CN116805663B - CPO co-packaging-based chip micro-distance packaging equipment and control method thereof - Google Patents
CPO co-packaging-based chip micro-distance packaging equipment and control method thereof Download PDFInfo
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- CN116805663B CN116805663B CN202311072397.0A CN202311072397A CN116805663B CN 116805663 B CN116805663 B CN 116805663B CN 202311072397 A CN202311072397 A CN 202311072397A CN 116805663 B CN116805663 B CN 116805663B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 107
- 238000000034 method Methods 0.000 title claims abstract description 65
- 239000000463 material Substances 0.000 claims abstract description 108
- 238000007789 sealing Methods 0.000 claims abstract description 59
- 230000008569 process Effects 0.000 claims abstract description 53
- 238000004513 sizing Methods 0.000 claims abstract description 46
- 238000001035 drying Methods 0.000 claims abstract description 39
- 238000004458 analytical method Methods 0.000 claims abstract description 5
- 238000002347 injection Methods 0.000 claims description 45
- 239000007924 injection Substances 0.000 claims description 45
- 238000007731 hot pressing Methods 0.000 claims description 25
- 238000005485 electric heating Methods 0.000 claims description 15
- 238000005538 encapsulation Methods 0.000 claims description 11
- 238000007405 data analysis Methods 0.000 claims description 9
- 238000012858 packaging process Methods 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 8
- 238000001125 extrusion Methods 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 7
- 238000012937 correction Methods 0.000 claims description 3
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- 238000000465 moulding Methods 0.000 abstract description 19
- 238000011049 filling Methods 0.000 abstract description 4
- 238000007493 shaping process Methods 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 3
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- 230000003287 optical effect Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
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- 230000029058 respiratory gaseous exchange Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
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Abstract
The invention discloses chip micro-distance packaging equipment based on CPO co-packaging and a control method thereof, belonging to the technical field of chip packaging; the invention is used for solving the technical problems that the filling thickness of the packaging sizing material is differentiated, so that the drying and shaping efficiency of the packaging sizing material is affected, and the strength of the inside and outside or local drying and shaping hardness of the packaging sizing material is poor; the invention comprises a conveying assembly, wherein the conveying assembly comprises a main guide rail, and a supporting framework is fixedly arranged on the outer wall of the bottom of the main guide rail; the invention realizes the rapid and efficient heat sealing molding of the chip, utilizes the auxiliary bracket of the heat drying channel to perform further multi-angle comprehensive heat sealing quick-drying treatment on the primarily heat sealing molded chip, is beneficial to the molding efficiency of the packaging sizing material of the chip and the uniform drying and hardening strength of the sizing material, and controls the component to execute actions again after redefining and revising formula analysis and comparison so as to make up for the defects in the prior treatment process and improve the sealing effect and molding quality of the chip.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to chip micro-distance packaging equipment based on CPO co-packaging and a control method thereof.
Background
CPO co-packaging is to assemble the exchange chip and the optical engine together on the same socket to form a co-packaging of the chip and the module, the traditional connection mode is called plug cable (Pluggable), the optical engine is a Pluggable optical module, the optical fiber is inserted on the optical module after coming, and then the optical fiber is sent to a network exchange chip (AISC) through a SerDes channel, and CPO engineering packaging is to assemble the exchange chip and the optical engine together on the same socket to form a co-packaging of the chip and the module;
in the CPO (complex programmable logic controller) industrial packaging processing process, the existing chip is jointly assembled on a CPB (complex programmable logic board) substrate by elements such as a chip, an optical device and the like, so that the filling thickness of a packaging sizing material is differentiated, the drying molding efficiency of the packaging sizing material is further influenced, and the internal and external or local drying molding hardness of the packaging sizing material is also caused to be poor in strength; the existing chip packaging and molding is interfered by factors such as the number of co-packaged elements, the quality of sizing materials, the pressing force, the hot drying temperature and the like, so that the efficiency and the quality of the chip co-packaging and molding are affected;
in view of the above technical drawbacks, a solution is now proposed.
Disclosure of Invention
The invention aims to provide CPO co-packaged chip micro-distance packaging equipment and a control method thereof, which aim to solve the problems that in the CPO industrial packaging processing process, elements such as a chip, an optical device and the like are assembled on a CPB substrate together to cause the difference in filling thickness of packaging sizing material, thereby influencing the drying and shaping efficiency of the packaging sizing material and causing the difference in internal and external or local drying and shaping hardness of the packaging sizing material; the existing chip packaging and molding is interfered by factors such as the number of co-packaged components, the quality of sizing materials, the pressing force, the hot drying temperature and the like, and the co-packaging and molding efficiency and the quality of the chip are affected.
