CN111987019A - Integrated packaging device and method for chip production - Google Patents
Integrated packaging device and method for chip production Download PDFInfo
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- CN111987019A CN111987019A CN202010883865.2A CN202010883865A CN111987019A CN 111987019 A CN111987019 A CN 111987019A CN 202010883865 A CN202010883865 A CN 202010883865A CN 111987019 A CN111987019 A CN 111987019A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 67
- 238000002347 injection Methods 0.000 claims abstract description 24
- 239000007924 injection Substances 0.000 claims abstract description 24
- 238000001035 drying Methods 0.000 claims abstract description 15
- 238000004140 cleaning Methods 0.000 claims abstract description 11
- 238000007761 roller coating Methods 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims description 41
- 238000000576 coating method Methods 0.000 claims description 41
- 238000001125 extrusion Methods 0.000 claims description 13
- 239000007921 spray Substances 0.000 claims description 10
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 9
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 9
- 241001330002 Bambuseae Species 0.000 claims description 9
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 9
- 239000011425 bamboo Substances 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 5
- 229920001169 thermoplastic Polymers 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 4
- 230000006698 induction Effects 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 2
- 210000001503 joint Anatomy 0.000 description 15
- 238000005096 rolling process Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 3
- 238000009501 film coating Methods 0.000 description 2
- 239000007888 film coating Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Containers And Plastic Fillers For Packaging (AREA)
Abstract
The invention discloses an integrated packaging device and a method for chip production in the technical field of chip integrated packaging, which comprises a working platform, wherein a horizontal chip conveying groove is formed in the center of the working platform, a transmission belt is arranged at the bottom end of the chip conveying groove, two groups of cleaning nozzles which are mutually symmetrical are arranged on the left side of the top end of the working platform, a roller coating cover is arranged on the right side of the cleaning nozzles, two groups of roller coating rollers which are mutually symmetrical are arranged in the roller coating cover, a drying nozzle is arranged on the right side of the roller coating cover, a guide rod is arranged on the right side of the drying nozzle, a guide block is sleeved on the guide rod in a sliding manner, the guide block is fixedly connected with a clamping block, one side of the guide block, which is far away from the clamping block, is fixedly connected with an outer sheath cylinder, an electric cylinder is arranged in the outer sheath cylinder, a material injection slide block is sleeved on the guide rod in a sliding manner, and, meanwhile, the packaging effect is good, and the packaged surface is smooth and full.
Description
Technical Field
The invention relates to the technical field of chip integrated packaging, in particular to an integrated packaging device and method for chip production.
Background
Chip packaging refers to mounting a shell on a semiconductor integrated circuit chip to achieve the effects of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, wherein the surface of the chip contains a large number of semiconductors and circuits, and in the packaging process, a clamping block is easy to damage the surface of the chip when being fixed, so that the surface of the chip is damaged, the qualification rate of the packaged product is reduced, and the chip cannot be used.
Disclosure of Invention
The present invention is directed to an integrated packaging apparatus and method for chip production, which solves the above problems.
In order to achieve the purpose, the invention provides the following technical scheme: an integrated packaging device for chip production comprises a working platform, wherein two groups of mutually symmetrical inclined blocks are arranged at the left end of the working platform, a horizontal chip conveying groove is formed in the center of the working platform, a driving belt is arranged at the bottom end of the chip conveying groove, two groups of mutually symmetrical cleaning nozzles are arranged on the left side of the top end of the working platform, a rolling coating cover is arranged on the right side of the cleaning nozzles, the rolling coating cover is just positioned at the top end of the chip conveying groove, two groups of mutually symmetrical rolling coating rollers are arranged in the rolling coating cover and are mutually attached to the chip conveying groove, a raw material box is arranged on one side, away from the chip conveying groove, of each rolling coating roller, a drying nozzle is arranged on the right side of the rolling coating cover, the drying nozzle faces the chip conveying groove, a timing gate is arranged on the right side of the drying nozzle, two groups of mutually symmetrical guide rods are arranged on the right side of the timing gate, the utility model discloses a chip conveying groove, including guide bar, guide block, and the telescopic shaft of electric cylinder, the equal sliding cup joints the guide block on the guide bar, the equal fixed connection clamp splice of one end that the guide block is close to the chip conveying groove, the outer sheathing section of thick bamboo of one side fixed connection of clamp splice is kept away from to the guide block, set up electric cylinder in the outer sheathing section of thick bamboo, electric cylinder's telescopic shaft passes guide block and clamp splice fixed connection, the outer wall and the horizontal cylinder fixed connection of outer sheathing section of thick bamboo, the slip cup joints on the guide bar and annotates the material slider, it is located the right-hand of guide block to annotate the material slider, annotate one side that the material slider is close to the chip conveying groove.
