CN111261573B - Support frame, vacuum drying device, drying system and substrate drying method - Google Patents

Support frame, vacuum drying device, drying system and substrate drying method Download PDF

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Publication number
CN111261573B
CN111261573B CN202010066591.8A CN202010066591A CN111261573B CN 111261573 B CN111261573 B CN 111261573B CN 202010066591 A CN202010066591 A CN 202010066591A CN 111261573 B CN111261573 B CN 111261573B
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China
Prior art keywords
supporting
support
substrate
needle
pins
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CN202010066591.8A
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Chinese (zh)
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CN111261573A (en
Inventor
张�浩
熊黎
唐成
杨金珂
孙泽斌
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Priority to CN202010066591.8A priority Critical patent/CN111261573B/en
Publication of CN111261573A publication Critical patent/CN111261573A/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

The application provides a support frame, vacuum drying device, drying system, base plate drying method relates to and shows technical field, can reduce the emergence probability because of the uneven phenomenon of display panel display brightness that the supporting needle leads to. The support frame includes: a supporting seat and a plurality of supporting rods. The support rods extend along the first direction, and the support rods are arranged at intervals and in parallel along the second direction and fixed on the support base. The first direction and the second direction are perpendicular. The plurality of support bars includes a first support bar and two second support bars. The second bracing piece is located the outermost side of a plurality of bracing pieces, and first bracing piece equals with the interval of two second bracing pieces. The first supporting rod is provided with a plurality of first supporting needles, the second supporting rod is provided with a plurality of second supporting needles, and the first supporting needles and the second supporting needles are used for supporting the substrate. The substrate comprises a plurality of sub-substrates with the same structure. And a region between the first support pin and the second support pin for positioning the plurality of sub-substrates in the substrate within the region.

Description

Support frame, vacuum drying device, drying system and substrate drying method
Technical Field
The application relates to the technical field of display, in particular to a support frame, a vacuum drying device, a drying system and a substrate drying method.
Background
In the manufacturing process of the display panel, a photolithography process is generally used to form a desired pattern. The photoetching process is to coat photoresist on the substrate deposited with the film, the photoresist is subjected to the process steps of drying, exposure, development, baking and the like to form an etching-resistant pattern, and the film on the substrate is formed into a required pattern after the processes of etching, photoresist stripping and the like.
Disclosure of Invention
The embodiment of the application provides a support frame, a vacuum drying device, a drying system and a substrate drying method, which can reduce the occurrence probability of uneven brightness of a display panel caused by a support needle in the photoresist drying process.
In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions:
in a first aspect of embodiments of the present application, a support bracket is provided. The support frame includes: a supporting seat and a plurality of supporting rods. Each of the plurality of support rods extends along the first direction, and the plurality of support rods are arranged at intervals and in parallel along the second direction and are fixed on the support seat. The first direction and the second direction are perpendicular. The plurality of support bars includes a first support bar and two second support bars. The second bracing piece is located the outermost side of a plurality of bracing pieces, and first bracing piece equals with the interval of two second bracing pieces. A plurality of first supporting needles are arranged on the first supporting rods, and a plurality of second supporting needles are arranged on each second supporting rod. The height direction of the first support pins and the second support pins is the direction perpendicular to the surface of the support rod arranged on the support seat, and the first support pins and the second support pins are used for supporting the substrate. The substrate comprises a plurality of sub-substrates with the same structure. And a region between the first support pins on the first support bar and the second support pins on the second support bar for positioning the plurality of sub-substrates in the substrate within the region.
Optionally, a plurality of first fixing grooves are formed in the first support rod along the first direction, the number of the first fixing grooves in the first support rod is greater than that of the first support pins in the first support rod, and each of the plurality of first support pins is fixed in one of the first fixing grooves respectively.
Optionally, the plurality of first fixing grooves on the first supporting rod are distributed at equal intervals, and the interval between any two adjacent first fixing grooves is 0.5-2 cm.
Optionally, a first iron block is arranged in the first fixing groove, a first magnetic block is embedded at the bottom of the first supporting needle, which is close to the supporting seat, and the bottom of the first supporting needle is contacted with the surface of the first iron block, which is far away from the supporting seat.
Optionally, the first support rod is provided with a groove, and the groove extends along the first direction. A portion of the first support pin is positioned within the recess. And a fixing piece is correspondingly arranged at a position close to each first supporting needle and used for fixing the first supporting needle, so that the first supporting needles are perpendicular to the first supporting rods.
Optionally, the fixing member comprises a square clip. The square clamp comprises two block-shaped clamping blocks, semi-cylindrical openings are respectively arranged on the side surfaces of the two clamping blocks, which are close to each other, and the square clamp extends along the height direction of the first supporting needle and is used for accommodating the accommodating hole of the first supporting needle.
Optionally, a plurality of second fixing grooves are formed in the second supporting rod along the first direction, the number of the second fixing grooves in the second supporting rod is the same as that of the second supporting pins in the second supporting rod, and the positions of the second supporting pins and the second fixing grooves are in one-to-one correspondence. The second fixed slot is internally provided with a second iron block, the bottom of the second supporting needle, which is close to the supporting seat, is embedded with a second magnetic block, and the bottom of the second supporting needle is contacted with the surface of the second iron block, which is far away from the supporting seat.
Optionally, the plurality of support bars further includes a plurality of third support bars, and the plurality of third support bars are located respectively in first bracing piece both sides. The third supporting rod is provided with two second supporting needles, at least one first supporting needle and a plurality of third supporting needles. Two second supporting needles on the third supporting rod are positioned at two ends of the third supporting rod. A first supporting needle on the third supporting rod is positioned at the middle position of the third supporting rod. The surface of the supporting rod is arranged opposite to the supporting seat, and the height of one end of the third supporting needle far away from the surface is lower than that of one end of the first supporting needle and the second supporting needle far away from the plane.
Optionally, a plurality of third fixing grooves are formed in the third supporting rod along the first direction, and each first supporting needle, each second supporting needle and each third supporting needle are located in one third fixing groove. The third supporting needle comprises a screw rod, and threads matched with the screw rod are arranged on the inner wall of the third fixing groove corresponding to the third supporting needle.