The aim of the invention can be achieved by the following technical scheme: the chip micro-distance packaging equipment based on CPO co-packaging and the control method thereof comprise a conveying assembly, wherein the conveying assembly comprises a main guide rail, a supporting framework is fixedly arranged on the outer wall of the bottom of the main guide rail, a micro-distance heat sealing assembly fixedly connected with the supporting framework is sleeved outside the main guide rail, a heat drying channel fixedly connected with the supporting framework is arranged on the end face of the micro-distance heat sealing assembly, a control panel fixedly connected with the outer wall of the supporting framework is arranged at one end, far away from the heat drying channel, of the main guide rail, a bracket is connected onto the inner wall of the main guide rail in a sliding manner, a plate frame is arranged at the top of the bracket in a clamping manner, a movable block sleeved with the bracket in a sliding manner is arranged at the bottom of the plate frame, and a pressure sensor is embedded at the top of the movable block;
the micro heat sealing assembly comprises a clamping cover, a jacking air cylinder is fixedly arranged below the clamping cover, a packaging cover is slidably arranged inside the clamping cover, a hot pressing plate is slidably arranged inside the packaging cover, and a plurality of groups of temperature sensors are embedded in the cover wall at the bottom of the packaging cover.
Preferably, the traction chain has been set up at main guide rail outer wall middle part, main guide rail below is equipped with the vice guide rail fixed with supporting framework inner wall joint, main guide rail both ends outer wall is erect and is got material arm, and gets material arm bottom and supporting framework fixed sleeve joint, be equipped with the steam spout that is the S-shaped and arrange on the stoving passageway inner wall, and the bracket of steam spout all orientation main guide rail top.
Preferably, the bracket one end bottom is equipped with the arc arm that is close to vice guide rail, and arc arm bottom be equipped with vice guide rail slip cup joint's guide pulley, the bracket other end bottom be provided with main guide rail inner wall sliding connection's action wheel, and the action wheel middle part is equipped with runs through main guide rail and with the spacing post that the drag chain cup jointed, the bracket top center is sunken to be offered the spacing groove with grillage joint.
Preferably, the grillage comprises the concatenation of the plate body of two sets of symmetry joints, grillage bottom center fixed mounting has the spacing lug of multiunit, movable block top fixed mounting has the frame of breathing in, the notch that cup joints with spacing lug is sunken to be seted up in the frame top center of breathing in, and pressure sensor fixes in the notch bottom, the circular slot has been seted up to movable block bottom recess, and the ejector pin has been cup jointed in the center of circular slot top slip, the ejector pin top rotates and is connected with multiunit connecting rod, and the connecting rod top rotates and is connected with the extrusion piece that extends to in the notch, the ejector pin side inlays and is equipped with the multiunit breather pipe of being connected with the frame of breathing in.
Preferably, the top of the clamping cover is fixedly provided with a jacking cylinder which is connected with the top of the packaging cover in a clamping manner, the outer wall of the bottom of the clamping cover is fixedly provided with a locking cylinder, the output end of the locking cylinder is provided with a sealing block which is close to the inner wall of the clamping cover, the sealing block is movably connected with the outer wall of the top of the plate frame, the inner wall of the bottom of the clamping cover is embedded with a plurality of groups of first electric heating plates, and the middle part of the cover wall of one side of the clamping cover is provided with a material injection port.
Preferably, the fixing frame at the top of the outer wall of one side of the clamping cover is provided with a telescopic cylinder, the bottom of the telescopic cylinder is sleeved with a material injection frame, one side of the material injection frame away from the material injection opening is sleeved with a regulating valve, and a plurality of groups of material injection nozzles are arranged at the bottom of one side of the material injection frame close to the material injection opening.
Preferably, the edge of the top of the packaging cover is fixedly provided with a plurality of groups of pushing cylinders, the bottoms of the pushing cylinders penetrate through the packaging cover and are fixedly clamped with the top of the hot pressing plate, the electric heating plate II is embedded in the hot pressing plate, the top of one side of the packaging cover, which is close to the material injection opening, is provided with a rectangular opening, the bottom of the jacking cylinder is fixedly provided with an exhaust fan, the top of the jacking cylinder is provided with a gas transmission pipe connected with the exhaust fan, and the top of the gas transmission pipe is sleeved with a vent pipe.
