the present application, as shown in fig. 4b, an ejection hole 4122 is further formed in the first fixing groove adjacent to the supporting seat 41 to facilitate the first iron block 4121 to be removed from the first fixing groove 412 by an ejection method.
The first iron block 4121 is disposed in the first fixing groove 412, and the first magnetic block 4111 is disposed at the bottom of the first supporting pin 411. In other embodiments, a magnetic block may be disposed in the first fixing groove 412, and an iron block may be disposed at the bottom of the first supporting pin 411. The present application does not limit this as long as the first supporting pin 411 can be stably fixed to the first supporting rod 410 and can be conveniently moved.
Illustratively, as shown in fig. 4d, the first support rod 410 includes 5 first support pins 411, and the positions of the first support pins 411 on the first support rod 410 are shown in fig. 4 d. One first supporting pin 411 is located at the middle position of the first supporting rod 410 in the length direction, two first supporting pins 411 are located 7mm away from the two end surfaces of the first supporting rod 410 respectively, and the other two first supporting pins 411 are located 543mm away from the two end surfaces of the first supporting rod 410 respectively. The first supporting pins 411 are located at the regions between the sub-substrates 101 on the substrate 100 corresponding to the sub-substrates 101 of some sizes, and the positions of the first supporting pins 411 on the first supporting bars 410 can be adjusted. Thus, the mura of the display panel caused by the first supporting pins 411 can be prevented.
Example two
In other embodiments of the present application, as shown in fig. 5a, the first support rod 410 is provided with a groove 413, and the groove 413 extends along a first direction.
A portion of the first supporting pin 411 is located in the groove 413. As shown in fig. 5b, a fixing member 414 is correspondingly disposed on the first supporting rod 410 at a position close to each first supporting pin 411 for fixing the first supporting pin 411 such that the first supporting pin 411 is perpendicular to the first supporting rod 410. It is avoided that the first supporting pins 411 are biased by a force during the low pressure drying process of the substrate 100.
In some embodiments of the present application, as shown in fig. 5b (a top view of the first support rod 410) and fig. 5c (a front view of the first support rod 410), the fixing member 414 includes a square clip including two block-shaped clamping blocks 4141, and one sides of the two clamping blocks 4141 adjacent to each other are respectively provided with a semi-cylindrical opening forming a receiving hole extending along a height direction of the first support pin 411 for receiving the first support pin 411.
The two holding blocks 4141 may be independent from each other or may be connected to each other. When the two holding blocks 4141 are connected, the two holding blocks 4141 can be opened and closed, so that the first supporting pin 411 can be placed in the two holding blocks 4141 when the two holding blocks 4141 are opened, and when the two holding blocks 4141 are closed, the first supporting pin 411 is located in the accommodating hole, namely the first supporting pin 411 is wrapped in the accommodating hole, so that the first supporting pin 411 can be supported.
When the two holding blocks 4141 may be of independent structures, for example, screw holes are further respectively formed on the two holding blocks 4141, and a first screw 4142 is inserted through the screw hole to connect the two holding blocks 4141, so that the first supporting pin 411 is placed in the receiving hole therein. Of course, the fixing method is not limited to the fixing method by the screw hole and the screw, and other fixing methods may be used, and the fixing method is not limited herein.
Optionally, as shown in fig. 5b, a bar-shaped iron block 4131 extending along the first direction is further disposed in the groove 413. The bottom of the first supporting pin 411 is embedded with a first magnetic block 4111, and the first supporting pin 411 is magnetically attracted to the bar-shaped iron block 4131, so that the stability of the first supporting pin 411 can be further enhanced.
