CN113085098A

CN113085098A - Molding and curing mold for producing plastic package diode and implementation method thereof

Info

Publication number: CN113085098A
Application number: CN202110394095.XA
Authority: CN
Inventors: 苏晓刚; 谢慈善
Original assignee: Ganlong Microelectronics Technology Dingnan Co ltd
Current assignee: Ganlong Microelectronics Technology Dingnan Co ltd
Priority date: 2021-04-13
Filing date: 2021-04-13
Publication date: 2021-07-09

Abstract

The invention discloses a forming and curing mold for producing a plastic package diode and an implementation method thereof, belonging to the technical field of plastic package diode production. The forming and curing mold for producing the plastic packaged diode and the implementation method thereof prevent injection liquid from leaking, improve the quality of a plastic packaged object, improve the demolding efficiency, reduce the inconvenience of manual demolding, achieve the effect of rapid curing, reduce water resource waste through circulating cooling, greatly improve the cooling efficiency, effectively guide the upper mold base mechanical energy, improve the pressing precision, ensure the joint closing efficiency, improve the injection molding efficiency, avoid the phenomenon that the inner groove is blocked by the solidification of the inner liquid during the next injection molding, and improve the dredging efficiency.

Description

Molding and curing mold for producing plastic package diode and implementation method thereof

Technical Field

The invention relates to the technical field of plastic package diode production, in particular to a forming and curing mold for plastic package diode production and an implementation method thereof.

Background

A diode is a device with two electrodes that only allows current to flow in a single direction, and many uses apply its rectifying function. When the diode is manufactured, a chip is welded in a pin frame provided with each passage structure, the frame is communicated with the chip and then placed in an injection mold, fluid-shaped insulating materials are injected into the mold through the injection mold, the insulating materials are cooled, molded, demoulded and taken out, and the independent diode is obtained after cutting. The plastic package mold of the diode mainly comprises an upper mold structure and a lower mold structure, a sunken mold cavity structure is generally arranged in the lower mold, a lead frame welded with a chip is placed between the upper mold and the lower mold, a mold cavity is formed between the upper mold and the lower mold, and then an injection molding machine is used for injecting a fluid-shaped insulating material into the mold cavity.

Disclosure of Invention

The invention aims to provide a forming and curing mold for producing a plastic package diode and an implementation method thereof, which can prevent injection liquid from leaking, improve the quality of a plastic package object, improve the demolding efficiency, reduce the inconvenience of manual demolding, achieve the effect of rapid curing, reduce the waste of water resources through circulating cooling, greatly improve the cooling efficiency, effectively guide the upper die base by mechanical energy, improve the pressing precision, ensure the seaming efficiency, improve the injection efficiency, avoid the internal liquid from solidifying and blocking an internal groove during the next injection and improve the dredging efficiency, and solve the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme:

the utility model provides a production of plastic envelope diode is with shaping curing mold, includes the base, the top of base sets up the curing mold subassembly, and the inside below of curing mold subassembly is provided with the ejecting subassembly of drawing of patterns, and the inside of curing mold subassembly sets up the cooling module, and power component is connected to the top of curing mold subassembly, and the subassembly of moulding plastics is connected to curing mold subassembly top power component top.

Further, the curing mould assembly comprises an upper mould base, a lower mould base, an upper mould groove, a lower mould groove, a packaging placing groove and a closed groove film, wherein the lower mould base is fixed above the base, the lower mould groove is formed in the upper part of the lower mould base, the upper mould base is arranged above the lower mould base, the upper mould groove is formed in the lower part of the upper mould base, the upper mould groove and the lower mould groove are symmetrically connected in a pressing mode, the packaging placing groove is formed in the side end of the lower mould groove, and the closed groove film is respectively arranged on the pressing surfaces of the upper mould groove and the lower mould groove.

Further, ejecting subassembly of drawing of patterns includes interior flexible groove, the piston cover, the knockout pin, the gas-supply pipe, branch gas pipe and air pump, interior flexible groove is seted up in the inside of die holder, the inside in interior flexible groove sets up the knockout pin, carry out sealing connection through cup jointing the piston cover between knockout pin bottom and the interior flexible inslot wall, the top of knockout pin sets up at the bed die inslot, interior flexible groove below sets up the air inlet and divides gas branch union coupling, branch gas pipe bottom is connected with the gas-supply pipe, the one end and the air pump of gas-supply pipe are connected, interior flexible groove, the piston cover, the quantity of knockout pin and branch gas pipe all is the same with the quantity in bed die groove.