A control method of chip micro-distance packaging equipment based on CPO co-packaging comprises a control panel, wherein a processor, a data acquisition module, a data analysis module and a signal execution module are arranged in the control panel;
the data acquisition module is used for acquiring chip sealing working condition information in the packaging process and transmitting the chip sealing working condition information to the data analysis module, wherein the sealing working condition information consists of a bearing factor, a temperature factor and a material quantity factor of a chip, the bearing factor represents average pressure data acquired by the pressure sensor, the temperature factor represents preliminary heat dry average data acquired by the temperature sensor, and the material quantity factor represents the maximum quantity of the single injection packaging sizing material of the regulating valve;
the data analysis module performs chip encapsulation supervision analysis operation on the received chip encapsulation working condition information in the encapsulation process according to the specific steps as follows:
a: acquiring chip sealing working condition information in the packaging process, and calibrating a pressure-bearing factor, a temperature factor and a material quantity factor in the chip sealing working condition information as Z, X and C respectively;
b: according to the formulaObtaining a process sealing level R of the chip in the packaging process, wherein z, x and c are process correction factors, c is larger than z and larger than x and larger than 0；
C: when the process sealing level R of the chip in the sealing process is larger than the maximum value of the preset range R, is positioned in the preset range R or is smaller than the minimum value of the preset range R, respectively generating a process general signal, a process excellent signal or a process poor signal, and transmitting the obtained process general signal, the process excellent signal or the process poor signal corresponding to the chip in the sealing process to a signal executing module through a processor;
d: the bracket lifts the chip in a clamping way through the plate frame, the chip is moved to the lower part of the clamping cover along the main guide rail, the top of the jacking cylinder pushes the ejector rod to submerge into the movable block, the extrusion block is forced to clamp the limiting convex block, the jacking cylinder drives the movable block to slide upwards to lift the plate frame through the ejector rod until the plate frame is spliced and closed with the clamping cover, the jacking cylinder drives the packaging cover to press down against the edge of the plate frame, the telescopic cylinder drives the material injection frame to pass through the material injection opening and spray packaging sizing materials on the top of the chip, the pushing cylinder drives the hot pressing plate to press down and push the packaging sizing materials, the electric heating plate is heated and dried at fixed time when being electrified, the jacking cylinder and the jacking cylinder are reset to be separated from the bracket, and the bracket drives the semi-finished packaged chip along the main guide rail to pass through the hot drying channel and then clamped by the material taking mechanical arm to enter the next procedure;
e: after the signal execution module receives the process bad signal, the pushing cylinder is controlled to drive the hot pressing plate to slide upwards, the telescopic cylinder drives the material injection frame to pass through the material injection port, the packaging sizing material is injected for the second time above the chip, the hot pressing plate presses the packaging sizing material downwards, and the electric heating plate is electrified to generate heat for timing heat drying;
f: after the signal execution module receives a general process signal, the air cylinder is pushed to drive the hot pressing plate to slide upwards, and the pressure of the hot pressing plate on the packaging sizing material and the chip is regulated;
g: the signal execution module does not make any processing after receiving the process-excellent signal.
The invention has the beneficial effects that:
(1) The invention forms a structural linkage and interaction relation through the auxiliary brackets of the conveying assembly, is favorable for the brackets to move to the lower part of the micro-distance heat-sealing assembly at fixed distance, realizes the chip lifting and embedding into the card cover and the packaging cover by utilizing the abutting linkage of the movable block and the jacking air cylinder, implements the quick and efficient heat-sealing molding of the chip, and simultaneously implements further multi-angle comprehensive heat-sealing quick-drying treatment on the primarily heat-sealed chip by utilizing the auxiliary brackets of the heat-drying channel, thereby being favorable for the molding efficiency of the packaging sizing material of the chip and the uniform drying and hardening strength of the sizing material;
(2) Through the structural linkage between the micro-distance heat sealing assembly and the bracket, the jacking cylinder is abutted against the ejector rod and the movable block, so that the extrusion block is not only used for clamping, limiting and locking the plate frame, but also used for lifting the plate frame to be embedded into the card cover, the chip is conveniently subjected to glue injection heat sealing treatment, an air suction negative pressure flowing environment is formed below the plate frame by utilizing the auxiliary air suction frame of the exhaust fan, the damage of heat for heat sealing and drying to the chip and the PCB substrate is reduced, and the dissipated heat is actively extracted and collected during the heat sealing of the chip and the separation from the card cover;
(3) The injection of the chip packaging sizing material is completed through the auxiliary material injection port of the glue injection port, and meanwhile, the rising, overflowing and diffusing of heat in the card cover after heat sealing and drying are facilitated, and the influence of single heat sealing residual heat on the subsequent packaging sizing material is reduced;
(4) The integrated sealing process of the chip is monitored and collected, and the sealing working condition of the chip in the sealing process is analyzed and compared through redefined and corrected formulas to obtain related process evaluation signals, and the control part executes actions again according to the process evaluation signals so as to make up for the defects in the prior processing process and improve the sealing effect and the molding quality of the chip.
