CN109243986A - A kind of multi-chip package technique - Google Patents
A kind of multi-chip package technique Download PDFInfo
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- CN109243986A CN109243986A CN201810946809.1A CN201810946809A CN109243986A CN 109243986 A CN109243986 A CN 109243986A CN 201810946809 A CN201810946809 A CN 201810946809A CN 109243986 A CN109243986 A CN 109243986A
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000007711 solidification Methods 0.000 claims abstract description 55
- 230000008023 solidification Effects 0.000 claims abstract description 55
- 238000004806 packaging method and process Methods 0.000 claims abstract description 20
- 239000004033 plastic Substances 0.000 claims abstract description 17
- 238000003466 welding Methods 0.000 claims abstract description 15
- 238000004080 punching Methods 0.000 claims abstract description 8
- 238000000465 moulding Methods 0.000 claims abstract description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 31
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 30
- 239000011265 semifinished product Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 22
- 229910052757 nitrogen Inorganic materials 0.000 claims description 15
- 239000000047 product Substances 0.000 claims description 14
- 238000000227 grinding Methods 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 8
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 4
- 238000011536 re-plating Methods 0.000 claims description 4
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 3
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 3
- 239000004568 cement Substances 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 241000218202 Coptis Species 0.000 claims description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000012536 packaging technology Methods 0.000 abstract description 5
- 238000003860 storage Methods 0.000 description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 30
- 239000006052 feed supplement Substances 0.000 description 20
- 238000005192 partition Methods 0.000 description 18
- 239000002994 raw material Substances 0.000 description 16
- 238000003756 stirring Methods 0.000 description 8
- 238000005485 electric heating Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000013589 supplement Substances 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Basic Packing Technique (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
The present invention provides a kind of multi-chip package techniques.The technical problems such as it, which solves existing Multi-chip packages, does not have corresponding packaging technology, can not produce in batches, and speed of production is slow.This multi-chip package technique includes the following steps: a, is thinned；B, scribing；C, primary to paste；D, one-step solidification；E, secondary stickup；F, secondary curing；G, pressure welding；H, plastic packaging；I, punching modeling；J, flash is removed；K, it is electroplated；L, it prints；M, Trim Molding；N, it detects.The present invention has the advantages that production is quick.
Description
Technical field
The invention belongs to chip encapsulation technology fields, are related to a kind of packaging technology, especially a kind of multi-chip package technique.
Background technique
For decades, integrated antenna package technology follows always the development of chip, from single-chip package to multicore
Piece encapsulation is expanded, and packaging density is continuously improved, and effectively pushes electronics and IT products miniaturization, functionalization, for volume, place
Under the premise of reason the comprehensively considering of the various aspects such as speed and electric characteristics, the development of system in package by widely concern with again
Depending on.Multi-chip display encapsulation because it is with many significant advantages such as high density integration, multi-functional, and becomes communication class and partly leads
The mainstream of body device packaging technique, particularly suitable for fields such as flashing light control, mobile communication and mobile multimedias.
Through retrieving, as Chinese patent literature discloses a kind of Multi-chip packages [application number: 201710945679.5；It is public
The number of opening: CN 107978581A].This Multi-chip packages, the Multi-chip packages include: package substrates, including the first base
Back welding disk；First group of semiconductor chip, is stacked in package substrates, each semiconductor core in the semiconductor chip in first group
Piece includes at least one bonding pad；First stud protrusion, is arranged in other than the lower side semiconductor chip in first group
First group of semiconductor chip bonding pad on；First conducting wiring, from lower side semiconductor chip in first group to
A few bonding pad down extends, and is connected to the first substrate pad；Second conducting wiring, from most lower in first group
At least one bonding pad of side semiconductor chip extends upward, and is sequentially connected to the first stud protrusion.
Although Multi-chip packages disclosed in the patent can reduce production cost, which does not have
Corresponding packaging technology can not be produced in batches, and speed of production is slow, and therefore, designing a kind of multi-chip package technique is that have very much must
It wants.
Summary of the invention
The purpose of the present invention is there is the above problem in view of the prior art, a kind of multi-chip package technique is proposed, is somebody's turn to do
Packaging technology has the characteristics that production is quick.
