CN116525506A - SIP chip stacking and packaging system and packaging method thereof - Google Patents
SIP chip stacking and packaging system and packaging method thereof Download PDFInfo
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- CN116525506A CN116525506A CN202310808806.2A CN202310808806A CN116525506A CN 116525506 A CN116525506 A CN 116525506A CN 202310808806 A CN202310808806 A CN 202310808806A CN 116525506 A CN116525506 A CN 116525506A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 165
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000004033 plastic Substances 0.000 claims description 151
- 239000000463 material Substances 0.000 claims description 108
- 238000002347 injection Methods 0.000 claims description 58
- 239000007924 injection Substances 0.000 claims description 58
- 238000003825 pressing Methods 0.000 claims description 29
- 230000005540 biological transmission Effects 0.000 claims description 21
- 239000005022 packaging material Substances 0.000 claims description 21
- 238000011156 evaluation Methods 0.000 claims description 17
- 238000013461 design Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 11
- 238000009826 distribution Methods 0.000 claims description 10
- 230000033001 locomotion Effects 0.000 claims description 10
- 238000009827 uniform distribution Methods 0.000 claims description 6
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 5
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 5
- 241001330002 Bambuseae Species 0.000 claims description 5
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 5
- 239000011425 bamboo Substances 0.000 claims description 5
- 238000002955 isolation Methods 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 12
- 238000005538 encapsulation Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000012858 packaging process Methods 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention discloses a SIP chip stacking and packaging system and a packaging method thereof, which belong to the technical field of chip packaging.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a SIP chip stacking and packaging system and a packaging method thereof.
Background
The SIP level chip is characterized in that a system level packaging technology developed in recent years is adopted, devices required by all functions are effectively combined into a whole, higher integration level is achieved, a basically complete functional device is realized, meanwhile, the supply chain of a downstream user is effectively optimized by means of efficient production process and test capability, the development time of the product is greatly reduced, the cost is saved, and the system level chip has obvious flexibility and adaptability;
in the prior art, when a plurality of functional chips and power devices are integrated on a printed circuit board, in consideration of control of an integrated space, the functional chips and the power devices are generally integrated and packaged through parallel space isolation or up-down stacking to form a plurality of design layers, so that miniaturization design of the SIP chips is facilitated, but for the SIP chips stacked in a stepped structure, even distribution of plastic packaging materials is not easy to realize when external packaging is performed, and after packaging, if gaps generated at the stacked positions of the chips are not filled with the plastic packaging materials, the overall packaging effect is affected;
for this reason, we propose a SIP chip stack package system and its packaging method for solving the above situation.
Disclosure of Invention
Compared with the prior art, the SIP chip stacking and packaging system and the packaging method thereof provided by the invention have the advantages that the feeding pipe capable of moving up and down and left and right is arranged on the plastic packaging box, the feeding height and the feeding direction of the feeding nozzle are changed, the feeding nozzle is easier to inject the plastic packaging material into the gap between the chip and the substrate, meanwhile, the ultrasonic transmission channel is utilized to transmit microwave signals to the inside of the plastic packaging box, the molecular movement of the plastic packaging material is aggravated, so that the plastic packaging material is prevented from being difficultly uniformly distributed by some gaps on the SIP chip, in addition, the intermittent continuous shooting is carried out by additionally arranging the camera in the packaging process, the packaging process is monitored, and the feeding position and the ultrasonic transmission time of the feeding nozzle are controlled by evaluating the monitoring information, so that the SIP chip is fully distributed by the plastic packaging material layer, and the packaging body is formed.
The aim of the invention can be achieved by the following technical scheme: the SIP chip stacking and packaging system comprises a plastic packaging table, wherein a packaging position for placing an SIP-level chip is arranged on the plastic packaging table, a plastic packaging box positioned above the packaging position is arranged on two sides of the upper end of the plastic packaging table through a group of electric lifting rods I, a movable cavity is formed in the top end wall of the plastic packaging table along the horizontal direction of the plastic packaging table, an electric guide rail I is fixedly arranged in the movable cavity, a connecting cylinder is fixedly arranged on an electric sliding block of the electric guide rail I, an electromagnetic positioning cylinder is sleeved in the connecting cylinder, a feeding pipe is inserted in the electromagnetic positioning cylinder in a penetrating manner, the lower end of the feeding pipe penetrates into the plastic packaging box and is fixedly connected with a feeding nozzle, the feeding pipe is made of a magnetic material which is magnetically absorbed by the electromagnetic positioning cylinder, the inner end of the top end wall of the plastic packaging box extends to an ultrasonic transmission channel in the plastic packaging box, and the other end of the ultrasonic transmission channel is connected with an ultrasonic generator;
the plastic packaging table is characterized in that electric guide rails II are fixedly arranged on two sides of the rear end of the plastic packaging table, a movable frame is arranged between the pair of electric guide rails II, an electric lifting rod III is fixedly connected to the top end of the movable frame, a pre-pressing plate movably and hermetically connected with the inner wall of the plastic packaging box is fixedly arranged at the telescopic end of the electric lifting rod III, a plugging groove for horizontally penetrating through the pre-pressing plate is formed in the rear end wall of the plastic packaging box, an image acquisition box which is arranged flush with the inner wall of the plastic packaging box is embedded in the end wall, close to the bottom end, of the plastic packaging box, and a camera and an industrial control panel electrically connected with the camera are arranged in the image acquisition box.
