CN201100597Y - 一种贴片式led灯 - Google Patents

一种贴片式led灯 Download PDF

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Publication number
CN201100597Y
CN201100597Y CNU2007201710179U CN200720171017U CN201100597Y CN 201100597 Y CN201100597 Y CN 201100597Y CN U2007201710179 U CNU2007201710179 U CN U2007201710179U CN 200720171017 U CN200720171017 U CN 200720171017U CN 201100597 Y CN201100597 Y CN 201100597Y
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China
Prior art keywords
lens
surface mounted
led lamp
led
adopting surface
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Expired - Lifetime
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CNU2007201710179U
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English (en)
Inventor
李国平
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Guangzhou Hongli Tronic Co Ltd
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Guangzhou Hongli Tronic Co Ltd
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Priority to CNU2007201710179U priority Critical patent/CN201100597Y/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)

Abstract

本实用新型公开了一种贴片式LED灯，包括LED、支架、透镜与封装体，LED、透镜与封装体位于支架上，其特征在于：所述透镜与封装体为一体结构。所述透镜与封装体为环氧树脂或光学硅胶。本实用新型具有可以解决其透镜和贴片式LED表面粘接不牢固及在客户加工过程中容易出现透镜脱离的优点。

Description

一种贴片式LED灯
技术领域
本实用新型涉及一种LED灯，具体是一种防止出现透镜脱离的贴片式LED灯。
背景技术
表面贴片发光二极管是一种新型的表面贴装式半导体发光器件，表面贴片发光二极管具有体积小、功耗少、发光效率高、寿命长、环保等优点，广泛应用于特殊照明、车灯、背光源、显示技术和电子设备等领域。表面贴片发光二极管的封装一般有两种结构：一种为PCB片式LED；另一种为金属塑料支架式LED。片式LED采用模造机进行模造封装，支架式LED采用点胶的方式封装。支架式LED的发光角度一般在120度左右，发光面大，光的投射距离短，造成产品在某些应用领域亮度不够而影响其工程效果。
目前一些生产LED的企业通过采用贴片式LED加透镜来减小发光角度，增加其发光强度。但是，市场上贴片式LED加透镜产品存在一些缺点：采用二次作业在贴片式LED表面上手工加粘透镜，透镜和贴片式LED表面粘接不牢固，容易掉落；由于透镜和贴片式LED在结构上是两个相互独立的部分，产品在客户加工如过回流焊及波锋焊过程中容易出现透镜脱离的现象。
发明内容
本实用新型的目的是提供一种解决其透镜和贴片式LED表面粘接不牢固及在客户加工过程中容易出现透镜脱离的贴片式LED灯。
本实用新型的目的通过以下技术方案来实现。
一种贴片式LED灯，包括LED、支架、透镜与封装体，LED、透镜与封装体位于支架上，其特征在于：所述透镜与封装体为一体结构。
所述透镜与封装体为环氧树脂或光学硅胶。
本实用新型贴片式LED灯采用模造工艺进行封装，其结构特征是采用环氧树脂材料或光学硅胶一次性模造得到的光学透镜和贴片式LED封装体形成一个整体，既起到封装的作用，又有聚光的作用，从而解决了因为透镜和贴片式LED在结构上是两个相互独立的部分引起的透镜脱离问题。因为环氧树脂材料或光学硅胶具有良好的粘接效果，所以光学透镜和贴片式LED外壳之间粘接力很高，其推力值可达15kg。通过更换不同的模具获得不同发光角度的贴片式LED光学透镜，可以快速满足市场上对不同发光角度贴片式LED产品的需求。
附图说明
图1为本实用新型贴片式LED灯的结构示意图。
具体实施方式
下面结合附图对本实用新型贴片式LED灯作进一步详细描述。
如图1所示，本实用新型贴片式LED灯包括一LED晶片1、具有反射腔体的塑料支架2以及采用模造工艺一体化成型的光学透镜3，LED晶片与光学透镜安装在塑料支架上，LED晶片位于光学透镜内。本实用新型贴片式LED灯的制造工艺是在固晶、焊线和除湿等工艺以后，采用环氧树脂材料或光学硅胶一次性模造工艺使光学透镜和LED外壳一体化成型。

Claims (2)

1、一种贴片式LED灯，包括LED、支架、透镜与封装体，LED、透镜与封装体位于支架上，其特征在于：所述透镜与封装体为一体结构。
2、根据权利要求1所述的贴片式LED灯，其特征在于：所述透镜与封装体为环氧树脂或光学硅胶。
CNU2007201710179U 2007-11-22 2007-11-22 一种贴片式led灯 Expired - Lifetime CN201100597Y (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007201710179U CN201100597Y (zh) 2007-11-22 2007-11-22 一种贴片式led灯

Publications (1)

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CN201100597Y true CN201100597Y (zh) 2008-08-13

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010099675A1 (zh) * 2009-03-04 2010-09-10 深圳市洲明科技有限公司 路灯用led发光单元
CN107179646A (zh) * 2017-07-11 2017-09-19 厦门富莱仕影视器材有限公司 一种带透镜的贴片灯珠的摄影摄像灯
CN110896124A (zh) * 2019-12-05 2020-03-20 厦门多彩光电子科技有限公司 一种生产硅胶透镜紫光全光谱灯珠的方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010099675A1 (zh) * 2009-03-04 2010-09-10 深圳市洲明科技有限公司 路灯用led发光单元
CN107179646A (zh) * 2017-07-11 2017-09-19 厦门富莱仕影视器材有限公司 一种带透镜的贴片灯珠的摄影摄像灯
CN110896124A (zh) * 2019-12-05 2020-03-20 厦门多彩光电子科技有限公司 一种生产硅胶透镜紫光全光谱灯珠的方法

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Address after: Four 11D room, 510000 floor, building B, 10 Fengshen Road, Huadu District, Guangdong, Guangzhou

Patentee after: Guangzhou Hongli Tronic Co., Ltd.

Address before: Four 11D room, 510000 floor, building B, 10 Fengshen Road, Huadu District, Guangdong, Guangzhou

Patentee before: Guangzhou Hongli Photoelectron Co., Ltd.

CX01 Expiry of patent term

Granted publication date: 20080813