CN111034369A - 柔性印刷电路板、包括其的电子设备及柔性印刷电路板的制造方法 - Google Patents

柔性印刷电路板、包括其的电子设备及柔性印刷电路板的制造方法 Download PDF

Info

Publication number
CN111034369A
CN111034369A CN201780009892.3A CN201780009892A CN111034369A CN 111034369 A CN111034369 A CN 111034369A CN 201780009892 A CN201780009892 A CN 201780009892A CN 111034369 A CN111034369 A CN 111034369A
Authority
CN
China
Prior art keywords
plating layer
circuit board
printed circuit
flexible printed
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780009892.3A
Other languages
English (en)
Chinese (zh)
Inventor
苫米地重尚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stemco Co Ltd
Original Assignee
Stemco Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stemco Co Ltd filed Critical Stemco Co Ltd
Publication of CN111034369A publication Critical patent/CN111034369A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
CN201780009892.3A 2017-06-20 2017-06-20 柔性印刷电路板、包括其的电子设备及柔性印刷电路板的制造方法 Pending CN111034369A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2017/006485 WO2018235971A1 (ko) 2017-06-20 2017-06-20 연성 회로 기판, 이를 포함하는 전자 장치 및 연성 회로 기판의 제조 방법

Publications (1)

Publication Number Publication Date
CN111034369A true CN111034369A (zh) 2020-04-17

Family

ID=64737663

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780009892.3A Pending CN111034369A (zh) 2017-06-20 2017-06-20 柔性印刷电路板、包括其的电子设备及柔性印刷电路板的制造方法

Country Status (3)

Country Link
JP (1) JP2019521503A (ko)
CN (1) CN111034369A (ko)
WO (1) WO2018235971A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022225372A1 (ko) * 2021-04-23 2022-10-27 삼성전자 주식회사 카메라 모듈 및 그를 포함하는 전자 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000036521A (ja) * 1998-05-11 2000-02-02 Mitsui Mining & Smelting Co Ltd 電子部品実装用フィルムキャリアテ―プおよびその製造方法
US20050122700A1 (en) * 2003-12-09 2005-06-09 Kim Deok-Heung Flexible printed circuit board
JP2013084774A (ja) * 2011-10-11 2013-05-09 Fujikura Ltd プリント配線板及びプリント配線板の製造方法
WO2017061715A1 (ko) * 2015-10-06 2017-04-13 엘지이노텍 주식회사 연성 회로기판
CN106605454A (zh) * 2015-08-06 2017-04-26 日本梅克特隆株式会社 多层柔性印刷线路板及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037353A (ja) * 2001-07-24 2003-02-07 Shindo Denshi Kogyo Kk フレキシブル回路基板およびその製造方法
KR100495932B1 (ko) * 2003-06-20 2005-06-16 스템코 주식회사 필름 캐리어 테이프 및 그 제조방법
JP2005129838A (ja) * 2003-10-27 2005-05-19 Seiko Epson Corp 回路基板、電子モジュール、回路基板の製造方法および電子モジュールの製造方法
JP4696924B2 (ja) * 2006-01-20 2011-06-08 住友電気工業株式会社 フレキシブル回路基板
KR101547500B1 (ko) * 2014-12-15 2015-08-26 스템코 주식회사 연성 회로 기판과 이를 포함하는 전자 장치 및 연성 회로 기판의 제조 방법
KR101753692B1 (ko) * 2016-02-05 2017-07-19 스템코 주식회사 연성 회로 기판, 이를 포함하는 전자 장치 및 연성 회로 기판의 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000036521A (ja) * 1998-05-11 2000-02-02 Mitsui Mining & Smelting Co Ltd 電子部品実装用フィルムキャリアテ―プおよびその製造方法
US20050122700A1 (en) * 2003-12-09 2005-06-09 Kim Deok-Heung Flexible printed circuit board
JP2013084774A (ja) * 2011-10-11 2013-05-09 Fujikura Ltd プリント配線板及びプリント配線板の製造方法
CN106605454A (zh) * 2015-08-06 2017-04-26 日本梅克特隆株式会社 多层柔性印刷线路板及其制造方法
WO2017061715A1 (ko) * 2015-10-06 2017-04-13 엘지이노텍 주식회사 연성 회로기판

Also Published As

Publication number Publication date
WO2018235971A1 (ko) 2018-12-27
JP2019521503A (ja) 2019-07-25

Similar Documents

Publication Publication Date Title
US10912192B2 (en) Flexible circuit board, COF module and electronic device comprising the same
CN107006116B (zh) 柔性电路板和包含柔性电路板的电子装置以及柔性电路板的制造方法
KR102475251B1 (ko) 연성 회로기판 및 이를 포함하는 칩 패키지, 및 이를 포함하는 전자 디바이스
KR102375124B1 (ko) 연성기판
KR20180010890A (ko) 연성 회로기판, cof 모듈 및 이를 포함하는 전자 디바이스
KR100947608B1 (ko) 연성 필름
KR20140059548A (ko) 회로 기판의 접속 구조
KR101753692B1 (ko) 연성 회로 기판, 이를 포함하는 전자 장치 및 연성 회로 기판의 제조 방법
KR20090067744A (ko) 연성 필름
US11197377B2 (en) Flexible circuit board and method for producing same
CN111034369A (zh) 柔性印刷电路板、包括其的电子设备及柔性印刷电路板的制造方法
KR101751390B1 (ko) 연성 회로 기판 및 그 제조 방법
CN111052880B (zh) 电路板及其制造方法
CN111699759A (zh) 柔性电路板及包括其的电子装置
KR100896439B1 (ko) 연성 필름
KR101611216B1 (ko) 연성 회로 기판 및 그 제조 방법
JP2022180656A (ja) フレキシブルプリント基板、これを含む電子装置、及びフレキシブルプリント基板の製造方法
KR20180018034A (ko) 연성 회로기판 및 이를 포함하는 전자 디바이스
KR102335445B1 (ko) 칩온필름 패키지용 연성인쇄회로기판 및 이의 제조 방법
CN117528897A (zh) 软性电路板及其制造方法
KR20240001552A (ko) 연성 인쇄회로기판, cof 모듈 및 이를 포함하는 전자디바이스
KR20190054500A (ko) 통합형 연성 회로기판 및 이를 포함하는 칩 패키지

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination