CN110880464A - Chip unloading device for semiconductor packaging process - Google Patents
Chip unloading device for semiconductor packaging process Download PDFInfo
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- CN110880464A CN110880464A CN201911129043.9A CN201911129043A CN110880464A CN 110880464 A CN110880464 A CN 110880464A CN 201911129043 A CN201911129043 A CN 201911129043A CN 110880464 A CN110880464 A CN 110880464A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a chip unloading device for a semiconductor packaging process, which comprises a support frame, wherein a workbench is arranged on the support frame, an ultrasonic generator is arranged on the workbench, a cover box is arranged on the support frame, an ultrasonic vibration head is arranged in the cover box, a receiving trough for receiving a chip is arranged at the upper end of the workbench, and the receiving trough is arranged below the ultrasonic vibration head. According to the invention, when the chip is required to be unloaded, the ultrasonic generator is started to enable the ultrasonic generator to be in linkage with the ultrasonic vibration head to vibrate, the UV adhesive tape with the chip is placed below the ultrasonic vibration head and is attached to the lower part of the ultrasonic vibration head, the chip can be rapidly separated from the UV adhesive tape under the high-frequency vibration action of the ultrasonic vibration head, and the chip can fall into the receiving trough, so that the chip can be unloaded and collected rapidly, and the working efficiency is greatly improved.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging process equipment, in particular to a chip unloading device for a semiconductor packaging process.
Background
Semiconductor packaging technology, as an indispensable part of the semiconductor manufacturing industry, directly determines the development level of semiconductor technology; the purpose of the semiconductor package is to complete the electrical interconnection between the pins of the internal circuit of the bare chip and the signal leading-out end of the external substrate, protect the bare chip, avoid the damage of foreign objects and enable the bare chip to bear certain external force. After decades of development, semiconductor packaging technology is advanced, and the packaging type shows a five-fold situation with different product applications, and from DIP, SOP, QFP, PGA, BGA to CSP to SIP, the first generation of technical indexes is advanced, which are developed according to the current assembly technology and market demand.
QFN (quad flat non-leaded package) is a more advanced packaging technology in semiconductor packaging in recent years, and the packaged product is square, and the pins are also square and arranged around the bottom of the substrate in parallel, and the packaged product has small size, short electrical path, good electrical performance and high reliability, and is favored by the market, and the main technology thereof is as follows: (1) thinning the wafer; (2) cutting the wafer into single chips; (3) bonding the chip and the lead frame; (4) bonding a lead; (5) plastic packaging; (6) printing characters; (7) separating the chips; (8) grabbing (chip separation from lead frame); (9) testing; (10) and (7) packaging and delivering.
In the process, after the chip is subjected to plastic packaging and printing, the product is subjected to a cutting (chip separation) step; as shown in fig. 1, before cutting, one side of the lead frame bearing the chip, on which the plastic package compound is formed, is adhered to a UV tape 1, the UV tape is adhered to a thin iron ring 2, and then the thin iron ring 2 is placed in an automatic cutting machine to cut the lead frame; after cutting, the lead frame units are separated from each other to form a single plastic-sealed chip, the adhesive force of the UV adhesive tape 1 is greatly reduced by ultraviolet irradiation, and the single plastic-sealed chip can be easily taken down by only slightly grabbing.
In order to improve the work efficiency of chip unloading, the prior patent, chinese invention patent with publication number CN201868404U, specifically discloses a chip unloading device for semiconductor packaging process, which comprises a chip unloading part and a packaging material receiving part located below the chip unloading part, wherein the chip unloading part and the packaging material receiving part are connected by a bracket; chip uninstallation portion is equipped with a funnel including a horizontal roof, this roof middle part, and the upper shed edge of funnel flushes with horizontal roof's upper surface, and the both ends that just are located the roof around the upper shed edge of funnel are equipped with the joint part of card establishing thin hoop respectively, lie in on the roof and form a thin hoop between two joint parts and place the region, should place and be equipped with in the region and be convenient for take off taking of structure of thin hoop.
