CN202405240U - Semiconductor integrated block automatic plane pin adjuster pin-adjusting guide rail - Google Patents
Semiconductor integrated block automatic plane pin adjuster pin-adjusting guide rail Download PDFInfo
- Publication number
- CN202405240U CN202405240U CN2011204586625U CN201120458662U CN202405240U CN 202405240 U CN202405240 U CN 202405240U CN 2011204586625 U CN2011204586625 U CN 2011204586625U CN 201120458662 U CN201120458662 U CN 201120458662U CN 202405240 U CN202405240 U CN 202405240U
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- CN
- China
- Prior art keywords
- guide rail
- pin
- pin guide
- whole
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The present utility model discloses a semiconductor integrated block automatic plane pin adjuster pin-adjusting guide rail. The guide rail is characterized in that a pin-adjusting guide rail panel (21) is designed, a rubber hose feed pipe (1) is fixedly connected on the upper part of the pin-adjusting guide rail panel, a rubber hose feed positioning module (2) is fixedly connected with the upper part of the rubber hose feed pipe, a fixed pitch cylinder (9) provided with a solenoid valve is fixedly connected with the middle part of the pin-adjusting guide rail panel, a flat pin cylinder (5) provided with a solenoid valve is closely fixed below the fixed pitch cylinder, an upper die(7) is connected with output ends of the two cylinders, the upper die is connected with a lower die(20) through an upper connecting snap close (6) and a lower connecting snap close (10), and the lower part of the pin-adjusting guide rail panel is provided with a discharge hole(13). In the semiconductor integrated block automatic plane pin adjuster pin-adjusting guide rail, the solenoid valves are combined with the cylinders, a program controller PLC is also perfectly combined with pneumatic control, all operations are carried out under the control of the program controller, thus production efficiency is high, pitch positioning is accurate, and quality is reliable.
Description
Technical field
The utility model relates to the whole pin guide rail of a kind of semiconductor integrated package automatic plane pins arranging machine.
Background technology
As everyone knows, the semiconductor integrated package is all produced through automation equipment by professional production producer, and the pin that much are connected with printed circuit board (PCB) are arranged on the integrated package, during use all is through welding these pin to be linked to each other with contact on the printed circuit board (PCB).But; Owing to be automated production, these pin pin inevitably can occur apart from against regulation size, and all pin are not in conplane problem; Cause to occur connection error or rosin joint when using producer to weld with automatic welder(welding machine), thus the quality of the influence product of producing.Therefore, before production, all need a distance and whole pin be carried out in (charging pipe) taking-up from packing one by one of these integrated packages.And prior art all is manual operation, and work efficiency is low, and quality can not be protected.
The utility model content
The purpose of the utility model is to provide a kind of production efficiency height, pin apart from accurate positioning, the whole pin guide rail of reliable quality semiconductor integrated package automatic plane pins arranging machine for the deficiency that overcomes prior art.Its concrete technical scheme is: design one whole pin guide rail panel; Whole pin guide rail panel top is connected with the sebific duct feed pipe, the affixed sebific duct charging positioning module in sebific duct feed pipe top, and what be connected with charged magnet valve in the middle part of the whole pin guide rail panel decides pin apart from cylinder; It is close to the flat beriberi cylinder that is fixed with a charged magnet valve down; Two cylinder outputs are connected with a patrix, patrix through connect snap close with under be connected snap close and connect a counterdie, whole pin guide rail panel bottom is provided with discharging opening.
For to being about to carry out the integrated package location of the whole pin in plane, put in order pin guide rail panel and be provided with charging location kerve, be fixed with a location cover plate on the kerve of charging location.
For the integrated package after making the whole pin in plane good gets into the charging sebific duct smoothly, whole pin guide rail rear surface is provided with discharging opening location kerve, is fixed with the discharging cover plate on it.
For accurately the control integrated package is at the whole pin of whole placement of foot, whole pin guide rail panel is provided with a whole pin location kerve at whole placement of foot, and its underpart is provided with the liftout cylinder and the backgauge cylinder of charged magnet valve.