Further, the clamp splice includes splint, open on the splint have with annotate the notes silo that the material shower nozzle agrees with each other, the both ends of splint all set up the sleeve, all set up flexible piece in the sleeve, flexible piece all with elasticity piece fixed connection, the outer wall slip of annotating the material shower nozzle cup joints the extrusion piece, extrusion piece and extrusion spring fixed connection, the extrusion spring cup joints on annotating the material shower nozzle.
Furthermore, a spring is arranged in the sleeve and fixedly connected with the movable block, an overflow channel is formed in the movable block, an opening at one end of the overflow channel is communicated with the inner groove of the clamping block, the other end of the overflow channel is communicated with the outside, and an overflow port is formed in the communication position.
Further, telescopic outer wall still sets up the induction port, the induction port includes the butt joint mouth, butt joint mouth and overflow passage dock each other, pass through pipeline and clout sucking pump intercommunication to the butt joint mouth, set up on the telescopic outer wall and arrange the pressure port.
Further, the roller coating roller comprises a rotating shaft, the rotating shaft is connected with the motor, the outer wall of the rotating shaft is sleeved with the rubber ring, the outer wall of the rubber ring is sleeved with the ring brush plate, the surface of the ring brush plate is smooth, the outer wall of the ring brush plate is uniformly provided with arc-shaped convex blocks, and the surface of the arc-shaped convex blocks is smooth.
Further, work platform's top still sets up the gag lever post of two sets of mutual symmetries, the stopper is cup jointed in the slip on the gag lever post, fixed articulated material conveying pipe on the stopper, material conveying pipe communicates each other with the notes material shower nozzle.
A method of integrated packaging apparatus for chip production, comprising the steps of:
s1: the driving belt drives the chip to move from left to right, when the chip and the inclined block are contacted with each other and continuously transported, the inclined surface on the inclined block enables the horizontal chip to stand up, and the chip can conveniently pass through the chip conveying groove;
s2: the cleaning nozzle sprays hot air flow for blowing dust stained on the surface of the chip to keep the surface of the chip dry and carry out small-amplitude temperature rise;
s3: when the chip passes through the roller coating roller, the roller coating roller contains the coating, so that the coating can be coated on the surface of the chip to form a thin layer, and the residual temperature on the surface of the chip can enable the coating in contact with the chip to be cured to cover the surface of the chip to form a protective film;
s4: when the chip passes through the drying nozzle, the drying nozzle sprays dry airflow to dry the coating, and the dried coating has a hard outer surface and is not easy to be crushed and stays in front of the timing gate to be dried and shaped;
s5: the timing gate is opened, the chip moves rightwards, the electric cylinder pushes the clamping blocks to enable the two groups of clamping blocks to firmly clamp the chip to finish fixation, the horizontal cylinder drives the guide block to move rightwards, the injection nozzle is inserted into the injection groove of the clamping blocks, the injection nozzle sprays thermoplastic plastics to enable polymers to be uniformly filled on the outer wall surface of the chip, and the clamping block upper clamping plate, the sleeve, the telescopic block and the chip outer wall surface form a closed space together to enable materials to be difficult to overflow;
s6: annotate the material and accomplish the back, horizontal cylinder drives the guide block and removes left for annotate the material shower nozzle and break away from the notes silo, electric cylinder drives the clamp splice and keeps away from the chip, makes the chip no longer by the centre gripping, and the chip breaks away from under the transport of drive belt, accomplishes encapsulation work.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the integrated packaging device and the method for chip production, film coating can be carried out before clamping the chip, after the film coating and curing, a layer of firmer protective film is formed on the surface of the chip, so that the damage to the surface of the chip caused by a clamping block when the chip is clamped can be prevented, and the packaging qualified rate of the chip can be improved;