Object of the invention can be realized by the following technical scheme: a kind of multi-chip package technique, which is characterized in that packet
Include following steps: a, be thinned: wafer is carried out by way of mechanical lapping it is thinned, wafer be thinned final thickness be 250-280 μ
m；B, scribing scribing: is carried out to the wafer after being thinned by scribing machine；C, primary to paste: by loader by the single core of first layer
Piece pastes on the pedestal of lead frame, and the glue used is conducting resinl；D, one-step solidification: the semi-finished product after primary paste are put into
Into curing apparatus, make conductive adhesive curing；E, the multiple chips of the second layer secondary stickup: are pasted by lead by loader respectively
On the bracket of frame, the glue used is insulating cement；F, the semi-finished product after secondary stickup secondary curing: are put into curing apparatus
In, make adhesive curing of insulating；G, bonding wire pressure welding: is carried out to first layer chip and second layer chip by bonding equipment；H, plastic packaging: pass through
Device for formulating prepares capsulation material, carries out plastic packaging to the semi-finished product after pressure welding by plastic packaging machine；I, punching modeling；J, it goes to overflow
Material；By going flash equipment to remove the residue glue on the semi-finished product after punching modeling；K, be electroplated: by electroplanting device to flash is removed after
The pin of semi-finished product is electroplated；L, it prints；The information of product is printed on the semi-finished product after plating by marking machine；M, it cuts
Muscle molding: the semi-finished product after plating are cut by predetermined size by cutter, finished product；N, it detects: passing through test
Machine carries out electrical detection to finished product.
Mechanical lapping in the step a is divided into two stages: leading portion corase grinding and back segment fine grinding.
The Carborundum wheel that the leading portion corase grinding is 30-40 μm using particle diameter, back segment fine grinding are 4-6 using particle diameter
μm Carborundum wheel.
Scribing machine in the step b uses DAD651 scribing machine, cutting speed 20-25mm/s.
One-step solidification condition in the step d are as follows: nitrogen filled protection, solidification temperature are 190-210 DEG C, and curing time is
40-80min。
Secondary curing condition in the step f are as follows: nitrogen filled protection, solidification temperature are 140-160 DEG C, and curing time is
40-80min。
Pressure welding in the step g uses low radian bond technology, the positive and negative routing mode of height arc, bonding wire material selection gold
Line, bonding wire temperature are 180-210 DEG C.
Plastic packaging in the step h is rubber filling type plastic packaging.
The copper for being first electroplated one layer 6-12 μm in the step k, the tin that one layer 12-16 μm of re-plating.
The curing apparatus includes pedestal, is connected with solidification case by support leg on pedestal, solidification case side, which offers, to be taken
Mouth to be put, the chamber door that pick-and-place mouth can be closed is hinged in solidification case, the solidification case other side has exhaust outlet and nitrogen inlet,
Exhaust ports are provided with solenoid valve one, and solenoid valve two is provided at nitrogen inlet, and solidification case bottom has electric heating tube, solidification
Shaft is also vertically arranged in case, the power mechanism that shaft lower end stretches out solidification case and it can be driven to rotate with one is connected, in shaft
End is fixed with flight, and several placement racks are fixed on flight, the placement for placing circulating frame is provided on placement rack
Slot, is additionally provided with deflector on pedestal, and deflector includes gasing pump and air inlet pipe in a ring, and air inlet pipe is fixed on solidification
Bottom portion, and air inlet pipe is located above electric heating tube, has several air inlets in air inlet pipe, air inlet tube side part passes through connecting tube one
It is connected with gasing pump one end, the gasing pump other end is connected by connecting tube two with the cavity inside shaft, and connecting tube two
Below solidification case, the side of shaft upper end also has several ventholes being connected with cavity.
The working principle of curing apparatus is as follows: cured semi-finished product will be needed to be put into Turnround basket, circulating frame is put into
Onto placement rack, electric heating tube to be opened, is driven by a power mechanism shaft rotation, shaft drives flight slowly to rotate, meanwhile,
Open gasing pump, the high-temperature gas of solidification case bottom is transported at the cavity of shaft by air inlet pipe, and from venthole by
Upward horizontal output down, and cooperate the effect of flight, the upward air-flow of spiral is formed it into, the temperature in solidification case can be made fast
It is fast uniformly to increase, it can be ensured that the solidification quality of product, solidification effect are good.
Check valve is additionally provided in the connecting tube two.
The power mechanism includes decelerating motor, driving gear and driven gear, and decelerating motor is fixed on the base, is slowed down
Straight up, driving gear is fixed on the output shaft of decelerating motor straight up to the output shaft of motor, and driven gear, which is fixed on, to be turned
Axis lower end, and driven gear is meshed with driving gear.
Using the above structure, control decelerating motor drives driving gear slowly to rotate, and driving gear drives driven gear slow
Slow-speed is dynamic, and driven gear drives shaft slowly to rotate.
Also there is insulating layer outside the solidification case.
Sink is fixed on the pedestal, sink one end has water supplement port, and the sink other end has water outlet, sets in sink
It is equipped with partition one and partition two, partition one is close to water supplement port, and partition two is close to water outlet, and the height of partition one is greater than partition two
Height, by sink separator at water storage part one, water storage part two and water storage part three, being horizontally disposed in sink has for partition one and partition two
Heat-exchange tube, and heat-exchange tube is penetrated from sink one end and is pierced by from the sink other end, heat-exchange tube one end passes through one He of connecting leg
Exhaust outlet is connected, and the heat-exchange tube other end is connected by connecting leg two with exhaust fan.
