CN111118446A - 掩模的更换时期的判定装置及方法、成膜装置及方法以及电子器件的制造方法 - Google Patents

掩模的更换时期的判定装置及方法、成膜装置及方法以及电子器件的制造方法 Download PDF

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Publication number
CN111118446A
CN111118446A CN201911014414.9A CN201911014414A CN111118446A CN 111118446 A CN111118446 A CN 111118446A CN 201911014414 A CN201911014414 A CN 201911014414A CN 111118446 A CN111118446 A CN 111118446A
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mask
determining
replacement timing
deflection
unit
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Chinese (zh)
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柏仓一史
石井博
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Canon Tokki Corp
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Canon Tokki Corp
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN201911014414.9A 2018-10-30 2019-10-24 掩模的更换时期的判定装置及方法、成膜装置及方法以及电子器件的制造方法 Pending CN111118446A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180131379A KR102634162B1 (ko) 2018-10-30 2018-10-30 마스크 교환시기 판정장치, 성막장치, 마스크 교환시기 판정방법, 성막방법 및 전자 디바이스의 제조방법
KR10-2018-0131379 2018-10-30

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Publication Number Publication Date
CN111118446A true CN111118446A (zh) 2020-05-08

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CN (1) CN111118446A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113846305A (zh) * 2020-06-26 2021-12-28 佳能特机株式会社 对准装置、成膜装置、对准方法、电子器件的制造方法及存储介质

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115513083B (zh) * 2022-09-29 2023-08-25 惠科股份有限公司 测试承载基板及膜厚监控装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004094068A (ja) * 2002-09-03 2004-03-25 Nikon Corp マスク検査方法及びマスク検査装置
JP2007115829A (ja) * 2005-10-19 2007-05-10 Nikon Corp マスク搬送装置、マスク搬送方法、及び露光方法
JP2009064608A (ja) * 2007-09-05 2009-03-26 Sony Corp 蒸着用マスクおよびその製造方法ならびに表示装置の製造方法
KR20140112189A (ko) * 2013-03-13 2014-09-23 주식회사 테스 박막증착장치
JP2015052162A (ja) * 2013-09-09 2015-03-19 株式会社ブイ・テクノロジー 成膜マスク、成膜装置及び成膜方法並びにタッチパネル基板
KR20170123932A (ko) * 2016-04-29 2017-11-09 엘지디스플레이 주식회사 유기 발광 표시 장치의 얼라인 검사 장치 및 검사 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4635364B2 (ja) * 2001-04-03 2011-02-23 株式会社ニコン 露光装置及び露光方法
KR101289345B1 (ko) 2005-07-19 2013-07-29 주성엔지니어링(주) 섀도우 마스크와 이를 이용한 정렬장치
JP2009068872A (ja) * 2007-09-11 2009-04-02 Seiko Epson Corp マスク検査方法及びマスク検査装置並びに電気光学装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004094068A (ja) * 2002-09-03 2004-03-25 Nikon Corp マスク検査方法及びマスク検査装置
JP2007115829A (ja) * 2005-10-19 2007-05-10 Nikon Corp マスク搬送装置、マスク搬送方法、及び露光方法
JP2009064608A (ja) * 2007-09-05 2009-03-26 Sony Corp 蒸着用マスクおよびその製造方法ならびに表示装置の製造方法
KR20140112189A (ko) * 2013-03-13 2014-09-23 주식회사 테스 박막증착장치
JP2015052162A (ja) * 2013-09-09 2015-03-19 株式会社ブイ・テクノロジー 成膜マスク、成膜装置及び成膜方法並びにタッチパネル基板
KR20170123932A (ko) * 2016-04-29 2017-11-09 엘지디스플레이 주식회사 유기 발광 표시 장치의 얼라인 검사 장치 및 검사 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113846305A (zh) * 2020-06-26 2021-12-28 佳能特机株式会社 对准装置、成膜装置、对准方法、电子器件的制造方法及存储介质
CN113846305B (zh) * 2020-06-26 2023-08-08 佳能特机株式会社 对准装置、成膜装置、对准方法、电子器件的制造方法及存储介质

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