CN111112808A - 基板分断装置及基板分断方法 - Google Patents

基板分断装置及基板分断方法 Download PDF

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Publication number
CN111112808A
CN111112808A CN201910999186.9A CN201910999186A CN111112808A CN 111112808 A CN111112808 A CN 111112808A CN 201910999186 A CN201910999186 A CN 201910999186A CN 111112808 A CN111112808 A CN 111112808A
Authority
CN
China
Prior art keywords
plasma
substrate
scribing line
laser
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910999186.9A
Other languages
English (en)
Chinese (zh)
Inventor
西岛浩一
中谷郁祥
松田启和
赤堀政人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd, Mitsuboshi Diamond Industrial Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN111112808A publication Critical patent/CN111112808A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K10/00—Welding or cutting by means of a plasma
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K10/00—Welding or cutting by means of a plasma
    • B23K10/003—Scarfing, desurfacing or deburring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/006—Other surface treatment of glass not in the form of fibres or filaments by irradiation by plasma or corona discharge
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0075—Cleaning of glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
CN201910999186.9A 2018-10-30 2019-10-21 基板分断装置及基板分断方法 Pending CN111112808A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-203663 2018-10-30
JP2018203663 2018-10-30

Publications (1)

Publication Number Publication Date
CN111112808A true CN111112808A (zh) 2020-05-08

Family

ID=70495372

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910999186.9A Pending CN111112808A (zh) 2018-10-30 2019-10-21 基板分断装置及基板分断方法

Country Status (4)

Country Link
JP (1) JP2020075852A (ko)
KR (1) KR20200049572A (ko)
CN (1) CN111112808A (ko)
TW (1) TWI757649B (ko)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1258398A (ko) * 1968-03-27 1971-12-30
CN1701435A (zh) * 2003-01-23 2005-11-23 松下电器产业株式会社 制造半导体器件的方法和用于切割半导体晶片的切割装置
JP2007076930A (ja) * 2005-09-12 2007-03-29 Joyo Kogaku Kk ガラス切断方法
CN105097482A (zh) * 2014-05-13 2015-11-25 株式会社迪思科 晶片的加工方法
CN105461207A (zh) * 2014-09-30 2016-04-06 三星钻石工业股份有限公司 分割方法及分割装置
CN107210204A (zh) * 2015-03-13 2017-09-26 古河电气工业株式会社 半导体晶片的处理方法、半导体芯片和表面保护带

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3887394B2 (ja) * 2004-10-08 2007-02-28 芝浦メカトロニクス株式会社 脆性材料の割断加工システム及びその方法
TW200633808A (en) * 2004-12-28 2006-10-01 Mitsuboshi Diamond Ind Co Ltd Method for cutting brittle material substrate and substrate cutting system
JP5317712B2 (ja) * 2008-01-22 2013-10-16 株式会社半導体エネルギー研究所 半導体装置及び半導体装置の作製方法
KR100984751B1 (ko) * 2008-09-09 2010-10-01 주식회사 코미코 열 응력 감소를 위한 이중 버퍼층을 포함하는 정전 척
JP5129826B2 (ja) * 2010-02-05 2013-01-30 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
JP6163341B2 (ja) 2013-04-02 2017-07-12 三星ダイヤモンド工業株式会社 ブレイク装置
KR101854198B1 (ko) * 2016-08-05 2018-05-03 한국미쯔보시다이아몬드공업(주) 프리 크랙킹 과정을 포함한 글래스기판 분단방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1258398A (ko) * 1968-03-27 1971-12-30
CN1701435A (zh) * 2003-01-23 2005-11-23 松下电器产业株式会社 制造半导体器件的方法和用于切割半导体晶片的切割装置
JP2007076930A (ja) * 2005-09-12 2007-03-29 Joyo Kogaku Kk ガラス切断方法
CN105097482A (zh) * 2014-05-13 2015-11-25 株式会社迪思科 晶片的加工方法
CN105461207A (zh) * 2014-09-30 2016-04-06 三星钻石工业股份有限公司 分割方法及分割装置
CN107210204A (zh) * 2015-03-13 2017-09-26 古河电气工业株式会社 半导体晶片的处理方法、半导体芯片和表面保护带

Also Published As

Publication number Publication date
TWI757649B (zh) 2022-03-11
TW202021918A (zh) 2020-06-16
JP2020075852A (ja) 2020-05-21
KR20200049572A (ko) 2020-05-08

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