CN111050257A - 防尘结构、麦克风封装结构以及电子设备 - Google Patents
防尘结构、麦克风封装结构以及电子设备 Download PDFInfo
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- H04—ELECTRIC COMMUNICATION TECHNIQUE
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- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
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- H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
- H04R2231/001—Moulding aspects of diaphragm or surround
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
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CN201911416430.0A CN111050257A (zh) | 2019-12-31 | 2019-12-31 | 防尘结构、麦克风封装结构以及电子设备 |
PCT/CN2020/099110 WO2021135108A1 (fr) | 2019-12-31 | 2020-06-30 | Structure étanche aux poussières, structure de conditionnement de microphone et dispositif électronique |
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CN201911416430.0A CN111050257A (zh) | 2019-12-31 | 2019-12-31 | 防尘结构、麦克风封装结构以及电子设备 |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111654796A (zh) * | 2020-06-30 | 2020-09-11 | 歌尔微电子有限公司 | 微型麦克风防尘装置及mems麦克风 |
CN111683332A (zh) * | 2020-06-08 | 2020-09-18 | 荣成歌尔电子科技有限公司 | 光噪测试系统、光噪测试方法及存储介质 |
CN111711904A (zh) * | 2020-06-24 | 2020-09-25 | 歌尔微电子有限公司 | 微型麦克风防尘装置及mems麦克风 |
CN111711902A (zh) * | 2020-06-24 | 2020-09-25 | 歌尔微电子有限公司 | 微型麦克风防尘装置及mems麦克风 |
CN111787473A (zh) * | 2020-06-30 | 2020-10-16 | 歌尔微电子有限公司 | 微型麦克风颗粒阻拦器及mems麦克风 |
WO2021135108A1 (fr) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Structure étanche aux poussières, structure de conditionnement de microphone et dispositif électronique |
WO2021135109A1 (fr) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Structure anti-poussière, structure d'emballage de microphone et dispositif électronique |
WO2021135113A1 (fr) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Structure anti-poussière, structure d'emballage de microphone, et dispositif électronique |
WO2021135126A1 (fr) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Structure étanche à la poussière, structure d'encapsulation de microphone et dispositif électronique |
WO2021135107A1 (fr) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Structure anti-poussière, structure d'encapsulation de microphone et dispositif électronique |
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US20080083961A1 (en) * | 2006-09-04 | 2008-04-10 | Yamaha Corporation | Semiconductor microphone unit |
CN201114761Y (zh) * | 2007-07-03 | 2008-09-10 | 歌尔声学股份有限公司 | 具备防尘功能的硅麦克风 |
CN102034764A (zh) * | 2009-09-25 | 2011-04-27 | 苏州纳维科技有限公司 | 具有自剥离功能的衬底以及剥离外延层的方法 |
US20110317863A1 (en) * | 2009-02-13 | 2011-12-29 | Funai Electric Co., Ltd. | Microphone unit |
CN104760924A (zh) * | 2015-04-20 | 2015-07-08 | 歌尔声学股份有限公司 | 一种mems麦克风芯片及其封装结构、制造方法 |
CN106057750A (zh) * | 2016-07-28 | 2016-10-26 | 合肥矽迈微电子科技有限公司 | 具有低翘曲度的封装结构 |
CN107428526A (zh) * | 2015-01-20 | 2017-12-01 | Tdk株式会社 | 具有无应力地固定的mems器件的模块 |
CN206932404U (zh) * | 2017-06-28 | 2018-01-26 | 歌尔科技有限公司 | Mems麦克风 |
CN107735872A (zh) * | 2015-06-30 | 2018-02-23 | Lg伊诺特有限公司 | 发光装置及包括该发光装置的发光装置封装体 |
CN108124228A (zh) * | 2018-02-28 | 2018-06-05 | 上海微联传感科技有限公司 | 麦克风芯片及麦克风 |
CN207652670U (zh) * | 2017-12-30 | 2018-07-24 | 东莞市艺展电子有限公司 | 一种麦克风模组 |
CN109309884A (zh) * | 2018-09-06 | 2019-02-05 | 歌尔股份有限公司 | 一种麦克风和电子设备 |
CN109660927A (zh) * | 2018-12-29 | 2019-04-19 | 华景科技无锡有限公司 | 一种麦克风芯片及麦克风 |
CN109857200A (zh) * | 2019-02-28 | 2019-06-07 | 北京小米移动软件有限公司 | 电子设备 |
CN209623067U (zh) * | 2019-03-22 | 2019-11-12 | 广东美的制冷设备有限公司 | 顶盖组件及空调 |
CN211557479U (zh) * | 2019-12-31 | 2020-09-22 | 潍坊歌尔微电子有限公司 | 防尘结构、麦克风封装结构以及电子设备 |