In other embodiments of the present application, as shown in fig. 5d and 5e (a cross-sectional view B-B' in fig. 5 d), the groove 413 may have an inverted "T" shape in a cross-section along the second direction, and a portion of the first supporting pin 411 is located in the groove 413. The fixing member 414 includes two fixing blocks 4143 disposed in the groove 413 and located at both sides of the first supporting pin 411 in the first direction. The fixing block 4143 has a length in the second direction greater than that of the groove 413 on the surface of the first support pole 410 where the first support pin 411 is disposed. The two fixing blocks 4143 are further respectively provided with a screw hole extending in a direction perpendicular to the surface of the first supporting pin 411 provided on the first supporting rod 410, the screw hole penetrates through the fixing block 4143, and the position of the screw hole corresponds to the position of the groove 413 provided on the surface of the first supporting pin 411 provided on the first supporting rod 410. The fixing member 414 further includes a second screw 4144, and the second screw 4144 penetrates through the screw hole of each fixing block 4143, as shown in fig. 5e, one end of the second screw 4144 abuts against the bottom of the groove 413, and one end surface of the fixing block 4143 abuts against the inner top surface of the "T" shaped groove, so that the fixing block 4143 and the second screw 4144 are fixed in the groove, thereby fixing the first supporting pin 411 at a position between the two fixing blocks 4143 in the groove 413.
Optionally, the two fixing blocks 4143 may be respectively provided with a semi-cylindrical opening on the side surface close to the first supporting pin 411, so as to form an accommodating hole extending along the height direction of the first supporting pin 411 and used for accommodating the first supporting pin 411, and the first supporting pin 411 is wrapped in the accommodating hole, so that the first supporting pin 411 is more stable.
The first supporting rod 410 provided by the embodiment of the present application is provided with the groove 413 along the length direction of the first supporting rod 410, the first supporting pin 411 is disposed in the groove 413, and the first supporting pin 411 can move along the groove 413, so that the first supporting pin 411 can be disposed at any position on the first supporting rod 410, and the position of the first supporting pin 411 on the first supporting rod 410 can be arbitrarily adjusted according to the size of the sub-substrate 101 on the substrate 100, which has high flexibility.
In some embodiments of the present application, as shown in fig. 6a, a plurality of second fixing grooves 422 are formed in the second support rod 420 at intervals along the first direction, the number of the second fixing grooves 422 in the second support rod 420 is the same as that of the second support needles 421 in the second support rod 420, and the positions of the second support needles 421 and the second fixing grooves 422 are in one-to-one correspondence.
As shown in fig. 6b (a cross-sectional view of C-C' in fig. 6 a), a second iron block 4221 is disposed in the second fixing groove 422 of the second support rod 420, and a second magnetic block 4211 is embedded in the bottom of the second support pin 421 close to the support seat 41. The bottom of the second supporting pin 421 contacts with the surface of the second iron block 4221 away from the supporting seat 41. The second supporting pin 421 is fixed in the second fixing groove 422 by a magnetic attraction manner. Thus, the height of the second supporting pin 421 can be easily adjusted, for example, the height of the second iron block 4221 can be adjusted according to the requirement.
In addition, as in the first support rod 410, as shown in fig. 6b, an ejection hole 4122 is also provided on the side of the second support rod 420 away from the second iron block 4221, so as to facilitate the second iron block 4221 to be taken out of the hole by ejection.
It should be noted that a magnetic block may be disposed in the second fixing groove 422, and an iron block may be disposed at the bottom of the second supporting pin 421. The present application is not limited thereto as long as the second supporting pin 421 can be stably fixed to the second supporting rod 420.
In addition, in some embodiments of the present application, as shown in fig. 3a, the plurality of support bars 40 further includes a plurality of third support bars 430, and the plurality of third support bars 430 are respectively disposed at two sides of the first support bar 410. That is, the plurality of third support bars 430 are respectively located between the first support bar 410 and the second support bar 420.
Each of the third support bars 430 is provided with two second support needles 421, and the two second support needles 421 are located at two ends of the third support bar 430. The second supporting pins 421 on the third supporting bar 430 are also located outside the area where all the sub-substrates 101 on the substrate 100 are located.