When the structure is used for unloading the chip, two ends of the thin iron ring are clamped between the two clamping strips to fix the thin iron ring, one side of the thin iron ring, which is adhered with the chip, faces downwards, a packaging tool is placed in the fixing groove below the funnel, the UV adhesive tape is manually scraped back and forth by using a round tool (such as a bottle cap or other smooth tool without edges and corners), although part of the chip is separated from the UV adhesive tape after being stressed, the chip and the UV adhesive tape still have viscosity, the chip cannot be completely separated from the UV adhesive tape, and the UV adhesive tape is pushed by other vibrating tools to vibrate the UV adhesive tape, so that the chip can be completely separated from the UV adhesive tape. Therefore, the chip unloading mode is complicated, and the chip cannot be completely separated from the UV adhesive tape, so that the chip unloading speed is low, and the unloading work efficiency is low.
Disclosure of Invention
The invention provides a chip unloading device for a semiconductor packaging process, which has the advantage of quickly unloading chips and can greatly improve the working efficiency.
The technical purpose of the invention is realized by the following technical scheme:
the utility model provides a chip uninstallation device for semiconductor package technology, includes the support frame, be provided with the workstation on the support frame, be provided with supersonic generator on the workstation, be provided with the cover case on the support frame, the cover incasement is provided with the ultrasonic vibration head, the ultrasonic vibration head extends to the below of cover case, the ultrasonic vibration head links with supersonic generator mutually, the workstation upper end is provided with the silo of accepting that is used for accepting the chip, accept the silo setting in the below of ultrasonic vibration head.
Through adopting above-mentioned technical scheme, when needing uninstallation chip, start supersonic generator, make supersonic generator linkage ultrasonic vibration head vibrate, place the UV sticky tape that has the chip in the below of ultrasonic vibration head, and make the UV sticky tape laminate mutually with the below of ultrasonic vibration head, under the high-frequency vibration effect of ultrasonic vibration head, the chip can be quick with UV sticky tape phase separation, the chip can fall into and accept the silo in, thereby the uninstallation that can be quick collects the chip, great improvement work efficiency.
The invention is further configured to: the lower end of the ultrasonic vibration head is arc-shaped.
Through adopting above-mentioned technical scheme, circular-arc setting can make ultrasonic vibration head in butt UV sticky tape upper surface, and the integrality of UV sticky tape can not destroyed to the ultrasonic vibration head, can prevent that cracked phenomenon from appearing in the UV sticky tape to can guarantee the smooth uninstallation of chip.
The invention is further configured to: the utility model discloses a supporting structure, including workstation upper end, supporting mechanism sets up the draw-in groove in first backup pad upper end, the supporting structure includes the first backup pad of setting in the workstation upper end, with first backup pad upper end fixed connection's fixed frame, set up in first backup pad upper end draw-in groove, accept silo and draw-in groove sliding joint cooperation, fixed frame upper end fixedly connected with places the board, the charging chute has been seted up on the fixed frame, place fixedly connected with limit baffle on the board, limit baffle encloses synthetic shape and corresponds with thin iron ring phase-match.
Through adopting above-mentioned technical scheme, when uninstalling the chip, can will accept silo and draw-in groove slip joint cooperation, and place thin iron ring in limit baffle, make chip place one face downwards, when thin iron ring and ultrasonic vibration head looks butt, the phenomenon that thin iron ring is difficult to take place to remove, thereby thin iron ring is difficult to take place to drop, when ultrasonic vibration head and UV sticky tape upper end looks butt, the chip can break away from mutually with the UV sticky tape, simultaneously more stable when uninstalling the chip, the phenomenon that thin iron ring and UV sticky tape can not take place to slide, guarantee that the chip is smooth drops to accepting the silo from the charging conduit in, accept the silo and first backup pad looks joint cooperation, thereby can guarantee to accept the silo more stable when accepting the chip.
The invention is further configured to: the magnetic block is fixedly connected in the clamping groove and is matched with the receiving trough.
Through adopting above-mentioned technical scheme, when accepting silo and draw-in groove looks joint cooperation, the magnetic path can with accept the silo looks joint cooperation to can guarantee to accept the silo more stable with first backup pad looks joint cooperation, can not take place to rock the phenomenon that drops when accepting the chip.
