CN113972312A - LED packaging device and packaging method - Google Patents
LED packaging device and packaging method Download PDFInfo
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- CN113972312A CN113972312A CN202111242985.5A CN202111242985A CN113972312A CN 113972312 A CN113972312 A CN 113972312A CN 202111242985 A CN202111242985 A CN 202111242985A CN 113972312 A CN113972312 A CN 113972312A
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- welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention relates to the field of LED packaging, in particular to an LED packaging device, which comprises: the base station, remove and place subassembly, bonding wire subassembly, hot-blast subassembly, control system and point and glue the subassembly of doing. According to the invention, the movable placing assembly, the welding wire assembly, the hot air drying assembly, the control system and the dispensing assembly are respectively arranged on the base station, the welding wire and the dispensing assembly are uniformly processed in the same process, and the problems that in the prior art, the LED chip is driven to move in the flowing process of epoxy resin injection and welding and secondary glue injection and secondary pre-drying are easily caused, after packaging, the packaging adhesive has certain hardness due to secondary pre-drying, and the appearance damage of the packaging resin caused in the transferring process after packaging is also avoided.
Description
Technical Field
The invention belongs to the field of LED packaging, and particularly relates to an LED packaging device; the invention also relates to a packaging method of the LED.
Background
The LED is a light emitting diode, which is a commonly used light emitting device, emits light by energy released by recombination of electrons and holes, and is widely used in the field of illumination. The light emitting diode can efficiently convert electric energy into light energy, and has wide application in modern society, such as illumination, flat panel display and medical devices.
When an LED is prepared, the LED needs to be packaged by transparent epoxy resin, in the prior art, the LED is welded and then transferred to a packaging table for packaging, and because the LED is welded and then packaged, when an LED chip is subjected to packaging glue injection, due to the flowability of epoxy resin injection and the external force action in the transferring process, the LED chip is driven to move, welding spots are easy to connect and fall off, and products are directly scrapped, so that the LED packaging device and the LED packaging method with more stable packaging quality are urgently needed to be provided.
Disclosure of Invention
In view of the above problems, the present invention provides an LED package device, including: the wire welding assembly, the hot air drying assembly and the dispensing assembly are sequentially arranged on the base platform along the advancing direction of the moving placement assembly;
the movable placing assembly comprises a guide rail, a sliding block, an electric push rod, a movable plate and a placing plate, the guide rail is fixedly arranged at the upper end of the base station, the sliding block is slidably arranged on the guide rail, the movable plate is arranged on the sliding block, the placing plate is slidably arranged on the movable plate through an electric sliding table, the electric push rod is fixedly arranged on the base station through a fixing part, one end of a piston rod of the electric push rod is fixedly connected with the side wall of the movable plate, and a placing groove is formed in the placing plate;
the welding wire assembly comprises a hot-press welding structure, a far infrared heating plate, a welding wire placing structure and a fixing frame, the fixing frame is welded on the base station, the hot-press welding structure and the welding wire placing structure are both arranged at the upper end of the fixing frame, the welding end of the hot-press welding structure penetrates through the fixing frame and is positioned above the placing plate, the far infrared heating plate is arranged on the side wall of the fixing frame, and a guide assembly for the welding wire to penetrate through is arranged on the fixing frame;
the hot air drying assembly is positioned between the fixing frame and the adhesive dispensing assembly, the hot air drying assembly comprises a mounting plate and an air heater, and the air blowing end of the air heater penetrates through the mounting plate and is positioned above the placing plate;
the dispensing assembly comprises: support, storage packing element, lift rubber structure and adhesive point head, storage packing element, lift rubber structure all set up the upper end at the support, adhesive point head and the inside intercommunication of storage packing element, just the one end of adhesive point head is run through the support and is located places the board top.
Further, the hot-press welding structure includes first elevating system, briquetting, slip post, compression spring and hot-press welding machine, briquetting fixed mounting is in first elevating system's lift end, the through-hole has been seted up on the mount, the slip post slides and pegs graft inside the through-hole, compression spring suit is on the slip post, the upper end of slip post is provided with the clamp plate, the briquetting is pressed and is hugged closely the upper surface that fits the clamp plate, compression spring's both ends are contradicted respectively in the upper surface of mount and the upper surface of clamp plate, hot-press welding machine installs in the lower extreme of slip post.
