CN103531671A - 一种发光二极管生产工艺及发光二极管 - Google Patents
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Abstract
本发明一种发光二极管生产工艺及发光二极管,涉及发光二极管的制造工艺与发光二极管;本发明采用如下工艺步骤:制作发光二极管框架;电镀切断;框架一次包封;连线;固晶;焊线;二次包封;冲切成型;分光编带;它包括晶片一(14)、晶片二(15)、晶片三(16)和外引脚(5);在引线框架(1)的功能区(6)设置下有杯底圆(8)上有杯口圆(9)的树脂杯(7);树脂杯(7)的底部设置独立晶片固定热沉(3)或晶片固定片(22);独立晶片固定热沉(3)上设置晶片一(14)、晶片二(15)、晶片三(16);其外设置一次包封树脂体(11),二次包封树脂体(13)和半球形透镜(19)、(24);本发明所生产的LED具备高可靠性,出光效率高,分辨率高,便于批量生产的特点。
Description
技术领域
本发明涉及发光二极管的制造工艺与发光二极管。
背景技术
由于LED发光二极管的技术的不断更新进步,并被大量运用到现实生活,例如户内外显示屏,各种景观照明以及工业照明、医疗照明等、电视与笔电背光等。随着LED技术的突飞猛进,目前LED正在扩展到几乎所有光源光学领域。常用的主要有直插式、SMD、TOP、食人鱼LED、大功率LED。目前有一些关于LED方面的专利。如:中国2004年公布了一种“陶瓷封装的贴片LED及其封装方法”的专利,其是采用陶瓷基板钻孔成杯的方式,然后在陶瓷杯内固晶焊线,然后采用硅橡胶填封LED芯片与金线,做成贴片式封装。其不足之处在于该方法只能封成平面,其光强就大打折扣。另外由于陶瓷基板的硬度较硬,且难以加工,凸显其不足之处。
发明内容
本发明的目的一在于:提供可以适应户外严苛使用环境的一种发光二极管生产工艺。
本发明的目的二在于:提供可以适应户外严苛使用环境的一种发光二极管。
本发明采用如下工艺步骤完成:
加工金属片材制作发光二极管框架→电镀切断→框架一次包封→连线→固晶→焊线→二次包封→冲切成型→分光编带;
制作引线框架:采用原材料金属薄片,材质以铜材为主,也可以用铁、银等;利用模具冲切、成型,形成一种片式引线框架(1),引线框架上有定位孔(2),引线框架上有多个功能区(6),每个功能区(6)有6支外引脚(5);对冲切完成的引线框架(1)进行相应的电镀处理;
电镀切断:电镀后切断框架;
框架一次热固包封:在模具上下模表面喷涂一层离模剂,将上一步制作的引线框架(1)放入热固模具内对应位置,再将经过相应表面处理的独立晶片固定热沉(3)或晶片固定片(22)放到框架每个单元的中心对应位置;然后合模,将白色固态树脂胶饼放入上模转进孔,然后操作转进杆下压,将固态胶饼压入模具,结合温度熔融,将熔融的流体树脂压入模具流道,待时间合适后开模形成框架;包含树脂杯(7),杯底圆(8),杯口圆(9),一次包封树脂体极性标记缺口(10),独立晶片固定热沉(3)或晶片固定片(22);独立晶片固定热沉(3)为凸台状,独立晶片固定热沉凸台(4)凸出于一次包封树脂体(11)底部;为提高分辨率,可在一次包封树脂体(11)正表面(20)涂成黑色。然后对树脂进行长烤,彻底烤干树脂;
连线:针对单电极晶片在固晶前,在单电极晶片固定区域采用焊
接机连接一条安全线(17),连接单电极的晶片固晶区域与独立晶片固定热沉(3),以在固晶胶与独立晶片固定热沉(3)表面结合不牢固时,仍能使晶片底部粘接胶与晶片固定热沉表面的导通;
固晶:在引线框架(1)的每个单元中心的独立晶片固定热沉(3)区域点上芯片粘接胶,单电极的晶片固晶粘接胶点在安全线(17)的一端,并将安全线(17)一端嵌入在固晶粘接胶内,单电极晶片的粘接胶为导电导热的粘接物;操作固晶机用一定力度将晶片一(14)、晶片二(15)、晶片三(16)放到点好的对应晶片粘接胶上面,使晶片与晶片固定热沉表面很好的接触;再通过加温烘烤,使芯片粘接胶固化;
焊线:操作键合机,用键合线(18)将晶片电极与对应的外引脚(5)焊盘连接,同时用键合线(18)将独立晶片固定热沉(3)表面与其中一只外引脚(5)焊盘连接起来,形成电流通路;