Furthermore, the cooling assembly comprises a water inlet pipe, a direction ring pipe, a connecting pipe, a bent pipe, a water outlet pipe and a cooling box, one end of the water inlet pipe is connected with the cooling box, the other end of the water inlet pipe is connected with one end of the direction ring pipe, the lower part of the direction ring pipe is connected with the two ends of the bent pipe through the connecting pipe, the other end of the direction ring pipe is connected with the water outlet pipe, and one end of the water outlet pipe is connected with the.

Furthermore, the power assembly comprises a pressing air cylinder, a telescopic rod, an upper pressure plate, a guiding upper sleeve and a guiding pipe sleeve, the pressing air cylinder is fixed on two sides in the base, the telescopic rod is connected to an output shaft of the pressing air cylinder, the telescopic rod penetrates through the base to be connected with the upper pressure plate, the upper pressure plate is arranged above the upper die base and connected with the top end of the upper die base, the guiding upper sleeves are respectively arranged at four corners of the upper pressure plate, the guiding pipe sleeves in butt joint with the guiding upper sleeves are arranged at four corners of the upper side of the base below the guiding upper sleeves, and.

Further, the subassembly of moulding plastics includes the pipe of moulding plastics, thermal-insulated outer tube, rotates the screw rod, zone of heating, piston, the mouth and the reposition of redundant personnel subassembly of moulding plastics, and the thermal-insulated outer tube is cup jointed in the outside of the pipe of moulding plastics, sets up the zone of heating between thermal-insulated outer tube and the pipe of moulding plastics, and the inside of the pipe of moulding plastics sets up rotates the screw rod, rotates the bottom of screw rod and connects the piston, and the mouth of moulding plastics sets up in the bottom of the pipe of moulding plastics.

Furthermore, the shunt assembly comprises an injection molding main groove, injection molding shunt grooves and injection molding holes, the top end of the injection molding main groove is in butt joint with the injection molding port, the injection molding main groove is respectively connected with a plurality of injection molding shunt grooves, the bottom ends of the injection molding shunt grooves are connected with the injection molding holes, the injection molding holes are formed in the top end of the upper mold groove, the injection molding shunt grooves and the injection molding holes are the same in number as the upper mold groove, and the injection molding shunt grooves are communicated with the upper mold groove through the injection molding holes.

Further, the inside heating element that still is provided with in curing mold subassembly top, heating element include thermostat, wire, heating rod and the core that generates heat, and the thermostat passes through the wire and is connected with the heating circuit of heating rod, and the inside cup joints the core arc winding that generates heat and moulds plastics between the splitter box in the upper die base of heating rod.

The invention provides another technical scheme: an implementation method of a molding curing mold for producing a plastic package diode comprises the following steps:

the method comprises the following steps: placing an object to be subjected to plastic package in a lower die groove through a packaging placing groove, and driving an upper die holder below an upper pressing plate to press downwards through a telescopic rod above a pressing air cylinder so as to press and seal the upper die holder and a lower die holder;

step two: after the upper die holder and the lower die holder are pressed, the screw is rotated to drive the piston to extrude and inject in the injection pipe, injection liquid is extruded into the injection main groove, and the injection liquid is respectively conveyed into each upper die groove and each lower die groove through the plurality of injection shunting grooves and the plurality of injection holes to complete injection;

step three: after the injection molding is finished, the air pump conveys air to the inner telescopic groove to pressurize, so that the piston sleeve and the ejector rod above the piston sleeve are driven to move upwards, finished products in the lower die groove are ejected and demoulded, and the packaging and curing of the objects are finished.

Further, aiming at the step two, after the upper die base and the lower die base are pressed and molded, cooling water is conveyed into the water inlet pipe to cool the rice in the direction of the ring pipe, the connecting pipe transmits the cooling water to the bent pipe, and the ground die after injection molding is cooled through the cooling water, so that the effect of fast solidification is achieved, and the water after heat exchange is conveyed into the cooling box through the water outlet pipe to be cooled and circulated.

Compared with the prior art, the invention has the beneficial effects that:

1. according to the forming and curing mold for producing the plastic package diode and the implementation method thereof, the side end of the lower mold groove is provided with the packaging placing groove, the sealing groove films are respectively arranged on the pressing surfaces of the upper mold groove and the lower mold groove, the plastic package object can be conveniently placed through the packaging placing groove, and the sealing groove films are arranged, so that the upper mold groove and the lower mold groove can be effectively sealed during pressing, the injection liquid is prevented from leaking, and the quality of the plastic package object is improved.

2. The invention provides a forming and curing mold for producing plastic-sealed diodes and an implementation method thereof.

3. One end of a water outlet pipe is connected with a cooling box, after an upper die base and a lower die base are pressed and pressed to complete injection molding, cooling water is conveyed into a water inlet pipe in a direction of a circular pipe to cool rice, a connecting pipe transmits the cooling water to a bent pipe, and the ground die after injection molding is cooled by the cooling water, so that the effect of rapid solidification is achieved.

4. According to the forming and curing die for producing the plastic package diode and the implementation method thereof, the guide pipe sleeve is sleeved outside the telescopic rod, the telescopic rod above the pressing cylinder is driven to drive the upper die holder below the upper pressing plate to press downwards, so that the upper die holder and the lower die holder are pressed and sealed, the guide pipe sleeve is arranged, the upper die holder can be effectively guided mechanically, the pressing precision is improved, and the seaming efficiency is ensured.

5. The invention provides a forming and curing mold for producing plastic-sealed diodes and an implementation method thereof.A heating rod is sleeved inside a heating rod and is wound between injection molding shunting grooves in an upper mold base in an arc shape, and the injection molding shunting grooves in the upper mold base are preheated by the heating rod before injection molding of an injection molding assembly, so that injection molding liquid is prevented from being cooled and solidified, the injection molding efficiency is improved, the inner grooves can be prevented from being blocked by solidification of the inner liquid during the next injection molding, and the dredging efficiency is improved.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is an exploded view of the curing mold assembly structure of the present invention;

FIG. 3 is a schematic structural view of the lower die holder of the present invention;

FIG. 4 is a cross-sectional view of a curing mold assembly of the present invention;

FIG. 5 is a cross-sectional view of the structure of the demold ejection assembly of the present invention;

FIG. 6 is a schematic view of the cooling assembly of the present invention;

FIG. 7 is a schematic view of the power assembly of the present invention;

FIG. 8 is a cross-sectional view of the injection molding assembly of the present invention;

FIG. 9 is a sectional view of the overall structure of a second embodiment of the present invention;

fig. 10 is a schematic structural view of a heating assembly of the present invention.

In the figure: 1. a base; 2. curing the mold assembly; 21. an upper die holder; 22. a lower die holder; 23. an upper mold groove; 24. a lower mold groove; 25. packaging the placing groove; 26. closing the tank membrane; 3. demolding and ejecting the component; 31. an inner telescopic groove; 32. a piston sleeve; 34. ejecting the rod; 35. a gas delivery pipe; 36. a gas distribution branch pipe; 37. an air pump; 4. a cooling assembly; 41. a water inlet pipe; 42. a directional ring pipe; 43. a connecting pipe; 44. bending the pipe; 45. a water outlet pipe; 46. a cooling tank; 5. a power assembly; 51. pressing a cylinder; 52. a telescopic rod; 53. an upper pressure plate; 54. a guide upper sleeve; 55. a guide pipe sleeve; 6. an injection molding assembly; 61. injection molding a tube; 62. an outer heat-insulating pipe; 63. rotating the screw; 64. a heating layer; 65. a piston; 66. an injection molding port; 67. a flow diversion assembly; 671. injection molding a main groove; 672. injection molding of the splitter box; 673. injection molding holes; 7. a heating assembly; 71. a temperature controller; 72. a wire; 73. a heating rod; 74. a heating core.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, a forming and curing mold for producing a plastic package diode and an implementation method thereof include a base 1, a curing mold assembly 2 is arranged above the base 1, a demolding and ejecting assembly 3 is arranged below the inside of the curing mold assembly 2, a cooling assembly 4 is arranged inside the curing mold assembly 2, a power assembly 5 is connected above the curing mold assembly 2, and an injection molding assembly 6 is connected above the power assembly 5 above the curing mold assembly 2.