Further, the fixed cover is equipped with the grip block on the end wall that the inlet pipe is located the linking section of thick bamboo top, link up and be fixed with fixed sleeve board on the outer end wall that the section of thick bamboo is located electric guide rail one top, fixed mounting has the electric lift pole two in the grip block bottom on the fixed sleeve board, when carrying out plastic package material injection, the feed inlet mouth extends to the base plate top of encapsulation district department, start electromagnetic positioning section of thick bamboo and be used for carrying out the location to the inlet pipe, to encapsulation district injection plastic package material, wait to annotate the material work after accomplishing, upwards lift the grip block through the electric lift pole, upwards lift the inlet pipe to the horizontal direction of prepressing plate on, at this moment, convey the prepressing plate to the plastic package incasement portion through a pair of electric guide rail two, reuse electric lift pole three drive prepressing plate pushes down, the prepressing plate carries out extrusion to the plastic package material on base plate and the chip.
Further, the movable cavity is provided with a U-shaped guide plate in a sliding sleeve manner on the end wall of one side far away from the electric guide rail, the U-shaped guide plate is fixedly connected with the outer wall of the connecting cylinder, and the stability of horizontal movement of the feeding pipe is improved by additionally arranging the U-shaped guide plate with a sliding guide effect.
Further, the rotating motor is fixedly arranged at the upper end of the U-shaped guide plate, the outer gear is fixedly connected with the driving end of the rotating motor, the inner wall of the upper end of the electromagnetic positioning cylinder is fixedly sleeved with the inner gear which is connected with the outer gear in a meshed mode, a groove which is used for the penetration of the end wall of the outer gear is formed in the outer wall of the connecting cylinder, the rotating motor is utilized to rotationally drive the electromagnetic positioning cylinder, the position of the feeding pipe in the horizontal direction is matched, the feeding direction of the feeding nozzle is changed, the feeding nozzle is convenient to feed materials in the gap between the chip and the substrate, and the plastic package material is uniformly distributed.
Furthermore, the inner end wall of the image acquisition box, which is positioned at the inner end wall of the plastic package box, is made of transparent materials, the camera is correspondingly arranged with the SIP chip, and the camera is used for acquiring images of the SIP chip.
Further, the image acquisition module is used for acquiring a side shot image of the SIP chip, and the camera is used for performing side shooting on the current SIP chip under the control of the central control module to acquire the side shot image of the current SIP chip.
Further, the image transmission module is used for transmitting the SIP chip side shot image to the image evaluation module for image evaluation to obtain evaluation information, and transmitting the evaluation information to the central control module, and the central control module controls the electric lifting rod II, the rotating motor and the ultrasonic generator, and the specific evaluation control process is as follows:
before the SIP chip is subjected to plastic packaging, a camera is used for performing side shooting on the SIP chip to obtain a preliminary side photo pre-estimated packaging area, the packaging area is divided into a plurality of sub-packaging areas from bottom to top according to the distribution of a plurality of design layers of the SIP chip, and the top ends of the sub-packaging areas are respectively marked as a packaging line I, a packaging line II and a packaging line III;
injecting the plastic package material into the first sub-package area by using the feeding nozzle, wherein in the process, the injection height and the injection direction of the feeding nozzle are changed by using horizontal movement and circumferential rotation of the feeding pipe, so that the plastic package material is injected into a gap between a chip and a substrate, meanwhile, a microwave signal is conducted into the plastic package box by using an ultrasonic transmission channel, the molecular movement of the plastic package material is enhanced by using microwaves, in the process, the plastic package material is continuously shot by using a camera in a discontinuous manner until the shot plastic package material rises to an upper range and a lower range of a package line, at the moment, the injection is stopped, and the ultrasonic generator is used for continuously performing ultrasonic operation so as to realize the vibration level of the plastic package material, and after the upper end face of the plastic package material shot by the camera is positioned at the same horizontal plane, the injection in the first stage is completed;
step three, injecting materials in the second stage, wherein the injecting materials in the first stage are consistent with the injecting materials in the first stage, in the injecting process, the camera is used for intermittently and continuously shooting until the shot plastic package materials rise to the upper and lower ranges of the packaging line II, at the moment, the injecting materials are stopped, the ultrasonic generator is used for continuously performing ultrasonic work so as to realize vibration level of the plastic package materials, and after the upper end faces of the plastic package materials shot by the camera are in the same horizontal plane, the injecting materials in the second stage are completed;
and fourthly, injecting materials in the third stage, wherein the injection materials in the third stage are consistent with the injection materials in the two stages, in the injection process, the camera is used for intermittently and continuously shooting until the shot plastic package materials rise to the upper and lower ranges of the packaging line, the injection materials are stopped at the moment, the ultrasonic generator is used for continuously performing ultrasonic operation so as to realize vibration level of the plastic package materials, and after the upper end faces of the plastic package materials shot by the camera are in the same horizontal plane, the injection materials in the third stage are completed.
