CN111816576B - 3D packaging process - Google Patents
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- CN111816576B CN111816576B CN202010625424.2A CN202010625424A CN111816576B CN 111816576 B CN111816576 B CN 111816576B CN 202010625424 A CN202010625424 A CN 202010625424A CN 111816576 B CN111816576 B CN 111816576B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
Abstract
The invention provides a 3D packaging process, and belongs to the technical field of semiconductors. The packaging process solves the technical problems of low production efficiency and the like of the existing packaging process. The 3D packaging process is characterized by comprising the following steps: a. thinning: thinning the wafer in a mechanical grinding mode, polishing the wafer to reduce a damage layer on the surface of the wafer, and thinning the wafer to a final thickness of 260 and 270 mu m; b. scribing: scribing the thinned wafer by a scribing machine; c. a first layer of chip bonding; d. curing the conductive adhesive; e. a second layer of chip bonding; f. curing the insulating glue; g. pressure welding; h. plastic packaging; i. plastic punching; j. removing flash; k. electroplating; l, printing; printing the information of the product on the electroplated semi-finished product through a marking machine; m, cutting ribs and forming; n, detection: and detecting the finished product through a testing device. The invention has the advantages of simple process and high production efficiency.
Description
Technical Field
The invention belongs to the technical field of semiconductors, relates to a packaging process, and particularly relates to a 3D packaging process.
Background
The integrated circuit packaging technology has been developed following the development of chips, the packaging density has been improved continuously from single chip packaging to 3D packaging, and the miniaturization and functionalization of electronic information products are strongly promoted. The 3D package is the mainstream of the packaging technology of the communication semiconductor device because of its many significant advantages such as high density integration and multiple functions, and is particularly suitable for applications in the fields of flash control, mobile communication and mobile multimedia. The 3D packaging can utilize various advanced packaging technologies such as flip chip, chip-on-chip, plastic package body stacking and the like, so that the marketization period of the product is greatly shortened. Meanwhile, because the signal transmission distance is shortened and the anti-electromagnetic interference capability is strong, the semiconductor device packaged in a 3D packaging mode usually has higher electrical performance. The latest 3D packaging technology can integrate and embed passive devices, antennas and other components, so that the product has the functions of low cost, small area, high frequency and high speed.
Compared with the traditional package, the 3D package system package has the advantages of multifunction, low power consumption, better performance, lower cost, smaller volume, lighter weight and shorter development period, and it is necessary to design a 3D package process.
Disclosure of Invention
The invention aims to solve the problems in the prior art, provides a 3D packaging process, and has the advantages of simple process and high production efficiency.
The purpose of the invention can be realized by the following technical scheme: A3D packaging process is characterized by comprising the following steps:
a. thinning: thinning the wafer in a mechanical grinding mode, polishing the wafer to reduce a damage layer on the surface of the wafer, and thinning the wafer to a final thickness of 260-;
b. scribing: scribing the thinned wafer by a scribing machine;
c. a first layer of chip bonding: adhering the first layer of single chip to a base of a lead frame by a chip mounter, wherein the glue used is conductive glue;
d. and (3) curing the conductive adhesive: c, thermally curing the semi-finished product in the step c;
e. second layer chip bonding: respectively sticking the second layer of the plurality of chips to a bracket of the lead frame by a chip mounter, wherein the used glue is insulating glue;
f. and (3) curing the insulating glue: e, thermally curing the semi-finished product in the step e;
g. pressure welding: carrying out pressure welding on the first layer chip and the second layer chip by using a hot-press welding machine, adjusting the voltage of a pressure welding control console to control the temperature of the substrate to be 150-200 ℃, and keeping the temperature of a knife of the pressure welding head to be 150 ℃;
h. plastic packaging: plastically packaging the semi-finished product subjected to pressure welding by a plastic packaging machine;
i. punching and molding;
j. removing flash; soaking the semi-finished product in the step i in a soaking box filled with a flash removing solution, and taking out after flash is removed;
k. electroplating: electroplating the semi-finished pins with flash removed by an electroplating device, wherein a layer of copper with the thickness of 6-12 mu m is electroplated, and a layer of tin with the thickness of 12-16 mu m is electroplated;
l, printing; printing the information of the product on the electroplated semi-finished product through a marking machine;
m, cutting ribs and forming: performing bar cutting and forming on the semi-finished product according to a specified size by a bar cutting and forming system to obtain a finished product;
n, detection: and detecting the finished product through a testing device.
By adopting the process, the process flow is simplified, and the method has the advantages of simple process and high production efficiency.
And e, adopting epoxy resin film adhesive as the insulating adhesive in the step e, and adopting an ESEC2008XP chip mounter as the chip mounter.
And d, performing plastic packaging in the step h by using glue pouring type plastic packaging.
And (f) adopting an NT9118 deflashing solution as the deflashing solution in the step j.
Step m in the rib cutting forming system, including the base, loading attachment, rib cutting forming device and unloader have set gradually on the base, the base on be provided with the step-by-step material feeding unit who is used for carrying the work piece, step-by-step material feeding unit is located between loading attachment and the rib cutting forming device, unloader include mount table, blanking pipe, cylinder, pay-off piece and a plurality of discharging pipe, the mount table is fixed on the base, and the mount table sets up with the base is perpendicular, the blanking pipe is fixed in one side of mount table, the one end and the blanking pipe of discharging pipe are linked together, the other end and the rib cutting forming device of discharging pipe are connected, the discharging pipe still is connected with a vibrations structure, the cylinder is fixed on the mount table, and the piston rod level of cylinder sets up, the pay-off piece is fixed on the piston rod of cylinder, and the pay-off piece is located the blanking pipe.
Structure more than adopting, the work piece carries out the material loading through loading attachment, and step-by-step material feeding unit carries the work piece from loading attachment to carry out bar cutting and shaping in the bar cutting forming device, under the action of gravity, during the work piece after the processing was accomplished passes through the discharging pipe and gets into blanking pipe, is provided with the vibrations structure on the discharging pipe, prevents that the work piece card from expecting, and the cylinder drives pay-off piece propelling movement work piece simultaneously, and the work piece realizes the unloading under the combined action of gravity and cylinder, has the advantage that work efficiency is high.
The vibration structure comprises a motor, an eccentric wheel, a vibration plate, a sliding seat and a spring, the motor is fixed on the mounting table, an output shaft of the motor is vertically arranged upwards, the eccentric wheel is fixed on the output shaft of the motor, the sliding seat is fixed on the mounting table, the vibration plate is arranged on the sliding seat in a sliding mode and is connected with the discharge pipe, one end of the spring is connected with the vibration plate, the other end of the spring is connected with the sliding seat, and under the elastic action of the spring, the vibration plate is abutted against the eccentric wheel.
By adopting the structure, the motor drives the eccentric wheel to rotate, the vibrating plate is abutted against the eccentric wheel under the elastic action of the spring, and the vibrating plate realizes back-and-forth vibration under the action of the eccentric wheel and the spring, so that the discharging pipe is driven to vibrate, the workpiece is prevented from being clamped during discharging, and the feeding device has the advantage of good using effect.
Step-by-step material feeding unit include spout and two tracks, the spout is seted up on the base, two track parallel arrangement just all fix on the base, be provided with a plurality of drive structures that can the back and forth movement on the track.
By adopting the structure, the feeding efficiency of the workpiece is improved.
And a blanking hopper for blanking waste materials is also arranged on the bar cutting forming device.
By adopting the structure, the feeding hopper is arranged, so that the waste material feeding is facilitated.
The blanking pipe is L-shaped.
By adopting the structure, the blanking pipe is L-shaped, so that the workpiece can fall conveniently.