Drawings
The invention is further described below with reference to the accompanying drawings;
FIG. 1 is a top view of the overall structure of the present invention;
FIG. 2 is a schematic side view of the conveyor assembly of the present invention;
FIG. 3 is a schematic diagram of the overall side view of the bracket of the present invention;
FIG. 4 is a schematic cross-sectional view of a movable block of the present invention;
FIG. 5 is a schematic view showing the internal structure of the baking channel according to the present invention;
FIG. 6 is a schematic side view of the macro heat seal assembly of the present invention;
FIG. 7 is a schematic diagram of a connection structure between a card cover and a package cover according to the present invention;
FIG. 8 is a schematic diagram of the connection structure of the telescopic cylinder and the clamping cover of the invention;
fig. 9 is a flow chart of the system of the present invention.
Legend description: 1. a transport assembly; 101. a main guide rail; 102. an auxiliary guide rail; 103. a drag chain; 104. a support skeleton; 2. a material taking mechanical arm; 3. a macro heat seal assembly; 301. a card cover; 302. jacking the air cylinder; 303. an exhaust fan; 304. a jacking cylinder; 305. a package cover; 306. a pushing cylinder; 307. an electric heating plate I; 308. a hot pressing plate; 309. a material injection port; 310. locking the air cylinder; 311. a sealing block; 312. a temperature sensor; 313. a telescopic cylinder; 314. a material injection frame; 315. a material spraying nozzle; 4. a hot baking channel; 401. a hot gas jet; 5. a bracket; 501. a limit groove; 503. an arc arm; 504. a movable block; 505. a push rod; 506. a driving wheel; 507. a plate frame; 508. a connecting rod; 509. extruding a block; 510. an air suction frame; 511. a vent pipe; 512. a pressure sensor; 6. and a control panel.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one:
the embodiment is used for solving the problems that in the CPO (complex processing) process of packaging the existing chip, elements such as a chip, an optical device and the like are assembled on a CPB (complex processing) substrate together, so that the packaging sizing material is different in filling thickness, the drying molding efficiency of the packaging sizing material is affected, and the strength difference exists between the inside and outside of the packaging sizing material or the local drying molding hardness of the packaging sizing material.
Referring to fig. 1-5, the embodiment is a chip micro-pitch packaging device based on CPO co-packaging and a control method thereof, comprising a conveying assembly 1, wherein the conveying assembly 1 comprises a main guide rail 101, a supporting framework 104 is fixedly mounted on the outer wall of the bottom of the main guide rail 101, a micro-pitch heat-seal assembly 3 fixedly connected with the supporting framework 104 is sleeved outside the main guide rail 101, a hot baking channel 4 fixedly connected with the supporting framework 104 is arranged on the end surface of the micro-pitch heat-seal assembly 3, a control panel 6 fixedly connected with the outer wall of the supporting framework 104 is arranged at one end, far away from the hot baking channel 4, of the main guide rail 101, a bracket 5 is connected on the inner wall of the main guide rail 101 in a sliding manner, a plate bracket 507 is mounted at the top of the bracket 5 in a clamping manner, a movable block 504 in sliding sleeve joint with the bracket 5 is arranged at the bottom of the plate bracket 507, and a pressure sensor 512 is embedded at the top of the movable block 504;
a traction chain 103 is arranged in the middle of the outer wall of the main guide rail 101, a secondary guide rail 102 which is fixedly clamped with the inner wall of a supporting framework 104 is arranged below the main guide rail 101, a material taking mechanical arm 2 is arranged on the outer wall of the two ends of the main guide rail 101, the bottom of the material taking mechanical arm 2 is fixedly sleeved with the supporting framework 104, hot air nozzles 401 which are arranged in an S shape are arranged on the inner wall of a hot air drying channel 4, and the hot air nozzles 401 face to a bracket 5 above the main guide rail 101;
an arc-shaped arm 503 close to the auxiliary guide rail 102 is arranged at the bottom of one end of the bracket 5, a guide wheel which is in sliding sleeve connection with the auxiliary guide rail 102 is arranged at the bottom of the arc-shaped arm 503, a driving wheel 506 which is in sliding sleeve connection with the inner wall of the main guide rail 101 is arranged at the bottom of the other end of the bracket 5, a limiting column which penetrates through the main guide rail 101 and is in sleeve connection with the traction chain 103 is arranged in the middle of the driving wheel 506, a limiting groove 501 which is in clamping connection with a plate frame 507 is concavely arranged at the center of the top of the bracket 5, the plate frame 507 is formed by splicing two groups of plate bodies which are symmetrically clamped, a plurality of groups of limiting convex blocks are fixedly arranged at the center of the bottom of the plate frame 507, an air suction frame 510 is fixedly arranged at the top of the movable block 504, a notch which is in sleeve connection with the limiting convex blocks is concavely arranged at the center of the top of the air suction frame 510, a pressure sensor 512 is fixedly arranged at the bottom of the notch, a circular groove is formed in a groove at the bottom of the movable block 504, a push rod 505 is in sliding sleeve connection with a plurality of connecting rods 508, the tops of the connecting rods 508 are rotatably connected with the tops of the circular grooves, the pressing blocks 509 which extend into the notches, and a plurality of the plurality of groups of the ventilating pipes 511 which are embedded at the sides of the push rod 505;