Each third support bar 430 is provided with at least one first support pin 411, and the first support pin 411 is located at the middle position of the third support bar 430.
The third support rod 430 is further provided with a plurality of third support pins 431. The surface of the supporting rod 40 is arranged opposite to the supporting seat 41, and the height of the end, away from the surface, of the third supporting pin 431 is lower than the height of the end, away from the plane, of the first supporting pin 411 and the second supporting pin 421. Therefore, the supporting pins of the supporting frame 4 that mainly support the substrate 100 are the first supporting pin 411 and the second supporting pin 421, and the third supporting pin 431 is a supporting pin that is not mainly stressed.
In some embodiments of the present application, as shown in fig. 7a, a plurality of third fixing grooves 432 are formed at intervals in the first direction on the third support rod 430, and each of the first support pins 411, each of the second support pins 421, and each of the third support pins 431 on the third support rod 430 are respectively located in one of the third fixing grooves 432.
The fixing manner of the first supporting pin 411 and the second supporting pin 421 on the third fixing groove 432 is the same as the fixing manner of the first supporting rod 410 and the second supporting rod 420, and the details are not repeated here.
As shown in fig. 7b (a cross-sectional view of D-D' in fig. 7 a), the third supporting pin 431 includes a screw 4311, a thread 4301 matching the screw is provided on an inner wall of a third fixing groove 432 of the third supporting rod 430 corresponding to the third supporting pin 431, and the third supporting pin 431 is fixed to the third supporting rod 430 by a threaded connection. The third supporting needle 431 is fixed in a threaded connection mode, so that the third supporting needle 431 is more stable to fix, convenient to detach and convenient to replace.
As shown in fig. 7b, the top of the third supporting needle 431 has a disk shape. The third supporting pins 431 have a lower height than the first supporting pins 411 and the second supporting pins 421, and are supporting pins with no main force, and one end of the third supporting pins 431 close to the substrate 100 is set into a disk shape, so that when the third supporting pins 431 are in contact with the substrate 100, the contact area between the third supporting pins 431 and the substrate 100 can be increased, the pressure of the third supporting pins 431 on the substrate 100 can be reduced, and the probability of mura defect of the display panel caused by the third supporting pins 431 is reduced.
The following describes a heating and drying device of the drying system provided by the present application in detail.
As shown in fig. 8a, some embodiments of the present application provide a heating and drying apparatus including a second chamber 02, and a heating plate 6 is disposed in the second chamber 02. In some embodiments of the present application, a heating wire is disposed in the heating plate 6 to heat the substrate 100 coated with the photoresist, so that a solvent in the photoresist on the substrate 100 is rapidly volatilized in a heated environment, and an adhesion force between the photoresist and the substrate 100 is enhanced.
A plurality of fourth supporting pins 641 and a plurality of fifth supporting pins 651 are further disposed in the second chamber 02. The plurality of fourth supporting pins 641 and the plurality of fifth supporting pins 651 penetrate the heating plate 6 to support the substrate 100.
As shown in fig. 8b (a top view of the heating plate in fig. 8 a), a plurality of fourth supporting needles 641 are aligned in a first direction (X direction in fig. 8 b). The plurality of fifth supporting pins 651 are arranged in a plurality of rows along the second direction (e.g., Y direction in fig. 8 b), the fifth supporting pins 651 of each row of the fifth supporting pins 651 are arranged along the first direction, and part of the rows and the rest of the rows of the fifth supporting pins 651 are disposed at both sides of one row of the fourth supporting pins 641.
It should be noted that the dotted lines in fig. 8b are only for illustrating that a plurality of supporting pins are located in the same row, and these dotted lines do not exist in practice.
In some embodiments of the present application, the corresponding positions of the plurality of rows of fifth supporting pins 651 on the substrate 100 may be the same as the corresponding positions of the supporting pins on the second supporting bar 420 and the third supporting bar 430 on the substrate 100 in the vacuum drying apparatus.