Referring to fig. 2-4, the curing mold assembly 2 includes an upper mold base 21, a lower mold base 22, an upper mold groove 23, a lower mold groove 24, a packaging placement groove 25 and a sealing groove film 26, the lower mold base 22 is fixed above the base 1, the lower mold groove 24 is formed in the upper portion of the lower mold base 22, the upper mold base 21 is arranged above the lower mold base 22, the upper mold groove 23 is formed in the lower portion of the upper mold base 21, the upper mold groove 23 and the lower mold groove 24 are symmetrically connected in a press fit manner, the packaging placement groove 25 is formed in the side end of the lower mold groove 24, the sealing groove film 26 is respectively arranged on the press fit surfaces of the upper mold groove 23 and the lower mold groove 24, the plastic package object can be conveniently placed through the packaging placement groove 25, the sealing groove film 26 is arranged, the upper mold groove 23 and the lower mold groove 24 can be effectively sealed during the press fit, the injection liquid is prevented from leaking, and the quality of.

Referring to fig. 5, the mold release and ejection assembly 3 includes an inner telescopic slot 31, a piston sleeve 32, an ejection rod 34, an air pipe 35, an air distribution branch pipe 36 and an air pump 37, the inner telescopic slot 31 is disposed inside the lower die base 22, the ejection rod 34 is disposed inside the inner telescopic slot 31, the bottom end of the ejection rod 34 is hermetically connected to the inner wall of the inner telescopic slot 31 through the sleeved piston sleeve 32, the top end of the ejection rod 34 is disposed in the lower die slot 24, an air inlet is disposed below the inner telescopic slot 31 and connected to the air distribution branch pipe 36, the bottom end of the air distribution branch pipe 36 is connected to the air pipe 35, one end of the air pipe 35 is connected to the air pump 37, the number of the inner telescopic slot 31, the number of the piston sleeve 32, the number of the ejection rod 34 and the number of the air distribution branch pipe 36 are the same as the number of the lower die slot 24, after the injection molding, the air pump 37 delivers air to the inner telescopic slot 31 for pressurization, thereby driving the piston sleeve 32 and the ejection rod, therefore, finished products in the lower die groove 24 are ejected out and demoulded, the objects are packaged and solidified, the demoulding efficiency is improved, and the inconvenience of manual demoulding is reduced.

Referring to fig. 6, the cooling module 4 includes a water inlet pipe 41, a directional loop pipe 42, a connecting pipe 43, a bent pipe 44, a water outlet pipe 45 and a cooling box 46, wherein one end of the water inlet pipe 41 is connected to the cooling box 46, the other end of the water inlet pipe 41 is connected to one end of the directional loop pipe 42, the lower portion of the directional loop pipe 42 is connected to both ends of the bent pipe 44 through the connecting pipe 43, the other end of the directional loop pipe 42 is connected to the water outlet pipe 45, one end of the water outlet pipe 45 is connected to, after the upper die holder 21 and the lower die holder 22 are pressed and injection molded, the water inlet pipe 41 conveys cooling water into a circular pipe 42 in the rice direction, the connecting pipe 43 transmits the cooling water to a bent pipe 44, the injection molded ground die is cooled by the cooling water, therefore, the effect of rapid solidification is achieved, the water after heat exchange is conveyed into the cooling box 46 by the water outlet pipe 45 for cooling circulation, and through circulation cooling, the waste of water resources is reduced, and the cooling efficiency is greatly improved.

Referring to fig. 7, the power assembly 5 includes a pressing cylinder 51, an expansion rod 52, an upper pressing plate 53, a guiding upper sleeve 54 and a guiding sleeve 55, the pressing cylinder 51 is fixed on two sides of the base 1, the expansion rod 52 is connected to an output shaft of the pressing cylinder 51, the expansion rod 52 penetrates the base 1 and is connected to the upper pressing plate 53, the upper pressing plate 53 is disposed above the upper mold base 21, and is connected with the top end of the upper die holder 21, the four corners of the upper press plate 53 are respectively provided with a guide upper sleeve 54, the four corners of the upper part of the base 1 below the guide upper sleeve 54 are provided with guide pipe sleeves 55 which are butted with the guide upper sleeve, the guide pipe sleeves 55 are sleeved outside the telescopic rods 52, the telescopic rods 52 above the driving pressing air cylinders 51 drive the upper die holder 21 below the upper press plate 53 to press downwards, thereby close upper die base 21 and die holder 22 pressfitting, through setting up guide tube sleeve 55, effectively lead upper die base 21 mechanical energy, improve the pressfitting precision, guarantee the joint close efficiency.