A packaging method of a SIP chip stack packaging system, comprising the steps of:
s1, solidifying a bottom chip: a technician firstly solidifies a first layer of chips on a substrate and connects the chips with layout electrodes to realize electrical conduction;
s2, stacking chips: bonding the second layer chip to the first layer chip and connecting the second layer chip with the layout electrode, wherein each stacking can be fixed by special bonding glue, so that a plurality of design layers are formed by parallel space isolation and stacking up and down to complete the stacking of the SIP chips;
s3, welding a chip: the perimeter of each layer of chips is soldered to provide electrical connection for the chips during the multi-layer stacking process.
S4, external packaging: placing the stacked SIP chips at a packaging position on a plastic packaging table, and covering a plastic packaging box on the SIP chips through a plurality of groups of electric lifting rods I;
the SIP chip before packaging is subjected to side shooting and pre-estimating a packaging area by using a camera, the packaging area is pre-divided into a plurality of sub-packaging areas distributed from bottom to top according to the distribution of a plurality of design layers of the SIP chip, the material injection height and the material injection direction of a feeding nozzle are changed by using horizontal movement and circumferential rotation of a feeding pipe, and the material injection of the sub-packaging areas from bottom to top is sequentially completed, and in the material injection process, an ultrasonic transmission channel is used for vibrating the plastic package material in combination with an ultrasonic generator so as to realize uniform distribution of the plastic package material in the packaging area;
after the material injection work is finished, the feeding pipe is moved upwards until the feeding nozzle is lifted to be above the horizontal direction of the pre-pressing plate, the pre-pressing plate is conveyed into the plastic packaging box by utilizing a pair of electric guide rails II, then the pre-pressing plate is driven to be pressed downwards by utilizing an electric lifting rod III, and the pre-pressing plate is used for extrusion molding of the plastic packaging material to obtain a packaging body;
s5, demolding: after the encapsulation is finished, the plastic packaging box is lifted upwards by utilizing the electric lifting rod, and the demolding of the encapsulation body is completed.
Compared with the prior art, the invention has the advantages that:
(1) This scheme is through setting up the inlet pipe that can reciprocate, control the motion on the plastic envelope case, change the notes material height and the notes material direction of feed inlet, more easily pour into the gap between chip and the base plate into the plastic envelope material through the feed inlet, meanwhile, utilize ultrasonic wave transfer passage to the inside conduction microwave signal of plastic envelope case, utilize microwave vibration to aggravate the molecular motion of plastic envelope material, realize plastic envelope material evenly distributed on the SIP chip, in order to avoid some gaps on the SIP chip to be difficult to full of plastic envelope material, in addition, add the camera and carry out intermittent continuous shooting in the encapsulation process, monitor the encapsulation process, through the aassessment to monitoring information regulate and control the notes material position and the ultrasonic wave transfer time of feed inlet, in order to realize that the plastic envelope bed layer is covered with the SIP chip and is formed the packaging body.
(2) According to the scheme, the SIP chip before packaging is subjected to side shooting by using the camera to obtain the primary side shooting, the packaging area is pre-divided into a plurality of sub-packaging areas from bottom to top according to the distribution of a plurality of design layers of the SIP chip, namely, the packaging process of the injection material is divided into a plurality of stages, the camera is used for intermittently and continuously shooting at each stage until the injection material is shot to rise to the upper and lower ranges of the packaging line at the stage, at the moment, the injection material is stopped, the ultrasonic generator is used for continuously working so as to realize the vibration level of the injection material, after the upper end face of the injection material shot by the camera is positioned at the same horizontal plane, the injection material at the stage is completed, a plurality of times of small injection material modes are used, and the injection material injected each time is fully vibrated so as to avoid the problem that the obtained package body has pores because of difficulty in uniform distribution due to one-time introduction of excessive injection material, and the packaging effect is improved.