The invention is further configured to: the workstation upper end is provided with the reciprocating motion mechanism that the drive accepting mechanism removed, reciprocating motion mechanism including set up in the workstation upper end first plummer, with first plummer sliding connection's second plummer, with second plummer sliding connection's third plummer, first backup pad fixed connection is in third plummer upper end, the direction of sliding of second plummer sets up with the direction of sliding mutually perpendicular of third plummer.
Through adopting above-mentioned technical scheme, when uninstalling the chip, the upper end looks butt of ultrasonic vibration head and UV sticky tape, make the second plummer slide on first plummer, make the third plummer slide on the second plummer simultaneously, can drive first backup pad and remove when second plummer and third plummer slide, thereby can make the chip drop automatically, do not need the manual work to hold the thin hoop and just can realize droing of chip, thereby can make the uninstallation convenience more of chip, great improvement work efficiency.
The invention is further configured to: the first plummer upper end is provided with first electronic guide rail, the second plummer sets up with first electronic guide rail phase-match, second plummer upper end is provided with the electronic guide rail of second, the electronic guide rail of second sets up with third plummer phase-match.
Through adopting above-mentioned technical scheme, when uninstalling the chip, start first electronic guide rail and the electronic guide rail of second, make first electronic guide rail drive the second plummer and remove, the electronic guide rail of second drives the third plummer and removes to can make the third plummer drive supporting mechanism and remove, can be that the abundant and ultrasonic vibration head looks butt of UV sticky tape at the in-process that removes, make the more swift facility of uninstallation of chip.
The invention is further configured to: the upper end of the workbench is fixedly connected with an oil cylinder, and a piston rod of the oil cylinder is fixedly connected with the lower end of the first bearing table.
Through adopting above-mentioned technical scheme, when placing and changing thin hoop, can start the hydro-cylinder, make the first plummer of hydro-cylinder linkage, can make first plummer reciprocate, make things convenient for the change of thin hoop and UV sticky tape to also can make UV sticky tape and ultrasonic vibration head looks butt, guarantee the uninstallation smoothly of chip.
The invention is further configured to: the fan is fixedly connected in the cover box and is arranged opposite to the ultrasonic vibration head.
Through adopting above-mentioned technical scheme, when the operation of ultrasonic vibration head, can start the fan, the fan can cool down the cooling to the ultrasonic vibration head, can guarantee the smooth operation of ultrasonic vibration head.
In conclusion, the beneficial technical effects of the invention are as follows:
1. when the chips need to be unloaded, the ultrasonic generator is started to enable the ultrasonic generator to be in linkage with the ultrasonic vibration head to vibrate, the UV adhesive tape with the chips is placed below the ultrasonic vibration head and is attached to the lower portion of the ultrasonic vibration head, the chips can be rapidly separated from the UV adhesive tape under the high-frequency vibration effect of the ultrasonic vibration head, and the chips can fall into the receiving material groove, so that the chips can be rapidly unloaded and collected, and the working efficiency is greatly improved;
2. when the chip is unloaded, the ultrasonic vibration head is abutted against the upper end of the UV adhesive tape, so that the second bearing table slides on the first bearing table, the third bearing table slides on the second bearing table, and the first supporting plate can be driven to move when the second bearing table and the third bearing table slide, so that the chip can automatically fall off, and the chip can fall off without manually holding a thin iron ring, so that the chip can be unloaded more conveniently, and the working efficiency is greatly improved;
3. when placing and changing thin hoop, can start the hydro-cylinder, make the first plummer of hydro-cylinder linkage, can make first plummer reciprocate, make things convenient for the change of thin hoop and UV sticky tape to also can make UV sticky tape and ultrasonic vibration head looks butt, guarantee the uninstallation smoothly of chip.
Drawings
FIG. 1 is a schematic diagram showing the detailed structure of a UV tape and a thin iron ring in the background art;
FIG. 2 is a schematic view of the overall structure of an unloading apparatus according to a first embodiment;
FIG. 3 is a schematic view of the entire structure of an unloading apparatus for embodying the second embodiment;
FIG. 4 is a schematic view showing a detailed structure for embodying the reciprocating mechanism;
FIG. 5 is a schematic diagram of a specific structure for embodying the carrying mechanism;
FIG. 6 is a schematic diagram of a structure for embodying specific positions of magnetic blocks.