二次热固包封:即采用根据光学要求与结构要求设计好的模具形腔,在模具形腔内表面均匀喷上一层离模剂,将上一步固晶连线后的引线框架(1)放入模具形腔对应位置固定,然后合模,通过转进杆压入初步软化的固态树脂胶饼,在温度与压力的作用下,固态树脂胶饼完全融化并使树脂胶饼熔融并填满整个模具形腔,经过一定时间,融化的树脂再次固化,并包封好引线支架(1)的每个单元,形成二次包封树脂体(13),半球形透镜(19),(24), 二次包封树脂体极性标记缺口(12); 独立晶片固定热沉凸台(4)仍然微凸出于二次包封树脂体(13);然后再将离模后的成片包封好的材料放入烤箱内,彻底烤干树脂体;单元(21)是二次包封后的引线框架(1)其中一个二极管单元(21);
冲切折弯成型:通过模具冲切,将引线框架(1)中的各个功能区(6)引脚冲断,折弯外引脚(5)到二次包封树脂体(13)底部,形成贴片使用的LED成品;
分光编带:将冲切成型后的LED成品,经过分选机按照设定档位分选后,再采用编带机按照档位编带,入库出货。
它包括晶片一(14)、晶片二(15)、晶片三(16)和外引脚(5);在引线框架(1)的功能区(6)设置下有杯底圆(8)上有杯口圆(9)的树脂杯(7);树脂杯(7)的底部设置独立晶片固定热沉(3)或晶片固定片(22); 独立晶片固定热沉(3)上设置晶片一(14)、晶片二(15)、晶片三(16); 晶片一(14)、晶片二(15)、晶片三(16)外设置一次包封树脂体(11);一次包封树脂体(11)体外再设置二次包封树脂体(13)和半球形透镜(19)、(24)。
树脂杯(7)的底部向下设置有独立晶片固定热沉凸台(4)。
一次包封树脂体(11)正表面(20)处理成黑色;
设置键合线(18)连接晶片一(14)、晶片二(15)、晶片三(16)和外引脚(5)。
设置安全线(17)连接晶片二(15)固晶区与独立晶片固定热沉(3)表面。
一次包封树脂体(11)的一角设置一次包封树脂体极性标记缺口(10)。
二次包封树脂体(13)的一角设置二次包封树脂体极性标记缺口(12)。
本发明工艺所生产的LED具备高可靠性,出光效率高,分辨率高,使用方便,便于批量生产的特点。
附图说明:
图1:本发明实施例一的引线框架主视图;
图2:本发明实施例一引线框架一次包封后的主视图;
图3:本发明实施例一图2引线框架一次包封后的A-A向剖视图;
图4:本发明实施例一引线框架二次包封后的主视图;
图5:本发明实施例一图4引线框架二次热固包封后的B-B向剖视图;
图6:本发明实施例一图4引线框架二次热固包封后的C-C剖视图;
图7:本发明实施例一二次包封后的引线框架其中一个二极管单元的主视放大图;
图8:本发明实施例一成品LED的主视图;
图9:本发明实施例一成品LED的仰视图;
图10:本发明实施例二引线框主视图;
图11:本发明实施例二引线框架二次包封后的主视图;
图12:本发明实施例二图11引线框架二次包封后的D-D向剖视图;
图13:本发明实施例二LED成品的俯视剖面图;
图14:本发明实施例二LED成品的仰视图;
图15:本发明的工艺流程图。
具体实施方式:
实施例一:
制作引线框架:采用原材料金属薄片,材质以铜材为主,也可以用铁、银等。利用模具冲切、成型,形成一种片式引线框架(1),引线框架上有定位孔(2),引线框架上有多个功能区(6),每个功能区(6)有6支外引脚(5)。对冲切完成的引线框架(1)进行相应的电镀处理。
电镀切断:电镀后切断框架。
一次热固包封:在模具上下模表面喷涂一层离模剂,将上一步制作的引线框架(1)放入热固模具内对应位置,再将经过相应表面处理的独立晶片固定热沉(3)或晶片固定片(22)放到框架每个单元的中心对应位置。然后合模,将白色固态树脂胶饼放入上模转进孔,然后操作转进杆下压,将固态胶饼压入模具,结合温度熔融,将熔融的流体树脂压入模具流道,待时间合适后开模,形成如图2所示的框架。包含树脂杯(7),杯底圆(8),杯口圆(9),一次包封树脂体极性标记缺口(10),独立晶片固定热沉(3)或晶片固定片(22)。独立晶片固定热沉(3)为凸台状,独立晶片固定热沉凸台(4)凸出于一次包封树脂体(11)底部。为提高分辨率,可在一次包封树脂体(11)正表面(20)涂成黑色。然后对树脂进行长烤,彻底烤干树脂。