Drawings
FIG. 1 is a schematic diagram of a first embodiment of the present invention;
FIG. 2 is a schematic diagram of a second embodiment of the present invention;
fig. 3 is a schematic view of the structure at the top of the plastic package case of the present invention;
FIG. 4 is a partial cross-sectional view of the junction of the adapter tube and feed tube of the present invention;
fig. 5 is an internal cross-sectional view at a plastic package box of the present invention;
FIG. 6 is an internal schematic view of the present invention;
FIG. 7 is an internal schematic view of the present invention in operation;
fig. 8 is a schematic diagram of a state of pressing a molding compound by a pre-pressing plate according to the present invention;
fig. 9 is a second schematic diagram of a state when the plastic package material is pressed by the pre-pressing plate;
fig. 10 is a schematic diagram III of a state when the plastic package material is pressed by the pre-pressing plate;
fig. 11 is a schematic view showing a state in which the plastic package case is ejected upward according to the present invention.
The reference numerals in the figures illustrate:
1. a plastic packaging table; 2. plastic packaging case, 3, electric lifting rod I; 4. a feed pipe; 41. a feed nozzle; 5. an electric guide rail I; 6. a connecting cylinder; 7. an electromagnetic positioning cylinder; 8. a clamping plate; 9. an electric lifting rod II; 10. fixing the sleeve plate; 11. a rotating motor; 12. an internal gear; 13. an external gear; 14. an ultrasonic wave transmission channel; 15. an image acquisition box; 16. a camera; 17. an electric guide rail II; 18. a movable frame; 19. an electric lifting rod III; 20. and (5) pre-pressing the plate.
Detailed Description
The drawings in the embodiments of the present invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only a few embodiments of the present invention; but not all embodiments, are based on embodiments in the present invention; all other embodiments obtained by those skilled in the art without undue burden; all falling within the scope of the present invention.
Example 1:
the invention discloses a SIP chip stacking and packaging system, please refer to fig. 1-5, which comprises a plastic packaging table 1, wherein a packaging position for placing a SIP chip is arranged on the plastic packaging table 1, both sides of the upper end of the plastic packaging table 1 are respectively provided with a plastic packaging box 2 positioned above the packaging position through a group of electric lifting rods 3, the top end wall of the plastic packaging table 1 is provided with a movable cavity along the horizontal direction, an electric guide rail 5 is fixedly arranged in the movable cavity, an electric sliding block of the electric guide rail 5 is fixedly provided with a connecting cylinder 6, an electromagnetic positioning cylinder 7 is sleeved in the connecting cylinder 6, a feeding pipe 4 is inserted on the electromagnetic positioning cylinder 7 in a penetrating way, the lower end of the feeding pipe 4 penetrates into the plastic packaging box 2 and is fixedly connected with a feeding nozzle 41, the feeding pipe 4 is made of magnetic material which is arranged with the electromagnetic positioning cylinder 7, the feeding pipe 4 can move up and down along the electromagnetic positioning cylinder 7, a clamping plate 8 is fixedly sleeved on the end wall of the feeding pipe 4 positioned above the connecting cylinder 6, a fixing sleeve 10 is fixedly arranged on the outer end wall of the electric guide rail 5, the connecting cylinder 10 is fixedly sleeved on the end wall of the electric guide rail 5, the sealing cylinder 10 is fixedly connected with the electric guide rail 10, the feeding pipe is fixedly arranged at the bottom end of the sealing plate is fixedly connected with the feeding pipe 4 by the plastic packaging box 4, the sealing area is positioned at the bottom end of the sealing area, and the sealing area is sealed by using the sealing position of the sealing area is sealed by using epoxy resin, and the sealing area is sealed by the sealing material, and the sealing area is sealed by the sealing area of the sealing material, and the sealing area is the sealing material is sealed by the sealing material and the sealing material.
Referring to fig. 3-5, a U-shaped guide plate is slidably sleeved on the end wall of the movable cavity far away from one side 5 of the electric guide rail, the U-shaped guide plate is fixedly connected with the outer wall of the connecting cylinder 6, the stability of horizontal movement of the feeding pipe 4 is improved by additionally arranging the U-shaped guide plate with a sliding guide function, a rotating motor 11 is fixedly arranged at the upper end of the U-shaped guide plate, an outer gear 13 is fixedly connected with the driving end of the rotating motor 11, an inner gear 12 in meshed connection with the outer gear 13 is fixedly sleeved on the inner wall of the upper end of the electromagnetic positioning cylinder 7, a slot for penetrating the end wall of the outer gear 13 is formed in the outer wall of the connecting cylinder 6, the electromagnetic positioning cylinder 7 is rotationally driven by the cooperation of the rotating motor 11 and the gear set, and the position of the feeding pipe 4 is adjusted in the horizontal direction in cooperation with the feeding pipe, so that the feeding direction of the feeding nozzle 41 is changed, the feeding nozzle 41 is convenient to fill a gap between a chip and a substrate, and the plastic package is uniformly distributed, and the plastic package is prevented from being unable to reach the gap between the chip and the substrate.
