CN1109129C - 气体输送定量分配管 - Google Patents
气体输送定量分配管 Download PDFInfo
- Publication number
- CN1109129C CN1109129C CN00108583A CN00108583A CN1109129C CN 1109129 C CN1109129 C CN 1109129C CN 00108583 A CN00108583 A CN 00108583A CN 00108583 A CN00108583 A CN 00108583A CN 1109129 C CN1109129 C CN 1109129C
- Authority
- CN
- China
- Prior art keywords
- pipe
- gas
- inboard
- quantitative distributing
- osculum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/05—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects
- G01F1/34—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure
- G01F1/36—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure the pressure or differential pressure being created by the use of flow constriction
- G01F1/40—Details of construction of the flow constriction devices
- G01F1/42—Orifices or nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/01—Control of flow without auxiliary power
- G05D7/0186—Control of flow without auxiliary power without moving parts
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Fluid Mechanics (AREA)
- Chemical Vapour Deposition (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Description
内侧管子 | 外侧管子 | |||||||||
方案 | #排 | #孔/排 | 孔径 | 内径ID | 外径OD | #排 | #孔/排 | 孔径 | 内径ID | 外径OD |
A | 1@2@ | 3938 | 0.014 | 0.114 | 0.314 | 5 | 156 | 0.014 | 0.186 | 0.25 |
B | 1 | 39 | 0.010 | 0.114 | 0.314 | 6 | 156 | 0.114 | 0.186 | 0.25 |
C | 孔隙材料 | |||||||||
D | 1 | 39 | 0.0095 | 0.136 | 0.156 | 1 | 77 | 0.0138 | 0.261 | 0.281 |
E | 1 | 39 | 0.0095 | 0.136 | 0.156 | 3 | 3.06×0.005 | 0.261 | 0.281 |
Claims (11)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13535899P | 1999-05-21 | 1999-05-21 | |
US60/135,358 | 1999-05-21 | ||
US47044699A | 1999-12-22 | 1999-12-22 | |
US09/470,446 | 1999-12-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1274823A CN1274823A (zh) | 2000-11-29 |
CN1109129C true CN1109129C (zh) | 2003-05-21 |
Family
ID=26833237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN00108583A Expired - Fee Related CN1109129C (zh) | 1999-05-21 | 2000-05-18 | 气体输送定量分配管 |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1054311B1 (zh) |
JP (1) | JP3612002B2 (zh) |
KR (1) | KR100441293B1 (zh) |
CN (1) | CN1109129C (zh) |
CA (1) | CA2308758A1 (zh) |
DE (1) | DE60004290T2 (zh) |
SG (1) | SG89328A1 (zh) |
TW (1) | TW452635B (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030061991A1 (en) * | 2001-08-24 | 2003-04-03 | Asml Us, Inc. | Protective shield and system for gas distribution |
JP3957549B2 (ja) * | 2002-04-05 | 2007-08-15 | 株式会社日立国際電気 | 基板処埋装置 |
KR100829327B1 (ko) | 2002-04-05 | 2008-05-13 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리 장치 및 반응 용기 |
JP5008252B2 (ja) * | 2004-05-18 | 2012-08-22 | パナソニック株式会社 | 燃料電池用液体燃料収納容器及び燃料電池システム |
JP4775641B2 (ja) * | 2006-05-23 | 2011-09-21 | 株式会社島津製作所 | ガス導入装置 |
CN102586739A (zh) * | 2012-03-14 | 2012-07-18 | 无锡康力电子有限公司 | 真空镀膜用布气系统 |
CN103510045A (zh) * | 2012-06-29 | 2014-01-15 | 深圳富泰宏精密工业有限公司 | 真空镀膜用气管及应用该气管的真空镀膜装置 |
GEP20186858B (en) * | 2013-02-14 | 2018-06-11 | Alliance Magnesium | Hydrogen gas diffusion anode arrangement producing hcl |
CN104167345B (zh) * | 2013-05-17 | 2016-08-24 | 中微半导体设备(上海)有限公司 | 等离子处理装置及其气体输送装置、气体切换方法 |