A second aspect of the embodiments of the present application provides a vacuum drying apparatus. The vacuum drying device comprises a first chamber, wherein a supporting frame for supporting a substrate is arranged in the first chamber. The support frame is the support frame that the first aspect of this application embodiment provided. The first chamber is communicated with an evacuation tube and an air inlet tube.
A third aspect of embodiments of the present application provides a drying system. The drying system comprises a vacuum drying device and a heating drying device. The vacuum drying device is provided in the second aspect of the embodiments of the present application.
Optionally, the heating and drying device comprises a second chamber, wherein a heating plate, a plurality of fourth supporting needles and a plurality of fifth supporting needles penetrating through the heating plate are arranged in the second chamber. The fourth support pins and the fifth support pins are used for supporting the substrate. The plurality of fourth support pins are aligned in the first direction. The plurality of fifth supporting needles are arranged in a plurality of rows, the plurality of rows of fifth supporting needles are distributed along the second direction, part of rows and other part of rows in the plurality of rows of fifth supporting needles are arranged on two sides of one row of fourth supporting needles, and the height of one end of the fifth supporting needles far away from the heating plate is 3-4mm higher than the height of one end of the fourth supporting needles far away from the heating plate. The heating and drying device further comprises a fixing device, wherein the fixing device is positioned below the heating plate and used for fixing the fourth supporting needle and the fifth supporting needle, and the fixing device is not in contact with the heating plate.
Optionally, the heating and drying device further comprises a lifting device, and the lifting device is used for driving the fixing device to lift.
A fourth aspect of embodiments of the present application provides a substrate drying method. The method adopts the drying system provided in the third aspect of the embodiment of the application to dry the substrate. The drying method comprises the following steps: and placing the substrate on a support frame of a first chamber in a vacuum drying device, and drying the substrate at a low pressure. The substrate is transferred from the first chamber to the second chamber and placed on a fifth support pin for a certain period of time. Wherein the height of the end of the fifth supporting needle far away from the heating plate is 65-70 mm from the heating plate. The fifth supporting needle and the fourth supporting needle are synchronously lowered until the height of the end, far away from the heating plate, of the fifth supporting needle from the heating plate is 4-6 mm, and the substrate is preheated for 50-80 seconds. The fifth supporting needle and the fourth supporting needle are synchronously lowered until the substrate is placed on the heating plate and kept for 80-110 s, and the substrate is heated and dried.
The support frame that this application provided, the region between a plurality of first supporting needles on the first bracing piece and a plurality of second supporting needles on the second bracing piece for a plurality of child substrates in the messenger base plate are located this region, and the first supporting needle that is used for supporting the base plate and the region outside the child substrate that the second supporting needle all is located on the base plate, so, in the drying process, first supporting needle and second supporting needle can not lead to the fact the influence to the photoresist on the child substrate, thereby can reduce the emergence probability because of the display panel that the supporting needle leads to shows the uneven phenomenon of luminance.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1a is a schematic diagram of a substrate in the related art;
FIG. 1b is a schematic diagram of uneven brightness of a display panel caused by supporting pins in the related art;
fig. 2 is a schematic diagram of a vacuum drying apparatus according to an embodiment of the present application;
fig. 3a is a schematic view of a support frame according to an embodiment of the present disclosure;
fig. 3b is a schematic diagram of a corresponding relationship between a support frame and a substrate according to an embodiment of the present disclosure;
FIG. 3c is a schematic view of a supporting needle on a supporting rack according to an embodiment of the present disclosure;
fig. 4a is a schematic view of a first support rod according to an embodiment of the present disclosure;
FIG. 4b is a cross-sectional view of A-A' of FIG. 4 a;
FIG. 4c is a schematic view of a supporting frame in the related art;
FIG. 4d is a schematic view of another first support bar according to an embodiment of the present disclosure;
FIG. 5a is a schematic view of a first support rod according to another embodiment of the present disclosure;
FIG. 5b is a schematic view of another first support bar according to another embodiment of the present disclosure;
FIG. 5c is a front view of the first support bar of FIG. 5 b;
FIG. 5d is a schematic view of yet another first support bar according to another embodiment of the present disclosure;
FIG. 5e is a cross-sectional view of B-B' of FIG. 5 d;
fig. 6a is a schematic view of a second support rod according to an embodiment of the present disclosure;
FIG. 6b is a cross-sectional view of C-C' of FIG. 6 a;
fig. 7a is a schematic view of a third support rod according to an embodiment of the present disclosure;
FIG. 7b is a cross-sectional view of D-D' of FIG. 7 a;
fig. 8a is a schematic diagram of a heating and drying device according to an embodiment of the present disclosure;
FIG. 8b is a schematic diagram of a heating plate according to an embodiment of the present application;
fig. 8c is a schematic diagram showing an improvement effect of the heating and drying device on the mura of the display panel according to the embodiment of the present application;
fig. 9 is a flowchart of a substrate drying method according to an embodiment of the present application;
fig. 10 is a schematic diagram of a process for drying a substrate by heating according to an embodiment of the present application.
Reference numerals:
100-a substrate; 101-a sub-substrate; 01-a first chamber; 2-vacuumizing the tube; 3-an air inlet pipe; 4-supporting frames; 5-a driving device; 40-supporting rods; 41-a supporting seat; 410-a first support bar; 411-a first support needle; 420-a second support bar; 421-second support needle; 430-a third support bar; 431-a third support needle; 4311-screw; 4301-threads; 412-a first fixing groove; 4111-first magnetic block; 4121-a first iron mass; 4122-ejection holes; 413-grooves; 414-a fixing member; 4141-clamping blocks; 4142-first screw; 4131-bar iron; 4143-a fixed block; 4144-second screw; 422-a second fixing groove; 4211-a second magnetic block; 4221-a second iron block; 432-a third fixing groove; 02-a second chamber; 6-heating plate; 7-fixing means; 8-lifting device; 641-fourth support pins; 651-fifth support pin; 661-sixth support needles.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Hereinafter, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
Furthermore, in this application, directional terms "upper", "lower", etc. may be defined as including, but not limited to, the orientation in which the components are schematically disposed with respect to one another, and it should be understood that these directional terms may be relative terms, which are used for descriptive and clarity with respect to one another, and which may be correspondingly altered with respect to the orientation in which the components are illustrated in the drawings.