Step n in testing arrangement, including the test box, test box one side has the opening, the box on be provided with the chamber door through the hinge, the chamber door can with the opening seal, the box internal fixation has a plurality of placing mechanism that are used for placing multi-chip module, still is fixed with the test structure who is used for testing multi-chip module on the box, placing mechanism include mounting panel, left side regulation structure, right side regulation structure, level measurement structure and a plurality of cards that are used for the card to establish multi-chip module establish the seat, left side regulation structure and right side regulation structure set up respectively on the test box, the one end of mounting panel is adjusted structurally through a plurality of springs one, the other end of mounting panel sets up on right side regulation structure through a plurality of springs two, the card is established the seat and is fixed on the mounting panel, the level measurement structure sets up on the mounting panel.
Structure more than adopting, be provided with the chamber door through the hinge, the chamber door can with the opening seal, can prevent that the dust from getting into the test box, be provided with left regulation structure and right regulation structure simultaneously, can carry out the accuracy to the mounting panel and adjust, have better adaptability, the levelness of mounting panel can be measured to the level measurement structure, conveniently adjusts the levelness of mounting panel, has excellent in use effect's advantage.
The left adjusting structure comprises a left screw rod, a left adjusting piece and a left base, the left screw rod is fixedly connected to the testing box body, a threaded hole is formed in the left adjusting piece, the left adjusting piece is connected with the left screw rod in a matched mode, the left base is rotatably arranged on the left adjusting piece, and the left base is connected with the first spring.
Structure more than adopting, rotatory left regulating part, under the cooperation of left screw rod, the height of adjustable left side base to adjust the left height of mounting panel.
The right adjusting structure comprises a right screw rod, a right adjusting piece and a right base, the right screw rod is fixedly connected to the test box body, the right adjusting piece is provided with a threaded hole and is connected with the right screw rod in a matched mode, the right base is rotatably arranged on the right adjusting piece, and the right base is connected with the spring two phase.
By adopting the structure, the right adjusting piece is rotated, and the height of the right base can be adjusted under the matching of the right screw rod, so that the height of the right side of the mounting plate is adjusted.
The horizontal measurement structure include scale, connecting wire and balancing weight, the scale is installed on the mounting panel through two connecting rods, the one end of connecting wire is fixed on the mounting panel, the other end of connecting wire is connected with the balancing weight.
Structure more than adopting through setting up the balancing weight for the mounting panel is more firm, sets up the scale simultaneously, when carrying out the levelness adjustment to the mounting panel, conveniently calibrates, has convenient to use's advantage.
The testing box body is provided with a fan which is communicated with the testing box body, and the testing box body is also provided with a plurality of air outlets.
Structure more than adopting, through setting up the fan, seting up the air outlet, conveniently cool down in the test box, prevent that the too high temperature of multi-chip assembly from influencing the effect of test.
The door is also fixed with a handle which is convenient for opening the door.
By adopting the structure, the door of the box can be opened and closed conveniently by arranging the handle.
Compared with the prior art, the invention has the following advantages: simplifies the process flow, and has the advantages of simple process and high production efficiency.
Drawings
FIG. 1 is a process flow diagram of the present invention.
Fig. 2 is a schematic plan view of the rib cutting and forming system of the present invention.
Fig. 3 is a schematic plan view of a blanking device of the rib cutting and forming system of the invention.
FIG. 4 is a schematic plan view of the testing apparatus of the present invention.
FIG. 5 is a schematic cross-sectional view of a testing device according to the present invention.