连线:针对单电极晶片在固晶前,在单电极晶片固定区域采用焊接机连接一条安全线(17),连接单电极的晶片固晶区域与独立晶片固定热沉(3),以在固晶胶与独立晶片固定热沉(3)表面结合不牢固时,仍能使晶片底部粘接胶与晶片固定热沉表面的导通。
固晶:在引线框架(1)的每个单元中心的独立晶片固定热沉(3)区域点上芯片粘接胶,单电极的晶片固晶粘接胶点在安全线(17)的一端,并将安全线(17)一端嵌入在固晶粘接胶内,单电极晶片的粘接胶为导电导热的粘接物。操作固晶机用一定力度将晶片一(14)、晶片二(15)、晶片三(16)放到点好的对应晶片粘接胶上面,使晶片与晶片固定热沉表面很好的接触。再通过加温烘烤,使芯片粘接胶固化;
焊线:操作键合机,用键合线(18)将晶片电极与对应的外引脚(5)焊盘连接,同时用键合线(18)将独立晶片固定热沉(3)表面与其中一只外引脚(5)焊盘连接起来,形成电流通路。
二次热固包封:即采用根据光学要求与结构要求设计好的模具形腔。在模具形腔内表面均匀喷上一层离模剂,将上一步固晶连线后的引线框架(1)放入模具形腔对应位置固定,然后合模,通过转进杆压入初步软化的固态树脂胶饼,在温度与压力的作用下,固态树脂胶饼完全融化并使树脂胶饼熔融并填满整个模具形腔,经过一定时间,融化的树脂再次固化,并包封好引线支架(1)的每个单元,形成二次包封树脂体(13),半球形透镜(19),(24), 二次包封树脂体极性标记缺口(12); 独立晶片固定热沉凸台(4)仍然微凸出于二次包封树脂体(13)。然后再将离模后的成片包封好的材料放入烤箱内,彻底烤干树脂体。单元(21)是二次包封后的引线框架(1)其中一个二极管单元(21)。
冲切折弯成型:通过模具冲切,将引线框架(1)中的各个功能区(6)引脚冲断,折弯外引脚(5)到二次包封树脂体(13)底部,形成如图8、图9所示的贴片使用的LED成品。
分光编带:将冲切成型后的LED成品,经过分选机按照设定档位分选后,再采用编带机按照档位编带,入库出货。
实施例二:
本发明针对一些要求亮度不高的场合,也设计出一套简易二次加热固化包封工艺。即支架冲压时,一次冲切好晶片固定片(22),晶片固定片(22)连着一只加宽外引脚(23),在一次热固包封时,形成一次包封树脂体(11)与树脂杯(7),再在杯体内打安全线(17),然后再点晶片粘接胶,固晶,连线。再采用二次热固方式,将已固晶、连线的引线框架放到模腔内,再次模压加热固化成型,形成包封半球形透镜(24)内二次包封,再形成半球形透镜(24),不对一次包封树脂体(11)做整体包封,然后通过长烤,彻底烤干树脂后,再依前面同样工序冲切、折弯成型、形成单颗的成品如图13、图14。
本发明所采用二次包封半球形透镜为实施的较佳方式,不限制在半球形,也可以为圆柱形、椭圆形、方形、凹形等。
本发明所生产的LED并具备防水、防潮、耐酸碱、耐高温与低温环境、对比度优良等优异的性能;同时本发明的LED采用将独立热沉与非独立热沉两种方式,以适应要求不同的场合。独立热沉,可以将热量很好的导出到LED外部,以利于做亮度较高的具有较大功率的LED;而非独立热沉,则使用在对亮度要求不高的小功率的LED。本发明可在一次包封后对一次包封的杯体正表面涂布成黑色,以提高二次包封后LED应用于显示屏的对比度。
Claims (8)
1.一种发光二极管生产工艺,其特征在于:采用如下工艺步骤完成:
加工金属片材制作发光二极管框架→电镀切断→框架一次包封→连线→固晶→焊线→二次包封→冲切成型→分光编带;
制作引线框架:采用原材料金属薄片,材质以铜材为主,也可以用铁、银等;利用模具冲切、成型,形成一种片式引线框架(1),引线框架上有定位孔(2),引线框架上有多个功能区(6),每个功能区(6)有6支外引脚(5);对冲切完成的引线框架(1)进行相应的电镀处理;
电镀切断:电镀后切断框架;