In the present application, unless explicitly specified and limited otherwise, the term "coupled" is to be construed broadly, and for example, "coupled" may be either fixedly coupled, detachably coupled, or integrally formed; can be directly connected or indirectly connected through an intermediate medium.
In the process of manufacturing a display panel, in order to reduce the production cost and improve the production efficiency, as shown in fig. 1a, a plurality of sub-substrates 101 having the same structure and being spaced apart from each other are generally manufactured on a single large substrate 100 at the same time, and are cut to form a plurality of display substrates. It will be appreciated that each sub-substrate 101 has a display area. Each sub-substrate 101 includes a plurality of functional structures, such as a switching transistor, a pixel electrode, a common electrode, and the like in a liquid crystal display panel (thin film transistor liquid crystal display, TFT-LCD). Or in turn, for example, switching transistors, driving transistors, pixel defining layers (pixel definition layer, PDL), planarization Layers (PLN), light emitting devices, etc. in an organic light emitting diode display panel (organic light emitting diode, OLED).
The functional structures described above, for example, the gate electrode, the active pattern, the source electrode, the drain electrode, the pixel electrode, the common electrode, the pixel defining layer, the planarizing layer, and the like constituting the switching transistor and/or the driving transistor are generally formed by using a photolithography process. The photoetching process comprises the following steps: firstly, a corresponding film layer is deposited on a substrate 100, then, an etching-resistant pattern which is the same as a required functional pattern is formed through the process steps of photoresist coating, exposure, development, baking and the like, and then, the film on the substrate 100 is formed into the required functional pattern through the processes of etching, photoresist stripping and the like. After the photoresist is coated, the photoresist is required to be dried, the solvent in the photoresist is removed, the adhesive force between the photoresist and the substrate is enhanced, and preparation is made for subsequent exposure and development.
Since the photoresist is coated on the substrate 100 with high fluidity, it is generally first dried under a low pressure in a vacuum environment to remove most of the solvent. Then, the substrate 100 is heated and dried in the heating chamber, so as to further remove the photoresist solvent and enhance the adhesion of the photoresist to the substrate 100.
In the process of low-pressure drying and heat drying, a supporting pin (pin) is generally used to support the substrate 100, and the stress and the heating degree of the part, which is in contact with the supporting pin, on the substrate 100 and other parts, which are not in contact with the supporting pin, are inconsistent, so that the thickness of the photoresist at the corresponding position of the supporting pin is inconsistent with that of the photoresist at other positions, and after processes such as etching, the thickness of the film at the corresponding position is uneven. In this way, the produced display panel is likely to have uneven brightness (mura) at the corresponding position, and the display panel is likely to have a stain-like darkening defect as shown in fig. 1 b. Particularly, under the superposition influence of low-pressure drying and heating drying, the mura phenomenon is more obvious, and the yield of the product is lost.
Based on this, some embodiments of the present application provide a drying system capable of reducing the occurrence probability of the uneven brightness phenomenon of the display panel caused by the supporting pins during the photoresist drying process. Some embodiments of the present application provide a drying system including a vacuum drying device and a heat drying device for performing low-pressure drying and heat drying processes, respectively, on a substrate coated with photoresist.
As shown in fig. 2, in some embodiments of the present application, the vacuum drying apparatus includes a first chamber 01, and the first chamber 01 communicates with a vacuum pipe 2 and an air intake pipe 3. The evacuation tube 2 is used to evacuate the first chamber 01, so that the photoresist-coated substrate 100 is in a low-pressure environment, thereby facilitating the volatilization of the solvent in the photoresist. The air inlet pipe 3 is used for inflating the first chamber 01 after the low-pressure drying is completed, so that the pressure in the first chamber 01 is restored to the atmospheric pressure state, and the substrate 100 is conveniently transferred out of the first chamber 01.
The number of the evacuation tubes 2 and the air inlet tubes 3 and the communication position of the first chamber 01 are not particularly limited, so long as the photoresist on the substrate 100 can be uniformly dried and the first chamber 01 can be restored to the atmospheric pressure state without affecting the substrate 100. The above vacuum pumpingThe tube 2 may be connected to a suction pump, such as a dry pump (dry pump) or the like, for suction. The inlet pipe 3 may be connected to a gas source such as dry air (CDA) or nitrogen (N) 2 ) Etc. for supplying gas to the first chamber 01.
In addition, a support frame 4 is disposed in the first chamber 01, and the support frame 4 is used for supporting the substrate 100 during the drying process of the substrate 100.
In some embodiments, as shown in fig. 2, the support frame 4 is further connected with a driving device 5, which may be a motor or an air cylinder, for example. The driving device 5 is located below the supporting frame 4 and can drive the supporting frame 4 to ascend and descend in the vertical direction.
The support frame 4, as shown in fig. 2, includes: a plurality of support bars 40 and a support base 41. The plurality of support bars 40 are fixed to the support base 41.
As shown in fig. 3a, each of the plurality of support rods 40 extends in a first direction (e.g., the X direction in fig. 3 a), and the plurality of support rods 40 are spaced apart and arranged in parallel in a second direction (e.g., the Y direction in fig. 3 a), wherein the first direction and the second direction are perpendicular.
As shown in fig. 3a, the plurality of support bars 40 includes a first support bar 410 and two second support bars 420. Wherein the two second support bars 420 are respectively located at the outermost sides of the plurality of support bars 40. The first support bar 410 is spaced apart from the two second support bars 420 at equal intervals, i.e., the first support bar 410 is positioned at a middle position of the plurality of support bars 40.
As shown in fig. 3a, the first support bar 410 is provided with a plurality of first support pins 411, and each second support bar 420 is provided with a plurality of second support pins 421.
As shown in fig. 2, the height direction of the plurality of first supporting pins 411 and the plurality of second supporting pins 421 is a direction perpendicular to the surface of the supporting base 41 where the supporting rod 40 is disposed. It will be appreciated that the ends of the first support needle 411 and the second support needle 421, which are remote from the support base 41, are each located on the same plane parallel to the surface of the support base 41 on which the support bar 40 is provided, i.e., the first support needle 411 and the second support needle 421 have the same height. The plurality of first support pins 411 and the plurality of second support pins 421 serve to support the substrate 100.