In the figure, 1, a base; 2. a feeding device; 3. a rib cutting and forming device; 4. a drive structure; 5. a chute; 6. a track; 7. an installation table; 8. a blanking pipe; 9. a cylinder; 10. a feeding block; 11. a discharge pipe; 12. a motor; 13. an eccentric wheel; 14. a vibration plate; 15. a sliding seat; 16. a spring; 17. feeding a hopper; 21. testing the box body; 21a and an air outlet; 22. a hinge; 23. a box door; 24. testing the structure; 25. mounting a plate; 26. a clamping seat; 27. a first spring; 28. a second spring; 29. a left screw; 30. a left adjustment member; 31. a left base; 33. a right screw; 34. a right adjustment member; 35. a right base; 37. a graduated scale; 38. connecting wires; 39. a balancing weight; 40. a connecting rod; 41. a fan; 42. a handle.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
As shown in fig. 1 to 5, the 3D packaging process, in this embodiment, includes the following steps:
a. thinning: thinning the wafer in a mechanical grinding mode, polishing the wafer to reduce a damage layer on the surface of the wafer, and thinning the wafer to a final thickness of 260 and 270 mu m;
b. scribing: scribing the thinned wafer by a scribing machine;
c. a first layer of chip bonding: adhering the first layer of single chip to a base of a lead frame by a chip mounter, wherein the glue used is conductive glue;
d. and (3) curing the conductive adhesive: c, thermally curing the semi-finished product in the step c;
e. second layer chip bonding: respectively sticking the second layer of the plurality of chips to a bracket of the lead frame by a chip mounter, wherein the used glue is insulating glue;
f. and (3) curing the insulating glue: e, thermally curing the semi-finished product in the step e;
g. pressure welding: carrying out pressure welding on the first layer chip and the second layer chip by using a hot-press welding machine, adjusting the voltage of a pressure welding control console to control the temperature of the substrate to be 150-200 ℃, and keeping the temperature of a knife of the pressure welding head to be 150 ℃;
h. plastic packaging: plastically packaging the semi-finished product subjected to pressure welding by a plastic packaging machine;
i. punching and molding;
j. removing flash; soaking the semi-finished product in the step i in a soaking box filled with a flash removing solution, and taking out after flash is removed;
k. electroplating: electroplating the pin of the semi-finished product after the flash is removed by an electroplating device, wherein a layer of copper with the thickness of 6-12 mu m is electroplated, and a layer of tin with the thickness of 12-16 mu m is electroplated;
l, printing; printing the information of the product on the electroplated semi-finished product through a marking machine;
m, cutting ribs and forming: performing bar cutting and forming on the semi-finished product according to a specified size by a bar cutting and forming system to obtain a finished product;
n, detection: and detecting the finished product through a testing device.
By adopting the process, the process flow is simplified, and the method has the advantages of simple process and high production efficiency.
And e, adopting epoxy resin film adhesive as the insulating adhesive in the step e, and adopting an ESEC2008XP chip mounter as the chip mounter.
And d, performing plastic packaging in the step h by using glue pouring type plastic packaging.
And (4) adopting the deflashing solution of NT9118 type in the step j.
The rib cutting forming system in the step m comprises a base 1, a feeding device 2, a rib cutting forming device 3 and a blanking device are sequentially arranged on the base 1, a stepping feeding device used for conveying workpieces is arranged on the base 1, the stepping feeding device is positioned between the feeding device 2 and the rib cutting forming device 3, the blanking device comprises an installation table 7, a blanking pipe 8, an air cylinder 9, a feeding block 10 and a plurality of discharging pipes 11, the installation table 7 is fixed on the base 1, the mounting table 7 is perpendicular to the base 1, the blanking pipe 8 is fixed on one side of the mounting table 7, one end of the discharge pipe 11 is communicated with the blanking pipe 8, the other end of the discharge pipe 11 is connected with the rib cutting forming device 3, the discharge pipe 11 is also connected with a vibration structure, the air cylinder 9 is fixed on the mounting table 7, and the piston rod of cylinder 9 sets up horizontally, and pay-off block 10 is fixed on the piston rod of cylinder 9, and pay-off block 10 is located blanking pipe 8.
Structure more than adopting, the work piece carries out the material loading through loading attachment 2, step-by-step material feeding unit carries the work piece from loading attachment 2 to carry out bar cutting and shaping in bar cutting forming device 3, under the action of gravity, the work piece after the processing is accomplished passes through during discharging pipe 11 gets into blanking pipe 8, be provided with the vibrations structure on discharging pipe 11, prevent work piece card material, in this embodiment, because the work piece size is inconsistent, adopt traditional equipment to block the material easily, cylinder 9 drives pay-off piece 10 propelling movement work piece simultaneously, the work piece is under gravity and cylinder 9's combined action, realize the unloading, the advantage that work efficiency is high has.