For on the plane whole placement of foot accurately locate, the pin that is fixed with charged magnet valve respectively below the whole placement of foot of whole pin guide rail panel is apart from positioning cylinder and plane positioning cylinder.
For upper and lower mould is separated, also be connected with the flat pin demoulding cylinder of the whole pin of charged magnet valve respectively under the whole pin guide rail panel apart from demoulding cylinder and charged magnet valve, two cylinders are affixed with counterdie respectively.
When using the utility model semiconductor integrated package automatic plane pins arranging machine to put in order the pin guide rail, will put in order the pin guide rail and load onto semiconductor integrated package automatic plane pins arranging machine, connect pressure gas source; Turn on the power switch, change over switch is switched on the automatic transmission, in the sebific duct feed pipe, load onto the sebific duct that integrated package is housed; Integrated package in the sebific duct will slide into down automatically along the inclined-plane and put in order the pin position; According to the instruction that cyclelog PLC sends, each working cylinder positions integrated package respectively, whole pin distance; Leveling face, and with the whole pin in plane the integrated package after good is put into the sebific duct that is inserted in discharging opening.When carrying out manual operation, with change over switch switch to manual on, progressively use according to the function of each operating key on the control panel to get final product.
Can find out from the technical scheme of the utility model; Because the utility model semiconductor integrated package automatic plane pins arranging machine whole pin guide rail has adopted combining of electromagnetically operated valve and cylinder; Simultaneously cyclelog PLC and pneumatic control have been carried out perfect combination; All flags all are to carry out down in cyclelog control, so the production efficiency height, and pin is apart from accurate positioning, reliable in quality, reached the goal of the invention of the utility model fully.
Description of drawings
Fig. 1 is the structural representation of the whole pin guide rail of the utility model semiconductor integrated package automatic plane pins arranging machine.
Embodiment
Below in conjunction with accompanying drawing the utility model is done further to detail.
Embodiment 1, referring to accompanying drawing 1, and design one whole pin guide rail panel 21; Whole pin guide rail panel top is connected with sebific duct feed pipe 1, the affixed sebific duct charging positioning module 2 in sebific duct feed pipe top, and what be connected with charged magnet valve in the middle part of the whole pin guide rail panel decides pin apart from cylinder 9; It is close to the flat beriberi cylinder 5 that is fixed with a charged magnet valve down; Two cylinder outputs are connected with a patrix 7, and patrix is put in order pin guide rail panel bottom and is provided with discharging opening 13 through connect to go up snap close 6 and be connected snap close 10 connections one counterdie 20 down.For to being about to carry out the integrated package location of the whole pin in plane, put in order pin guide rail panel and be provided with charging location kerve 3, be fixed with a location cover plate 4 on the kerve of charging location.For the integrated package after making the whole pin in plane good gets into the charging sebific duct smoothly, whole pin guide rail rear surface is provided with discharging opening location kerve 11, is fixed with discharging cover plate 12 on it.For accurately the control integrated package is at the whole pin of whole placement of foot, whole pin guide rail panel is provided with a whole pin location kerve 8 at whole placement of foot, and its underpart is provided with the liftout cylinder 14 and backgauge cylinder 15 of charged magnet valve.For on the plane whole placement of foot accurately locate, the pin that is fixed with charged magnet valve respectively below the whole placement of foot of whole pin guide rail panel is apart from positioning cylinder 17 and plane positioning cylinder 18.For upper and lower mould is separated, the whole pin that also is connected with charged magnet valve under the whole pin guide rail panel respectively is affixed with counterdie respectively apart from flat pin demoulding cylinder 19, two cylinders of demoulding cylinder 16 and charged magnet valve.