As shown in fig. 3b, the substrate 100 includes a plurality of sub-substrates 101 having the same structure, and after forming a desired functional pattern, a desired size of a display substrate, which can be used for manufacturing a display panel, is obtained by cutting along the area between the sub-substrates 101.
As shown in fig. 3b, the area between the plurality of first supporting pins 411 on the first supporting bar 410 and the plurality of second supporting pins 421 on the second supporting bar 420 is used to locate the plurality of sub-substrates 101 in the substrate 100 in the area. In some embodiments, the first supporting pins 411 are located in the area between the sub-substrates 101, and the second supporting pins 421 are located outside the area where all the sub-substrates 101 are located. That is, the first support pins 411 and the second support pins 421 for supporting the substrate 100 each correspond to an area other than the submount 101.
The support frame 4 provided by the application is used for supporting the substrate 100, and the first support needle 411 and the second support needle 421 are both positioned in the area outside the child substrate 101 on the substrate 100, so that in the drying process, the first support needle 411 and the second support needle 421 cannot influence the photoresist on the child substrate 101, thereby reducing the occurrence probability of uneven display brightness of the display panel caused by the support needles.
On this basis, as shown in fig. 3c, the ends of the first and second support pins 411 and 421 near the substrate 100 may be tapered, so that the contact area with the substrate 100 may be reduced, thereby reducing the influence of the support on the substrate 100.
Alternatively, the material of the first supporting needle 411 and the second supporting needle 421 may be polyetheretherketone (poly ether ether ketone, PEEK), which has high mechanical strength and is not easy to scratch the substrate.
The specific structure of the first support bar 410 in this application will be described in detail below.
Example one
In some embodiments of the present application, as shown in fig. 4a, a plurality of first fixing slots 412 are disposed on the first support rod 410 along the first direction, and the number of the first fixing slots 412 is greater than the number of the first support pins 411 on the first support rod 410, and each of the plurality of first support pins 411 is fixed in one first fixing slot 412.
As shown in fig. 4c, each first supporting pin 411 is located in one first fixing slot 412 in a one-to-one correspondence, and the setting position of the first supporting pin 411 on the first supporting rod 410 is fixed, so that the first supporting pin cannot be flexibly adjusted according to the size of the sub-substrate 101 on the substrate 100. When the size of the sub-substrate 101 is changed, a part of the first supporting pins 411 may be located within the range of the sub-substrate 101, thereby causing mura defect of the product.
A plurality of first fixing grooves 412 are arranged on the first support rod 410 at intervals, and the number of the first fixing grooves 412 is greater than the number of the first support pins 411. In this way, the position of the first supporting pin 411 on the first supporting rod 410 can be adjusted to other first fixing slots 412 according to the requirement, so that the position of the first supporting pin 411 on the first supporting rod 410 can be adjusted according to the size of the sub-substrate 101 on the substrate 100, and the position of the first supporting pin 411 can avoid the region where the sub-substrate 101 is located, thereby avoiding mura phenomenon of the display panel due to the influence of the first supporting pin 411.
Based on this, in some embodiments of the present application, the plurality of first fixing grooves 412 on the first support rod 410 are arranged at equal intervals, and the interval between any two adjacent first fixing grooves 412 is 0.5-2 cm. For example, the first fixing groove 412 may have a pitch of 0.7 to 1.6cm. For example, the first fixing grooves 412 may have a pitch of 0.5cm,1cm,1.5cm,2cm.
In this way, more first fixing slots 412 can be provided on the first support rod 410, so that the first support pins 411 can be more in adjustable positions on the first support rod 410, thereby meeting more product design requirements and having higher flexibility.
In some embodiments of the present application, the first support rod 410 is made of an aluminum alloy material.
In some embodiments of the present application, as shown in fig. 4b (a cross-sectional view of A-A' in fig. 4 a), a first iron block 4121 is disposed in a first fixing groove 412 on the first support bar 410.
On this basis, as shown in fig. 4b, a first magnetic block 4111 is embedded in the bottom of the first supporting needle 411 near the supporting seat 41. The bottom of the first supporting pin 411 is in contact with the surface of the first iron block 4121 remote from the supporting seat 41. In this way, the first supporting needle 411 is fixed to the first supporting rod 410 by magnetic attraction, so that the position of the first supporting needle 411 can be easily changed.
In some embodiments of the present application, as shown in fig. 4b, an ejection hole 4122 is further provided near the support seat 41 in the first fixing groove, so as to facilitate the removal of the first iron block 4121 from the first fixing groove 412 by ejection.
The first iron block 4121 is disposed in the first fixing groove 412, and the first magnetic block 4111 is disposed at the bottom of the first supporting pin 411. In other embodiments, a magnetic block may be disposed in the first fixing slot 412, and an iron block may be disposed at the bottom of the first supporting pin 411. The present application is not limited thereto as long as the first supporting needle 411 can be stably fixed to the first supporting rod 410 and can be conveniently moved.
For example, as shown in fig. 4d, the first support bar 410 includes 5 first support pins 411 thereon, and the first support pins 411 are disposed on the first support bar 410 as shown in fig. 4 d. One first supporting pin 411 is located at an intermediate position in the length direction of the first supporting rod 410, two first supporting pins 411 are located at positions 7mm from both end surfaces of the first supporting rod 410, respectively, and the other two first supporting pins 411 are located at positions 543mm from both end surfaces of the first supporting rod 410, respectively. Corresponding to some sizes of the sub-substrates 101, the first support pins 411 are located at regions between the sub-substrates 101 on the substrate 100, and the positions of the first support pins 411 on the first support bars 410 can be adjusted. Thus, the first supporting pin 411 can be prevented from causing mura to the display panel.
Example two
In other embodiments of the present application, as shown in fig. 5a, the first support rod 410 is provided with a groove 413, and the groove 413 extends along the first direction.
A portion of the first support pin 411 is located within the groove 413. Further, as shown in fig. 5b, a fixing member 414 is correspondingly disposed on the first support rod 410 at a position close to each first support needle 411, for fixing the first support needle 411 such that the first support needle 411 is perpendicular to the first support rod 410. The first support pins 411 are prevented from being displaced due to stress during low pressure drying of the substrate 100.