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CN203883992U (zh) * | 2014-05-05 | 2014-10-15 | 歌尔声学股份有限公司 | 一种mems麦克风 |
CN206596212U (zh) * | 2017-01-04 | 2017-10-27 | 歌尔科技有限公司 | 一种电子设备终端 |
DE102017103195B4 (de) * | 2017-02-16 | 2021-04-08 | Infineon Technologies Ag | Mikroelektromechanisches Mikrofon und Herstellungsverfahren für ein Mikroelektromechanisches Mikrofon |
CN110482477A (zh) * | 2019-09-10 | 2019-11-22 | 苏州敏芯微电子技术股份有限公司 | 硅麦克风封装结构及其封装方法 |
CN111050257A (zh) * | 2019-12-31 | 2020-04-21 | 歌尔股份有限公司 | 防尘结构、麦克风封装结构以及电子设备 |
CN110944276A (zh) * | 2019-12-31 | 2020-03-31 | 歌尔股份有限公司 | 用于mems器件的防尘结构及mems麦克风封装结构 |
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2019
- 2019-12-31 CN CN201911416430.0A patent/CN111050257A/zh active Pending
-
2020
- 2020-06-30 WO PCT/CN2020/099110 patent/WO2021135108A1/fr active Application Filing
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US20080083961A1 (en) * | 2006-09-04 | 2008-04-10 | Yamaha Corporation | Semiconductor microphone unit |
CN201114761Y (zh) * | 2007-07-03 | 2008-09-10 | 歌尔声学股份有限公司 | 具备防尘功能的硅麦克风 |
US20110317863A1 (en) * | 2009-02-13 | 2011-12-29 | Funai Electric Co., Ltd. | Microphone unit |
CN102034764A (zh) * | 2009-09-25 | 2011-04-27 | 苏州纳维科技有限公司 | 具有自剥离功能的衬底以及剥离外延层的方法 |
CN107428526A (zh) * | 2015-01-20 | 2017-12-01 | Tdk株式会社 | 具有无应力地固定的mems器件的模块 |
CN104760924A (zh) * | 2015-04-20 | 2015-07-08 | 歌尔声学股份有限公司 | 一种mems麦克风芯片及其封装结构、制造方法 |
CN107735872A (zh) * | 2015-06-30 | 2018-02-23 | Lg伊诺特有限公司 | 发光装置及包括该发光装置的发光装置封装体 |
CN106057750A (zh) * | 2016-07-28 | 2016-10-26 | 合肥矽迈微电子科技有限公司 | 具有低翘曲度的封装结构 |
CN206932404U (zh) * | 2017-06-28 | 2018-01-26 | 歌尔科技有限公司 | Mems麦克风 |
CN207652670U (zh) * | 2017-12-30 | 2018-07-24 | 东莞市艺展电子有限公司 | 一种麦克风模组 |
CN108124228A (zh) * | 2018-02-28 | 2018-06-05 | 上海微联传感科技有限公司 | 麦克风芯片及麦克风 |
CN109309884A (zh) * | 2018-09-06 | 2019-02-05 | 歌尔股份有限公司 | 一种麦克风和电子设备 |
CN109660927A (zh) * | 2018-12-29 | 2019-04-19 | 华景科技无锡有限公司 | 一种麦克风芯片及麦克风 |
CN109857200A (zh) * | 2019-02-28 | 2019-06-07 | 北京小米移动软件有限公司 | 电子设备 |
CN209623067U (zh) * | 2019-03-22 | 2019-11-12 | 广东美的制冷设备有限公司 | 顶盖组件及空调 |
CN211557479U (zh) * | 2019-12-31 | 2020-09-22 | 潍坊歌尔微电子有限公司 | 防尘结构、麦克风封装结构以及电子设备 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021135108A1 (fr) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Structure étanche aux poussières, structure de conditionnement de microphone et dispositif électronique |
WO2021135109A1 (fr) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Structure anti-poussière, structure d'emballage de microphone et dispositif électronique |
WO2021135113A1 (fr) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Structure anti-poussière, structure d'emballage de microphone, et dispositif électronique |
WO2021135126A1 (fr) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Structure étanche à la poussière, structure d'encapsulation de microphone et dispositif électronique |
WO2021135107A1 (fr) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Structure anti-poussière, structure d'encapsulation de microphone et dispositif électronique |
CN111683332A (zh) * | 2020-06-08 | 2020-09-18 | 荣成歌尔电子科技有限公司 | 光噪测试系统、光噪测试方法及存储介质 |
CN111683332B (zh) * | 2020-06-08 | 2021-11-09 | 荣成歌尔电子科技有限公司 | 光噪测试系统、光噪测试方法及存储介质 |
CN111711904A (zh) * | 2020-06-24 | 2020-09-25 | 歌尔微电子有限公司 | 微型麦克风防尘装置及mems麦克风 |
CN111711902A (zh) * | 2020-06-24 | 2020-09-25 | 歌尔微电子有限公司 | 微型麦克风防尘装置及mems麦克风 |
CN111654796A (zh) * | 2020-06-30 | 2020-09-11 | 歌尔微电子有限公司 | 微型麦克风防尘装置及mems麦克风 |
CN111787473A (zh) * | 2020-06-30 | 2020-10-16 | 歌尔微电子有限公司 | 微型麦克风颗粒阻拦器及mems麦克风 |
CN111654796B (zh) * | 2020-06-30 | 2021-12-28 | 歌尔微电子有限公司 | 微型麦克风防尘装置及mems麦克风 |
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