2. when annotating the material, annotate the material shower nozzle and be located chip central authorities just for thermoplastic evenly fills on the chip surface, arrange the atmospheric pressure that the pressure port can discharge the grip block, make plastics can fully fill, unnecessary material gets into overflow channel, and can in time be absorbed by the clout suction pump, make after annotating the material, the thermoplastic on chip surface is regular full, smooth, improves encapsulation quality.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a clamping block structure according to the present invention;
FIG. 3 is a schematic view of the structure of an overflow channel according to the present invention;
FIG. 4 is a schematic view of a roll coating roller of the present invention;
in the figure: 1. a working platform; 2. a sloping block; 3. a chip conveying groove; 4. a transmission belt; 5. cleaning the nozzle; 6. rolling and coating a cover; 7. rolling and coating a roller; 8. a raw material tank; 9. drying the nozzle; 10. timing gates; 11. a guide bar; 12. a guide block; 13. a clamping block; 14. an outer jacket barrel; 15. an electric cylinder; 16. a horizontal cylinder; 17. injecting a material sliding block; 18. injecting a material spray head; 19. a return spring; 20. a limiting block; 21. a limiting rod; 22. an air suction port; 71. a rotating shaft; 72. a rubber ring; 73. a circular brush plate; 74. an arc-shaped bump; 131. a splint; 132. a material injection groove; 133. a sleeve; 134. a telescopic block; 135. an elastic block; 181. extruding the block; 182. a compression spring; 221. a butt joint port; 222. a residual material suction pump; 1341. a spring; 1342. a movable block; 1343. an overflow channel; 1344. an overflow port; 1345. and (4) a pressure discharge port.
The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, an integrated packaging device and method for chip production includes a working platform 1, two sets of symmetrical inclined blocks 2 are arranged at the left side end of the working platform 1, the inclined planes on the inclined blocks 2 can enable horizontal chips to stand up, and the integrated packaging device is the prior art, a horizontal chip conveying groove 3 is formed in the center of the working platform 1, the width of the chip conveying groove 3 is just the same as the thickness of a received chip, a transmission belt 4 is arranged at the bottom end of the chip conveying groove 3, the transmission belt 4 is convenient for chip transmission, two sets of symmetrical cleaning nozzles 5 are arranged at the left side of the top end of the working platform 1, and the cleaning nozzles 5 are communicated with an air pump and used for ejecting dry hot air;
as shown in fig. 1, a roll coating cover 6 is arranged on the right of a cleaning nozzle 5, the roll coating cover 6 is just positioned at the top end of a chip conveying groove 3, the roll coating cover 6 is used for preventing dust from falling off, two groups of roll coating rollers 7 which are symmetrical to each other are arranged in the roll coating cover 6, the two groups of roll coating rollers 7 are extruded mutually, so that a layer of protective liquid is attached to the surface of a chip, a protective film is formed after curing, the two groups of roll coating rollers 7 are positioned at the chip conveying groove 3 and are mutually attached, a raw material box 8 is arranged on one side of each roll coating roller 7, which is far away from the chip conveying groove 3, paint is placed in the raw material box 8 and is used for consumption, a drying nozzle 9 is arranged on the right of the roll coating cover 6, the drying nozzle 9 faces;
as shown in fig. 1, a timing gate 10 is arranged on the right of the drying nozzle 9, the timing gate 10 can release chips at equal intervals, two groups of guide rods 11 which are symmetrical to each other are arranged on the right of the timing gate 10, the guide rods 11 are all slidably sleeved with guide blocks 12, one ends of the guide blocks 12 close to the chip conveying groove 3 are all fixedly connected with clamping blocks 13, and the clamping blocks 13 are used for clamping the chips, and the contact positions of the clamping blocks 13 and the chips are close to the edges of the chips;