CN104451583B (zh) * | 2015-01-05 | 2017-05-10 | 合肥京东方显示光源有限公司 | 磁控溅射真空室进气装置及磁控溅射设备 |
JP6549903B2 (ja) * | 2015-05-27 | 2019-07-24 | Dowaサーモテック株式会社 | Si含有DLC膜の成膜装置 |
JP6509104B2 (ja) * | 2015-09-30 | 2019-05-08 | 東京エレクトロン株式会社 | 基板液処理装置 |
CN109306458A (zh) * | 2018-12-16 | 2019-02-05 | 湖南玉丰真空科学技术有限公司 | 一种溅射阴极匀气装置 |
CN115354303B (zh) * | 2022-08-25 | 2024-01-19 | 拓荆科技(上海)有限公司 | 反应腔装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6137969A (ja) * | 1984-07-31 | 1986-02-22 | Canon Inc | プラズマcvd薄膜製造装置 |
US5423936A (en) * | 1992-10-19 | 1995-06-13 | Hitachi, Ltd. | Plasma etching system |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4369031A (en) * | 1981-09-15 | 1983-01-18 | Thermco Products Corporation | Gas control system for chemical vapor deposition system |
US4834020A (en) * | 1987-12-04 | 1989-05-30 | Watkins-Johnson Company | Atmospheric pressure chemical vapor deposition apparatus |
TW359943B (en) * | 1994-07-18 | 1999-06-01 | Silicon Valley Group Thermal | Single body injector and method for delivering gases to a surface |
US5849088A (en) * | 1998-01-16 | 1998-12-15 | Watkins-Johnson Company | Free floating shield |
-
2000
- 2000-04-07 TW TW089106456A patent/TW452635B/zh not_active IP Right Cessation
- 2000-05-16 SG SG200002705A patent/SG89328A1/en unknown
- 2000-05-18 CA CA002308758A patent/CA2308758A1/en not_active Abandoned
- 2000-05-18 CN CN00108583A patent/CN1109129C/zh not_active Expired - Fee Related
- 2000-05-18 DE DE60004290T patent/DE60004290T2/de not_active Expired - Fee Related
- 2000-05-18 EP EP00304190A patent/EP1054311B1/en not_active Expired - Lifetime
- 2000-05-19 KR KR10-2000-0026966A patent/KR100441293B1/ko not_active IP Right Cessation
- 2000-05-19 JP JP2000148939A patent/JP3612002B2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6137969A (ja) * | 1984-07-31 | 1986-02-22 | Canon Inc | プラズマcvd薄膜製造装置 |
US5423936A (en) * | 1992-10-19 | 1995-06-13 | Hitachi, Ltd. | Plasma etching system |
Also Published As
Publication number | Publication date |
---|---|
TW452635B (en) | 2001-09-01 |
KR100441293B1 (ko) | 2004-07-23 |
EP1054311A1 (en) | 2000-11-22 |
DE60004290T2 (de) | 2004-07-01 |
CN1274823A (zh) | 2000-11-29 |
KR20010087091A (ko) | 2001-09-15 |
SG89328A1 (en) | 2002-06-18 |
EP1054311B1 (en) | 2003-08-06 |
DE60004290D1 (de) | 2003-09-11 |
JP3612002B2 (ja) | 2005-01-19 |
CA2308758A1 (en) | 2000-11-21 |
JP2001026874A (ja) | 2001-01-30 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: ASML AMERICA CO.,LTD. Free format text: FORMER NAME OR ADDRESS: SILICON VALLEY GROUP, INC. Owner name: SILICON VALLEY GROUP, INC. Free format text: FORMER NAME OR ADDRESS: SILICON VALLY GROUP HEAT SYSTEM INC. |
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CP01 | Change in the name or title of a patent holder |
Patentee after: ASML US, Inc. Patentee before: SILICON VALLEY Group Inc. Patentee after: SILICON VALLEY Group Inc. Patentee before: SILICON VALLEY GROUP, THERMAL SYSTEMS LLC |
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C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: WD Ref document number: 1032096 Country of ref document: HK |