Using the above structure, the water in sink can successively be flowed along water storage part one, water storage part two and water storage part three, and hot
The high-temp waste gas exchanged in pipe is successively flowed along water storage part three, water storage part two and water storage part one, so as to make heat-exchange tube
Heat exchange is preferably carried out with sink, the heat in the exhaust gas of solidification case is sufficiently recycled.
Also there is radiating fin on the heat-exchange tube.
Also there is temperature to indicate component, temperature indicates that component includes controller, temperature sensor and display on the pedestal
Screen, controller is fixed on the base, and temperature sensor is arranged in solidification case, and display screen is fixed on solidification case by mounting plate
On, temperature sensor and display screen are connected with the controller by route.
Using the above structure, the temperature in solidification case can detect by temperature sensor, and signal is passed into controller,
Controller controls the temperature in display screen display solidification case, and intelligence degree is high.
The device for formulating includes pedestal, and preparation case is fixed on pedestal, prepares upper box part and is vertically arranged with main shaft, main shaft
The dynamic structure that upper end can drive it to rotate with one is connected, and main shaft lower end, which extend into prepare, to be connected in case with turntable, solid on turntable
Surely there are several stirring blades, main shaft upper end is further fixed on mounting disc, is fixed in mounting disc several for placing the storing of raw material
Bucket, and storage hopper is evenly distributed, storage hopper upper end has input port, and storage hopper lower end has delivery outlet, equipped at outlet port setting
There is solenoid valve three, delivery outlet is also connected with feed pipe upper end, and feed pipe lower end, which is located at, prepares in case, by solid in the middle part of feed pipe
Fixed pole is connected with turntable, prepares lower box part and is connected with discharge nozzle, solenoid valve four is provided on discharge nozzle.
The working principle of device for formulating is as follows: all kinds of raw materials being respectively put into corresponding storage hopper, dynamic structure is passed through
Main axis is driven, main shaft drives turntable rotation, and the rotation of driven by rotary disc feed pipe opens solenoid valve three, by the original in storage hopper
Material is transported to from feed pipe and prepares everywhere in case, meanwhile, driven by rotary disc stirring blade rotation, so as to quickly that all kinds of stirrings are equal
It is even, capsulation material is made, it is convenient to prepare.
The dynamic structure includes bracket, power motor, driving wheel, driven wheel and belt, and bracket is fixed on the base, and is moved
Force motor is fixed on bracket, and straight down, driving wheel is fixed on the output shaft end of power motor to the output shaft of power motor,
Driven wheel is fixed on main shaft end, and driven wheel is located above storage hopper, and belt is set between driving wheel and driven wheel.
Using the above structure, control power motor drives driving wheel rotation, and driving wheel drives driven wheel to rotate by belt,
Driven wheel drives main axis.
The feed supplement mechanism that raw material can be supplemented into storage hopper is additionally provided on the pedestal, feed supplement mechanism includes bottom plate, mends
Expects pipe, telescoping tube one, telescoping tube two and delivery pump, bottom plate are fixed on the base, and several racks, rack are fixed on bottom plate
Upper to have the hook that position material bag sack, feed supplement pipe is fixed on the base by connection frame inclination, and feed supplement pipe is located at
Between bottom plate and configuration case, feed supplement pipe lower end is connected with the upper end of telescoping tube one, and the lower end of telescoping tube one is connected with ring is aggravated,
Feed supplement pipe upper end is connected cylinder with the upper end of telescoping tube two, and the lower end of telescoping tube two is connected with lifting ring, and lifting ring can be located at storage
The surface of hopper, lifting ring can also drive the moving structure of lower movement to be thereon connected with one, and delivery pump is arranged in feed supplement pipe.
Using the above structure, all kinds of material bags are respectively positioned on corresponding rack, the lower end of telescoping tube one is put into
Into required material bag, corresponding storage hopper is made to be located at the underface of lifting ring, is driven by moving structure and moved down on lifting ring
It is dynamic, it is located at the lower end of telescoping tube two in storage hopper, opens delivery pump, the raw material in material strip is added to by storing by feed supplement pipe
In bucket, feed supplement is quick.
The moving structure includes column, guide rail, sliding block and push-rod electric machine, and column is fixed on bracket, and guide rail is solid vertically
Be scheduled on column, sliding block be arranged on guide rail, push-rod electric machine is fixed on column, the push rod of push-rod electric machine straight down, push rod
The push rod end of motor is connected with sliding block, and lifting ring is connected by connecting rod with sliding block.
Using the above structure, control push-rod electric machine band movable slider moves up and down, and sliding block drives lifting ring or more by connecting rod
It is mobile.
Vibrating motor is further fixed on the exacerbation ring.
Observation panel is offered on the preparation case, and there is transparent access panel at observation panel.
Using the above structure, quickly the exception prepared in case can be observed by access panel, observation is intuitive.
Material guide mechanism is additionally provided in the preparation case, material guide mechanism includes several passages, and passage one end passes through bullet
Property pipe be connected with feed pipe lower end, the passage other end is guide end, and passage is in horizontally disposed, guide tube side part also and
Lower end of the guide rod is connected, and guide rod upper end is connected with limited block, and driving idler wheel is connected on limited block, is arranged with guide sleeve in the middle part of guide rod,
Guide sleeve is connected by support rod with turntable, and spring is also arranged on guide rod, and spring upper end is connected with limited block, lower spring end with lead
Set is connected, and preparing upper box part also has a guide ring in irregular wave shape wave, and guide ring is located above turntable, and drive idler wheel and
Guide ring leans.
Using the above structure, during turntable rotates, the driving idler wheel position different from guide ring leans, and makes to lead
Bar floats up and down, and guide rod drives passage to float up and down, can be by all kinds of feedstock transportations in storage hopper to the different height of preparation case
Position is spent, during charging, plays the role of auxiliary mixing, so as to time needed for significantly less preparation, guide effect
Fruit is good.
It is further fixed on several push pieces on the guide rod, and pushes piece in horizontally disposed.
Using the above structure, push piece is driven to float up and down by guide rod, push piece can carry out the raw material for preparing case
Lower push, in addition the mixing of each raw material.
The section of the passage assumes diamond in shape.
Using the above structure, when passage can be made to float up and down or rotate, the raw material in case will be prepared and pushed to two sides.
Compared with prior art, this multi-chip package technique has the advantages that this: by being thinned, scribing, once pasting, is primary
Solidification, secondary curing, pressure welding, plastic packaging, punching modeling, goes flash, plating, printing, Trim Molding and detection at secondary stickup,
The packaging operation for achieving that multi-chip, can be realized continuous uninterrupted encapsulation, and production is quick.
Detailed description of the invention
Fig. 1 is the step schematic diagram of packaging technology.
Fig. 2 is the planar structure schematic diagram of curing apparatus.
Fig. 3 is the planar structure schematic diagram that curing apparatus removes part.
Fig. 4 is the planar structure schematic diagram of device for formulating.
Fig. 5 is the planar structure schematic diagram that device for formulating removes part.
In figure, 1, pedestal；2, support leg；3, connecting tube one；4, gasing pump；5, connecting tube two；6, check valve；7, driven tooth
Wheel；8, decelerating motor；9, driving gear；10, controller；11, solidification case；11a, mouth is picked and placed；11b, exhaust outlet；11c, nitrogen are defeated
Entrance；12, placement rack；12a, placing groove；13, temperature sensor；14, solenoid valve two；15, solenoid valve one；16, flight；17,
Mounting plate；18, display screen；19, shaft；19a, venthole；20, air inlet pipe；20a, air inlet；21, electric heating tube；22, exhausting
Machine；23, connecting leg two；24, sink；24a, water supplement port；24b, water outlet；25, heat-exchange tube；26, partition one；27, radiating fin；
28, partition two；29, connecting leg one；31, pedestal；32, case is prepared；32a, observation panel；33, turntable；34, stirring blade；35, bracket；
36, access panel；37, fixed link；38, feed pipe；39, solenoid valve three；40, mounting disc；41, storage hopper；42, driving wheel；43, it moves
Force motor；44, belt；45, driven wheel；46, main shaft；47, column；48, push-rod electric machine；49, guide rail；50, sliding block；51, connecting rod；
52, telescoping tube two；53, lifting ring；54, delivery pump；55, feed supplement pipe；56, telescoping tube one；57, it links up with；58, bottom plate；59, it places
Frame；60, ring is aggravated；61, vibrating motor；62, connection frame；63, discharge nozzle；64, solenoid valve four；65, guide ring；66, driving rolling
Wheel；67, limited block；68, spring；69, guide sleeve；70, support rod；71, piece is pushed；72, guide rod；73, elastic tube；74, passage.
Specific embodiment
Following is a specific embodiment of the present invention in conjunction with the accompanying drawings, technical scheme of the present invention will be further described,
However, the present invention is not limited to these examples.
As shown in Figure 1, this multi-chip package technique, includes the following steps: a, is thinned: to crystalline substance by way of mechanical lapping
Circle carry out it is thinned, wafer be thinned final thickness be 250-280 μm；In the present embodiment, it is 260 μm that final thickness, which is thinned, in wafer；
B, scribing scribing: is carried out to the wafer after being thinned by scribing machine；C, primary to paste: by loader by first layer one single chip
It pastes on the pedestal of lead frame, the glue used is conducting resinl；D, one-step solidification: the semi-finished product after primary paste are put into
In curing apparatus, make conductive adhesive curing；E, the multiple chips of the second layer secondary stickup: are pasted by lead frame by loader respectively
Bracket on, the glue that uses is insulating cement；In the present embodiment, the number of chips of the second layer is four；F, secondary curing: will
Semi-finished product after secondary stickup are put into curing apparatus, and adhesive curing of insulating is made；G, pressure welding: by bonding equipment to first layer chip
Bonding wire is carried out with second layer chip；H, plastic packaging: preparing capsulation material by device for formulating, by plastic packaging machine to pressure welding after
Semi-finished product carry out plastic packaging；In the present embodiment, capsulation material is using the existing raw material that can be bought in the market by preparing dress
It sets and is formulated；I, punching modeling；J, flash is removed；By going flash equipment to remove the residue glue on the semi-finished product after punching modeling；K, it is electroplated:
It is electroplated by pin of the electroplanting device to the semi-finished product after removing flash；L, it prints；The information of product is beaten by marking machine
On semi-finished product after printing to plating；M, Trim Molding: being cut the semi-finished product after plating by predetermined size by cutter,
Finished product；N, it detects: electrical detection is carried out to finished product by test machine.
Mechanical lapping in step a is divided into two stages: leading portion corase grinding and back segment fine grinding.
The Carborundum wheel that leading portion corase grinding is 30-40 μm using particle diameter, back segment fine grinding are 4-6 μm using particle diameter
Carborundum wheel；In the present embodiment, the Carborundum wheel that leading portion corase grinding is 35 μm using particle diameter, back segment fine grinding are straight using particle
The Carborundum wheel that diameter is 5 μm.
Scribing machine in step b uses DAD651 scribing machine, cutting speed 20-25mm/s；In the present embodiment, cutting speed
Spend 22mm/s.
One-step solidification condition in step d are as follows: nitrogen filled protection, solidification temperature are 190-210 DEG C, curing time 40-
80min；In the present embodiment, solidification temperature is 200 DEG C, curing time 60min.
Secondary curing condition in step f are as follows: nitrogen filled protection, solidification temperature are 140-160 DEG C, curing time 40-
80min；In the present embodiment, solidification temperature is 150 DEG C, curing time 60min.
Pressure welding in step g uses low radian bond technology, the positive and negative routing mode of height arc, bonding wire material selection gold thread,
Bonding wire temperature is 180-210 DEG C；In the present embodiment, bonding wire temperature is 190 DEG C.
Plastic packaging in step h is rubber filling type plastic packaging.
The copper for being first electroplated one layer 6-12 μm in step k, the tin that one layer 12-16 μm of re-plating；In the present embodiment, step
The copper for being first electroplated one layer 8 μm in k, the tin that one layer 14 μm of re-plating.
Advantage of the invention can be summarized in: 1) multi-functional；2) low-power consumption；3) more preferably performance；4) lower cost；5)
Smaller volume, lighter weight；6) the shorter development cycle.
As shown in Fig. 2-Fig. 3, curing apparatus includes pedestal 1, passes through support leg 2 on pedestal 1 and is connected with solidification case 11, solidifies
11 side of case, which offers, picks and places mouth 11a, and the chamber door that can close pick-and-place mouth 11a is hinged in solidification case 11, and solidification case 11 is another
Side has exhaust outlet 11b and nitrogen inlet 11c, is provided with solenoid valve 1 at exhaust outlet 11b, at nitrogen inlet 11c
It is provided with solenoid valve 2 14, extraneous source nitrogen can be input in solidification case 11 by nitrogen inlet 11c, nitrogen inlet
The structure that 11c is connected with source nitrogen is using the prior art；11 bottom of solidification case has electric heating tube 21, goes back in solidification case 11
It is vertically arranged with shaft 19, the power mechanism that 19 lower end of shaft stretches out solidification case 11 and it can be driven to rotate with one is connected, shaft 19
Upper end is fixed with flight 16, and in the present embodiment, 19 upper end of shaft is fixed with flight 16 by welding；Flight
Several placement racks 12 are fixed on 16, in the present embodiment, the quantity of placement rack 12 is six；It is provided on placement rack 12 useful
It is additionally provided with deflector in the placing groove 12a for placing circulating frame, on pedestal 1, deflector includes gasing pump 4 and in a ring
Air inlet pipe 20, air inlet pipe 20 is fixed on 11 bottom of solidification case, and air inlet pipe 20 is located at 21 top of electric heating tube, has in air inlet pipe 20
There are several air inlet 20a, in the present embodiment, the quantity of air inlet 20a is 20；20 side of air inlet pipe passes through connecting tube one
3 are connected with 4 one end of gasing pump, and 4 other end of gasing pump is connected by connecting tube 25 with the cavity inside shaft 19, and even
Adapter tube 25 is located at 11 lower section of solidification case, and the side of 19 upper end of shaft also has several venthole 19a being connected with cavity,
In the present embodiment, the quantity of venthole 19a is 20.
Check valve 6 is additionally provided in connecting tube 25.
Power mechanism includes decelerating motor 8, driving gear 9 and driven gear 7, and decelerating motor 8 is fixed on pedestal 1,
In the present embodiment, decelerating motor 8 is fixed on by bolted connection on pedestal 1；The output shaft of decelerating motor 8 vertically to
On, driving gear 9 is fixed on the output shaft of decelerating motor 8 straight up, and driven gear 7 is fixed on 19 lower end of shaft, and driven
Gear 7 is meshed with driving gear 9.
Also there is insulating layer, in the present embodiment, insulating layer is using the existing production that can be bought in the market outside solidification case 11
Product.
It is fixed with sink 24 on pedestal 1, in the present embodiment, is fixed with sink by bolted connection on pedestal 1
24；24 one end of sink has water supplement port 24a, and 24 other end of sink has water outlet 24b, is provided with one 26 He of partition in sink 24
Partition 2 28, partition 1 is close to water supplement port 24a, and partition 2 28 is close to water outlet 24b, and the height of partition 1 is greater than partition
Sink 24 is separated into water storage part one, water storage part two and water storage part three, sink 24 by 2 28 height, partition 1 and partition 2 28
Interior be horizontally disposed with has heat-exchange tube 25, and heat-exchange tube 25 is penetrated from 24 one end of sink and is pierced by from 24 other end of sink, and heat is handed over
It changes 25 one end of pipe and is connected by connecting leg 1 with exhaust outlet 11b, 25 other end of heat-exchange tube passes through connecting leg 2 23 and exhaust fan
22 are connected.
Using the structure, the water in sink 24 can successively be flowed along water storage part one, water storage part two and water storage part three, and hot
The high-temp waste gas exchanged in pipe 25 is successively flowed along water storage part three, water storage part two and water storage part one, so as to make heat exchange
Pipe 25 and sink 24 preferably carry out heat exchange, sufficiently recycle to the heat in the exhaust gas of solidification case 11.
Also there is radiating fin 27 on heat-exchange tube 25.
Also there is temperature to indicate that component, temperature instruction component include controller 10, temperature sensor 13 and display on pedestal 1
Screen 18, controller 10 is fixed on pedestal 1, and temperature sensor 13 is arranged in solidification case 11, and display screen 18 passes through mounting plate 17
It is fixed in solidification case 11, temperature sensor 13 and display screen 18 are connected with the controller 10 by route；In the present embodiment
In, controller 10 using the single-chip microcontroller that can buy in the market, single-chip microcontroller control display screen and sensor program be it is existing,
Program does not need to update.
Using the structure, the temperature in solidification case 11 can detect by temperature sensor 13, and signal is passed into control
Device 10, controller 10 control the temperature in the display solidification case 11 of display screen 18, and intelligence degree is high.
The working principle of curing apparatus is as follows: cured semi-finished product will be needed to be put into Turnround basket, circulating frame is put into
Onto placement rack 12, electric heating tube 21 is opened, control decelerating motor 8 drives driving gear 9 slowly to rotate, and driving gear 9 drives
Driven gear 7 slowly rotates, and driven gear 7 drives shaft 19 slowly to rotate, and shaft 19 drives flight 16 slowly to rotate, together
When, gasing pump 4 is opened, the high-temperature gas of 11 bottom of solidification case is transported at the cavity of shaft 19 by air inlet pipe 20, and from
Horizontal output from bottom to top at venthole 19a, and cooperate the effect of flight 16, the upward air-flow of spiral is formed it into, can be made
Temperature Quick uniform in solidification case 11 increases, it can be ensured that the solidification quality of product, solidification effect are good.
As shown in fig. 4-5, device for formulating includes pedestal 31, is fixed on pedestal 31 and prepares case 32, in the present embodiment,
It is fixed with by bolted connection on pedestal 31 and prepares case 32；It prepares 32 Upper vertical of case and is provided with main shaft 46, main shaft 46
The dynamic structure that upper end can drive it to rotate with one is connected, and 46 lower end of main shaft, which extend into prepare, to be connected in case 32 with turntable 33, turns
Several stirring blades 34 are fixed on disk 33, in the present embodiment, the quantity of stirring blade 34 is four；46 upper end of main shaft is also solid
Surely there is mounting disc 40, in the present embodiment, 46 upper end of main shaft is further fixed on mounting disc 40 by welding；In mounting disc 40
Several storage hoppers 41 for being used to place raw material are fixed with, in the present embodiment, the quantity of storage hopper 41 is six；And storage hopper 41
It is evenly distributed, 41 upper end of storage hopper has input port, and 41 lower end of storage hopper has delivery outlet, and equipped at outlet port is provided with solenoid valve
3 39, delivery outlet is also connected with 38 upper end of feed pipe, and 38 lower end of feed pipe, which is located at, prepares in case 32, passes through in the middle part of feed pipe 38
Fixed link 37 is connected with turntable 33, prepares 32 lower part of case and is connected with discharge nozzle 63, solenoid valve 4 64 is provided on discharge nozzle 63.
Dynamic structure includes bracket 35, power motor 43, driving wheel 42, driven wheel 45 and belt 44, and bracket 35 is fixed on
On pedestal 31, in the present embodiment, bracket 35 is fixed on by bolted connection on pedestal 31；Power motor 43 is fixed on
On bracket 35, in the present embodiment, power motor 43 is fixed on by bolted connection on bracket 35；Power motor 43
Straight down, driving wheel 42 is fixed on the output shaft end of power motor 43 to output shaft, and driven wheel 45 is fixed on 46 upper end of main shaft,
And driven wheel 45 is located at 41 top of storage hopper, belt 44 is set between driving wheel 42 and driven wheel 45.
Be additionally provided with the feed supplement mechanism that raw material can be supplemented into storage hopper 41 on pedestal 31, feed supplement mechanism include bottom plate 58,
Feed supplement pipe 55, telescoping tube 1, telescoping tube 2 52 and delivery pump 54, bottom plate 58 are fixed on pedestal 31, in the present embodiment, bottom
Plate 58 is fixed on by welding on pedestal 31；It is fixed with several racks 59 on bottom plate 58, in the present embodiment, places
The quantity of frame 59 is six；Connection frame can be passed through for the hook 57 that material bag sack positions, feed supplement pipe 55 by having on rack 59
62 inclinations are fixed on pedestal 31, and feed supplement pipe 55 is located between bottom plate 58 and configuration case, 55 lower end of feed supplement pipe and telescoping tube one
56 upper end is connected, and the lower end of telescoping tube 1 is connected with ring 60 is aggravated, the upper end of feed supplement pipe 55 upper end and telescoping tube 2 52
Be connected cylinder, and the lower end of telescoping tube 2 52 is connected with lifting ring 53, and lifting ring 53 can be located at the surface of storage hopper 41, lifting ring
53 can also drive the moving structure of lower movement to be thereon connected with one, and delivery pump 54 is arranged in feed supplement pipe 55.
Using the structure, all kinds of material bags are respectively positioned on corresponding rack 59, the lower end of telescoping tube 1 is put
Enter into required material bag, corresponding storage hopper 41 is made to be located at the underface of lifting ring 53, controls push-rod electric machine 48 with movable slider
50 move up and down, and sliding block 50 drives lifting ring 53 to move up and down by connecting rod 51, and the lower end of telescoping tube 2 52 is made to be located at storage hopper
In 41, delivery pump 54 is opened, is added to the raw material in material strip in storage hopper 41 by feed supplement pipe 55, feed supplement is quick.
Moving structure includes column 47, guide rail 49, sliding block 50 and push-rod electric machine 48, and column 47 is fixed on bracket 35,
In the present embodiment, column 47 is fixed on by bolted connection on bracket 35；Guide rail 49 is fixed on vertically on column 47, sliding
Block 50 be arranged on guide rail 49, push-rod electric machine 48 is fixed on column 47, the push rod of push-rod electric machine 48 straight down, push-rod electric machine
48 push rod end is connected with sliding block 50, and lifting ring 53 is connected by connecting rod 51 with sliding block 50.
It aggravates to be further fixed on vibrating motor 61 on ring 60, in the present embodiment, aggravates the side being bolted on ring 60
Formula is further fixed on vibrating motor 61.
It prepares and offers observation panel 32a on case 32, there is transparent access panel 36 at observation panel 32a.
Using the structure, quickly the exception prepared in case 32 can be observed by access panel 36, observation is intuitive.
It prepares in case 32 and is additionally provided with material guide mechanism, material guide mechanism includes several passages 74, and 74 one end of passage passes through
Elastic tube 73 is connected with 38 lower end of feed pipe, and in the present embodiment, elastic tube 73 is using the existing production that can be bought in the market
Product；74 other end of passage is guide end, and passage 74 is in horizontally disposed, 74 side of passage also with 72 lower end phase of guide rod
Even, 72 upper end of guide rod is connected with limited block 67, and driving idler wheel 66 is connected on limited block 67, is arranged with guide sleeve in the middle part of guide rod 72
69, guide sleeve 69 is connected by support rod 70 with turntable 33, and spring 68,68 upper end of spring and limited block 67 are also arranged on guide rod 72
It is connected, 68 lower end of spring is connected with guide sleeve 69, and preparing 32 top of case also has the guide ring 65 in irregular wave shape wave, guide ring
Above turntable 33, and idler wheel 66 is driven to lean with guide ring 65.
Using the structure, during turntable 33 rotates, driving idler wheel 66 position different from guide ring 65 leans,
Guide rod 72 is set to float up and down, guide rod 72 drives passage 74 to float up and down, can be by all kinds of feedstock transportations in storage hopper 41 to matching
The different height and position of case 32 processed plays the role of auxiliary mixing, during charging so as to needed for significantly less preparation
Time, guide effect is good.