as shown in fig. 1, one side fixed connection outer sheath section of thick bamboo 14 that clamp splice 13 was kept away from to guide block 12, set up electric cylinder 15 in the outer sheath section of thick bamboo 14, electric cylinder 15 can promote two sets of clamp splice 13 and be in the same place, electric cylinder 15's telescopic shaft passes guide block 12 and clamp splice 13 fixed connection, outer wall and the horizontal cylinder 16 fixed connection of outer sheath section of thick bamboo 14, sliding sleeve connects on the guide bar 11 and annotates material slider 17, it is right-hand that annotates material slider 17 is located guide block 12, annotate one side that material slider 17 is close to chip conveyer trough 3 and fixedly set up notes material shower nozzle 18, annotate in material shower nozzle 18 can stretch into clamp splice 13, annotate the material to the clamp splice, annotate material slider 17's right side and reset spring 19 fixed connection, reset spring 19 cup joints on guide bar 11.
As shown in fig. 2, the clamping block 13 includes a clamping plate 131, a material injection groove 132 engaged with the material injection nozzle 18 is formed on the clamping plate 131, the material injection nozzle 18 can extend into the material injection groove 132, sleeves 133 are respectively disposed at two ends of the clamping plate 131, telescopic blocks 134 are respectively disposed in the sleeves 133, the telescopic blocks 134 are respectively fixedly connected with an elastic block 135, the elastic block 135 is in elastic contact with four walls of the chip to reduce extrusion damage to the chip, an extrusion block 181 is slidably sleeved on an outer wall of the material injection nozzle 18, the extrusion block 181 is fixedly connected with an extrusion spring 182, and the extrusion spring 182 is sleeved on the material injection nozzle 18;
as shown in fig. 3, a spring 1341 is arranged in the sleeve 133, the spring 1341 is fixedly connected with a movable block 1342, an overflow channel 1343 is formed in the movable block 1342, the overflow channel 1343 facilitates the passage of excess materials, so that the clamp block 13 is filled with the materials, the excess materials are discharged through the overflow channel 1343, an opening at one end of the overflow channel 1343 is communicated with an inner groove of the clamp block 13, the other end of the overflow channel 1343 is communicated with the outside, and an overflow port 1344 is formed at the communication position;
as shown in fig. 3, the outer wall of the sleeve 133 is further provided with an air suction port 22, the air suction port 22 includes a butt joint port 221, the butt joint port 221 is in butt joint with an overflow channel 1343, the butt joint port 221 is communicated with the excess material suction pump 222 through a pipeline, a pressure discharge port 1345 is arranged on the outer wall of the sleeve 133, when the chip is extruded and fixed, the movable block 1342 is extruded, the spring 1341 is compressed, the overflow port 1344 and the pressure discharge port 1345 are in mutual butt joint, the inner cavity of the clamp block 13 is filled with material flow, and redundant air and material flow from the pressure discharge port 1345; after filling, when the chip is separated from the clamping block 13, the overflow channel 1343 and the butt joint port 221 are mutually butted, and the excess material suction pump 222 can absorb excess materials, so that the overflow channel 1343 is kept smooth;
as shown in fig. 4, the roll coating roller 7 includes a rotating shaft 71, the rotating shaft 71 is connected with a motor, the motor drives the rotating shaft 71 to rotate, the outer wall of the rotating shaft 71 is sleeved with a rubber ring 72, the rubber ring 72 has certain elasticity to prevent the chip from being damaged by pressure, the outer wall of the rubber ring 72 is sleeved with a circular brush plate 73, the surface of the circular brush plate 73 is smooth, the outer wall of the circular brush plate 73 is uniformly provided with arc-shaped bumps 74, the surface of the arc-shaped bumps 74 is smooth, and roll coating liquid is filled between two adjacent groups of arc-shaped bumps 74, so that the surface of the chip can be stained with the roll coating liquid;
as shown in fig. 1, the top end of the working platform 1 is further provided with two sets of mutually symmetrical limiting rods 21, the limiting rods 21 are slidably sleeved with the limiting blocks 20, the limiting blocks 20 are fixedly hinged with the material conveying pipes, the material conveying pipes are communicated with the injection material nozzles 18, the limiting rods 21 and the limiting blocks 20 can limit the injection material nozzles 18, and the injection material nozzles 18 are prevented from being involutively closed with the injection material grooves 132.