Referring to fig. 1, fig. 2 and fig. 5-fig. 7, the top end wall of the plastic package box 2 is fixedly connected with an ultrasonic transmission channel 14 with the inner end extending to the inside, the other end of the ultrasonic transmission channel 14 is connected with an ultrasonic generator, two sides of the rear end of the plastic package table 1 are fixedly provided with electric guide rails II 17, a movable frame 18 is installed between the pair of electric guide rails II 17, the top end of the movable frame 18 is fixedly connected with an electric lifting rod III 19, the telescopic end of the electric lifting rod III 19 is fixedly provided with a pre-pressing plate 20 movably sealed and connected with the inner wall of the plastic package box 2, the rear end wall of the plastic package box 2 is provided with an inserting groove for horizontally penetrating the pre-pressing plate 20, after the material injection work is completed, referring to fig. 8-fig. 10, the feeding pipe 4 is lifted upwards to the horizontal direction of the pre-pressing plate 20 through the electric lifting rod II 9, at this time, the pre-pressing plate 20 is conveyed into the inside of the plastic package box 2 through the pair of electric guide rails II 17, the pre-pressing plate 20 is completely sealed and attached to the inner wall of the plastic package box 2 by the electric lifting rod III 19, the pre-pressing plate 20 is driven to be pressed downwards, the pre-pressing plate 20 is pressed, after the pre-pressing plate 20 is extruded and molded, the plastic package body is molded by the electric lifting rod 3, and the package body is completed, and the lifting and the package is completed.
Example 2:
according to the embodiment, on the basis of embodiment 1, the camera 16 is additionally arranged at one side of the bottom end of the plastic packaging box 2, real-time monitoring is carried out in the packaging process by using the camera 16, the material injection position of the feeding nozzle 41 and the ultrasonic transmission time are controlled by evaluating monitoring information, and the distribution uniformity of plastic packaging materials is further improved, specifically as follows:
referring to fig. 5-7, an image collection box 15 which is arranged flush with the inner wall of the plastic packaging box 2 is embedded in the end wall of the plastic packaging box 2 near the bottom end, a camera 16 and an industrial control panel electrically connected with the camera 16 are installed in the image collection box 15, the inner end wall of the image collection box 15 at the inner end wall of the plastic packaging box 2 is made of transparent materials, the camera 16 is arranged corresponding to the SIP-level chip, and the camera 16 is used for obtaining images of the SIP-level chip;
the industrial control panel comprises a central control module, an image acquisition module, an image transmission module and an image evaluation module, wherein the central control module is in signal connection with the electric lifting rod II 9, the rotating motor 11, the ultrasonic generator and the camera 16, the image acquisition module is in signal connection with the camera 16, the image acquisition module is used for acquiring a side shooting image of an SIP chip, the camera 16 is used for side shooting the current SIP chip under the control of the central control module to acquire the side shooting image of the current SIP chip, the image transmission module is used for transmitting the side shooting image of the SIP chip to the image evaluation module to carry out image evaluation to obtain evaluation information, the evaluation information is transmitted to the central control module, and the central control module controls the electric lifting rod II 9, the rotating motor 11 and the ultrasonic generator, and the specific evaluation and control process is as follows:
before the SIP chip is subjected to plastic packaging, the SIP chip is subjected to side shooting by utilizing a camera 16 to obtain a preliminary side photo estimated packaging area, the packaging area is divided into a plurality of sub-packaging areas from bottom to top according to the distribution of a plurality of design layers of the SIP chip, and the top ends of the plurality of sub-packaging areas are respectively marked as a packaging line I, a packaging line II and a packaging line III;
step two, injecting plastic package materials into a first sub-package area by using a feeding nozzle 41, in the process, horizontally moving and circumferentially rotating a feeding pipe 4, changing the injection height and the injection direction of the feeding nozzle 41, realizing injection of the plastic package materials into a gap between a chip and a substrate, simultaneously, conducting microwave signals into a plastic package box 2 by using an ultrasonic transmission channel 14, and utilizing microwaves to intensify molecular movement of the plastic package materials, realizing uniform distribution of the plastic package materials, in the process, intermittently and continuously shooting by using a camera 16 until the shot plastic package materials rise to an upper range and a lower range of a package line, stopping injection at the moment, continuously performing ultrasonic operation by using an ultrasonic generator, so as to realize vibration level of the plastic package materials, and finishing injection of the first stage after the upper end face of the plastic package materials shot by the camera 16 is in the same horizontal plane;