Further, the structure is placed to the bonding wire includes that stand, rolling bearing, flat board and bonding wire bundle place the post, the stand is fixed to be welded in the upper end of mount, rolling bearing embeds in dull and stereotyped lower surface, the fixed grafting in the rolling bearing inner circle of one end of stand, the bonding wire bundle is placed the post and is fixed in dull and stereotyped upper surface, just the bonding wire bundle is placed the post upper end and has been seted up the screw, and the inside threaded connection of screw has the stopper.
Further, go up and down to press glued structure to include second elevating system, spliced pole and piston piece, the spliced pole is fixed in second elevating system's lift end, piston piece fixed connection is in the one end of spliced pole, just the piston piece is located stores up inside the packing element, the inner wall that stores up the packing element sets up to smooth inner wall, the cover is provided with the sealing rubber circle on the piston piece, the sealing rubber circle is laminated with the inner wall that stores up the packing element.
Further, first elevating system includes hollow post, driving motor, ball screw and sliding block, driving motor fixed mounting is in the upper end of hollow post, just driving motor's output shaft runs through hollow post and is connected with ball screw's one end, the sliding block is installed in the one end of ball screw seat, the spout has been seted up on the inner wall of hollow post, sliding block slidable mounting is inside the spout.
Furthermore, the fixing frame is embedded and fixed with a hollow pipe, a guide fixed pulley is arranged on the side wall of the flat plate, the guide fixed pulley is located at the center of an upper pipe orifice of the hollow pipe, and an arc-shaped chamfer is formed at a lower pipe orifice of the hollow pipe.
Further, control system includes a plurality of signal receiver of group, a plurality of infrared induction grating of group and PLC control cabinet, a plurality of groups signal receiver installs respectively in the control end of electric putter, hot press welding structure, lift rubber structure and air heater, a plurality of groups infrared induction grating installs respectively on mount, mounting panel and support, a plurality of groups infrared induction grating's output all with PLC control cabinet input communication connection, a plurality of groups signal receiver's input all with PLC control cabinet output communication connection, PLC control cabinet installs on the lateral wall of base station.
The invention also provides an LED packaging method, and the LED packaging device comprises the following steps:
s1, pushing a placing plate to move from initial displacement to a position right below a dispensing head through an electric push rod, and injecting resin into a placing groove;
s2, moving the placing plate to an initial position through an electric push rod, placing the LED chip on resin in the placing groove, and reserving a welding wire end of the LED chip;
s3, pushing the placing plate to the lower end of an air heater through an electric push rod, and pre-drying the resin through the air heater to relatively fix the LED chip and the resin;
s4, pushing the lower end of a welding head of the hot-press welding machine by the placing plate through an electric push rod, heating the LED chip through the far infrared heating plate, and welding and fixing the LED chip and the connecting wire through a hot-press welding method;
s5, after welding, pushing the placing plate to move to the position right below the dispensing head on the guide rail through the electric push rod again, and performing secondary glue injection to completely encapsulate the LED chip;
s6, after secondary glue injection, pushing the placing plate to the lower end of the air heater through the electric push rod again, and pre-drying the newly injected resin;
s7, pulling the placing plate to return to the initial position through an electric push rod, and taking materials.
Further, the amount of glue injection in step S1 is 30% ± 3% of the holding tank capacity.
The invention has the beneficial effects that:
according to the invention, the movable placing assembly, the welding wire assembly, the hot air drying assembly, the control system and the dispensing assembly are respectively arranged on the base station, the welding wire and the dispensing assembly are uniformly processed in the same process, and the problems that in the prior art, welding points are connected and fall off due to the movement of an LED chip in the processes of epoxy resin injection and transfer are solved by the modes of glue injection, pre-drying, welding, secondary glue injection and secondary pre-drying.
According to the invention, the control system comprises a plurality of groups of signal receivers, a plurality of groups of infrared induction gratings and the PLC control cabinet, the position of the placing plate is induced through the infrared induction gratings, then information is transmitted to the PLC control cabinet, and then the PLC control cabinet sends action signals to the control ends of the air heater, the driving motor and the electric push rod to control corresponding actions of the air heater, the driving motor and the electric push rod, so that braking high-precision welding and packaging can be realized.