A method of integrated packaging apparatus for chip production, the method comprising the steps of:
s1: the driving belt 4 drives the chip to move from left to right, when the chip and the inclined block 2 are contacted with each other and continuously transported, the inclined surface on the inclined block 2 enables the horizontal chip to stand up, so that the chip can conveniently pass through the chip conveying groove 3;
s2: the cleaning nozzle 5 sprays hot air flow for blowing dust stained on the surface of the chip to keep the surface of the chip dry and carry out small-amplitude temperature rise;
s3: when the chip passes through the roller coating roller 7, the roller coating roller 7 contains the coating, so that the coating can be coated on the surface of the chip to form a thin layer, and the residual temperature on the surface of the chip can enable the coating in contact with the chip to be cured and cover the surface of the chip to form a protective film;
s4: when the chip passes through the drying nozzle 9, the drying nozzle 9 sprays dry airflow to dry the coating, and the dried coating has a hard outer surface and is not easy to be crushed and stays in front of the timing gate 10 to be dried and shaped;
s5: the timing gate 10 is opened, the chip moves rightwards, the electric cylinder 15 pushes the clamping blocks 13, so that the two groups of clamping blocks 13 firmly clamp the chip to finish fixing, the horizontal cylinder 16 drives the guide block 12 to move rightwards, the injection nozzle 18 is inserted into the injection groove 132 of the clamping blocks 13, the injection nozzle 18 sprays thermoplastic plastics, so that polymers are uniformly filled on the outer wall surface of the chip, and the clamping plate 131, the sleeve 133, the telescopic block 134 and the outer wall surface of the chip on the clamping blocks 13 form a closed space together, so that the materials are difficult to overflow;
s6: after the material is injected, the horizontal cylinder 16 drives the guide block 12 to move leftwards, so that the material injection nozzle 18 is separated from the material injection groove 132, the electric cylinder 15 drives the clamping block 13 to be away from the chip, the chip is not clamped any more, the chip is separated under the conveying of the conveying belt 4, and the packaging work is completed.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
The standard parts used in the invention can be purchased from the market, the special-shaped parts can be customized according to the description of the specification and the accompanying drawings, the specific connection mode of each part adopts conventional means such as bolts, rivets, welding and the like mature in the prior art, the machines, the parts and equipment adopt conventional models in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, so that the detailed description is omitted.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. An integrated packaging device for chip production, comprising a working platform (1), characterized in that: the left side end of work platform (1) sets up two sets of sloping block (2) of mutual symmetry, the central authorities department of work platform (1) opens has horizontally chip conveyer trough (3), the bottom of chip conveyer trough (3) sets up drive belt (4), work platform (1) top left side sets up two sets of clean spout (5) of mutual symmetry, the right-hand side of clean spout (5) sets up roll coating cover (6), roll coating cover (6) are located the top of chip conveyer trough (3) just, set up two sets of roll coating roller (7) of mutual symmetry in roll coating cover (6), two sets of roll coating roller (7) are located chip conveyer trough (3) and are located laminating each other, one side that chip conveyer trough (3) were kept away from to roll coating roller (7) all sets up raw material tank (8), the right-hand