JP2019521503A - フレキシブルプリント基板、これを含む電子装置、及びフレキシブルプリント基板の製造方法 - Google Patents
フレキシブルプリント基板、これを含む電子装置、及びフレキシブルプリント基板の製造方法 Download PDFInfo
- Publication number
- JP2019521503A JP2019521503A JP2018540816A JP2018540816A JP2019521503A JP 2019521503 A JP2019521503 A JP 2019521503A JP 2018540816 A JP2018540816 A JP 2018540816A JP 2018540816 A JP2018540816 A JP 2018540816A JP 2019521503 A JP2019521503 A JP 2019521503A
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- flexible printed
- printed circuit
- area
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000007747 plating Methods 0.000 claims abstract description 101
- 238000005452 bending Methods 0.000 claims abstract description 60
- 239000010410 layer Substances 0.000 claims description 145
- 239000011241 protective layer Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 8
- 239000010408 film Substances 0.000 description 46
- 239000000758 substrate Substances 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
- 239000004020 conductor Substances 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- -1 Polyethylene Terephthalate Polymers 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000012787 coverlay film Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000002438 flame photometric detection Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/KR2017/006485 WO2018235971A1 (ko) | 2017-06-20 | 2017-06-20 | 연성 회로 기판, 이를 포함하는 전자 장치 및 연성 회로 기판의 제조 방법 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020085217A Division JP2020127054A (ja) | 2020-05-14 | 2020-05-14 | フレキシブルプリント基板、これを含む電子装置、及びフレキシブルプリント基板の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2019521503A true JP2019521503A (ja) | 2019-07-25 |
Family
ID=64737663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018540816A Pending JP2019521503A (ja) | 2017-06-20 | 2017-06-20 | フレキシブルプリント基板、これを含む電子装置、及びフレキシブルプリント基板の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2019521503A (ko) |
| CN (1) | CN111034369A (ko) |
| WO (1) | WO2018235971A1 (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022225372A1 (ko) * | 2021-04-23 | 2022-10-27 | 삼성전자 주식회사 | 카메라 모듈 및 그를 포함하는 전자 장치 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000036521A (ja) * | 1998-05-11 | 2000-02-02 | Mitsui Mining & Smelting Co Ltd | 電子部品実装用フィルムキャリアテ―プおよびその製造方法 |
| JP2005129838A (ja) * | 2003-10-27 | 2005-05-19 | Seiko Epson Corp | 回路基板、電子モジュール、回路基板の製造方法および電子モジュールの製造方法 |
| JP2007194459A (ja) * | 2006-01-20 | 2007-08-02 | Sumitomo Electric Ind Ltd | フレキシブル回路基板 |
| WO2016099011A1 (ko) * | 2014-12-15 | 2016-06-23 | 스템코 주식회사 | 연성 회로 기판과 이를 포함하는 전자 장치 및 연성 회로 기판의 제조 방법 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037353A (ja) * | 2001-07-24 | 2003-02-07 | Shindo Denshi Kogyo Kk | フレキシブル回路基板およびその製造方法 |
| KR100495932B1 (ko) * | 2003-06-20 | 2005-06-16 | 스템코 주식회사 | 필름 캐리어 테이프 및 그 제조방법 |
| KR100530749B1 (ko) * | 2003-12-09 | 2005-11-23 | 삼성테크윈 주식회사 | 연성회로기판 |
| JP5878725B2 (ja) * | 2011-10-11 | 2016-03-08 | 株式会社フジクラ | プリント配線板及びプリント配線板の製造方法 |
| JP6426067B2 (ja) * | 2015-08-06 | 2018-11-21 | 日本メクトロン株式会社 | 多層フレキシブルプリント配線板およびその製造方法 |
| KR102257253B1 (ko) * | 2015-10-06 | 2021-05-28 | 엘지이노텍 주식회사 | 연성기판 |
| KR101753692B1 (ko) * | 2016-02-05 | 2017-07-19 | 스템코 주식회사 | 연성 회로 기판, 이를 포함하는 전자 장치 및 연성 회로 기판의 제조 방법 |
-
2017
- 2017-06-20 WO PCT/KR2017/006485 patent/WO2018235971A1/ko active Application Filing
- 2017-06-20 JP JP2018540816A patent/JP2019521503A/ja active Pending
- 2017-06-20 CN CN201780009892.3A patent/CN111034369A/zh active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000036521A (ja) * | 1998-05-11 | 2000-02-02 | Mitsui Mining & Smelting Co Ltd | 電子部品実装用フィルムキャリアテ―プおよびその製造方法 |
| JP2005129838A (ja) * | 2003-10-27 | 2005-05-19 | Seiko Epson Corp | 回路基板、電子モジュール、回路基板の製造方法および電子モジュールの製造方法 |
| JP2007194459A (ja) * | 2006-01-20 | 2007-08-02 | Sumitomo Electric Ind Ltd | フレキシブル回路基板 |
| WO2016099011A1 (ko) * | 2014-12-15 | 2016-06-23 | 스템코 주식회사 | 연성 회로 기판과 이를 포함하는 전자 장치 및 연성 회로 기판의 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111034369A (zh) | 2020-04-17 |
| WO2018235971A1 (ko) | 2018-12-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180807 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190730 |
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| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20191029 |
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| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191113 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20200114 |