In addition, as shown in fig. 8a, the height of the fifth supporting pin 651 away from the end of the heating plate 6 is higher than the height of the fourth supporting pin 641 away from the end of the heating plate 6.
In some embodiments of the present application, the height of the fifth supporting pin 651 remote from the end of the heating plate 6 is 3-4mm higher than the height of the fourth supporting pin 641 remote from the end of the heating plate 6. For example, the height of the end of the fifth supporting pin 651 far from the heating plate 6 is 3mm, 3.5mm, or 4mm higher than the height of the end of the fourth supporting pin 641 far from the heating plate 6.
Thus, in the heat drying process, the effect of the fourth supporting pins 641 on the substrate 100 is weakened, so that the influence on the substrate 100 is small, and the serious mura phenomenon of the sub-substrate 101 in the middle of the substrate 100 due to the superposition of the low-pressure drying and the heat drying is avoided, thereby reducing the occurrence probability of the mura.
In some embodiments of the present application, as shown in fig. 8a, the above-mentioned heating and drying device further includes a fixing device 7, the fixing device 7 being located below the heating plate 6 for fixing the fourth supporting pin 641 and the fifth supporting pin 651, the fixing device 7 not being in contact with the heating plate 6.
In addition, the heating and drying device further comprises a lifting device 8, and the lifting device 8 is connected with the fixing device 7 and used for driving the fixing device 7 to lift. As an example, the lifting device 8 may be a motor.
Fig. 8c is a mura incidence curve of the display panel prepared by heating and drying the substrate 100 coated with the photoresist by using the above heating and drying apparatus provided in the embodiment of the present application from different functional pattern layers in the process of manufacturing the OLED display panel. When the heating drying device provided in some related arts is used for heating drying, the incidence of mura failures of the display panel is 1%. As shown in fig. 8c, the incidence of mura defects in the display panel is effectively reduced by the above-described heat drying apparatus according to the embodiment of the present application, and the earlier the introduction is, the lower the incidence of mura defects is. When the heating and drying device provided by the application is adopted for each film layer from the active layer (active) layer and the subsequent film layer, the mura defect occurrence rate is only 0.21%.
Some embodiments of the present application also provide a substrate drying method for drying the substrate 100 coated with the photoresist using the drying system provided by the above embodiments. As shown in fig. 9, the substrate drying method includes S101 to S105.
S101, the substrate 100 is placed on the support frame 4 of the first chamber 01 in the vacuum drying apparatus, the first chamber 01 is evacuated by the vacuum evacuation tube 2, and the substrate 100 is dried under low pressure.
As can be seen from the above description of the vacuum drying apparatus, the first chamber 01 is communicated with the vacuum pumping tube 2, and the vacuum pumping tube 2 can vacuum the first chamber 01, so that the substrate 100 is in a low-pressure environment, which is beneficial to volatilization of the solvent in the photoresist.
The first chamber 01 includes a support frame 4, and the support frame 4 includes a plurality of support bars 40, wherein a first support pin 411 and a second support pin 421 of the plurality of support bars mainly support the substrate 100. The first supporting pins 411 are located in the regions between the sub-substrates 101 on the substrate 100, and the second supporting pins 421 are located outside the regions where all the sub-substrates 101 are located. Thus, the incidence of mura caused by supporting needles during the low pressure drying process can be reduced.
S102, the first chamber 01 is inflated by the intake pipe 3, and the air pressure in the first chamber 01 is returned to the atmospheric pressure.
The inlet pipe 3 may be connected to a gas source, which may be, for example, dry air (CDA) or nitrogen (N)2) After the low-pressure drying is completed, the first chamber 01 is filled with CDA or N through the air inlet pipe 32The first chamber 01 is returned to the atmospheric pressure state, and the substrate 100 is easily transferred out of the first chamber 01.
S103, as shown in fig. 10 (a), the fixing device 7 in the heating and drying device is adjusted such that the height of the fifth supporting pin 651 from the heating plate 6 is 65 to 70mm, and the substrate 100 is transferred from the first chamber 01 to the second chamber 02, placed on the fifth supporting pin 651, and held for 3 seconds.
After the low pressure drying is completed, the first chamber 01 is returned to the atmospheric pressure state, and the substrate 100 is transferred from the first chamber 01 to the second chamber 02 by using, for example, a robot or the like, and placed on the fifth support pins 651 in the second chamber 02.
In order to conveniently pick and place the substrate 100 and avoid the interference of the heating plate 6 on the pick and place operation, the end of the fifth supporting pin 651 far away from the heating plate 6, which is used for supporting the substrate 100 in this step, needs to be higher than the heating plate 6 by a certain height. For example, the height 65, 68, 70mm of the fifth supporting pins 651 above the heating plate 6 may be adjusted according to the state of the robot taking and placing the substrate 100. Wherein, the height of the end of the fifth supporting pin 651 far away from the heating plate 6 is 3-4mm higher than the height of the end of the fourth supporting pin 641 far away from the heating plate 6.
When the substrate 100 is transferred from the first chamber 01 to the second chamber 02 in an unstable state, for example, shaking may occur, and the height of the fixing device 7 needs to be maintained for a certain period of time, for example, for about 3 seconds, to stabilize the substrate 100.
S104, as shown in (b) of FIG. 10, adjusting the fixing device 7 to make the fixing device 7 drive the fourth supporting pins 641 and the fifth supporting pins 651 to descend synchronously until the height of one end of the fifth supporting pins 651 far away from the heating plate 6 is 4-6 mm, keeping for 50-80S, and preheating the substrate 100.
After the substrate 100 is transferred from the first chamber 01 to the second chamber 02, in order to prevent the substrate 100 from being damaged due to a sudden increase in the temperature of the substrate 100, it is necessary to preheat the substrate 100 at a position distant from the heating plate 6, so that the substrate 100 is slowly heated.
In this step, the height of the end of the fifth supporting pin 651 away from the heating plate 6 is 4-6 mm, for example, 4mm, 5mm, or 6mm, from the heating plate 6, and the time is kept for 50-80 s, which can be adjusted according to the process requirement. In addition, as can be seen from the above description, the height of the end of the fifth supporting pin 651 away from the heating plate 6 is 3-4mm higher than the height of the end of the fourth supporting pin 641 away from the heating plate 6, so the height of the end of the fourth supporting pin 641 away from the heating plate 6 in this step is 1-2 mm. Since the fourth supporting pins 641 at the middle position of the substrate 100 play a non-dominant supporting role for the substrate 100 in the preheating step, the influence on the substrate 100 is small, and the probability of mura generated at the corresponding position on the substrate 100 is reduced.
S105, as shown in fig. 10 (c), adjusting the fixing device 7 to make the fixing device 7 drive the fourth supporting pin 641 and the fifth supporting pin 651 to synchronously descend until the substrate 100 is completely placed on the heating plate 6, and keeping the position for 80-110S to heat and dry the substrate 100.
At this time, the fifth supporting pins 651 do not support the substrate 100 any more, and are completely supported by the heating plate 6.
After the substrate 100 is preheated, the fixing device 7 is adjusted to completely place the substrate 100 on the heating plate 6 and support the substrate 100 by the heating plate 6, so that the heating plate 6 can sufficiently heat the substrate 100 for 80-110 s, for example, 80s, 85s, 90s, 95s, 100s, and 110s, and the adjustment can be performed according to the drying condition of the photoresist on the substrate 100.