side of roll coating cover (6) sets up stoving spout (9), stoving spout (9) are towards chip conveyer trough (3), the right-hand timing gate (10) that sets up of stoving spout (9), the right-hand guide bar (11) that sets up two sets of mutual symmetries of timing gate (10), all slide on guide bar (11) and cup joint guide block (12), the equal fixed connection clamp splice (13) of one end that guide block (12) are close to chip conveyer trough (3), one side fixed connection outer sheath section of thick bamboo (14) of clamp splice (13) are kept away from in guide block (12), set up electric cylinder (15) in outer sheath section of thick bamboo (14), the telescopic shaft of electric cylinder (15) passes guide block (12) and clamp splice (13) fixed connection, the outer wall and horizontal cylinder (16) fixed connection of outer sheath section of thick bamboo (14), slide on guide bar (11) and cup joint notes material slider (17), it is located the right-hand of guide block (12) to annotate material slider (17), it is close to the one side fixed the setting of chip conveyer trough (3) and annotates material shower nozzle (18) to annotate material slider (17), the right side of the material injection sliding block (17) is fixedly connected with a return spring (19), and the return spring (19) is sleeved on the guide rod (11).
2. An integrated packaging unit for chip production according to claim 1, characterized in that: clamp splice (13) are including splint (131), open on splint (131) have with annotate the notes material groove (132) that material shower nozzle (18) agreed with each other, the both ends of splint (131) all set up sleeve (133), all set up flexible piece (134) in sleeve (133), flexible piece (134) all with elastic block (135) fixed connection, the outer wall slip of annotating material shower nozzle (18) cup joints extrusion piece (181), extrusion piece (181) and extrusion spring (182) fixed connection, extrusion spring (182) cup joint on annotating material shower nozzle (18).
3. An integrated packaging unit for chip production according to claim 2, characterized in that: a spring (1341) is arranged in the sleeve (133), the spring (1341) is fixedly connected with a movable block (1342), an overflow channel (1343) is formed in the movable block (1342), an opening at one end of the overflow channel (1343) is communicated with an inner groove of the clamping block (13), the other end of the overflow channel is communicated with the outside, and an overflow port (1344) is formed in the communication position.
4. An integrated packaging unit for chip production according to claim 3, characterized in that: the outer wall of sleeve (133) still sets up induction port (22), induction port (22) are including interfacing (221), interface (221) and overflow channel (1343) dock each other, interface (221) pass through pipeline and clout suction pump (222) intercommunication, set up pressure discharge mouth (1345) on the outer wall of sleeve (133).
5. An integrated packaging unit for chip production according to claim 1, characterized in that: roll and scribble roller (7) including axis of rotation (71), axis of rotation (71) are connected with the motor, rubber ring (72) are cup jointed to the outer wall of axis of rotation (71), ring brush board (73) is cup jointed to the outer wall of rubber ring (72), the surface of ring brush board (73) is smooth, the outer wall of ring brush board (73) evenly sets up arc lug (74), arc lug (74) surface is smooth.
6. An integrated packaging unit for chip production according to claim 1, characterized in that: the top of work platform (1) still sets up two sets of gag lever posts (21) of mutual symmetry, stopper (20) are cup jointed in the slip on gag lever post (21), fixed articulated material conveying pipe on stopper (20), material conveying pipe communicates each other with notes material shower nozzle (18).