step three, injecting materials in the second stage, wherein the injecting materials in the second stage are consistent with the injecting materials in the first stage, in the injecting process, the camera 16 is used for intermittently and continuously shooting until the shot plastic package materials rise to the upper and lower ranges of the packaging line II, at the moment, the injecting materials are stopped, the ultrasonic generator is used for continuously performing ultrasonic work so as to realize vibration level of the plastic package materials, and after the upper end faces of the plastic package materials shot by the camera 16 are in the same horizontal plane, the injecting materials in the second stage are completed;
and fourthly, injecting materials in the third stage, wherein the injection materials in the third stage are consistent with the injection materials in the two stages, in the injection process, the camera 16 is used for intermittently and continuously shooting until the shot plastic package materials rise to the upper and lower ranges of the packaging line, the injection materials are stopped at the moment, the ultrasonic generator is used for continuously performing ultrasonic operation so as to realize vibration leveling of the plastic package materials, and after the upper end faces of the plastic package materials shot by the camera 16 are in the same horizontal plane, the injection materials in the third stage are completed.
The SIP chip before packaging is subjected to side shooting by using the camera 16 to obtain a primary side shooting film, the packaging area is divided into a plurality of sub-packaging areas distributed from bottom to top according to the distribution of a plurality of design layers of the SIP chip, namely, the packaging process of the injection material is divided into a plurality of stages, the camera 16 is used for intermittently and continuously shooting in the material injection process of each stage until the shot plastic package material rises to the upper and lower ranges of the packaging line of the stage, at the moment, the injection material is stopped, the ultrasonic generator is used for continuously working so as to realize the full vibration level of the plastic package material, after the upper end face of the plastic package material shot by the camera 16 is positioned at the same horizontal plane, the injection material of the stage is completed, the injection material of a plurality of stages is used for fully vibrating the plastic package material injected each time in a plurality of times in a small quantity, and the problem that the obtained package material is difficult to be uniformly distributed due to the fact that the excessive plastic package material is introduced at one time is avoided, so that the packaging effect is improved.
In combination with embodiment 1 and embodiment 2, the packaging method of this embodiment includes the following steps:
referring to fig. 5-11, S1, curing the underlying chip: a technician firstly solidifies a first layer of chips on a substrate and connects the chips with layout electrodes to realize electrical conduction;
s2, stacking chips: bonding the second layer chip to the first layer chip and connecting the second layer chip with the layout electrode, wherein each stacking can be fixed by special bonding glue, so that a plurality of design layers are formed by parallel space isolation and stacking up and down to complete the stacking of the SIP chips;
s3, welding a chip: the perimeter of each layer of chips is soldered to provide electrical connection for the chips during the multi-layer stacking process.
S4, external packaging: placing the stacked SIP chips at a packaging position on a plastic packaging table 1, covering a plastic packaging box 2 on the SIP chips through a plurality of groups of electric lifting rods I3, and sealing and embedding a substrate with the inner wall of the plastic packaging box 2;
the SIP chip before packaging is subjected to side shooting to estimate a packaging area by using a camera 16, the packaging area is pre-divided into a plurality of sub-packaging areas distributed from bottom to top according to the distribution of a plurality of design layers of the SIP chip, the feeding pipe 4 is used for horizontally moving and circumferentially rotating, the feeding height and the feeding direction of the feeding nozzle 41 are changed, and the feeding of the sub-packaging areas from bottom to top is sequentially completed, and in the feeding process, the ultrasonic transmission channel 14 is used for vibrating the plastic packaging material in combination with an ultrasonic generator so as to realize uniform distribution of the plastic packaging material in the packaging area;
after the material injection work is finished, the feeding pipe 4 is moved upwards until the feeding nozzle 41 is lifted to be above the horizontal direction of the pre-pressing plate 20, the pre-pressing plate 20 is conveyed into the plastic packaging box 2 by utilizing the pair of electric guide rails II 17, the pre-pressing plate 20 is driven to be pressed downwards by utilizing the electric lifting rod III 19, and the pre-pressing plate 20 extrudes and forms the plastic packaging material to obtain a packaging body;
s5, demolding: after the encapsulation is finished, the plastic packaging box 2 is lifted upwards by the electric lifting rod I3, and the demolding of the encapsulation body is completed.