Referring to fig. 8, the injection molding assembly 6 includes an injection molding pipe 61, an outer insulating pipe 62, a rotating screw 63, a heating layer 64, a piston 65, an injection molding port 66 and a shunt assembly 67, the outer side of the injection molding pipe 61 is sleeved with the outer insulating pipe 62, the heating layer 64 is arranged between the outer insulating pipe 62 and the injection molding pipe 61, the rotating screw 63 is arranged inside the injection molding pipe 61, the bottom end of the rotating screw 63 is connected with the piston 65, the injection molding port 66 is arranged at the bottom end of the injection molding pipe 61, the shunt assembly 67 is arranged below the injection molding port 66, the shunt assembly 67 includes an injection molding main tank 671, injection molding shunt tanks 672 and injection molding holes 673, the top end of the injection molding main tank 671 is butted with the injection molding port 66, the injection molding main tank 671 is respectively connected with a plurality of injection molding shunt tanks 672, the bottom ends of the injection molding shunt tanks are connected with the injection molding holes 673, the injection molding holes 673 are arranged in, and the injection molding diversion grooves 672 are communicated with the upper mold groove 23 through the injection molding holes 673, the screw 63 is rotated to drive the piston 65 to extrude and mold in the injection molding pipe 61, the injection molding liquid is extruded into the injection molding main groove 671, the injection molding liquid is respectively conveyed into each upper mold groove 23 and each lower mold groove 24 through the plurality of injection molding diversion grooves 672 and the plurality of injection molding holes 673, the injection molding is completed, a plurality of objects can be packaged simultaneously through the injection molding diversion grooves 672, and the plastic packaging efficiency is improved.

In order to better show the implementation process of the molding and curing mold for producing the plastic packaged diode, the embodiment provides an implementation method of the molding and curing mold for producing the plastic packaged diode, which includes the following steps:

the method comprises the following steps: placing an object to be subjected to plastic package in the lower die groove 24 through the package placing groove 25, and driving the upper die holder 21 below the upper pressing plate 53 to be pressed downwards through the telescopic rod 52 above the pressing cylinder 51, so that the upper die holder 21 and the lower die holder 22 are pressed and sealed;

step two: after the upper die holder 21 and the lower die holder 22 are pressed, the screw 63 is rotated to drive the piston 65 to extrude and inject in the injection molding pipe 61, injection molding liquid is extruded into the injection molding main groove 671, and the injection molding liquid is respectively conveyed into each upper die groove 23 and each lower die groove 24 through the plurality of injection molding branch grooves 672 and the plurality of injection molding holes 673, so that injection molding is completed;

step three: after the injection molding is completed, the air pump 37 delivers air into the inner telescopic slot 31 to pressurize, so as to drive the piston sleeve 32 and the ejector rod 34 above the piston sleeve to move upwards, so as to eject, demold and complete the packaging and curing of the object, wherein the finished product in the lower mold slot 24 is obtained.