In some embodiments of the present application, as shown in fig. 5b (a top view of the first support rod 410) and fig. 5c (a front view of the first support rod 410), the fixing member 414 includes a square clip, the square clip includes two block-shaped clamping blocks 4141, and two sides of the two clamping blocks 4141, which are close to each other, are respectively provided with a semi-cylindrical opening, so as to form a receiving hole extending along the height direction of the first support needle 411 for receiving the first support needle 411.
The two clamping blocks 4141 may be independent of each other or may be connected to each other. When the two clamping blocks 4141 are in a connected structure, the two clamping blocks 4141 can be opened and closed, so that the first supporting needle 411 can be placed in the two clamping blocks when the two clamping blocks are opened, and the first supporting needle 411 can be placed in the accommodating hole when the two clamping blocks are closed, namely the first supporting needle 411 is wrapped in the accommodating hole, so that the supporting effect on the first supporting needle 411 is achieved.
When the two clamping blocks 4141 may be independent structures, for example, screw holes are further formed in the two clamping blocks 4141, respectively, and the first screw 4142 passes through the screw holes to connect the two clamping blocks 4141, so that the first supporting needle 411 is placed in the accommodating hole therein. Of course, the fixing method is not limited to the screw hole and the screw, but may be other fixing methods, and is not limited herein.
Optionally, as shown in fig. 5b, a bar-shaped iron block 4131 extending in the first direction is also provided in the groove 413. The bottom of the first supporting needle 411 is embedded with a first magnetic block 4111, and the first supporting needle 411 is magnetically attracted on the strip-shaped iron block 4131, so that the stability of the first supporting needle 411 can be further enhanced.
In other embodiments of the present application, as shown in fig. 5d and 5e (the cross-sectional view of B-B' in fig. 5 d), the cross-sectional shape of the groove 413 along the second direction may be inverted "T" shape, and a portion of the first supporting pin 411 is located in the groove 413. The fixing member 414 includes two fixing blocks 4143 disposed in the groove 413 and located at both sides of the first supporting needle 411 in the first direction. The length of the fixing block 4143 in the second direction is greater than the length of the groove 413 in the second direction on the surface of the first support rod 410 where the first support needle 411 is disposed. The two fixing blocks 4143 are further provided with screw holes extending in a direction perpendicular to the surface of the first support rod 410 where the first support pins 411 are provided, respectively, the screw holes penetrate the fixing blocks 4143, and the positions of the screw holes correspond to the positions of the grooves 413 on the surface of the first support rod 410 where the first support pins 411 are provided. The fixing member 414 further includes a second screw 4144, the second screw 4144 passes through a screw hole of each fixing block 4143, as shown in fig. 5e, one end of the second screw 4144 is abutted against the bottom of the groove 413, and one end surface of the fixing block 4143 is abutted against the inner top surface of the "T" -shaped groove, so that the fixing blocks 4143 and the second screw 4144 are fixed in the groove, thereby fixing the first supporting pin 411 in a position between the two fixing blocks 4143 in the groove 413.
Alternatively, two fixing blocks 4143 may be provided with semi-cylindrical openings on the side surface of the first supporting needle 411, which extends along the height direction of the first supporting needle 411, and are used for accommodating the accommodating hole of the first supporting needle 411, so that the first supporting needle 411 is wrapped in the accommodating hole, and the first supporting needle 411 is more stable.
The first support rod 410 provided in this embodiment is provided with the groove 413 along the length direction of the first support rod 410, the first support needle 411 is disposed in the groove 413, and the first support needle 411 can move along the groove 413, so that the first support needle 411 can be disposed at any position on the first support rod 410, and the position of the first support needle 411 on the first support rod 410 can be adjusted at will according to the size of the sub-substrate 101 on the substrate 100, so that the flexibility is high.
In some embodiments of the present application, as shown in fig. 6a, a plurality of second fixing grooves 422 are disposed on the second support bar 420 along the first direction, and the number of the second fixing grooves 422 on the second support bar 420 is the same as the number of the second support pins 421 on the second support bar 420, and the positions of the second support pins 421 and the second fixing grooves 422 are in one-to-one correspondence.
As shown in fig. 6b (the cross-sectional view of C-C' in fig. 6 a), a second iron block 4221 is disposed in a second fixing groove 422 on the second support rod 420, and a second magnetic block 4211 is embedded in the bottom of the second support needle 421 near the support seat 41. The bottom of the second supporting needle 421 is in contact with the surface of the second iron piece 4221 remote from the supporting seat 41. The second supporting needle 421 is fixed in the second fixing groove 422 by means of magnetic attraction. In this way, the height of the second supporting needle 421 can be easily adjusted, for example, the height of the second supporting needle 421 can be adjusted by adjusting the height of the second iron 4221 or the like as needed.
In addition, as in the first support bar 410, as shown in fig. 6b, an ejection hole 4122 is also provided at a side of the second support bar 420 remote from the second iron piece 4221 to facilitate removal of the second iron piece 4221 from the hole by ejection.
It should be noted that a magnetic block may be disposed in the second fixing slot 422, and an iron block may be disposed at the bottom of the second supporting needle 421. The present application is not limited thereto, as long as the second supporting needle 421 can be stably fixed to the second supporting rod 420.
In addition, in some embodiments of the present application, as shown in fig. 3a, the plurality of support bars 40 further includes a plurality of third support bars 430, and the plurality of third support bars 430 are disposed at both sides of the first support bar 410. That is, the plurality of third support bars 430 are respectively located between the first support bar 410 and the second support bar 420.
Two second supporting pins 421 are provided on each third supporting bar 430, and the two second supporting pins 421 are located at both ends of the third supporting bar 430. The second supporting pins 421 on the third supporting bar 430 are also located outside the area of all the sub-substrates 101 on the substrate 100.
At least one first supporting needle 411 is provided on each third supporting rod 430, and the first supporting needle 411 is located at a middle position of the third supporting rod 430.
