CN111162016A - Packaging method for temporary bonding reinforcement of lead frame - Google Patents

Packaging method for temporary bonding reinforcement of lead frame Download PDF

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Publication number
CN111162016A
CN111162016A CN201911373511.7A CN201911373511A CN111162016A CN 111162016 A CN111162016 A CN 111162016A CN 201911373511 A CN201911373511 A CN 201911373511A CN 111162016 A CN111162016 A CN 111162016A
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CN
China
Prior art keywords
lead frame
temporary bonding
bonding
glass
chip
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Pending
Application number
CN201911373511.7A
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Chinese (zh)
Inventor
陆惠芬
沙长青
徐赛
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Changjiang Elec Tech Suqian Co ltd
Original Assignee
Changjiang Elec Tech Suqian Co ltd
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Application filed by Changjiang Elec Tech Suqian Co ltd filed Critical Changjiang Elec Tech Suqian Co ltd
Priority to CN201911373511.7A priority Critical patent/CN111162016A/en
Publication of CN111162016A publication Critical patent/CN111162016A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H01L2224/83005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/85005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate being a temporary or sacrificial substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

The invention relates to a packaging method for temporary bonding reinforcement of a lead frame, which comprises the following steps: step one, a lead frame is taken, wherein the lead frame comprises a base island and a plurality of pins; step two, temporary bonding; step three, mounting the patch; step four, welding wires; step five, primary encapsulation; and sixthly, bonding is released. The invention utilizes the temporary bonding process to temporarily bond the lead frame on the glass in advance so as to improve the strength and stability of the lead frame, and removes the glass through bonding release after the package is finished subsequently, so that the strength of the base island and the pin can be temporarily improved, the shaking of the base island and the pin in the packaging operation is avoided, and the stability of the packaging operation is improved.