Referring to fig. 9, a forming and curing mold for producing a plastic package diode and an implementation method thereof include a base 1, a curing mold assembly 2 is disposed above the base 1, a demolding ejection assembly 3 is disposed below the inside of the curing mold assembly 2, a cooling assembly 4 is disposed inside the curing mold assembly 2, a power assembly 5 is connected above the curing mold assembly 2, an injection molding assembly 6 is connected above the power assembly 5 above the curing mold assembly 2, the curing mold assembly 2 includes an upper mold base 21, a lower mold base 22, an upper mold groove 23, a lower mold groove 24, a packaging placement groove 25 and a sealing groove film 26, the lower mold base 22 is fixed above the base 1, the lower mold groove 24 is disposed above the lower mold base 22, the upper mold base 21 is disposed above the lower mold base 22, the upper mold groove 23 is disposed below the upper mold base 21, the upper mold groove 23 and the lower mold groove 24 are symmetrically press-connected, the side end of the lower mold groove 24 is provided with a packaging placing groove 25, the laminating surfaces of the upper mold groove 23 and the lower mold groove 24 are respectively provided with a closed groove film 26, the packaging placing groove 25 is arranged to facilitate the placement of a plastic package object, the closed groove film 26 is arranged, the upper mold groove 23 and the lower mold groove 24 can be effectively sealed during laminating to prevent injection liquid from leaking, the quality injection molding assembly 6 of the plastic package object comprises an injection molding pipe 61, a heat insulation outer pipe 62, a rotating screw 63, a heating layer 64, a piston 65, an injection molding opening 66 and a shunt assembly 67, the heat insulation outer pipe 62 is sleeved outside the injection molding pipe 61, the heating layer 64 is arranged between the heat insulation outer pipe 62 and the injection molding pipe 61, the rotating screw 63 is arranged inside the injection molding pipe 61, the bottom end of the rotating screw 63 is connected with the piston 65, the injection molding opening 66 is arranged at the bottom end of the injection molding pipe 61, the shunt assembly 67 is arranged below the injection molding opening 66, The injection molding shunt grooves 672 and the injection molding holes 673 are formed in the top end of the injection molding main groove 671, the top end of the injection molding main groove 671 is in butt joint with the injection molding port 66, the injection molding main groove 671 is respectively connected with the injection molding shunt grooves 672, the bottom ends of the injection molding shunt grooves 672 are connected with the injection molding holes 673, the injection molding holes 673 are formed in the top end of the upper mold groove 23, the injection molding shunt grooves 672 and the injection molding holes 673 are the same as the upper mold groove 23 in number, the injection molding shunt grooves 672 are communicated with the upper mold groove 23 through the injection molding holes 673, the piston 65 is driven by the rotating screw 63 to extrude and mold in the injection molding pipe 61, the injection molding liquid is extruded into the injection molding main groove 671, the injection molding liquid is respectively conveyed into each of the upper mold groove 23 and the lower mold groove 24 through the injection molding shunt grooves 672, injection molding is completed.

Referring to fig. 10, a heating assembly 7 is further disposed inside the upper portion of the curing mold assembly 2, the heating assembly 7 includes a temperature controller 71, a lead 72, a heating rod 73 and a heating core 74, the temperature controller 71 is connected to a heating circuit of the heating rod 73 through the lead 72, the heating rod 73 is sleeved inside the heating rod 73, the heating core 74 is wound between the injection shunting grooves 672 of the heating rod 73 in the upper mold base 21 in an arc shape, before the injection molding of the injection molding assembly 6, the injection shunting grooves 672 of the upper mold base 21 are preheated through the heating rod 73, so as to prevent the injection molding liquid from being cooled and solidified, improve the injection molding efficiency, and also prevent the inner grooves from being blocked by the solidification of the internal liquid during the next injection.

In summary, the molding and curing mold for producing the plastic packaged diode and the implementation method thereof provided by the present invention are characterized in that a packaging placing groove 25 is formed at a side end of a lower mold groove 24, a sealing groove film 26 is respectively disposed on a pressing surface of an upper mold groove 23 and the lower mold groove 24, the plastic packaged object is convenient to place by disposing the packaging placing groove 25, and the sealing groove film 26 is disposed, so that the upper mold groove 23 and the lower mold groove 24 can be effectively sealed during pressing, leakage of injection molding liquid is prevented, and quality of the plastic packaged object is improved, the number of the inner telescopic groove 31, the number of the piston sleeve 32, the number of the ejector rods 34 and the number of the gas distribution branch pipes 36 are the same as that of the lower mold groove 24, after injection molding is completed, the air pump 37 delivers air into the inner telescopic groove 31 to pressurize, thereby driving the piston sleeve 32 and the ejector rods 34 above to move upwards, thereby ejecting and demolding finished products in the lower mold groove 24, and completing packaging and curing of, the efficiency of demoulding is improved, the inconvenience of manual demoulding is reduced, one end of a water outlet pipe 45 is connected with a cooling box 46, after the upper die holder 21 and the lower die holder 22 are pressed and pressed to complete injection moulding, cooling water is conveyed into a rice direction circular pipe 42 in a water inlet pipe 41 and is transmitted to a bent pipe 44 through a connecting pipe 43, the ground die after injection moulding is cooled and cooled through the cooling water, so that the effect of rapid solidification is achieved, the water after heat exchange is conveyed into the cooling box 46 through the water outlet pipe 45 for cooling circulation, the waste of water resources is reduced through circulation cooling, the cooling efficiency is greatly improved, a guide pipe sleeve 55 is sleeved outside a telescopic rod 52, the telescopic rod 52 above a pressing cylinder 51 is driven to drive the upper die holder 21 below an upper pressure plate 53 to be pressed downwards, so that the upper die holder 21 and the lower die holder 22 are pressed and sealed, the mechanical energy of the upper die holder 21, guarantee the joint close efficiency, the inside of heating rod 73 cup joints and generates heat core 74 heating rod 73 arc winding and moulds between the subchannel 672 in upper die base 21, before 6 moulds plastics of subassembly of moulding plastics, moulds plastics the subchannel 672 in to upper die base 21 through heating rod 73 and preheat, prevents to mould plastics liquid cooling and solidifies, improves the efficiency of moulding plastics, and inside liquid solidifies the jam inside groove when also can avoiding moulding plastics next time, improves and dredges efficiency.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.

Claims

1. The utility model provides a production of plastic envelope diode is with shaping solidification mould which characterized in that: the injection molding machine is characterized by comprising a base (1), a curing mold component (2) is arranged above the base (1), a demolding ejection component (3) is arranged below the inside of the curing mold component (2), a cooling component (4) is arranged inside the curing mold component (2), a power component (5) is connected above the curing mold component (2), and an injection molding component (6) is connected above the power component (5) above the curing mold component (2).

2. The molding and curing mold for producing the plastic package diode as claimed in claim 1, wherein: the curing mold assembly (2) comprises an upper mold base (21), a lower mold base (22), an upper mold groove (23), a lower mold groove (24), a packaging placing groove (25) and a closed groove film (26), wherein the lower mold base (22) is fixed above the base (1), the lower mold groove (24) is formed in the upper portion of the lower mold base (22), the upper mold base (21) is arranged above the lower mold base (22), the upper mold groove (23) is formed in the inner portion below the upper mold base (21), the upper mold groove (23) and the lower mold groove (24) are in symmetrical press fit connection, the packaging placing groove (25) is formed in the side end of the lower mold groove (24), and the closed groove film (26) is arranged on the press fit surfaces of the upper mold groove (23) and the lower mold groove (24) respectively.

3. The molding and curing mold for producing the plastic package diode as claimed in claim 2, wherein: the demoulding and ejecting component (3) comprises an inner telescopic groove (31), a piston sleeve (32), an ejecting rod (34), an air pipe (35), an air distributing branch pipe (36) and an air pump (37), the inner telescopic groove (31) is arranged in the lower die base (22), the inner telescopic groove (31) is internally provided with an ejector rod (34), the bottom end of the ejector rod (34) is hermetically connected with the inner wall of the inner telescopic groove (31) through a sleeved piston sleeve (32), the top end of the ejector rod (34) is arranged in the lower die groove (24), an air inlet is arranged below the inner telescopic groove (31) and is connected with an air distribution branch pipe (36), the bottom end of the air distribution branch pipe (36) is connected with an air pipe (35), one end of the air pipe (35) is connected with an air pump (37), the number of the inner telescopic grooves (31), the piston sleeves (32), the ejector rods (34) and the air distribution branch pipes (36) is the same as that of the lower die grooves (24).

4. The molding and curing mold for producing the plastic package diode as claimed in claim 3, wherein: cooling element (4) are including inlet tube (41), direction ring pipe (42), connecting pipe (43), curved type pipe (44), outlet pipe (45) and cooler bin (46), inlet tube (41) one end is connected with cooler bin (46), the inlet tube (41) other end is connected with direction ring pipe (42) one end, the below of direction ring pipe (42) is passed through connecting pipe (43) and is connected with the both ends of curved type pipe (44), direction ring pipe (42) other end is connected with outlet pipe (45), outlet pipe (45) one end is connected with cooler bin (46).

5. The molding and curing mold for producing the plastic package diode as claimed in claim 4, wherein: the power assembly (5) comprises a pressing cylinder (51), an expansion rod (52), an upper pressing plate (53), a guide upper sleeve (54) and a guide pipe sleeve (55), the pressing cylinder (51) is fixed on two sides in the base (1), the expansion rod (52) is connected to an output shaft of the pressing cylinder (51), the expansion rod (52) penetrates through the base (1) and is connected with the upper pressing plate (53), the upper pressing plate (53) is arranged above the upper die base (21) and is connected with the top end of the upper die base (21), the guide upper sleeve (54) is respectively arranged at four corners of the upper pressing plate (53), the guide pipe sleeve (55) butted with the upper base (1) below the guide upper sleeve (54) is arranged at four corners of the upper base (1), and the guide pipe sleeve (55) is sleeved on the outer side.