The third support bar 430 is further provided with a plurality of third support pins 431. The surface of the support rod 40 is disposed opposite to the support seat 41, and the height of the end of the third support needle 431 away from the surface is lower than the height of the ends of the first support needle 411 and the second support needle 421 away from the plane. Therefore, the support pins on the support frame 4 that mainly support the substrate 100 are the first support pin 411 and the second support pin 421, and the third support pin 431 is a non-mainly stressed support pin.
In some embodiments of the present application, as shown in fig. 7a, a plurality of third fixing grooves 432 are disposed on the third support bar 430 at intervals along the first direction, and each of the first support pins 411, each of the second support pins 421, and each of the third support pins 431 on the third support bar 430 is located in one of the third fixing grooves 432.
The fixing manner of the first supporting needle 411 and the second supporting needle 421 in the third fixing groove 432 is the same as the fixing manner of the first supporting needle 410 and the second supporting needle 421 in the first supporting rod 420, and will not be described herein.
As shown in fig. 7b (the cross-sectional view of D-D' in fig. 7 a), the third supporting pin 431 includes a screw 4311, a thread 4301 matching the screw is provided on an inner wall of a third fixing groove 432 corresponding to the third supporting pin 431 on the third supporting pin 430, and the third supporting pin 431 is fixed to the third supporting pin 430 through a screw connection. The third supporting needle 431 is fixed in a threaded connection mode, so that the third supporting needle 431 is more stable in fixation, convenient to detach and convenient to replace.
Further, as shown in fig. 7b, the top of the third supporting needle 431 is disk-shaped. The third supporting needle 431 is lower than the first supporting needle 411 and the second supporting needle 421 in height, and is a non-main stressed supporting needle, one end of the third supporting needle 431 close to the substrate 100 is arranged in a disc shape, when the third supporting needle 431 contacts with the substrate 100, the contact area between the third supporting needle 431 and the substrate 100 can be increased, and the pressure of the third supporting needle 431 acting on the substrate 100 can be reduced, so that the probability of mura failure of the display panel caused by the third supporting needle 431 is reduced.
The heating and drying apparatus of the drying system provided in the present application will be described in detail below.
As shown in fig. 8a, some embodiments of the present application provide a heating and drying apparatus including a second chamber 02, and a heating plate 6 is disposed in the second chamber 02. In some embodiments of the present application, the heating plate 6 is provided with a heating wire therein, which is used for heating the substrate 100 coated with the photoresist, so that the solvent in the photoresist on the substrate 100 volatilizes rapidly in the heated environment, and the adhesion between the photoresist and the substrate 100 is enhanced.
The second chamber 02 is further provided with a plurality of fourth support pins 641 and a plurality of fifth support pins 651. A plurality of fourth support pins 641 and a plurality of fifth support pins 651 pass through the heating plate 6 for supporting the substrate 100.
As shown in fig. 8b (top view of the heating plate in fig. 8 a), a plurality of fourth support pins 641 are aligned in a first direction (e.g., X-direction in fig. 8 b). The plurality of fifth support pins 651 are arranged in a plurality of rows in the second direction (e.g., Y direction in fig. 8 b), the fifth support pins 651 in each row of fifth support pins 651 are arranged in the first direction, and a portion of the rows of fifth support pins 651 are disposed on both sides of a row of fourth support pins 641 with the remaining portion of the rows.
It should be noted that, the dashed lines in fig. 8b are only for illustrating that the plurality of supporting pins are located in the same row, and these dashed lines are not present in practice.
In some embodiments of the present application, the corresponding positions of the rows of fifth supporting pins 651 on the substrate 100 may be the same as the corresponding positions of the supporting pins on the second supporting pins 420 and the third supporting pins 430 on the substrate 100 in the vacuum drying apparatus, respectively.
Further, as shown in fig. 8a, the fifth support needle 651 has a higher height away from the end of the heating plate 6 than the fourth support needle 641 has at the end away from the heating plate 6.
In some embodiments of the present application, the height of the end of the fifth support needle 651 away from the heating plate 6 is 3-4mm higher than the height of the end of the fourth support needle 641 away from the heating plate 6. By way of example, the height of the end of the fifth support needle 651 away from the heating plate 6 is 3mm,3.5mm,4mm higher than the height of the end of the fourth support needle 641 away from the heating plate 6.
In this way, in the heating and drying process, the effect of the fourth supporting needle 641 on the substrate 100 is weakened, so that the influence on the substrate 100 is small, the serious mura phenomenon of the intermediate sub-substrate 101 on the substrate 100 due to the superposition of low-pressure drying and heating and drying is avoided, and the occurrence probability of mura is reduced.
In some embodiments of the present application, as shown in fig. 8a, the above-mentioned heating and drying device further comprises a fixing device 7, the fixing device 7 being located below the heating plate 6 for fixing the fourth 641 and fifth 651 support pins, the fixing device 7 not being in contact with the heating plate 6.
In addition, the heating and drying device further comprises a lifting device 8, and the lifting device 8 is connected with the fixing device 7 and is used for driving the fixing device 7 to lift. The lifting device 8 may be a motor, for example.
Fig. 8c is a mura incidence curve of the prepared display panel, in which the substrate 100 coated with photoresist is heated and dried by the above-mentioned heating and drying device provided in the embodiment of the present application from different functional pattern layers in the process of manufacturing the OLED display panel. When the heat drying is performed using the heat drying apparatus provided by some related art, the mura defect occurrence rate of the display panel is 1%. As shown in fig. 8c, with the above-mentioned heat drying apparatus provided in the embodiment of the present application, the mura defect occurrence rate of the display panel is effectively reduced, and the earlier the mura defect occurrence rate is reduced. When the heat drying device provided in the present application is used for each film layer from the active layer (active) layer and thereafter, the mura defect occurrence rate is only 0.21%.
Some embodiments of the present application also provide a substrate drying method for drying a photoresist-coated substrate 100 using the drying system provided in the above embodiments. The substrate drying method includes S101 to S105 as shown in fig. 9.
S101, placing the substrate 100 on the support frame 4 of the first chamber 01 in the vacuum drying apparatus, and vacuum-pumping the first chamber 01 by using the vacuum-pumping tube 2, and drying the substrate 100 at a low pressure.
As can be seen from the above description of the vacuum drying apparatus, the first chamber 01 is communicated with the evacuation tube 2, and the evacuation tube 2 can evacuate the first chamber 01, so that the substrate 100 is in a low-pressure environment, which is beneficial to volatilizing the solvent in the photoresist.
The first chamber 01 includes a support frame 4, and the support frame 4 includes a plurality of support rods 40, wherein a first support pin 411 and a second support pin 421 of the plurality of support rods play a main supporting role on the substrate 100. And the first supporting pins 411 are located at the region between the plurality of sub-substrates 101 on the substrate 100, and the second supporting pins 421 are located outside the region where all sub-substrates 101 are located. Thus, the occurrence of mura caused by supporting the needle during low-pressure drying can be reduced.
S102, the first chamber 01 is inflated by the intake pipe 3, and the air pressure in the first chamber 01 is returned to the atmospheric pressure.
The air inlet pipe 3 may be connected with a gas source, such as dry air (CDA) or nitrogen (N) 2 ) After the low-pressure drying is completed, CDA or N is charged into the first chamber 01 through the air inlet pipe 3 2 Returning the first chamber 01 to the atmospheric pressure state facilitates the transfer of the substrate 100 from the first chamber 01.
S103, as shown in fig. 10 (a), the fixing device 7 in the heating and drying apparatus is adjusted so that the height of the fifth support pin 651 from the heating plate 6 to the heating plate 6 is 65 to 70mm at the end distant from the heating plate 6, and the substrate 100 is transferred from the first chamber 01 to the second chamber 02, placed on the fifth support pin 651, and held for 3S.
When the low pressure drying is completed, the first chamber 01 is restored to an atmospheric pressure state, and the substrate 100 is transferred from the first chamber 01 to the second chamber 02 using, for example, a robot or the like, and placed on the fifth support pins 651 in the second chamber 02.
In order to facilitate the picking and placing of the substrate 100, the heater plate 6 is prevented from interfering with the picking and placing operation, and the end of the fifth supporting needle 651 for supporting the substrate 100 in this step, which is far away from the heater plate 6, needs to be higher than the heater plate 6 by a certain height. For example, the heights 65, 68, 70mm of the fifth support pins 651 higher than the heating plate 6 can be adjusted according to the state of the robot picking and placing the substrate 100. Wherein the height of the end of the fifth support needle 651 away from the heating plate 6 is 3-4mm higher than the height of the end of the fourth support needle 641 away from the heating plate 6.
When the substrate 100 is transferred from the first chamber 01 to the second chamber 02, it is in an unstable state, for example, jitter or the like may occur, and the height of the fixture 7 needs to be maintained for a period of time, for example, for about 3s, to stabilize the substrate 100.
S104, as shown in fig. 10 (b), the fixing device 7 is adjusted so that the fixing device 7 drives the fourth supporting needle 641 and the fifth supporting needle 651 to descend synchronously until the height of the end of the fifth supporting needle 651 away from the heating plate 6 is 4-6 mm, and the substrate 100 is preheated for 50-80S.
After the substrate 100 is transferred from the first chamber 01 to the second chamber 02, in order to prevent the substrate 100 from being damaged due to a sudden temperature increase of the substrate 100, it is necessary to place the substrate 100 at a distance from the heating plate 6 for preheating so that the substrate 100 is slowly heated.
In this step, the height of the end of the fifth support pin 651 away from the heating plate 6 is set to 4 to 6mm, for example, 4mm, 5mm, 6mm, for 50 to 80 seconds, and can be adjusted according to the process requirement. Further, as is apparent from the above, the height of the end of the fifth support needle 651 away from the heating plate 6 is 3-4mm higher than the height of the end of the fourth support needle 641 away from the heating plate 6, and thus the height of the end of the fourth support needle 641 away from the heating plate 6 in this step is 1-2 mm from the heating plate 6. Since the fourth support pins 641 at the middle position of the substrate 100 play a non-main supporting role on the substrate 100 in the preheating step, the influence on the substrate 100 is small, and the probability of mura generation at the corresponding positions on the substrate 100 is reduced.
S105, as shown in fig. 10 (c), the fixing device 7 is adjusted so that the fixing device 7 drives the fourth supporting needle 641 and the fifth supporting needle 651 to descend synchronously until the substrate 100 is completely placed on the heating plate 6, and the substrate 100 is heated and dried for 80 to 110 seconds.
At this time, the fifth support pins 651 no longer support the substrate 100, and are completely supported by the heating plate 6.
After the substrate 100 is preheated, the fixing device 7 is adjusted to enable the substrate 100 to be completely placed on the heating plate 6 and supported by the heating plate 6, so that the heating plate 6 can fully heat the substrate 100, the heating time is 80-110 s, for example, 80s, 85s, 90s, 95s, 100s and 110s, and the adjustment can be performed according to the drying condition of the photoresist on the substrate 100.
Further, in some embodiments of the present application, in order to prevent electrostatic adsorption between the substrate 100 and the heating plate 6, when the fixing device 7 drives the fourth support pin 641 and the fifth support pin 651 to rise after the completion of the heating and drying, the substrate 100 is broken due to electrostatic adsorption force, and as shown in (c) of fig. 10, the sixth support pin 661 is provided on the heating plate 6. The sixth supporting needle 661 is fixed on the heating plate 6, and the height of one end of the sixth supporting needle 661, which is far away from the heating plate 6, from the heating plate 6 is 0.3mm, and in the heating and drying process, the sixth supporting needle 661 supports the substrate 100, so that the substrate 100 is prevented from being directly attached to the heating plate 6, and the substrate 100 is prevented from being damaged due to electrostatic adsorption.