框架一次热固包封:在模具上下模表面喷涂一层离模剂,将上一步制作的引线框架(1)放入热固模具内对应位置,再将经过相应表面处理的独立晶片固定热沉(3)或晶片固定片(22)放到框架每个单元的中心对应位置;然后合模,将白色固态树脂胶饼放入上模转进孔,然后操作转进杆下压,将固态胶饼压入模具,结合温度熔融,将熔融的流体树脂压入模具流道,待时间合适后开模形成框架;包含树脂杯(7),杯底圆(8),杯口圆(9),一次包封树脂体极性标记缺口(10),独立晶片固定热沉(3)或晶片固定片(22);独立晶片固定热沉(3)为凸台状,独立晶片固定热沉凸台(4)凸出于一次包封树脂体(11)底部;为提高分辨率,可在一次包封树脂体(11)正表面(20)涂成黑色;然后对树脂进行长烤,彻底烤干树脂;
连线:针对单电极晶片在固晶前,在单电极晶片固定区域采用焊接机连接一条安全线(17),连接单电极的晶片固晶区域与独立晶片固定热沉(3),以在固晶胶与独立晶片固定热沉(3)表面结合不牢固时,仍能使晶片底部粘接胶与晶片固定热沉表面的导通;
固晶:在引线框架(1)的每个单元中心的独立晶片固定热沉(3)区域点上芯片粘接胶,单电极的晶片固晶粘接胶点在安全线(17)的一端,并将安全线(17)一端嵌入在固晶粘接胶内,单电极晶片的粘接胶为导电导热的粘接物;操作固晶机用一定力度将晶片一(14)、晶片二(15)、晶片三(16)放到点好的对应晶片粘接胶上面,使晶片与晶片固定热沉表面很好的接触;再通过加温烘烤,使芯片粘接胶固化;
焊线:操作键合机,用键合线(18)将晶片电极与对应的外引脚(5)焊盘连接,同时用键合线(18)将独立晶片固定热沉(3)表面与其中一只外引脚(5)焊盘连接起来,形成电流通路;
二次热固包封:即采用根据光学要求与结构要求设计好的模具形腔;在模具形腔内表面均匀喷上一层离模剂,将上一步固晶连线后的引线框架(1)放入模具形腔对应位置固定,然后合模,通过转进杆压入初步软化的固态树脂胶饼,在温度与压力的作用下,固态树脂胶饼完全融化并使树脂胶饼熔融并填满整个模具形腔,经过一定时间,融化的树脂再次固化,并包封好引线支架(1)的每个单元,形成二次包封树脂体(13),半球形透镜(19),(24), 二次包封树脂体极性标记缺口(12); 独立晶片固定热沉凸台(4)仍然微凸出于二次包封树脂体(13);然后再将离模后的成片包封好的材料放入烤箱内,彻底烤干树脂体;单元(21)是二次包封后的引线框架(1)其中一个二极管单元(21);
冲切折弯成型:通过模具冲切,将引线框架(1)中的各个功能区(6)引脚冲断,折弯外引脚(5)到二次包封树脂体(13)底部,形成贴片使用的LED成品;
分光编带:将冲切成型后的LED成品,经过分选机按照设定档位分选后,再采用编带机按照档位编带,入库出货。
2.一种发光二极管,它包括晶片一(14)、晶片二(15)、晶片三(16)和外引脚(5),其特征在于:在引线框架(1)的功能区(6)设置下有杯底圆(8)上有杯口圆(9)的树脂杯(7);树脂杯(7)的底部设置独立晶片固定热沉(3)或晶片固定片(22); 独立晶片固定热沉(3)上设置晶片一(14)、晶片二(15)、晶片三(16); 晶片一(14)、晶片二(15)、晶片三(16)外设置一次包封树脂体(11);一次包封树脂体(11)体外再设置二次包封树脂体(13)和半球形透镜(19)、(24)。
3.如权利要求2所述的一种发光二极管,其特征在于:树脂杯(7)的底部向下设置有独立晶片固定热沉凸台(4)。
4.如权利要求2所述的一种发光二极管,其特征在于:一次包封树脂体(11)正表面(20)处理成黑色。
5.如权利要求2所述的一种发光二极管,其特征在于:设置键合线(18)连接晶片一(14)、晶片二(15)、晶片三(16)和外引脚(5)。
6.如权利要求2所述的一种发光二极管,其特征在于:设置安全线(17)连接晶片二(15)固晶区与独立晶片固定热沉(3)表面。
7.如权利要求2所述的一种发光二极管,其特征在于:一次包封树脂体(11)的一角设置一次包封树脂体极性标记缺口(10)。
8.如权利要求2所述的一种发光二极管,其特征在于:二次包封树脂体(13)的一角设置二次包封树脂体极性标记缺口(12)。
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