The vibration structure comprises a motor 12, an eccentric wheel 13, a vibration plate 14, a sliding seat 15 and a spring 16, wherein the motor 12 is fixed on the mounting table 7, an output shaft of the motor 12 is vertically arranged upwards, the eccentric wheel 13 is fixed on the output shaft of the motor 12, the sliding seat 15 is fixed on the mounting table 7, the vibration plate 14 is arranged on the sliding seat 15 in a sliding mode, the vibration plate 14 is connected with the discharge pipe 11, one end of the spring 16 is connected with the vibration plate 14, the other end of the spring 16 is connected with the sliding seat 15, and under the elastic force action of the spring 16, the vibration plate 14 abuts against the eccentric wheel 13.
By adopting the structure, the motor 12 drives the eccentric wheel 13 to rotate, the vibration plate 14 is abutted against the eccentric wheel 13 under the elastic force action of the spring 16, and the vibration plate 14 realizes back-and-forth vibration under the action of the eccentric wheel 13 and the spring 16, so that the discharge pipe 11 is driven to vibrate, the workpiece is prevented from being clamped during discharging, and the feeding device has the advantage of good use effect.
Step-by-step material feeding unit includes spout 5 and two tracks 6, and spout 5 is seted up on base 1, and two tracks 6 parallel arrangement just all fix on base 1, are provided with a plurality of drive structure 4 that can round trip movement on the track 6, and in this embodiment, drive structure 4 is current structure, and the quantity of drive structure 4 is three.
By adopting the structure, the feeding efficiency of the workpiece is improved.
The rib cutting forming device 3 is also provided with a blanking hopper 17 for blanking waste materials.
By adopting the structure, the feeding hopper 17 is arranged, so that the waste material can be conveniently fed.
The down pipe 8 is L-shaped.
By adopting the structure, the blanking pipe 8 is L-shaped, so that the workpiece can fall conveniently.
The testing device in the step n comprises a testing box body 21, wherein an opening is formed in one side of the testing box body 21, a box door 23 is arranged on the box body through a hinge 22, the opening can be sealed by the box door 23, a plurality of placing mechanisms for placing the multi-chip component are fixed in the box body, in the embodiment, the number of the placing mechanisms is three, a testing structure 24 for testing the multi-chip component is also fixed on the box body, the placing mechanisms comprise a mounting plate 25, a left adjusting structure, a right adjusting structure, a horizontal measuring structure and a plurality of clamping seats 26 for clamping the multi-chip component, in the embodiment, the number of the clamping seats 26 is two, the left adjusting structure and the right adjusting structure are respectively arranged on the testing box body 21, one end of the mounting plate 25 is arranged on the left adjusting structure through a plurality of first springs 27, the other end of the mounting plate 25 is arranged on the right adjusting structure through a plurality of second springs 28, the card holder 26 is fixed on the mounting plate 25, and the leveling structure is provided on the mounting plate 25.
Structure more than adopting, be provided with chamber door 23 through hinge 22, chamber door 23 can seal the opening, can prevent that the dust from getting into test box 21, is provided with left regulation structure and right regulation structure simultaneously, can carry out the accuracy adjustment to mounting panel 25, has better adaptability, and the levelness measurement structure can be measured mounting panel 25's levelness, conveniently adjusts mounting panel 25's levelness, has excellent in use effect's advantage.
The left adjusting structure comprises a left screw 29, a left adjusting piece 30 and a left base 31, the left screw 29 is fixedly connected to the test box body 21, the left adjusting piece 30 is provided with a threaded hole, the left adjusting piece 30 is connected with the left screw 29 in a matched mode, the left base 31 is rotatably arranged on the left adjusting piece 30, and the left base 31 is connected with the first spring 27.
With the above structure, the left adjustment member 30 is rotated, and the height of the left base can be adjusted in cooperation with the left screw 29, thereby adjusting the height of the left side of the mounting plate 25.