In the preheating process, the substrate 100 is sufficiently preheated and the temperatures of the respective regions on the substrate 100 are uniform, so that the sixth support pin 661 has a small influence on the substrate 100, and mura of the substrate 100 due to the sixth support pin 661 is not generated.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A support bracket, comprising:
a support base;
a plurality of support bars; each of the plurality of support rods extends along a first direction, and the plurality of support rods are arranged at intervals and in parallel along a second direction and are fixed on the support seat, and the first direction is perpendicular to the second direction; the plurality of support rods comprise a first support rod and two second support rods, the second support rods are positioned at the outermost sides of the plurality of support rods, and the distance between the first support rods and the two second support rods is equal; a plurality of first supporting pins are arranged on the first supporting rod, and a plurality of second supporting pins are arranged on each second supporting rod;
The height direction of the first support pins and the second support pins is a direction perpendicular to the surface of the support seat where the support rods are arranged, and the first support pins and the second support pins are used for supporting a substrate, wherein the substrate comprises a plurality of sub-substrates with the same structure; a region between the plurality of first support pins on the first support bar and the plurality of second support pins on the second support bar for positioning the plurality of sub-substrates in the substrate within the region;
a plurality of first fixing grooves are formed in the first supporting rod along the first direction at intervals, the number of the first fixing grooves in the first supporting rod is larger than that of the first supporting pins in the first supporting rod, and each of the first supporting pins is respectively fixed in one of the first fixing grooves; a first iron block is arranged in the first fixing groove, a first magnetic block is embedded at the bottom of the first supporting needle, which is close to the supporting seat, and the bottom of the first supporting needle is contacted with the surface of the first iron block, which is far away from the supporting seat; or alternatively, the first and second heat exchangers may be,
the first support rod is provided with a groove, and the groove extends along the first direction; a portion of the first support needle is positioned in the groove, and the first support needle can move along the groove; a fixing piece is correspondingly arranged at a position close to each first supporting needle and used for fixing the first supporting needle so that the first supporting needle is perpendicular to the first supporting rod; the fixing piece comprises a square clip; the square clamp comprises two block-shaped clamping blocks, semi-cylindrical openings are respectively formed in the side faces, close to each other, of the two clamping blocks, the two clamping blocks extend along the height direction of the first supporting needle, and the square clamp is used for accommodating holes of the first supporting needle.
2. The support frame according to claim 1, wherein, in the case that a plurality of first fixing grooves are arranged on the first support rod at intervals along the first direction, the plurality of first fixing grooves on the first support rod are arranged at equal intervals, and the interval between any two adjacent first fixing grooves is 0.5-2 cm.
3. The support frame according to claim 1, wherein a plurality of second fixing grooves are formed in the second support rod along the first direction at intervals, the number of the second fixing grooves in the second support rod is the same as the number of the second support pins in the second support rod, and the positions of the second support pins and the second fixing grooves are in one-to-one correspondence;
the second fixing groove is internally provided with a second iron block, the bottom of the second supporting needle, which is close to the supporting seat, is embedded with a second magnetic block, and the bottom of the second supporting needle is contacted with the surface of the second iron block, which is far away from the supporting seat.
4. A support according to any one of claims 1 to 3, wherein a plurality of the support bars further comprises a plurality of third support bars, the plurality of third support bars being disposed on either side of the first support bar;
The third supporting rod is provided with two second supporting pins, at least one first supporting pin and a plurality of third supporting pins; the two second supporting pins on the third supporting rod are positioned at two ends of the third supporting rod; one of the first support pins on the third support rod is positioned at the middle position of the third support rod; the surface of the supporting rod is arranged opposite to the supporting seat, and the height of one end of the third supporting needle far away from the surface is lower than that of one end of the first supporting needle and the second supporting needle far away from the surface.
5. The support frame of claim 4, wherein a plurality of third fixing grooves are formed in the third support bar at intervals along the first direction, and each of the first support pins, each of the second support pins, and each of the third support pins are respectively located in one of the third fixing grooves;
the third supporting needle comprises a screw rod, and threads matched with the screw rod are formed on the inner wall of the third fixing groove corresponding to the third supporting needle.
6. A vacuum drying apparatus, comprising: a first chamber, in which a support frame for supporting a substrate is provided, the support frame being a support frame according to any one of claims 1 to 5;
The first chamber is communicated with an evacuation tube and an air inlet tube.
7. A drying system, which is characterized by comprising a vacuum drying device and a heating drying device;
the vacuum drying apparatus according to claim 6.
8. The drying system of claim 7, wherein the heated drying means comprises a second chamber having a heating plate disposed therein, and a plurality of fourth support pins and a plurality of fifth support pins passing through the heating plate; a plurality of the fourth support pins and a plurality of the fifth support pins for supporting a substrate;
a plurality of the fourth support pins are aligned in a first direction; the plurality of fifth supporting needles are arranged in a plurality of rows, the plurality of rows of fifth supporting needles are distributed along the second direction, part of rows and the rest of rows in the plurality of rows of fifth supporting needles are arranged on two sides of one row of fourth supporting needles, and the height of the fifth supporting needles, which is far away from one end of the heating plate, is 3-4mm higher than the height of the fourth supporting needles, which is far away from one end of the heating plate;
the heating and drying device further comprises a fixing device which is positioned below the heating plate and used for fixing the fourth supporting needle and the fifth supporting needle, and the fixing device is not in contact with the heating plate.
9. The drying system of claim 8, wherein the heating and drying apparatus further comprises a lifting device for driving the fixing device to lift.
10. A substrate drying method, characterized in that the substrate is dried by using the drying system according to any one of claims 7 to 9, the substrate drying method comprising:
placing the substrate on a support frame of a first chamber in a vacuum drying device, and drying the substrate at low pressure;
transferring the substrate from the first chamber to a second chamber, placing the substrate on a fifth supporting needle, and keeping the substrate for a certain time; wherein the height of one end of the fifth supporting needle far away from the heating plate is 65-70 mm;
synchronously descending the fifth supporting needle and the fourth supporting needle until the height of the fifth supporting needle away from one end of the heating plate and away from the heating plate is 4-6 mm, keeping for 50-80 s, and preheating the substrate;
and synchronously descending the fifth supporting needle and the fourth supporting needle until the substrate is placed on the heating plate, keeping for 80-110 s, and heating and drying the substrate.
CN202010066591.8A 2020-01-20 2020-01-20 Support frame, vacuum drying device, drying system and substrate drying method Active CN111261573B (en)

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CN112366176A (en) * 2020-11-23 2021-02-12 中芯长电半导体（江阴）有限公司 Die pick-up device and method
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CN114454628A (en) * 2022-01-28 2022-05-10 Tcl华星光电技术有限公司 Vacuum drying device
CN114913772A (en) * 2022-04-22 2022-08-16 武汉华星光电半导体显示技术有限公司 Display module and mobile terminal

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