In the figure, 1, UV adhesive tape; 2. a thin iron ring; 3. a support frame; 4. a work table; 5. an ultrasonic generator; 6. a cover box; 7. an ultrasonic vibration head; 8. a receiving trough; 9. a carrying mechanism; 91. a first support plate; 92. a fixing frame; 93. a card slot; 931. a magnetic block; 10. placing the plate; 101. a charging chute; 102. a limit baffle; 11. a reciprocating mechanism; 111. a first carrier stage; 112. a second carrier table; 113. a third bearing table; 12. a first motorized rail; 13. a second motorized rail; 14. an oil cylinder; 15. a fan.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The first embodiment is as follows: a chip unloading device for a semiconductor packaging process comprises a support frame 3, a workbench 4 is arranged on the support frame 3, an ultrasonic generator 5 is arranged on the workbench 4, a cover box 6 is arranged on the support frame 3, an ultrasonic vibration head 7 is arranged in the cover box 6, the ultrasonic vibration head 7 extends to the lower part of the cover box 6, the ultrasonic vibration head 7 is linked with the ultrasonic generator 5, a fan 15 is fixedly connected to the upper end of the cover box 6, the fan 15 is a heat dissipation fan, an air outlet of the fan 15 is arranged opposite to the ultrasonic vibration head 7, when the chip is unloaded, the ultrasonic generator 5 can be started, the ultrasonic generator 5 can be linked with the ultrasonic vibration head 7, so that the ultrasonic vibration head 7 generates high-frequency vibration, and simultaneously, the fan 15 is started, so that the fan 15 acts on the ultrasonic vibration head 7, and the ultrasonic vibration head 7 is ensured to vibrate smoothly.
As shown in fig. 2, the lower end of the ultrasonic vibration head 7 is arc-shaped, and when the arc end of the ultrasonic vibration head 7 abuts against the UV tape 1, the UV tape 1 is not broken, the integrity of the UV tape 1 is ensured, and the chip can be smoothly separated from the UV tape 1.
As shown in fig. 2, a receiving trough 8 for receiving the chip is placed at the upper end of the workbench 4, the receiving trough 8 is arranged below the ultrasonic vibration head 7, when the chip is unloaded, the thin iron ring 2 and the UV adhesive tape 1 are placed at the upper end of the receiving trough 8, and the position of the chip corresponds to the inner cavity of the receiving trough 8.
The specific implementation process comprises the following steps: when the chip needs to be unloaded, the receiving trough 8 and the thin iron ring 2 are manually lifted, the upper end of the UV adhesive tape 1 is abutted to the ultrasonic vibration head 7, the chip can be separated from the UV adhesive tape 1 when the ultrasonic vibration head 7 vibrates at high frequency, and the chip falls into the receiving trough 8.
Example two: a chip unloading device for a semiconductor packaging process is characterized in that two oil cylinders 14 are fixedly connected to the upper end of a workbench 4, the two oil cylinders 14 are linked and can run synchronously, a reciprocating mechanism 11 is arranged at the upper end of each oil cylinder 14, and the reciprocating mechanism 11 comprises a first bearing platform 111 arranged at the upper end of the workbench 4, a second bearing platform 112 connected with the first bearing platform 111 in a sliding mode, and a third bearing platform 113 connected with the second bearing platform 112 in a sliding mode, as shown in FIG. 3.
As shown in fig. 4, the upper end of the first loading platform 111 is fixedly connected with the first electric guide rail 12, the second loading platform 112 is linked with the first electric guide rail 12 to start the first electric guide rail 12, and the second loading platform 112 can slide on the upper end of the first loading platform 111. The upper end of the second bearing platform 112 is fixedly connected with a second electric guide rail 13, the third bearing platform 113 is linked with the second electric guide rail 13 to start the second electric guide rail 13, and the third bearing platform 113 can move at the upper end of the second bearing platform 112.
As shown in fig. 4, the first motor-driven rail 12 is perpendicular to the second motor-driven rail 13, and the first motor-driven rail 12 is coupled to the second motor-driven rail 13, so that the third platform 113 can be moved at will, and the thin iron ring 2 can be moved when the third platform is moved.