the material taking mechanical arm 2 takes and puts the chip welded on the PCB substrate into the plate frame 507, the traction chain 103 is driven by a motor to move along the outer side of the main guide rail 101, the traction chain 103 drives the driving wheel 506 to slide along the inner wall of the main guide rail 101 through the limit post until the bracket 5 slides along the main guide rail 101 to be close to the micro heat seal assembly 3, the bracket 5 lifts the chip in a clamping manner through the plate frame 507 and moves to the lower part of the clamping cover 301 along the main guide rail 101, the micro heat seal assembly 3 encapsulates the chip, after the primary heat seal treatment, the bracket 5 slides along the main guide rail 101 into the hot drying channel 4, the main guide rail 101 positioned in the hot drying channel 4 is arranged in a wave shape, when the driving wheel 506 pulls the bracket 5 to slide along the wave area of the main guide rail 101, the arc-shaped arm 503 is slidably connected with the auxiliary guide rail 102 through guide wheels, one end of the arc-shaped arm 503 is pulled and regulated by the auxiliary guide rail 102 to deflect the bracket 5, so that the bracket 5 is always kept in a horizontal state, in the process that the bracket 5 moves along the main guide rail 101 in the hot drying channel 4, the hot air nozzle 401 pushes hot air to flow along the hot drying channel 4, the hot air is disturbed by the main guide rail 101 and the auxiliary guide rail 102 to generate disorder flow, and the bracket 5 transported up and down along the main guide rail 101 drives the chip to extend a transportation path in the hot drying channel 4, so that the chip is enabled to be contacted with irregular hot air at multiple angles, further multi-angle comprehensive thermalization quick drying treatment is implemented, and the molding efficiency of the packaging sizing material of the chip and the uniform drying and hardening strength of the sizing material are facilitated.
Embodiment two:
the embodiment is used for solving the problem that the chip co-packaging molding efficiency and quality are affected by the fact that the existing chip packaging molding is interfered by factors such as the number of co-packaging elements, the quality of sizing materials, the pressing force, the hot drying temperature and the like.
Referring to fig. 1, 6-9, the chip micro-distance packaging device based on CPO co-packaging and the control method thereof in this embodiment include that the micro-distance heat seal assembly 3 includes a card cover 301, a jacking cylinder 302 is fixedly installed below the card cover 301, a packaging cover 305 is slidably installed inside the card cover 301, a hot pressing plate 308 is slidably installed inside the packaging cover 305, a plurality of groups of temperature sensors 312 are embedded in a cover wall at the bottom of the packaging cover 305, a jacking cylinder 304 which is fixedly installed at the top of the card cover 301 and is tightly connected with the top of the packaging cover 305, a locking cylinder 310 is fixedly installed on an outer wall at the bottom of the card cover 301, a sealing block 311 which is close to an inner wall of the card cover 301 is provided at an output end of the locking cylinder 310, the sealing block 311 is movably connected with an outer wall at the top of a plate bracket 507, a plurality of groups of electric heating plates 307 are embedded in an inner wall at the bottom of the card cover 301, a material injection port 309 is formed in the middle of a cover wall on one side of the clamping cover 301, a telescopic cylinder 313 is arranged on a fixed frame at the top of the outer wall on one side of the clamping cover 301, a material injection frame 314 is sleeved at the bottom of the telescopic cylinder 313, an adjusting valve is sleeved at one side, far away from the material injection port 309, of the material injection frame 314, a plurality of groups of material injection nozzles 315 are arranged at the bottom, close to the material injection port 309, of the material injection frame 314, a plurality of groups of pushing cylinders 306 are fixedly arranged at the top edge of the packaging cover 305, the bottom of the pushing cylinders 306 penetrates through the packaging cover 305 and is fixedly clamped and fixed with the top of the hot-pressing plate 308, an electric heating plate II is embedded in the hot-pressing plate 308, a rectangular port is arranged at the top, close to the material injection port 309, of the packaging cover 305, an exhaust fan 303 is fixedly arranged at the bottom of the jacking cylinder 302, a gas pipe connected with the exhaust fan 303 is arranged at the top of the jacking cylinder 302, and the top of the gas pipe is sleeved with a vent pipe 511;