It is further fixed on several push pieces 71 on guide rod 72, in the present embodiment, is further fixed on three on every guide rod 72 and pushes away
Send piece 71；And push piece 71 is in horizontally disposed.
Using the structure, push piece 71 is driven to float up and down by guide rod 72, push piece 71 can will prepare the raw material of case 32
Push up and down is carried out, in addition the mixing of each raw material.
The section of passage 74 assumes diamond in shape.
Using the structure, when passage 74 can be made to float up and down or rotate, the raw material in case 32 will be prepared and pushed to two sides.
The working principle of device for formulating is as follows: all kinds of raw materials being respectively put into corresponding storage hopper 41, power electric is controlled
Machine 43 drives driving wheel 42 to rotate, and driving wheel 42 drives driven wheel 45 to rotate by belt 44, and driven wheel 45 drives 46 turns of main shaft
Dynamic, main shaft 46 drives turntable 33 to rotate, and turntable 33 drives feed pipe 38 to rotate, and opens solenoid valve 3 39, will be in storage hopper 41
Raw material is transported to from feed pipe 38 and prepares everywhere in case 32, meanwhile, turntable 33 drives stirring blade 34 to rotate, so as to quickly will
All kinds of to stir evenly, it is convenient to prepare.
Specific embodiment described herein is only an example for the spirit of the invention.The neck of technology belonging to the present invention
The technical staff in domain can make various modifications or additions to the described embodiments or replace by a similar method
In generation, however, it does not deviate from the spirit of the invention or beyond the scope of the appended claims.
Claims (9)
1. a kind of multi-chip package technique, which comprises the steps of: a, be thinned: by way of mechanical lapping pair
Wafer carry out it is thinned, wafer be thinned final thickness be 250-280 μm；B, scribing: the wafer after being thinned is carried out by scribing machine
Scribing；C, primary to paste: to be pasted first layer one single chip on the pedestal of lead frame by loader, the glue used is to lead
Electric glue；D, one-step solidification: the semi-finished product after primary paste are put into curing apparatus, conductive adhesive curing is made；E, secondary stickup:
The multiple chips of the second layer are pasted respectively on the bracket of lead frame by loader, the glue used is insulating cement；F, secondary
Solidify: the semi-finished product after secondary stickup are put into curing apparatus, makes adhesive curing of insulating；G, pressure welding: by bonding equipment to
One layer of chip and second layer chip carry out bonding wire；H, plastic packaging: capsulation material is prepared by device for formulating, passes through plastic packaging machine
Plastic packaging is carried out to the semi-finished product after pressure welding；I, punching modeling；J, flash is removed；By going flash equipment will be residual on the semi-finished product after punching modeling
Glue removal；K, it is electroplated: being electroplated by pin of the electroplanting device to the semi-finished product after removing flash；L, it prints；Pass through marking machine
The information of product is printed on the semi-finished product after plating；M, Trim Molding: by cutter by the semi-finished product after plating by rule
Scale little progress row is cut, finished product；N, it detects: electrical detection is carried out to finished product by test machine.
2. multi-chip package technique according to claim 1, which is characterized in that the mechanical lapping in the step a is divided into
Two stages: leading portion corase grinding and back segment fine grinding.
3. multi-chip package technique according to claim 1, which is characterized in that the leading portion, which is roughly ground using particle diameter, is
30-40 μm of Carborundum wheel, the Carborundum wheel that back segment fine grinding is 4-6 μm using particle diameter.
4. multi-chip package technique according to claim 1, which is characterized in that the scribing machine in the step b uses
DAD651 scribing machine, cutting speed 20-25mm/s.
5. multi-chip package technique according to claim 1, which is characterized in that the one-step solidification condition in the step d
Are as follows: nitrogen filled protection, solidification temperature are 190-210 DEG C, curing time 40-80min.
6. multi-chip package technique according to claim 1, which is characterized in that the secondary curing condition in the step f
Are as follows: nitrogen filled protection, solidification temperature are 140-160 DEG C, curing time 40-80min.
7. multi-chip package technique according to claim 1, which is characterized in that the pressure welding in the step g uses low arc
Bond technology is spent, the positive and negative routing mode of height arc, bonding wire material selection gold thread, bonding wire temperature is 180-210 DEG C.
8. multi-chip package technique according to claim 1, which is characterized in that the plastic packaging in the step h is rubber filling type
Plastic packaging.
9. multi-chip package technique according to claim 1, which is characterized in that one layer of 6- of first plating in the step k
12 μm of copper, the tin that one layer 12-16 μm of re-plating.
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| CN201810946809.1A CN109243986B (en) | 2018-08-20 | 2018-08-20 | Multi-chip packaging process |
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| CN201810946809.1A CN109243986B (en) | 2018-08-20 | 2018-08-20 | Multi-chip packaging process |
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| CN111816576A (en) * | 2020-07-01 | 2020-10-23 | 浙江亚芯微电子股份有限公司 | 3D packaging process |
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