Description

Packaging method for temporary bonding reinforcement of lead frame
Technical Field
The invention relates to a packaging method for temporary bonding reinforcement of a lead frame, belonging to the technical field of semiconductor packaging.
Background
The lead frame used in semiconductor package is a main structural material in the package, and it mainly plays the role of carrying chip in the circuit, and at the same time plays the role of connecting the chip with the external circuit board for electric signal, and the mechanical role of mounting and fixing, etc.
Along with the promotion of the hierarchy and functions of electronic products, the electronic products tend to be multifunctional, high-speed, large-capacity, high-density and light. The semiconductor package is also developing towards miniaturization and high integration, more and more pins of a chip are required, so that the number of pins of a lead frame is required to be correspondingly increased, and the requirement of miniaturization of a package body is also required to be met, so that the pins of the lead frame are required to be designed to be narrow, the lead frame is easy to vibrate and deform pins and a base island in the wire bonding and flip-chip processes, and even the wire bonding is broken and the flip-chip bonding point is cracked.
Disclosure of Invention
The invention aims to solve the technical problem of providing a packaging method for temporary bonding reinforcement of a lead frame aiming at the prior art, which can solve the problem of vibration of the pin and the base island of the traditional lead frame.
The technical scheme adopted by the invention for solving the problems is as follows: a lead frame temporary bonding reinforced packaging method, the method comprises the following steps:
step one, a lead frame is taken, wherein the lead frame comprises a base island and a plurality of pins;
step two, temporary bonding
Taking a piece of glass, coating a layer of temporary bonding glue on one side surface of the glass, aligning and pressing the lead frame obtained in the step one on the surface of the temporary bonding glue, and enabling the lead frame, the temporary bonding glue and the glass to form a whole and heating and baking the whole;
step three, positively mounting the patch
Coating a bonding substance or solder on the upper surface of the base island of the lead frame, and normally attaching the chip to the bonding substance or solder on the upper surface of the base island and carrying out curing operation;
step four, welding wires
Performing wire bonding operation between the surface pressing area of the chip and the pin which are assembled and attached through the metal wire;
step five, primary encapsulation
Performing primary packaging operation on the front surface of the lead frame after wire bonding;
step six, bonding release
And performing bonding removal on the back of the lead frame which is encapsulated for one time.
A method for encapsulating a lead frame with temporary bonding reinforcement, the method comprising the steps of:
step one, a lead frame is taken, wherein the lead frame comprises a plurality of pins;
step two, temporary bonding
Taking a piece of glass, coating a layer of temporary bonding glue on one side surface of the glass, aligning and pressing the lead frame obtained in the step one on the surface of the temporary bonding glue, and enabling the lead frame, the temporary bonding glue and the glass to form a whole and heating and baking the whole;
step three, flip chip
Flip-chip welding a chip to be operated on a pin of the lead frame to ensure that a metal lug on the chip is completely connected with the pin of the lead frame;
step four, primary encapsulation
Performing primary encapsulation on the front surface of the lead frame with the flip chip;
step five, bonding release
And (4) performing bonding removal on the back of the lead frame which is packaged once.
Preferably, the temporary bonding paste is applied in a manner including: spin coating, spray coating, printing or lamination.
Preferably, the primary plastic package body formed by primary encapsulation is partially encapsulated on the surface of the temporary bonding glue.
Preferably, a secondary encapsulation operation is performed on the back surface of the lead frame after the debonding.
Preferably, the secondary plastic package body formed by the secondary packaging is connected with the primary plastic package body to form a whole.
Compared with the prior art, the invention has the advantages that:
according to the packaging method for temporary bonding reinforcement of the lead frame, the lead frame is temporarily bonded on the glass in advance by using a temporary bonding process so as to improve the strength and stability of the lead frame, and the glass is removed by bonding removal after subsequent packaging is finished, so that the strength of a base island and a pin can be temporarily improved, the lead is prevented from shaking in packaging operation, and the stability of the packaging operation is improved.
Drawings
Fig. 1 to 4 are schematic views of a conventional flip-chip packaging process flow.
Fig. 5-8 are schematic diagrams illustrating a conventional normal wire bonding packaging process.
Fig. 9 to fig. 14 are schematic flow charts of an embodiment 1 of a package method for temporary bonding reinforcement of a lead frame according to the present invention.
Fig. 15 to fig. 21 are schematic flow charts of an embodiment 2 of a package method for temporary bonding reinforcement of a lead frame according to the present invention.
Wherein:
lead frame 1
Base island 1-1
Pin 1-2
Chip 2
Metal bump 3
Plastic package body 4
Disposable plastic package body 4-1
Secondary plastic package body 4-2
Metal wire 5
Temporary bonding glue 6
And (7) glass.
Detailed Description
The invention is described in further detail below with reference to the accompanying examples.
Example 1: upright wire welding process
The invention relates to a packaging method for temporary bonding reinforcement of a lead frame, which comprises the following steps:
step one, referring to fig. 9, a lead frame 1 is taken, wherein the lead frame 1 comprises a base island 1-1 and a plurality of pins 1-2;
step two, temporary bonding
Referring to fig. 10, a piece of glass 7 is taken, a layer of temporary bonding glue 6 is coated on one side surface of the glass 7, and then the lead frame 1 obtained in the first step is aligned and pressed on the surface of the temporary bonding glue 6, so that the lead frame 1, the temporary bonding glue 6 and the glass 7 are integrated into a whole and heated and baked;
the coating method of the temporary bonding glue comprises the following steps: spin coating, spray coating, printing or film pressing;
step three, positively mounting the patch
Referring to fig. 11, an adhesive substance or solder is coated on the upper surface of the base island 1-1 of the lead frame 1, and the chip 2 is normally mounted on the adhesive substance or solder on the upper surface of the base island and cured;
step four, welding wires
Referring to fig. 12, wire bonding is performed between the surface nip of the die 2 being bonded and the pins 1-2 through the wire 5;
step five, primary encapsulation
Referring to fig. 13, a primary encapsulation operation is performed on the front surface of the lead frame after wire bonding, and a part of the primary plastic-encapsulated body 4-1 is coated on the surface of the temporary bonding adhesive;
step six, bonding release
Referring to fig. 14, the back of the once encapsulated lead frame is debonded, and the glass 7 and the temporary bonding adhesive 6 are all removed, wherein the glass 7 can be reused;
step seven, secondary encapsulation
Referring to fig. 15, a secondary encapsulation operation is performed on the back of the lead frame after the bonding is released, and the secondary plastic package body 4-2 and the primary plastic package body 4-1 are connected into a whole;
this step is optional and may not be performed for a second encapsulation.
Example 2: flip-chip process flow
The invention relates to a packaging method for temporary bonding reinforcement of a lead frame, which comprises the following steps:
step one, referring to fig. 16, a lead frame 1 is taken, wherein the lead frame 1 comprises a plurality of pins;
step two, temporary bonding
Referring to fig. 17, a piece of glass 7 is taken, a layer of temporary bonding glue 6 is coated on one side surface of the glass 7, and then the lead frame 1 obtained in the first step is aligned and pressed on the surface of the temporary bonding glue 6, so that the lead frame 1, the temporary bonding glue 6 and the glass 7 are integrated into a whole and heated and baked;
the coating method of the temporary bonding glue comprises the following steps: spin coating, spray coating, printing or film pressing;
step three, flip chip
Referring to fig. 18, the chip 2 to be operated is flip-chip bonded on the pins of the lead frame 1, so that the metal bumps 3 on the chip 2 are completely connected with the pins of the lead frame 1;
step four, primary encapsulation
Referring to fig. 19, local primary encapsulation is performed on the front surface of the lead frame 1 with the flip chip 2 completed, and a primary plastic-encapsulated body 4-1 encapsulates the chip 2, the metal bump 3, the encapsulated part of the pin, and part of the encapsulated part of the pin on the surface of the temporary bonding adhesive;
step five, bonding release
Referring to fig. 20, the back of the once encapsulated lead frame 1 is debonded, and the glass 7 and the temporary bonding glue 6 are all removed, wherein the glass 7 can be reused;
step six, secondary encapsulation
Referring to fig. 21, a secondary encapsulation operation is performed on the back surface of the lead frame 1 after the bonding is released, and the secondary plastic package body 4-2 and the primary plastic package body 4-1 are connected into a whole;
this step is optional and may not be performed for a second encapsulation.
In addition, the present invention also includes other embodiments, and any technical solutions formed by equivalent transformation or equivalent replacement should fall within the protection scope of the claims of the present invention.

