CN111186182A - 一种用于向多层陶瓷的空腔内印刷牺牲材料的方法 - Google Patents

一种用于向多层陶瓷的空腔内印刷牺牲材料的方法 Download PDF

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CN111186182A
CN111186182A CN201911372879.1A CN201911372879A CN111186182A CN 111186182 A CN111186182 A CN 111186182A CN 201911372879 A CN201911372879 A CN 201911372879A CN 111186182 A CN111186182 A CN 111186182A
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cavity
printing
polyester film
sacrificial
slurry
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陈江翠
胡乾
李学成
张晨
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Jiangsu Weizhe New Material Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/14—Printing or colouring
    • B32B38/145—Printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/162—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1808—Handling of layers or the laminate characterised by the laying up of the layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/26—Printing on other surfaces than ordinary paper
    • B41M1/30—Printing on other surfaces than ordinary paper on organic plastics, horn or similar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers

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  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

本发明提供了一种用于向多层陶瓷的空腔内印刷牺牲材料的方法，其能在印刷牺牲浆料时，其更接近空腔顶端，同时能够避免生瓷表面沾染浆料。其技术方案是这样的：在向空腔内印刷牺牲浆料前，先在生瓷表面粘附聚酯膜，聚酯膜上开设有与空腔的位置和形状相对应的开口，再将网板压覆在聚酯膜上进行印刷，印刷完成并烘干后，再撕去聚酯膜进行叠压操作。

Description

一种用于向多层陶瓷的空腔内印刷牺牲材料的方法
技术领域
本发明涉及多层陶瓷生产技术领域，具体为一种用于向多层陶瓷的空腔内印刷牺牲材料的方法。
背景技术
多层共烧陶瓷工艺包括落片、打孔、网印、叠压、切割、共烧等多个工序。已知在多层共烧陶瓷工艺中，制作内埋空腔时，一般采用在空腔中印刷牺牲浆料的方法，然后通过叠压、烧结步骤制成带空腔的陶瓷基板，这种方法可以避免空腔在叠压的过程中由于外部压力，导致空腔变形。
传统印刷牺牲材料的方式有丝网印刷等，但是在向空腔内印刷牺牲材料时，为了保证空腔在后期的叠压过程中变形较小，一般要求空腔1内填入的牺牲浆料2与空腔1表面大致平齐。在印刷填浆的过程中，如图1、图2、图3所示，由于牺牲浆料2的特性，其高度一般很难超过生瓷3表面，而且浆料还需经过烘干，以除去浆料中多余的溶剂，经过烘干后，浆料还会有一定收缩，使得牺牲材料不能有效地支撑叠压时对空腔的压力，导致空腔大小与需要的大小偏差较大，而且由于对准和印渗等因素，空腔周围的生瓷表面会沾染到一些浆料，可能会在叠压、烧结过程时，陶瓷之间产生缝隙影响连接的稳定性。
发明内容
针对使用传统印刷牺牲材料的方式，可能会使空腔大小偏差过大、连接不稳定的问题，本发明提供了一种用于向多层陶瓷的空腔内印刷牺牲材料的方法，其能在印刷牺牲浆料时，其更接近空腔顶端，同时能够避免生瓷表面沾染浆料。
其技术方案是这样的：一种用于向多层陶瓷的空腔内印刷牺牲材料的方法，其特征在于：在向空腔内印刷牺牲浆料前，先在生瓷表面粘附聚酯膜，聚酯膜上开设有与空腔的位置和形状相对应的开口，再将网板压覆在聚酯膜上进行印刷，印刷完成并烘干后，再撕去聚酯膜进行叠压操作。
其进一步特征在于：
所述聚酯膜厚度为0.05mm-0.1mm。
采用了这样的方式后，牺牲浆料在烘干后能够基本与空腔顶部平齐，同时在撕去聚酯膜时还能同时带走因对准或者印渗留在聚酯膜表面的浆料，去除了多余的浆料，避免在叠压、烧结时，陶瓷之间可能产生缝隙影响连接的稳定性。
附图说明
图1为传统方式印刷浆料时的操作图；
图2为传统方式印刷浆料烘干前浆料高度与空腔高度位置图；
图3为传统方式印刷浆料烘干后浆料高度与空腔高度位置图；
图4为采用本发明的方式印刷浆料时的操作图；
图5为采用本发明的方式印刷浆料时未撕去聚酯膜烘干前的浆料高度与空腔高度位置图；
图6为采用本发明的方式印刷浆料时未撕去聚酯膜烘干后的浆料高度与空腔高度位置图；
图7为采用本发明的方式印刷浆料时撕去聚酯膜烘干后的浆料高度与空腔高度位置图。
具体实施方式
如图4所示，一种用于向多层陶瓷的空腔内印刷牺牲材料的方法，在向空腔1内印刷牺牲浆料2前，先在生瓷3表面粘附0.05mm-0.1mm厚的聚酯膜4，聚酯膜4上开设有与空腔1的位置和形状相对应的开口，再将网板5压覆在聚酯膜4上利用刮板条6向空腔1内刮入浆料进行印刷，印刷完成并烘干后，再撕去聚酯膜4继续进行叠压操作。
如图5所示，印刷后，浆料高度增加，并且一部分浆料位于聚酯膜4的上表面，如图6所示，烘干后，浆料仍然可以位于空腔1内较高处，撕去聚酯膜4后，如图7所示，牺牲浆料在烘干后能够基本与空腔顶部平齐，并且空腔表面不会残余浆料。
以上，仅为本发明较佳的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉该技术的人在本发明所揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应该以权利要求的保护范围为准。

Claims (2)

1.一种用于向多层陶瓷的空腔内印刷牺牲材料的方法，其特征在于：在向空腔内印刷牺牲浆料前，先在生瓷表面粘附聚酯膜，聚酯膜上开设有与空腔的位置和形状相对应的开口，再将网板压覆在聚酯膜上进行印刷，印刷完成并烘干后，再撕去聚酯膜进行叠压操作。
2.根据权利要求1所述的一种用于向多层陶瓷的空腔内印刷牺牲材料的方法，其特征在于：所述聚酯膜厚度为0.05mm-0.1mm。
CN201911372879.1A 2019-12-27 2019-12-27 一种用于向多层陶瓷的空腔内印刷牺牲材料的方法 Withdrawn CN111186182A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112786519A (zh) * 2021-01-13 2021-05-11 中国兵器工业集团第二一四研究所苏州研发中心 一种生瓷叠片装置及方法
CN115366225A (zh) * 2021-05-21 2022-11-22 江苏惟哲新材料有限公司 一种多层陶瓷元件内埋深孔腔的制作方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112786519A (zh) * 2021-01-13 2021-05-11 中国兵器工业集团第二一四研究所苏州研发中心 一种生瓷叠片装置及方法
CN115366225A (zh) * 2021-05-21 2022-11-22 江苏惟哲新材料有限公司 一种多层陶瓷元件内埋深孔腔的制作方法
CN115366225B (zh) * 2021-05-21 2023-11-21 江苏惟哲新材料有限公司 一种多层陶瓷元件内埋深孔腔的制作方法

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