In addition, in some embodiments of the present application, in order to prevent electrostatic adsorption between the substrate 100 and the heating plate 6, when the fixing device 7 lifts the fourth supporting pins 641 and the fifth supporting pins 651 after the heat drying is completed, the substrate 100 is damaged due to the electrostatic adsorption force, and as shown in (c) of fig. 10, a sixth supporting pin 661 is disposed on the heating plate 6. Sixth supporting pin 661 is fixed on hot plate 6, and sixth supporting pin 661 is kept away from hot plate 6 one end and is 0.3mm apart from the height of hot plate 6, and in the heat drying process, sixth supporting pin 661 supports base plate 100, prevents that base plate 100 from directly attaching on hot plate 6, produces the electrostatic adsorption and results in the base plate 100 damaged.
In the preheating process, the substrate 100 is sufficiently preheated, and the temperature of each region on the substrate 100 is uniform, so that the sixth supporting pins 661 have a small influence on the substrate 100, and mura of the substrate 100 due to the sixth supporting pins 661 is not generated.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (14)
1. A support frame, comprising:
a supporting seat;
a plurality of support rods; each support rod of the plurality of support rods extends along a first direction, the plurality of support rods are arranged at intervals and in parallel along a second direction and are fixed on the support seat, and the first direction is vertical to the second direction; the plurality of support rods comprise a first support rod and two second support rods, the second support rods are positioned at the outermost sides of the plurality of support rods, and the distance between the first support rod and the two second support rods is equal; a plurality of first supporting pins are arranged on the first supporting rod, and a plurality of second supporting pins are arranged on each second supporting rod;
the height direction of the first support pins and the second support pins is perpendicular to the surface of the support seat, where the support pins are arranged, and the first support pins and the second support pins are used for supporting a substrate, where the substrate includes a plurality of sub-substrates with the same structure; and the area between the plurality of first supporting pins on the first supporting rod and the plurality of second supporting pins on the second supporting rod is used for enabling the plurality of sub-substrates in the substrate to be positioned in the area.
2. The support frame of claim 1, wherein a plurality of first fixing grooves are formed at intervals along the first direction on the first support rod, the number of the first fixing grooves on the first support rod is greater than that of the first support pins on the first support rod, and each of the plurality of first support pins is fixed in one of the first fixing grooves.
3. The support frame of claim 2, wherein the first fixing grooves of the first support rod are arranged at equal intervals, and the interval between any two adjacent first fixing grooves is 0.5-2 cm.
4. The supporting frame according to claim 2, wherein a first iron block is disposed in the first fixing groove, a first magnetic block is embedded in the bottom of the first supporting pin close to the supporting seat, and the bottom of the first supporting pin contacts with a surface of the first iron block away from the supporting seat.
5. The support bracket of claim 1 wherein said first support bar is provided with a groove extending along said first direction;
a portion of the first support pin is located within the recess;
a fixing member is correspondingly arranged at a position close to each first supporting needle, and the fixing member is used for fixing the first supporting needles so that the first supporting needles are perpendicular to the first supporting rods.
6. A support as claimed in claim 5, wherein the fixing means comprises a square clip;
the square card includes two massive grip blocks, two be provided with the semi-cylindrical opening on the side that the grip block is close to each other respectively, form the edge first supporting pin direction of height extends, and is used for the holding hole of first supporting pin.
7. The supporting frame according to claim 1, wherein a plurality of second fixing grooves are formed in the second supporting rod at intervals along the first direction, the number of the second fixing grooves in the second supporting rod is the same as that of the second supporting pins in the second supporting rod, and the positions of the second supporting pins and the positions of the second fixing grooves are in one-to-one correspondence;
and a second iron block is arranged in the second fixing groove, a second magnetic block is embedded at the bottom of the second support needle close to the support seat, and the bottom of the second support needle is in contact with the surface of the second iron block far away from the support seat.