Claims (6)

1. A lead frame temporary bonding reinforcement packaging method is characterized by comprising the following steps:
step one, a lead frame is taken, wherein the lead frame comprises a base island and a plurality of pins;
step two, temporary bonding
Taking a piece of glass, coating a layer of temporary bonding glue on one side surface of the glass, aligning and pressing the lead frame obtained in the step one on the surface of the temporary bonding glue, and enabling the lead frame, the temporary bonding glue and the glass to form a whole and heating and baking the whole;
step three, positively mounting the patch
Coating a bonding substance or solder on the upper surface of the base island of the lead frame, and normally attaching the chip to the bonding substance or solder on the upper surface of the base island and carrying out curing operation;
step four, welding wires
Performing wire bonding operation between the surface pressing area of the chip and the pin which are assembled and attached through the metal wire;
step five, primary encapsulation
Performing primary packaging operation on the front surface of the lead frame after wire bonding;
step six, bonding release
And performing bonding removal on the back of the lead frame which is encapsulated for one time.
2. A lead frame temporary bonding reinforcement packaging method is characterized by comprising the following steps:
step one, a lead frame is taken, wherein the lead frame comprises a plurality of pins;
step two, temporary bonding
Taking a piece of glass, coating a layer of temporary bonding glue on one side surface of the glass, aligning and pressing the lead frame obtained in the step one on the surface of the temporary bonding glue, and enabling the lead frame, the temporary bonding glue and the glass to form a whole and heating and baking the whole;
step three, flip chip
Flip-chip welding a chip to be operated on a pin of the lead frame to ensure that a metal lug on the chip is completely connected with the pin of the lead frame;
step four, primary encapsulation
Performing primary encapsulation on the front surface of the lead frame with the flip chip;
step five, bonding release
And (4) performing bonding removal on the back of the lead frame which is packaged once.
3. The lead frame temporary bonding reinforced encapsulation method according to claim 1 or 2, wherein: the coating method of the temporary bonding glue comprises the following steps: spin coating, spray coating, printing or lamination.
4. The lead frame temporary bonding reinforced encapsulation method according to claim 1 or 2, wherein: and the primary plastic package body formed by primary packaging is partially packaged on the surface of the temporary bonding glue.
5. The lead frame temporary bonding reinforced encapsulation method according to claim 1 or 2, wherein: and performing secondary packaging operation on the back surface of the lead frame after bonding is released.
6. The lead frame temporary bonding reinforced packaging method of claim 5, wherein: the secondary plastic package body formed by secondary encapsulation is connected with the primary plastic package body into a whole.
CN201911373511.7A 2019-12-27 2019-12-27 Packaging method for temporary bonding reinforcement of lead frame Pending CN111162016A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911373511.7A CN111162016A (en) 2019-12-27 2019-12-27 Packaging method for temporary bonding reinforcement of lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911373511.7A CN111162016A (en) 2019-12-27 2019-12-27 Packaging method for temporary bonding reinforcement of lead frame

Publications (1)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103021883A (en) * 2012-12-09 2013-04-03 华天科技（西安）有限公司 Flat package part manufacturing process based on corrosion plastic package body
CN107146777A (en) * 2017-05-27 2017-09-08 江苏长电科技股份有限公司 One kind exempts from cutting encapsulating structure and its manufacturing process
US20180076054A1 (en) * 2016-09-12 2018-03-15 Win Semiconductors Corp. Anti-Plasma Adhesive Tape and Manufacturing Method
CN110383471A (en) * 2017-03-07 2019-10-25 德克萨斯仪器股份有限公司 For manufacturing the method for being used for the lead frame of integrated antenna package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103021883A (en) * 2012-12-09 2013-04-03 华天科技（西安）有限公司 Flat package part manufacturing process based on corrosion plastic package body
US20180076054A1 (en) * 2016-09-12 2018-03-15 Win Semiconductors Corp. Anti-Plasma Adhesive Tape and Manufacturing Method
CN110383471A (en) * 2017-03-07 2019-10-25 德克萨斯仪器股份有限公司 For manufacturing the method for being used for the lead frame of integrated antenna package
CN107146777A (en) * 2017-05-27 2017-09-08 江苏长电科技股份有限公司 One kind exempts from cutting encapsulating structure and its manufacturing process

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Application publication date: 20200515