The foregoing is only a preferred embodiment of the present invention; the scope of the invention is not limited in this respect; any person skilled in the art is within the technical scope of the present disclosure; equivalent substitutions or changes are made according to the technical proposal of the invention and the improved conception thereof; are intended to be encompassed within the scope of the present invention.
Claims (8)
1. The SIP chip stacking and packaging system comprises a plastic packaging table (1), and is characterized in that: the packaging machine is characterized in that a packaging position for placing the SIP-level chip is arranged on the plastic packaging table (1), a plastic packaging box (2) positioned above the packaging position is arranged on two sides of the upper end of the plastic packaging table (1) through a group of electric lifting rods I (3), a movable cavity is formed in the top end wall of the plastic packaging table (1) along the horizontal direction of the plastic packaging box, an electric guide rail I (5) is fixedly arranged in the movable cavity, a connecting cylinder (6) is fixedly arranged on an electric sliding block of the electric guide rail I (5), an electromagnetic positioning cylinder (7) is sleeved in the connecting cylinder (6), a feeding pipe (4) is inserted on the electromagnetic positioning cylinder (7), the lower end of the feeding pipe (4) penetrates into the plastic packaging box (2) and is fixedly connected with a feeding nozzle (41), the feeding pipe (4) is made of a magnetic material which is arranged in a magnetic attraction mode, an ultrasonic wave transmission channel (14) of which the inner end extends into the plastic packaging box (2) is fixedly connected with the top end wall, and the other end of the ultrasonic wave transmission channel (14) is connected with a generator;
the plastic packaging machine is characterized in that two sides of the rear end of the plastic packaging table (1) are fixedly provided with two electric guide rails (17), a movable frame (18) is arranged between the two electric guide rails (17), the top end of the movable frame (18) is fixedly connected with a three electric lifting rod (19), the telescopic end of the three electric lifting rod (19) is fixedly provided with a pre-pressing plate (20) movably sealed and connected with the inner wall of the plastic packaging box (2), the rear end wall of the plastic packaging box (2) is provided with an inserting groove for the pre-pressing plate (20) to horizontally penetrate through, the end wall, close to the bottom end, of the plastic packaging box (2) is embedded with an image acquisition box (15) which is arranged flush with the inner wall of the plastic packaging box (2), and the inside of the image acquisition box (15) is provided with a camera (16) and an industrial control panel electrically connected with the camera (16).
2. The SIP chip stack package system of claim 1, wherein: the feeding pipe (4) is located the fixed cover of the end wall above the linking section of thick bamboo (6) and is equipped with grip block (8), be fixed with fixed sleeve board (10) on the outer end wall that links up section of thick bamboo (6) and is located electric guide rail one (5) top, fixed sleeve board (10) are last to be fixedly installed electric lift pole two (9) of being connected in grip block (8) bottom.
3. The SIP chip stack package system of claim 2, wherein: the end wall of the movable cavity far away from one side of the electric guide rail I (5) is sleeved with a U-shaped guide plate in a sliding mode, and the U-shaped guide plate is fixedly connected with the outer wall of the connecting barrel (6).
4. A SIP chip stack package system according to claim 3, wherein: the U-shaped guide plate is fixedly arranged on the upper end of the U-shaped guide plate, a rotating motor (11) is fixedly connected with the driving end of the rotating motor (11), an external gear (13) is fixedly connected with the driving end of the rotating motor, an internal gear (12) meshed with the external gear (13) is fixedly sleeved on the inner wall of the upper end of the electromagnetic positioning cylinder (7), and a slot for the end wall of the external gear (13) to penetrate is formed in the outer wall of the connecting cylinder (6).
5. The SIP chip stack package system of claim 4, wherein: the inner end wall of the image acquisition box (15) at the inner end wall of the plastic packaging box (2) is made of transparent materials, the camera (16) is arranged corresponding to the SIP chip in position, and the camera (16) is used for acquiring images of the SIP chip.
6. The SIP chip stack package system of claim 5, wherein: the industrial control panel comprises a central control module, an image acquisition module, an image transmission module and an image evaluation module, wherein the central control module is connected with an electric lifting rod II (9), a rotating motor (11), an ultrasonic generator and a camera (16) in a signal manner, the image acquisition module is connected with the camera (16) in a signal manner, the image acquisition module is used for acquiring a side shooting image of an SIP chip, and the camera (16) is used for side shooting the current SIP chip under the control of the central control module to acquire the side shooting image of the current SIP chip.