the intelligent control system comprises a control panel 6, wherein a processor, a data acquisition module, a data analysis module and a signal execution module are arranged in the control panel 6; the data acquisition module is used for acquiring chip sealing working condition information in the packaging process and transmitting the information to the data analysis module, the sealing working condition information consists of a bearing factor, a temperature factor and a material quantity factor of the chip, the bearing factor represents average pressure data acquired by the pressure sensor 512, the temperature factor represents preliminary heat dry average data acquired by the temperature sensor 312, and the material quantity factor represents the maximum quantity value of the single injection packaging sizing material of the regulating valve;
the data analysis module performs chip encapsulation supervision analysis operation on the received chip encapsulation working condition information in the encapsulation process according to the specific steps as follows:
a: acquiring chip sealing working condition information in the packaging process, and calibrating a pressure-bearing factor, a temperature factor and a material quantity factor in the chip sealing working condition information as Z, X and C respectively;
b: according to the formulaObtaining a process sealing level R of the chip in the packaging process, wherein z, x and c are process correction factors, c is larger than z and larger than x and larger than 0；
C: when the process sealing level R of the chip in the sealing process is larger than the maximum value of the preset range R, is positioned in the preset range R or is smaller than the minimum value of the preset range R, respectively generating a process general signal, a process excellent signal or a process poor signal, and transmitting the obtained process general signal, the process excellent signal or the process poor signal corresponding to the chip in the sealing process to a signal executing module through a processor;
d: the top of the jacking cylinder 302 pushes the ejector rod 505 to be immersed into the movable block 504, meanwhile, the top of the air supply pipe is sleeved with the bottom of the air pipe 511, the ejector rod 505 drives a plurality of groups of connecting rods 508 to deflect in the process of sliding up the inside of the movable block 504, the connecting rods 508 drive the extrusion block 509 to move close to the notch, the extrusion block 509 is stressed to be clamped and clamped with a limit bump in the notch in a linkage manner, the plate frame 507 is locked and fixed on the movable block 504, the side bottom of the plate frame 507 is abutted with the top of the air suction frame 510, the jacking cylinder 302 drives the movable block 504 to slide up through the ejector rod 505 to lift the plate frame 507 until the plate frame 507 is spliced and closed with the clamping cover 301, the locking cylinder 310 drives the sealing block 311 to move close to the side outer wall of the plate frame 507, sealing treatment of a gap between the inner wall of the bottom of the clamping cover 301 and the outer wall of the bottom of the plate frame 507 is completed, the jacking cylinder 304 drives the packaging cover 305 to be pressed down and abutted against the top edge of the plate frame 507, the telescopic cylinder 313 drives the material injection frame 314 to pass through the material injection port 309, the regulating valve guides the quantitative packaging sizing material to be injected at the top of the chip along the material spraying nozzle 315, the packaging sizing material is sprayed at the top of the chip, the telescopic cylinder 313 is reset, the pushing cylinder 306 drives the hot pressing plate 308 to push down and pass through the material injection opening 309 and push the packaging sizing material until the packaging sizing material is pressed on the chip, the first electric heating plate 307 and the electric heating plate are electrified to generate heat, the packaging sizing material on the chip is heated and dried regularly, the jacking cylinder 302 and the jacking cylinder 304 are reset to be separated from the bracket 5, during the period, the exhaust fan 303 extracts the heating air under the plate frame 507 through the air supply pipe, the air pipe 511 and the air suction frame 510, the damage to the chip and the PCB substrate caused by heat seal drying is reduced, and during the period of heat seal separation of the chip from the card cover, the active extraction and collection of the dissipated heat are carried out, the bracket 5 drives the semi-finished packaging chip along the main guide rail 101 to pass through the heat drying channel 4, the material taking mechanical arm 2 clamps the material to enter the next working procedure;
e: after the signal execution module receives the process bad signal, the pushing cylinder 306 is controlled to drive the hot pressing plate 308 to slide upwards, the telescopic cylinder 313 drives the material injection frame 314 to pass through the material injection port 309, the packaging sizing material is injected for the second time above the chip, the hot pressing plate 308 presses the packaging sizing material, and the first electric heating plate 307 and the second electric heating plate are subjected to two-way electric heating and timing heat drying;
f: after receiving the general process signal, the signal execution module pushes the air cylinder 306 to drive the hot pressing plate 308 to slide upwards, and adjusts the pressure of the hot pressing plate 308 on the packaging sizing material and the chip;
g: the signal execution module does not make any processing after receiving the process-excellent signal.