8. The support frame of any one of claims 1-7, wherein the plurality of support bars further comprises a plurality of third support bars, the plurality of third support bars being disposed on two sides of the first support bar;
the third support rod is provided with two second support needles, at least one first support needle and a plurality of third support needles; the two second supporting needles on the third supporting rod are positioned at two ends of the third supporting rod; one first supporting needle on the third supporting rod is positioned in the middle of the third supporting rod; the surface of the supporting rod is arranged opposite to the supporting seat, and the height of one end, far away from the surface, of the third supporting pin is lower than the height of one end, far away from the surface, of the first supporting pin and the second supporting pin.
9. The supporting frame according to claim 8, wherein a plurality of third fixing grooves are formed at intervals along the first direction on the third supporting rod, and each of the first supporting pins, each of the second supporting pins and each of the third supporting pins are located in one of the third fixing grooves;
the third supporting needle comprises a screw rod, and threads matched with the screw rod are arranged on the inner wall of the third fixing groove corresponding to the third supporting needle.
10. A vacuum drying apparatus, comprising: a first chamber having a support frame disposed therein for supporting a substrate, the support frame being as defined in any one of claims 1 to 9;
the first cavity is communicated with a vacuum pumping pipe and an air inlet pipe.
11. A drying system is characterized by comprising a vacuum drying device and a heating drying device;
the vacuum drying apparatus according to claim 10.
12. The drying system of claim 11, wherein the heating and drying device comprises a second chamber in which a heating plate is disposed, and a plurality of fourth supporting pins and a plurality of fifth supporting pins passing through the heating plate; the plurality of fourth supporting pins and the plurality of fifth supporting pins are used for supporting the substrate;
the fourth supporting pins are arranged in a line along a first direction; the plurality of fifth supporting needles are arranged in a plurality of rows, the plurality of rows of fifth supporting needles are distributed along the second direction, part of the rows of fifth supporting needles and the rest of the rows of fifth supporting needles are arranged on two sides of one row of fourth supporting needles, and the height of one end, far away from the heating plate, of each fifth supporting needle is 3-4mm higher than that of one end, far away from the heating plate, of each fourth supporting needle;
the heating and drying device further comprises a fixing device which is located below the heating plate and used for fixing the fourth supporting needle and the fifth supporting needle, and the fixing device is not in contact with the heating plate.
13. The drying system of claim 12, wherein the thermal drying device further comprises a lifting device for driving the fixing device to lift.
14. A method for drying a substrate, wherein the substrate is dried by the drying system according to any one of claims 12 to 13, the method comprising:
placing the substrate on a support frame of a first chamber in a vacuum drying device, and drying the substrate at low pressure;
transferring the substrate from the first chamber to a second chamber, placing the substrate on a fifth supporting needle, and keeping the substrate for a certain time; the height of one end, away from the heating plate, of the fifth support needle from the heating plate is 65-70 mm;
synchronously descending the fifth supporting pin and the fourth supporting pin until the height of one end of the fifth supporting pin, which is far away from the heating plate, from the heating plate is 4-6 mm, keeping the height for 50-80 s, and preheating the substrate;
and synchronously descending the fifth supporting needle and the fourth supporting needle until the substrate is placed on the heating plate, keeping the temperature for 80-110 s, and heating and drying the substrate.
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| CN202010066591.8A CN111261573B (en) | 2020-01-20 | 2020-01-20 | Support frame, vacuum drying device, drying system and substrate drying method |
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| CN202010066591.8A CN111261573B (en) | 2020-01-20 | 2020-01-20 | Support frame, vacuum drying device, drying system and substrate drying method |
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| CN112366176A (en) * | 2020-11-23 | 2021-02-12 | 中芯长电半导体（江阴）有限公司 | Die pick-up device and method |
| CN113074542A (en) * | 2021-03-17 | 2021-07-06 | 深圳市华星光电半导体显示技术有限公司 | Bearing assembly and drying equipment |
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| CN114789431A (en) * | 2021-01-25 | 2022-07-26 | 南京以太通信技术有限公司 | A hold in palm and put board subassembly for holding in palm put medium piece |
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