The right adjusting structure comprises a right screw 33, a right adjusting piece 34 and a right base 35, the right screw 33 is fixedly connected to the test box body 21, the right adjusting piece 34 is provided with a threaded hole, the right adjusting piece 34 is connected with the right screw 33 in a matched mode, the right base 35 is rotatably arranged on the right adjusting piece 34, and the right base 35 is connected with the second spring 28.
With the above structure, the right adjusting member 34 is rotated, and the height of the right base can be adjusted in cooperation with the right screw 33, so that the height of the right side of the mounting plate 25 can be adjusted.
The horizontal measurement structure includes scale 37, connecting wire 38 and balancing weight 39, and scale 37 is installed on mounting panel 25 through two connecting rods 40, and the one end of connecting wire 38 is fixed on mounting panel 25, and the other end of connecting wire 38 is connected with balancing weight 39.
Structure more than adopting through setting up balancing weight 39 for mounting panel 25 is more firm, sets up scale 37 simultaneously, when carrying out the levelness adjustment to mounting panel 25, conveniently calibrates, has convenient to use's advantage.
The testing box body 21 is provided with a first fan spring 27, the first fan spring 27 is communicated with the testing box body 21, and the testing box body 21 is further provided with a plurality of air outlets 21 a.
Structure more than adopting, through setting up fan spring 27, seting up air outlet 21a, conveniently cool down in to test box 21, prevent that the too high effect of test of multichip module temperature from influencing.
A handle 42 for facilitating the opening of the door is also fixed to the door 23.
With the above structure, the door 23 can be opened and closed conveniently by providing the handle 42.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (4)
1. A3D packaging process is characterized by comprising the following steps:
a. thinning: thinning the wafer in a mechanical grinding mode, polishing the wafer to reduce a damage layer on the surface of the wafer, and thinning the wafer to a final thickness of 260-;
b. scribing: scribing the thinned wafer by a scribing machine;
c. a first layer of chip bonding: adhering the first layer of single chip to a base of a lead frame by a chip mounter, wherein the glue used is conductive glue;
d. and (3) curing the conductive adhesive: c, thermally curing the semi-finished product in the step c;
e. second layer chip bonding: respectively sticking the second layer of the plurality of chips to a bracket of the lead frame by a chip mounter, wherein the used glue is insulating glue;
f. and (3) curing the insulating glue: e, thermally curing the semi-finished product in the step e;
g. pressure welding: carrying out pressure welding on the first layer chip and the second layer chip by using a hot-press welding machine, adjusting the voltage of a pressure welding control console to control the temperature of the substrate to be 150-200 ℃, and keeping the temperature of a knife of the pressure welding head to be 150 ℃;
h. plastic packaging: plastically packaging the semi-finished product subjected to pressure welding by a plastic packaging machine;
i. plastic punching;
j. removing flash; soaking the semi-finished product in the step i in a soaking box filled with a flash removing solution, and taking out after flash is removed;
k. electroplating: electroplating the pin of the semi-finished product after the flash is removed by an electroplating device, wherein a layer of copper with the thickness of 6-12 mu m is electroplated, and a layer of tin with the thickness of 12-16 mu m is electroplated;
l, printing; printing the information of the product on the electroplated semi-finished product by a marking machine;
m, cutting ribs and forming: performing bar cutting and forming on the semi-finished product according to a specified size by a bar cutting and forming system to obtain a finished product;
n, detection: detecting a finished product through a testing device;