By combining the first embodiment and the second embodiment, the quick and efficient heat sealing forming of the chip can be realized, the chip subjected to preliminary heat sealing forming is subjected to further multi-angle comprehensive heat sealing quick-drying treatment by utilizing the auxiliary bracket of the heat drying channel, the molding efficiency of the packaging sizing material of the chip and the uniform drying hardening strength of the sizing material are facilitated, the associated process evaluation signals are obtained through redefined and corrected formula analysis and comparison, and the control part performs the action again according to the process evaluation signals to make up for the defects in the prior treatment process, so that the sealing effect and the molding quality of the chip are improved.
The foregoing is merely illustrative of the structures of this invention and various modifications, additions and substitutions for those skilled in the art can be made to the described embodiments without departing from the scope of the invention or from the scope of the invention as defined in the accompanying claims.
Claims (4)
1. The utility model provides a chip microspur encapsulation equipment based on CPO is encapsulation altogether, includes conveying component (1), its characterized in that, conveying component (1) includes main rail (101), and fixedly mounted has supporting framework (104) on main rail (101) bottom outer wall, main rail (101) outside cover is equipped with and is connected fixed microspur heat-seal assembly (3) with supporting framework (104), microspur heat-seal assembly (3) terminal surface is equipped with and is connected fixed stoving passageway (4) with supporting framework (104), main rail (101) keep away from the one end of stoving passageway (4) be equipped with supporting framework (104) outer wall fixed connection's control panel (6), sliding connection has bracket (5) on main rail (101) inner wall, bracket (5) top joint installs grillage (507), grillage (507) bottom be equipped with bracket (5) slip joint movable block (504), pressure sensor (512) are inlayed at movable block (504) top.
The micro-heat sealing assembly (3) comprises a clamping cover (301), a jacking air cylinder (302) is fixedly arranged below the clamping cover (301), a packaging cover (305) is slidably arranged inside the clamping cover (301), a hot pressing plate (308) is slidably arranged inside the packaging cover (305), and a plurality of groups of temperature sensors (312) are embedded in the cover wall at the bottom of the packaging cover (305);
the middle part of the outer wall of the main guide rail (101) is provided with a traction chain (103), an auxiliary guide rail (102) which is fixedly clamped with the inner wall of the supporting framework (104) is arranged below the main guide rail (101), the outer walls of the two ends of the main guide rail (101) are provided with material taking mechanical arms (2), the bottoms of the material taking mechanical arms (2) are fixedly sleeved with the supporting framework (104), the inner wall of the hot drying channel (4) is provided with hot air nozzles (401) which are distributed in an S shape, and the hot air nozzles (401) face to a bracket (5) above the main guide rail (101);
the plate frame (507) is formed by splicing two groups of plate bodies which are symmetrically clamped, a plurality of groups of limiting protruding blocks are fixedly arranged at the center of the bottom of the plate frame (507), an air suction frame (510) is fixedly arranged at the top of the movable block (504), a notch sleeved with the limiting protruding blocks is concavely formed in the center of the top of the air suction frame (510), a pressure sensor (512) is fixed at the bottom of the notch, a circular groove is formed in a groove at the bottom of the movable block (504), a push rod (505) is slidingly sleeved in the center of the top of the circular groove, a plurality of groups of connecting rods (508) are rotatably connected to the top of the push rod (505), extrusion blocks (509) extending into the notch are rotatably connected to the top of the connecting rods (508), and a plurality of groups of vent pipes (511) connected with the air suction frame (510) are embedded on the side edges of the push rod (505).
The top of the clamping cover (301) is fixedly provided with a jacking cylinder (304) which is connected and clamped with the top of the packaging cover (305), the outer wall of the bottom of the clamping cover (301) is fixedly provided with a locking cylinder (310), the output end of the locking cylinder (310) is provided with a sealing block (311) which is close to the inner wall of the clamping cover (301), the sealing block (311) is movably connected with the outer wall of the top of the plate frame (507), the inner wall of the bottom of the clamping cover (301) is embedded with a plurality of groups of first electric heating plates (307), and the middle part of one side cover wall of the clamping cover (301) is provided with a material injection port (309);
the top fixing frame of the outer wall of one side of the clamping cover (301) is provided with a telescopic cylinder (313), the bottom of the telescopic cylinder (313) is sleeved with a material injection frame (314), one side, far away from a material injection port (309), of the material injection frame (314) is sleeved with an adjusting valve, and the bottom, close to the material injection port (309), of one side of the material injection frame (314) is provided with a plurality of groups of material injection nozzles (315);
the packaging cover (305) top edge fixed mounting has multiunit to promote cylinder (306), it is fixed with hot pressing board (308) top joint to promote cylinder (306) bottom to run through packaging cover (305), and hot pressing board (308) inside inlay is equipped with electrical heating board two, packaging cover (305) are close to annotate material mouth (309) one side top and are equipped with the rectangle mouth, jacking cylinder (302) bottom fixed mounting has air exhauster (303), and jacking cylinder (302) top is equipped with the gas-supply pipe of being connected with air exhauster (303), and gas-supply pipe top cup joints with breather pipe (511).