As shown in fig. 5, a receiving mechanism 9 is arranged at the upper end of the third bearing platform 113, the receiving mechanism 9 includes a first supporting plate 91 fixedly connected to the upper end of the third bearing platform 113, a fixing frame 92 fixedly connected to the upper end of the first supporting plate 91, and a clamping groove 93 arranged at the upper end of the first supporting plate 91, the receiving trough 8 is matched with the clamping groove 93 in a sliding clamping manner, the upper end of the fixing frame 92 is fixedly connected with a placing plate 10, a blanking trough 101 is arranged on the placing plate 10, a limit baffle 102 is fixedly connected to the placing plate 10, and the limit baffle 102 encloses a synthetic shape corresponding to the matching of the thin iron ring 2.
As shown in fig. 5, when unloading the chip, the thin iron ring 2 is placed on the upper end of the placing plate 10, the chip faces downward, and corresponds to the charging chute 101, and at the same time, the receiving chute 8 is engaged with the engaging groove 93, and the upper end of the receiving chute 8 is attached to the lower end of the placing plate 10.
As shown in fig. 6, fixedly connected with magnetic block 931 in the slot 93, magnetic block 931 with accept the silo 8 phase-match setting, when accepting the silo 8 and the slot 93 looks joint cooperation, magnetic block 931 can with accept the silo 8 looks joint cooperation to when can making the third plummer 113 drive and accept the silo 8 and remove, accept the silo 8 and can be comparatively steady place in first backup pad 91 upper end.
The specific implementation process comprises the following steps: when the chip needs to be unloaded, the thin iron ring 2 is placed at the upper end of the placing plate 10, the chip faces downwards and corresponds to the charging chute 101, meanwhile, the receiving chute 8 and the clamping groove 93 are in clamping fit, the oil cylinder 14 is started, the two oil cylinders 14 synchronously abut against the first bearing platform 111 to move upwards, and when the first bearing platform 111 moves upwards, the upper end face of the UV adhesive tape 1 can abut against the ultrasonic vibration head 7.
Start first electronic guide rail 12 and the electronic guide rail 13 of second, can make third plummer 113 remove under the drive of first electronic guide rail 12 and the electronic guide rail 13 of second, at the in-process that removes, UV sticky tape 1 is moved in the support that ultrasonic vibration head 7 can be abundant, makes the smooth and UV sticky tape 1 phase separation of chip to drop to accepting in the silo 8.
The embodiments of the present invention are preferred embodiments of the present invention, and the scope of the present invention is not limited by these embodiments, so: all equivalent changes made according to the structure, shape and principle of the invention are covered by the protection scope of the invention.
Claims (8)
1. A chip uninstallation device for semiconductor packaging technology, includes support frame (3), be provided with workstation (4) on support frame (3), its characterized in that: be provided with supersonic generator (5) on workstation (4), be provided with cover case (6) on support frame (3), be provided with ultrasonic vibration head (7) in cover case (6), ultrasonic vibration head (7) extend to the below of cover case (6), ultrasonic vibration head (7) and supersonic generator (5) link mutually, workstation (4) upper end is provided with accepts silo (8) of accepting that is used for accepting the chip, accept silo (8) and set up the below at ultrasonic vibration head (7).
2. The chip unloading device for semiconductor packaging process according to claim 1, wherein: the lower end of the ultrasonic vibration head (7) is arc-shaped.
3. The chip unloading device for semiconductor packaging process according to claim 1, wherein: workstation (4) upper end is provided with supporting mechanism (9), supporting mechanism (9) including set up in first backup pad (91) of workstation (4) upper end, with fixed frame (92) of first backup pad (91) upper end fixed connection, set up draw-in groove (93) in first backup pad (91) upper end, accept silo (8) and draw-in groove (93) sliding joint cooperation, fixed frame (92) upper end fixedly connected with places board (10), place and seted up chute (101) on board (10), place fixedly connected with limit baffle (102) on board (10), limit baffle (102) enclose synthetic shape and thin hoop (2) phase-match and correspond.
4. The chip unloading device for semiconductor packaging process according to claim 3, wherein: the clamping groove (93) is internally and fixedly connected with a magnetic block (931), and the magnetic block (931) is matched with the receiving trough (8).