Claims (6)
1. a semiconductor integrated package automatic plane pins arranging machine is put in order the pin guide rail; It is characterized in that: design one whole pin guide rail panel (21); Whole pin guide rail panel top is connected with sebific duct feed pipe (1), the affixed sebific duct charging positioning module (2) in sebific duct feed pipe top, and what be connected with charged magnet valve in the middle part of the whole pin guide rail panel decides pin apart from cylinder (9); It is close to the flat beriberi cylinder (5) that is fixed with a charged magnet valve down; Two cylinder outputs are connected with a patrix (7), and patrix is put in order pin guide rail panel bottom and is provided with discharging opening (13) through connect to go up snap close (6) and be connected snap close (10) connection one counterdie (20) down.
2. a kind of semiconductor integrated package automatic plane pins arranging machine according to claim 1 is put in order the pin guide rail, it is characterized in that: whole pin guide rail panel is provided with charging location kerve (3), is fixed with a location cover plate (4) on the kerve of charging location.
3. a kind of semiconductor integrated package automatic plane pins arranging machine according to claim 1 is put in order the pin guide rail, it is characterized in that: whole pin guide rail rear surface is provided with discharging opening location kerve (11), is fixed with discharging cover plate (12) on it.
4. a kind of semiconductor integrated package automatic plane pins arranging machine according to claim 1 is put in order the pin guide rail; It is characterized in that: whole pin guide rail panel is provided with a whole pin location kerve (8) at whole placement of foot, and its underpart is provided with the liftout cylinder (14) and the backgauge cylinder (15) of charged magnet valve.
5. a kind of semiconductor integrated package automatic plane pins arranging machine according to claim 1 is put in order the pin guide rail, it is characterized in that: the pin that is fixed with charged magnet valve respectively below the whole placement of foot of whole pin guide rail panel is apart from positioning cylinder (17) and plane positioning cylinder (18).
6. a kind of semiconductor integrated package automatic plane pins arranging machine according to claim 1 is put in order the pin guide rail; It is characterized in that: also be connected with the flat pin demoulding cylinder (19) of the whole pin of charged magnet valve apart from demoulding cylinder (16) and charged magnet valve respectively under the whole pin guide rail panel, two cylinders are affixed with counterdie respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204586625U CN202405240U (en) | 2011-11-18 | 2011-11-18 | Semiconductor integrated block automatic plane pin adjuster pin-adjusting guide rail |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204586625U CN202405240U (en) | 2011-11-18 | 2011-11-18 | Semiconductor integrated block automatic plane pin adjuster pin-adjusting guide rail |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202405240U true CN202405240U (en) | 2012-08-29 |
Family
ID=46702871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204586625U Expired - Fee Related CN202405240U (en) | 2011-11-18 | 2011-11-18 | Semiconductor integrated block automatic plane pin adjuster pin-adjusting guide rail |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202405240U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107622960A (en) * | 2016-07-15 | 2018-01-23 | 京元电子股份有限公司 | The semiconductor subassembly processing unit and semiconductor subassembly class test system of elastomeric composition |
| CN116525506A (en) * | 2023-07-04 | 2023-08-01 | 成都汉芯国科集成技术有限公司 | SIP chip stacking and packaging system and packaging method thereof |
-
2011
- 2011-11-18 CN CN2011204586625U patent/CN202405240U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107622960A (en) * | 2016-07-15 | 2018-01-23 | 京元电子股份有限公司 | The semiconductor subassembly processing unit and semiconductor subassembly class test system of elastomeric composition |
| CN107622960B (en) * | 2016-07-15 | 2020-04-10 | 京元电子股份有限公司 | Semiconductor component processing device with flexible combination and semiconductor component classification test system |
| CN116525506A (en) * | 2023-07-04 | 2023-08-01 | 成都汉芯国科集成技术有限公司 | SIP chip stacking and packaging system and packaging method thereof |
| CN116525506B (en) * | 2023-07-04 | 2023-09-01 | 成都汉芯国科集成技术有限公司 | SIP chip stacking and packaging system and packaging method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120829 Termination date: 20131118 |