2. The CPO co-packaging-based chip micro-distance packaging device according to claim 1, wherein an arc-shaped arm (503) close to the auxiliary guide rail (102) is arranged at the bottom of one end of the bracket (5), a guide wheel sleeved with the auxiliary guide rail (102) in a sliding manner is arranged at the bottom of the arc-shaped arm (503), a driving wheel (506) connected with the inner wall of the main guide rail (101) in a sliding manner is arranged at the bottom of the other end of the bracket (5), a limit column penetrating through the main guide rail (101) and sleeved with the traction chain (103) is arranged in the middle of the driving wheel (506), and a limit groove (501) clamped with the plate frame (507) is formed in the center of the top of the bracket (5) in a recessed manner.
3. The CPO co-packaged chip macro packaging apparatus according to claim 1, wherein the control panel (6) is internally provided with a processor, a data acquisition module, a data analysis module and a signal execution module.
4. A control method of a chip micro-scale packaging device based on CPO co-packaging, which is used for the chip micro-scale packaging device based on CPO co-packaging as claimed in any one of claims 1 to 3, and is characterized by comprising the following steps of;
the data acquisition module is used for acquiring chip sealing working condition information in the packaging process and transmitting the information to the data analysis module, the sealing working condition information consists of a bearing factor, a temperature factor and a material quantity factor of the chip, the bearing factor represents average pressure data acquired by the pressure sensor (512), the temperature factor represents preliminary heat dry average data acquired by the temperature sensor (312), and the material quantity factor represents the maximum quantity value of the single injection packaging sizing material of the regulating valve;
the data analysis module performs chip encapsulation supervision analysis operation on the received chip encapsulation working condition information in the encapsulation process according to the specific steps as follows:
a: acquiring chip sealing working condition information in the packaging process, and calibrating a pressure-bearing factor, a temperature factor and a material quantity factor in the chip sealing working condition information as Z, X and C respectively;
b: according to the formulaObtaining a process sealing level R of the chip in the packaging process, wherein z, x and c are process correction factors, c is greater than z and greater than x and greater than 0, and +.>；
C: when the process sealing level R of the chip in the sealing process is larger than the maximum value of the preset range R, is positioned in the preset range R or is smaller than the minimum value of the preset range R, respectively generating a process general signal, a process excellent signal or a process poor signal, and transmitting the obtained process general signal, the process excellent signal or the process poor signal corresponding to the chip in the sealing process to a signal executing module through a processor;
d: the chip is clamped and lifted by the bracket (5) through the plate frame (507), the chip is moved to the lower part of the clamping cover (301) along the main guide rail (101), the top of the jacking cylinder (302) pushes the ejector rod (505) to be immersed into the movable block (504), the extrusion block (509) is stressed to be linked to clamp and limit the protruding block, the jacking cylinder (302) drives the movable block (504) to slide upwards to lift the plate frame (507) through the ejector rod (505) until the plate frame (507) and the clamping cover (301) are spliced and closed, the jacking cylinder (304) drives the packaging cover (305) to be pressed downwards to abut against the edge of the plate frame (507), the telescopic cylinder (313) drives the material injection frame (314) to pass through the material injection opening (309) and spray packaging sizing materials for the top of the chip, the pushing cylinder (306) drives the hot pressing plate (308) to be pressed downwards, the first electric heating plate (307) is electrified to generate heat and dried at a fixed time, the jacking cylinder (302) and the jacking cylinder (304) are reset to be separated from the bracket (5), the bracket (5) drives the semi-finished packaging chip to pass through the hot drying channel (4), and then the mechanical arm (2) is driven to take the semi-finished packaging chip to enter a lower clamping step;
e: after the signal execution module receives the process bad signal, the pushing cylinder (306) is controlled to drive the hot pressing plate (308) to slide upwards, the telescopic cylinder (313) drives the material injection frame (314) to pass through the material injection port (309), the packaging sizing material is injected for the second time above the chip, the hot pressing plate (308) presses the packaging sizing material downwards, and the first electric heating plate (307) is electrified to generate heat for timing heat drying;
f: after the signal execution module receives the general process signal, the air cylinder (306) is pushed to drive the hot pressing plate (308) to slide upwards, and the pressure of the hot pressing plate (308) on the packaging sizing material and the chip is adjusted;
g: the signal execution module does not make any processing after receiving the process-excellent signal.
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