7. The method of claim 1, wherein the method comprises: the method comprises the following steps:
s1: the driving belt (4) drives the chip to move from left to right, when the chip and the inclined block (2) are contacted with each other and continuously transported, the inclined surface on the inclined block (2) enables the horizontal chip to stand up, so that the chip can conveniently pass through the chip conveying groove (3);
s2: the cleaning nozzle (5) sprays hot air for blowing dust stained on the surface of the chip to keep the surface of the chip dry and perform small-amplitude temperature rise;
s3: when the chip passes through the roller coating roller (7), the roller coating roller (7) contains paint, so that the paint can be coated on the surface of the chip to form a thin layer, and the residual temperature of the surface of the chip can enable the paint in contact with the surface of the chip to be cured and cover the surface of the chip to form a protective film;
s4: when the chip passes through the drying nozzle (9), the drying nozzle (9) sprays dry airflow to dry the coating, the dried coating has a hard outer surface and is not easy to be crushed, and the dried coating stays in front of the timing gate (10) to be dried and shaped;
s5: the timing gate (10) is opened, the chip moves rightwards, the electric cylinder (15) pushes the clamping blocks (13) to enable the two groups of clamping blocks (13) to firmly clamp the chip to finish fixing, the horizontal cylinder (16) drives the guide block (12) to move rightwards, the injection nozzle (18) is inserted into the injection groove (132) of the clamping blocks (13), the injection nozzle (18) sprays thermoplastic plastics to enable polymers to be uniformly filled on the outer wall surface of the chip, and the upper clamping plate (131) of the clamping blocks (13), the sleeve (133), the telescopic block (134) and the outer wall surface of the chip form a closed space together to enable the materials to be difficult to overflow;
s6: annotate the material and accomplish the back, horizontal cylinder (16) drive guide block (12) remove left for annotate material shower nozzle (18) and break away from notes silo (132), electric cylinder (15) drive clamp splice (13) keep away from the chip, make the chip no longer by the centre gripping, the chip breaks away from under the transport of drive belt (4), accomplishes encapsulation work.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010883865.2A CN111987019A (en) | 2020-08-28 | 2020-08-28 | Integrated packaging device and method for chip production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010883865.2A CN111987019A (en) | 2020-08-28 | 2020-08-28 | Integrated packaging device and method for chip production |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114180129A (en) * | 2021-12-16 | 2022-03-15 | 深圳市捷泰欣通信设备有限公司 | Insert PLC optical splitter adopting shell-withdrawing design |
| CN114325299A (en) * | 2021-11-04 | 2022-04-12 | 苏州联讯仪器有限公司 | Pick-and-place assembly and method for chip testing |
| CN115910865A (en) * | 2022-11-29 | 2023-04-04 | 江苏盐芯微电子有限公司 | Packaging device and packaging method for packaging fingerprint identification chip |
| CN116805663A (en) * | 2023-08-24 | 2023-09-26 | 成都汉芯国科集成技术有限公司 | CPO co-packaging-based chip micro-distance packaging equipment and control method thereof |
-
2020
- 2020-08-28 CN CN202010883865.2A patent/CN111987019A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114325299A (en) * | 2021-11-04 | 2022-04-12 | 苏州联讯仪器有限公司 | Pick-and-place assembly and method for chip testing |
| CN114325299B (en) * | 2021-11-04 | 2024-03-01 | 苏州联讯仪器股份有限公司 | Pick-and-place assembly and method for chip test |
| CN114180129A (en) * | 2021-12-16 | 2022-03-15 | 深圳市捷泰欣通信设备有限公司 | Insert PLC optical splitter adopting shell-withdrawing design |
| CN115910865A (en) * | 2022-11-29 | 2023-04-04 | 江苏盐芯微电子有限公司 | Packaging device and packaging method for packaging fingerprint identification chip |
| CN115910865B (en) * | 2022-11-29 | 2023-11-24 | 江苏盐芯微电子有限公司 | Packaging device and packaging method for packaging fingerprint identification chip |
| CN116805663A (en) * | 2023-08-24 | 2023-09-26 | 成都汉芯国科集成技术有限公司 | CPO co-packaging-based chip micro-distance packaging equipment and control method thereof |
| CN116805663B (en) * | 2023-08-24 | 2023-11-28 | 成都汉芯国科集成技术有限公司 | CPO co-packaging-based chip micro-distance packaging equipment and control method thereof |
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Application publication date: 20201124 |