CN111107970B - 发光装置及其制造方法 - Google Patents

发光装置及其制造方法 Download PDF

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Publication number
CN111107970B
CN111107970B CN201880060923.2A CN201880060923A CN111107970B CN 111107970 B CN111107970 B CN 111107970B CN 201880060923 A CN201880060923 A CN 201880060923A CN 111107970 B CN111107970 B CN 111107970B
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CN
China
Prior art keywords
thermally conductive
emitting device
optically transparent
light emitting
conductive material
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CN201880060923.2A
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English (en)
Chinese (zh)
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CN111107970A (zh
Inventor
陈楠
P.S.马丁
丁超
L.程
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Koninklijke Philips NV
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Koninklijke Philips NV
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Publication of CN111107970A publication Critical patent/CN111107970A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1657—Making multilayered or multicoloured articles using means for adhering or bonding the layers or parts to each other
    • B29C2045/1659—Fusion bonds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1657—Making multilayered or multicoloured articles using means for adhering or bonding the layers or parts to each other
    • B29C2045/1664—Chemical bonds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
    • B29K2995/0013—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/747—Lightning equipment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0365—Manufacture or treatment of packages of means for heat extraction or cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
CN201880060923.2A 2017-09-19 2018-09-10 发光装置及其制造方法 Active CN111107970B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CNPCT/CN2017/102216 2017-09-19
CN2017102216 2017-09-19
EP17195850 2017-10-11
EP17195850.7 2017-10-11
PCT/EP2018/074303 WO2019057534A1 (en) 2017-09-19 2018-09-10 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

Publications (2)

Publication Number Publication Date
CN111107970A CN111107970A (zh) 2020-05-05
CN111107970B true CN111107970B (zh) 2022-08-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880060923.2A Active CN111107970B (zh) 2017-09-19 2018-09-10 发光装置及其制造方法

Country Status (5)

Country Link
US (1) US11511467B2 (https=)
EP (1) EP3684582A1 (https=)
JP (1) JP7297768B2 (https=)
CN (1) CN111107970B (https=)
WO (1) WO2019057534A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
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DE10163117C1 (de) * 2001-12-24 2003-01-16 Reitter & Schefenacker Gmbh Verfahren zum Herstellen von lichtleitenden LED-Körpern in zwei zeitlich getrennten Stufen
CN102593320A (zh) * 2012-02-08 2012-07-18 珠海晟源同泰电子有限公司 Led光源及其封装方法
JP2013004939A (ja) * 2011-06-22 2013-01-07 Apic Yamada Corp 車載用電子モジュールの樹脂モールド方法
JP2016025253A (ja) * 2014-07-22 2016-02-08 旭化成イーマテリアルズ株式会社 半導体発光素子及びその製造方法

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JP2778608B2 (ja) * 1992-02-10 1998-07-23 日本電気株式会社 樹脂モールド型半導体装置の製造方法
JP2002208668A (ja) * 2001-01-10 2002-07-26 Hitachi Ltd 半導体装置およびその製造方法
US7355284B2 (en) 2004-03-29 2008-04-08 Cree, Inc. Semiconductor light emitting devices including flexible film having therein an optical element
US7868343B2 (en) 2004-04-06 2011-01-11 Cree, Inc. Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same
EP1630913B1 (de) * 2004-08-31 2007-10-03 Infineon Technologies AG Verfahren zum Herstellen eines mit einem Kunststoffgehäuse versehenen optischen oder elektronischen Moduls das eine optische oder elektronische Komponente enthält, sowie optisches oder elektronisches Modul
US7646035B2 (en) * 2006-05-31 2010-01-12 Cree, Inc. Packaged light emitting devices including multiple index lenses and multiple index lenses for packaged light emitting devices
DE102005053979A1 (de) * 2005-11-11 2007-05-24 Wilhelm Weber Gmbh & Co. Kg Verfahren und Kunststoffspritzvorrichtung zur Herstellung eines Lichtleitkörpers
JP5232369B2 (ja) 2006-02-03 2013-07-10 日立化成株式会社 光半導体素子搭載用パッケージ基板の製造方法およびこれを用いた光半導体装置の製造方法
WO2007135707A1 (ja) * 2006-05-18 2007-11-29 Nichia Corporation 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
DE102006046678A1 (de) * 2006-09-29 2008-04-03 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zum Herstellen eines Gehäuses für ein optoelektronisches Bauelement
JP5470680B2 (ja) * 2007-02-06 2014-04-16 日亜化学工業株式会社 発光装置及びその製造方法並びに成形体
JP5233170B2 (ja) 2007-05-31 2013-07-10 日亜化学工業株式会社 発光装置、発光装置を構成する樹脂成形体及びそれらの製造方法
CN100481546C (zh) * 2007-11-26 2009-04-22 佛山市国星光电股份有限公司 一种底部注胶透镜成型的功率led及其制造方法
JP2010027974A (ja) 2008-07-23 2010-02-04 Sharp Corp 発光装置の製造方法
US20130170174A1 (en) * 2011-12-29 2013-07-04 Intematix Technology Center Corp. Multi-cavities light emitting device
US20130329429A1 (en) * 2012-06-11 2013-12-12 Cree, Inc. Emitter package with integrated mixing chamber
JP6303738B2 (ja) 2013-04-12 2018-04-04 日亜化学工業株式会社 発光装置
JP5939644B2 (ja) * 2013-08-30 2016-06-22 富士フイルム株式会社 画像形成方法、インモールド成型品の製造方法、及び、インクセット
KR102310797B1 (ko) * 2013-12-17 2021-10-15 루미리즈 홀딩 비.브이. 로우 및 하이 빔 led 램프
US9360188B2 (en) 2014-02-20 2016-06-07 Cree, Inc. Remote phosphor element filled with transparent material and method for forming multisection optical elements
DE102014106585A1 (de) * 2014-05-09 2015-11-12 Leonhard Kurz Stiftung & Co. Kg Mehrschichtkörper und Verfahren zu dessen Herstellung
JP6481349B2 (ja) * 2014-12-02 2019-03-13 日亜化学工業株式会社 パッケージの製造方法及び発光装置の製造方法
JP2017065010A (ja) * 2015-09-29 2017-04-06 豊田合成株式会社 発光装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10163117C1 (de) * 2001-12-24 2003-01-16 Reitter & Schefenacker Gmbh Verfahren zum Herstellen von lichtleitenden LED-Körpern in zwei zeitlich getrennten Stufen
JP2013004939A (ja) * 2011-06-22 2013-01-07 Apic Yamada Corp 車載用電子モジュールの樹脂モールド方法
CN102593320A (zh) * 2012-02-08 2012-07-18 珠海晟源同泰电子有限公司 Led光源及其封装方法
JP2016025253A (ja) * 2014-07-22 2016-02-08 旭化成イーマテリアルズ株式会社 半導体発光素子及びその製造方法

Also Published As

Publication number Publication date
US11511467B2 (en) 2022-11-29
CN111107970A (zh) 2020-05-05
US20200238582A1 (en) 2020-07-30
EP3684582A1 (en) 2020-07-29
JP7297768B2 (ja) 2023-06-26
WO2019057534A1 (en) 2019-03-28
JP2020534706A (ja) 2020-11-26

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