6. The molding and curing mold for producing the plastic package diode as claimed in claim 5, wherein: injection moulding subassembly (6) including moulding plastics pipe (61), thermal-insulated outer tube (62), rotate screw rod (63), zone of heating (64), piston (65), mouth (66) and reposition of redundant personnel subassembly (67) mould plastics, the outside of moulding plastics pipe (61) is cup jointed thermal-insulated outer tube (62), set up zone of heating (64) between thermal-insulated outer tube (62) and the pipe (61) of moulding plastics, the inside of the pipe (61) of moulding plastics sets up rotates screw rod (63), piston (65) are connected to the bottom of rotating screw rod (63), the mouth (66) of moulding plastics sets up the bottom at the pipe (61) of moulding plastics, the below of the mouth (66) of moulding plastics sets up reposition of redundant personnel subassembly (.

7. The molding and curing mold for producing the plastic package diode as claimed in claim 6, wherein: shunt subassembly (67) including moulding plastics total trough (671), shunt trough (672) and the hole of moulding plastics (673), total trough (671) top of moulding plastics with the mouth of moulding plastics (66) butt joint, total trough (671) of moulding plastics are connected a plurality of shunt troughs (672) of moulding plastics respectively, the bottom and the hole of moulding plastics (673) of shunt trough (672) of moulding plastics are connected, the top of last mould groove (23) is seted up in hole of moulding plastics (673), shunt trough (672) of moulding plastics and hole of moulding plastics (673) are the same with last mould groove (23) quantity, and the shunt trough (672) of moulding plastics communicates in through hole of moulding plastics (673) and last mould groove (23).

8. The molding and curing mold for producing the plastic package diode as claimed in claim 7, wherein: the inside heating element (7) that still is provided with in solidification mould subassembly (2) top, heating element (7) include thermostat (71), wire (72), heating rod (73) and generate heat core (74), and thermostat (71) are connected with the heating circuit of heating rod (73) through wire (72), and the inside of heating rod (73) is cup jointed and is generated heat core (74) heating rod (73) arc winding and annotate in upper die base (21) and mould between the subchannel (672).

9. An implementation method of the molding and curing mold for producing the plastic package diode according to claim 8, characterized in that: the method comprises the following steps:

the method comprises the following steps: placing an object to be subjected to plastic package in a lower die groove (24) through a packaging placing groove (25), and driving an upper die holder (21) below an upper pressing plate (53) to press downwards through a telescopic rod (52) above a pressing cylinder (51), so that the upper die holder (21) and a lower die holder (22) are pressed and sealed;

step two: after the upper die holder (21) and the lower die holder (22) are pressed, the screw (63) is rotated to drive the piston (65) to extrude and inject in the injection molding pipe (61), injection molding liquid is extruded into the injection molding main groove (671), and the injection molding liquid is respectively conveyed into each upper die groove (23) and each lower die groove (24) through the plurality of injection molding branch grooves (672) and the plurality of injection molding holes (673), so that injection molding is completed;

step three: after the injection molding is finished, the air pump (37) conveys air into the inner telescopic groove (31) to pressurize, so that the piston sleeve (32) and the ejector rod (34) above the piston sleeve are driven to move upwards, finished products in the lower mold groove (24) are ejected and demolded, and the packaging and curing of the objects are finished.

10. The implementation method of the molding and curing mold for producing the plastic package diode according to claim 9, wherein the implementation method comprises the following steps: and aiming at the second step, after the upper die holder (21) and the lower die holder (22) are pressed and molded, the cooling water is conveyed into a water inlet pipe (41) to cool a rice direction ring pipe (42), the cooling water is transmitted to a bent pipe (44) through a connecting pipe (43), the ground die after injection molding is cooled through the cooling water, so that the effect of rapid solidification is achieved, and the water after heat exchange is conveyed into a cooling box (46) through a water outlet pipe (45) to be cooled and circulated.