the rib cutting forming system in the step m comprises a base, wherein a feeding device, a rib cutting forming device and a discharging device are sequentially arranged on the base, a stepping feeding device used for conveying workpieces is arranged on the base and located between the feeding device and the rib cutting forming device, the discharging device comprises an installation platform, a blanking pipe, an air cylinder, a feeding block and a plurality of discharging pipes, the installation platform is fixed on the base and is perpendicular to the base, the blanking pipe is fixed on one side of the installation platform, one end of each discharging pipe is communicated with the blanking pipe, the other end of each discharging pipe is connected with the rib cutting forming device, each discharging pipe is also connected with a vibration structure, the air cylinder is fixed on the installation platform, a piston rod of the air cylinder is horizontally arranged, the feeding block is fixed on a piston rod of the air cylinder, and the feeding block is located in the blanking pipe; the vibration structure comprises a motor, an eccentric wheel, a vibration plate, a sliding seat and a spring, the motor is fixed on the mounting table, an output shaft of the motor is vertically arranged upwards, the eccentric wheel is fixed on the output shaft of the motor, the sliding seat is fixed on the mounting table, the vibration plate is arranged on the sliding seat in a sliding manner, the vibration plate is connected with the discharge pipe, one end of the spring is connected with the vibration plate, the other end of the spring is connected with the sliding seat, and the vibration plate is abutted against the eccentric wheel under the elastic force of the spring; the testing device in the step n comprises a testing box body, wherein an opening is formed in one side of the testing box body, a box door is arranged on the box body through a hinge, the opening can be sealed by the box door, a plurality of placing mechanisms used for placing the multi-chip assembly are fixed in the box body, a testing structure used for testing the multi-chip assembly is also fixed on the box body, each placing mechanism comprises a mounting plate, a left adjusting structure, a right adjusting structure, a horizontal measuring structure and a plurality of clamping seats used for clamping the multi-chip assembly, the left adjusting structure and the right adjusting structure are respectively arranged on the testing box body, one end of the mounting plate is arranged on the left adjusting structure through a plurality of springs, the other end of the mounting plate is arranged on the right adjusting structure through a plurality of springs, the clamping seats are fixed on the mounting plate, and the horizontal measuring structure is arranged on the mounting plate; the left adjusting structure comprises a left screw, a left adjusting piece and a left base, the left screw is fixedly connected to the test box body, the left adjusting piece is provided with a threaded hole and is matched and connected with the left screw, the left base is rotatably arranged on the left adjusting piece, and the left base is connected with the first spring; the right adjusting structure comprises a right screw, a right adjusting piece and a right base, the right screw is fixedly connected to the test box body, the right adjusting piece is provided with a threaded hole and is connected with the right screw in a matched mode, the right base is rotatably arranged on the right adjusting piece, and the right base is connected with the spring II.
2. The 3D packaging process according to claim 1, wherein the insulating glue in the step e is epoxy resin film glue, and a chip mounter is an ESEC2008XP type chip mounter.
3. The 3D packaging process according to claim 1, wherein the plastic package in the step h is a potting type plastic package.
4. The 3D packaging process according to claim 1, wherein the deflashing solution in step j is NT9118 type deflashing solution.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010625424.2A CN111816576B (en) | 2020-07-01 | 2020-07-01 | 3D packaging process |
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| CN202010625424.2A CN111816576B (en) | 2020-07-01 | 2020-07-01 | 3D packaging process |
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| CN111816576A CN111816576A (en) | 2020-10-23 |
| CN111816576B true CN111816576B (en) | 2022-09-30 |
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| CN202984852U (en) * | 2012-12-24 | 2013-06-12 | 海宁凌通光伏科技有限公司 | Efficient full-automatic soldering machine |
| CN109243986A (en) * | 2018-08-20 | 2019-01-18 | 浙江亚芯微电子股份有限公司 | A kind of multi-chip package technique |
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| KR20130047362A (en) * | 2011-10-31 | 2013-05-08 | 삼성전기주식회사 | Power module package |
| CN102522392B (en) * | 2011-12-31 | 2014-11-05 | 天水华天科技股份有限公司 | e/LQFP (low-profile quad flat package) planar packaging part with grounded ring and production method of e/LQFP planar packaging part with grounded ring |
| CN204102863U (en) * | 2014-09-19 | 2015-01-14 | 铜陵富仕三佳机器有限公司 | The full-automatic package system of a kind of lead frame |
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| CN202984852U (en) * | 2012-12-24 | 2013-06-12 | 海宁凌通光伏科技有限公司 | Efficient full-automatic soldering machine |
| CN109243986A (en) * | 2018-08-20 | 2019-01-18 | 浙江亚芯微电子股份有限公司 | A kind of multi-chip package technique |
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