7. The packaging method of a SIP chip stack packaging system according to claim 6, wherein: the image transmission module is used for transmitting the SIP chip side shot image to the image evaluation module for image evaluation to obtain evaluation information, and transmitting the evaluation information to the central control module, and the central control module controls the electric lifting rod II (9), the rotating motor (11) and the ultrasonic generator, and the specific evaluation control process is as follows:
before the SIP chip is subjected to plastic packaging, a camera (16) is used for performing side shooting on the SIP chip to obtain a preliminary side photo pre-estimated packaging area, the packaging area is divided into a plurality of sub-packaging areas from bottom to top according to the distribution of a plurality of design layers of the SIP chip, and the top ends of the sub-packaging areas are respectively marked as a packaging line I, a packaging line II and a packaging line III;
injecting plastic packaging materials into the first sub-packaging area by using a feeding nozzle (41), wherein in the process, the feeding nozzle (4) horizontally moves and circumferentially rotates to change the injection height and the injection direction of the feeding nozzle (41) so as to inject the plastic packaging materials into a gap between a chip and a substrate, meanwhile, an ultrasonic transmission channel (14) is used for transmitting microwave signals into a plastic packaging box (2), and the molecular motion of the plastic packaging materials is enhanced by microwaves so as to realize uniform distribution of the plastic packaging materials, in the process, intermittent continuous shooting is performed by using a camera (16) until the plastic packaging materials are shot to rise to an upper range and a lower range of a packaging line, at the moment, the injection is stopped, and continuous ultrasonic operation is performed by using an ultrasonic generator so as to realize vibration leveling of the plastic packaging materials, and after the upper end face of the plastic packaging materials shot by the camera (16) is in the same horizontal plane, the injection of the first stage is completed;
step three, injecting materials in the second stage, wherein the injection materials in the second stage are consistent with the injection materials in the first stage, in the injection process, the camera (16) is used for intermittently and continuously shooting until the shot plastic package materials rise to the upper and lower ranges of the packaging line II, at the moment, the injection materials are stopped, the ultrasonic generator is used for continuously performing ultrasonic operation so as to realize the vibration level of the plastic package materials, and after the upper end faces of the plastic package materials shot by the camera (16) are in the same horizontal plane, the injection materials in the second stage are completed;
and fourthly, injecting materials in the third stage, wherein the injection materials in the third stage are consistent with the injection materials in the two stages, in the injection process, the camera (16) is used for intermittently and continuously shooting until the shot plastic package materials rise to the range of the packaging line, the injection materials are stopped at the moment, the ultrasonic generator is used for continuously performing ultrasonic work so as to realize vibration leveling of the plastic package materials, and after the upper end surfaces of the plastic package materials shot by the camera (16) are in the same horizontal plane, the injection materials in the third stage are completed.
8. The packaging method of the SIP chip stack packaging system according to claim 7, wherein: the method comprises the following steps:
s1, solidifying a bottom chip: a technician firstly solidifies a first layer of chips on a substrate and connects the chips with layout electrodes to realize electrical conduction;
s2, stacking chips: bonding the second layer chip to the first layer chip and connecting the second layer chip with the layout electrode, wherein each stacking can be fixed by special bonding glue, so that a plurality of design layers are formed by parallel space isolation and stacking up and down to complete the stacking of the SIP chips;
s3, welding a chip: soldering the periphery of each layer of chips to provide electrical connection for the chips during the multi-layer stacking process;
s4, external packaging: placing the stacked SIP chips at a packaging position on a plastic packaging table (1), and covering a plastic packaging box (2) on the SIP chips through a plurality of groups of electric lifting rods I (3);
the SIP chip before packaging is subjected to side shooting prediction packaging area by using a camera (16), the packaging area is pre-divided into a plurality of sub-packaging areas distributed from bottom to top according to the distribution of a plurality of design layers of the SIP chip, the feeding pipe (4) is used for horizontally moving and circumferentially rotating, the feeding height and the feeding direction of a feeding nozzle (41) are changed, and the feeding of the sub-packaging areas from bottom to top is sequentially completed, and in the feeding process, an ultrasonic transmission channel (14) is used for vibrating the plastic packaging material in cooperation with an ultrasonic generator so as to realize the uniform distribution of the plastic packaging material in the packaging areas;
after the material injection is finished, the feeding pipe (4) is moved upwards until the feeding nozzle (41) is lifted to be above the horizontal direction of the pre-pressing plate (20), the pre-pressing plate (20) is conveyed into the plastic packaging box (2) by utilizing a pair of electric guide rails II (17), the pre-pressing plate (20) is driven to be pressed downwards by utilizing an electric lifting rod III (19), and the pre-pressing plate (20) is used for extrusion molding of the plastic packaging material to obtain a packaging body;
s5, demolding: after packaging is finished, the plastic packaging box (2) is lifted upwards by the electric lifting rod I (3), and demolding of the packaging body is completed.
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