5. The chip unloading device for semiconductor packaging process according to claim 3, wherein: workstation (4) upper end is provided with reciprocating motion mechanism (11) that drive supporting mechanism (9) removed, reciprocating motion mechanism (11) including set up first plummer (111) in workstation (4) upper end, with first plummer (111) sliding connection's second plummer (112), with second plummer (112) sliding connection's third plummer (113), first backup pad (91) fixed connection is in third plummer (113) upper end, the direction of sliding of second plummer (112) sets up with the direction of sliding mutually perpendicular of third plummer (113).
6. The chip unloading device for semiconductor packaging process as claimed in claim 5, wherein: first plummer (111) upper end is provided with first electronic guide rail (12), second plummer (112) and first electronic guide rail (12) phase-match set up, second plummer (112) upper end is provided with the electronic guide rail of second (13), the electronic guide rail of second (13) and third plummer (113) phase-match set up.
7. The chip unloading device for semiconductor packaging process as claimed in claim 5, wherein: workstation (4) upper end fixedly connected with hydro-cylinder (14), the piston rod and the first plummer (111) lower extreme fixed connection of hydro-cylinder (14).
8. The chip unloading device for semiconductor packaging process according to claim 1, wherein: the fan (15) is fixedly connected in the cover box (6), and the fan (15) is arranged opposite to the ultrasonic vibration head (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911129043.9A CN110880464A (en) | 2019-11-18 | 2019-11-18 | Chip unloading device for semiconductor packaging process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911129043.9A CN110880464A (en) | 2019-11-18 | 2019-11-18 | Chip unloading device for semiconductor packaging process |
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| CN110880464A true CN110880464A (en) | 2020-03-13 |
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| CN201911129043.9A Pending CN110880464A (en) | 2019-11-18 | 2019-11-18 | Chip unloading device for semiconductor packaging process |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113658899A (en) * | 2021-08-11 | 2021-11-16 | 日照东讯电子科技有限公司 | CSP core stripping machine |
| CN113707582A (en) * | 2020-05-22 | 2021-11-26 | 台湾爱司帝科技股份有限公司 | Chip transfer system, chip transfer method and chip transfer module |
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| JPH02230754A (en) * | 1989-03-03 | 1990-09-13 | Furukawa Electric Co Ltd:The | Peeling of thin film chip from adhesive sheet |
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| CN104051281A (en) * | 2014-06-13 | 2014-09-17 | 武汉理工大学 | Device and method for conducting plastic package forming and bottom-filling on flip chip through ultrasonic vibration assistance |
| CN208706595U (en) * | 2018-09-11 | 2019-04-05 | 苏州希迈克精密机械科技有限公司 | A kind of novel microelectronic element stripping machine |
| CN109747085A (en) * | 2019-03-13 | 2019-05-14 | 陈官海 | A kind of ultrasonic wave demoulding mechanism |
| CN209616145U (en) * | 2019-03-13 | 2019-11-12 | 陈官海 | A kind of ultrasonic wave demoulding mechanism |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02230754A (en) * | 1989-03-03 | 1990-09-13 | Furukawa Electric Co Ltd:The | Peeling of thin film chip from adhesive sheet |
| JPH04263436A (en) * | 1991-02-18 | 1992-09-18 | Nippon Telegr & Teleph Corp <Ntt> | Diebonding device |
| CN202363433U (en) * | 2011-12-12 | 2012-08-01 | 大连佳峰电子有限公司 | Ultrasonic ejection structure |
| CN104051281A (en) * | 2014-06-13 | 2014-09-17 | 武汉理工大学 | Device and method for conducting plastic package forming and bottom-filling on flip chip through ultrasonic vibration assistance |
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| CN209616145U (en) * | 2019-03-13 | 2019-11-12 | 陈官海 | A kind of ultrasonic wave demoulding mechanism |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113707582A (en) * | 2020-05-22 | 2021-11-26 | 台湾爱司帝科技股份有限公司 | Chip transfer system, chip transfer method and chip transfer module |
| CN113658899A (en) * | 2021-08-11 | 2021-11-16 | 日照东讯电子科技有限公司 | CSP core stripping machine |
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Application publication date: 20200313 |