According to the invention, when the LED chip is heated in the hot-press welding process, the infrared heating plate can realize the accurate adjustment of the hot-press temperature, and can further cure the resin injected for the first time, so that the resin has enough strength, and the phenomenon that the packaging effect is influenced due to the damage caused by the pressure applied in the hot-press welding process is avoided.
According to the invention, the moving end of the second lifting mechanism is connected with the piston block through the connecting column, and the piston block is driven to be pressed down accurately through the second lifting mechanism, so that the glue injection amount is controlled, quantitative glue injection is realized, and the sequential glue injection amount in the processing method can be accurately controlled to be 30 +/-3% of the capacity of the placing groove.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an LED packaging device according to an embodiment of the present invention;
FIG. 2 shows a schematic view of a placement board according to an embodiment of the invention;
FIG. 3 is a schematic view showing a structure of a fixing member according to an embodiment of the present invention;
FIG. 4 is a schematic view of a wire bonding assembly according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a first lifting mechanism of an embodiment of the invention;
FIG. 6 shows a schematic structural view of a hot air drying assembly of an embodiment of the invention;
FIG. 7 is a schematic diagram of a dispensing assembly according to an embodiment of the invention;
FIG. 8 is a schematic diagram illustrating an internal structure of a glue storage barrel according to an embodiment of the invention;
fig. 9 shows a flow chart of an LED packaging method according to an embodiment of the present invention.
In the figure: 1. moving the placement component; 2. a wire bonding assembly; 3. a hot air drying component; 4. dispensing components; 5. a guide rail; 6. a slider; 7. placing the plate; 8. a base station; 9. an electric push rod; 10. a fixing member; 11. hot-press welding the structure; 12. a far infrared heating plate; 13. a bonding wire placement structure; 14. a fixed mount; 15. a guide assembly; 16. a hot air blower; 17. a support; 18. a glue storage cylinder; 19. a pressure increasing and reducing glue structure; 20. dispensing a glue head; 21. a signal receiver; 22. an infrared induction grating; 23. the PLC controls the cabinet; 24. a first lifting mechanism; 25. briquetting; 26. a sliding post; 27. a compression spring; 28. a hot-press welder; 29. pressing a plate; 30 upright posts; 31. moving the plate; 32. a flat plate; 33. a wire bond placement post; 34. a second lifting mechanism; 35. connecting columns; 36. a piston block; 37. sealing the rubber ring; 38. a hollow column; 39. a drive motor; 40. a ball screw; 41. a slider; 42. a chute; 43. a hollow tube; 44. connecting blocks; 45. an arc-shaped block; 46. connecting plates: 47. and (6) placing the groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of the present invention provides an LED packaging apparatus, as shown in fig. 1, including: base station 8, remove and place subassembly 1, bonding wire subassembly 2, hot-blast subassembly 3 that does, control system and point and glue subassembly 4, bonding wire subassembly 2, hot-blast subassembly 3 that does and glue subassembly 4 and place subassembly 1 advancing direction along removing and install in proper order on base station 8.
The movable placing assembly 1, the welding wire assembly 2, the hot air drying assembly 3, the control system and the glue dispensing assembly 4 are respectively arranged on the base platform, welding wires and glue are uniformly processed in the same process, and through the glue injection-pre-drying-welding-secondary glue injection-secondary pre-drying mode, the problem that in the prior art, the LED chip is driven to move in the flowing process of epoxy resin injection, welding spot connection falling is easily caused is solved.
As shown in fig. 1 and 2, the mobile placing assembly 1 includes a guide rail 5, a slider 6, an electric push rod 9, a moving plate and a placing plate 7, the guide rail 5 is fixedly mounted at the upper end of the base station 8, the slider 6 is slidably mounted on the guide rail 5, the moving plate 31 is mounted on the slider 6, the placing plate 7 is slidably mounted on the moving plate 31 through an electric sliding table, the electric push rod 9 is fixedly mounted on the base station 8 through a fixing member 10, one end of a piston rod of the electric push rod 9 is fixedly connected with a side wall of the moving plate 31, and a placing groove 47 is formed in the placing plate 7.
Preferably, as shown in fig. 3, the fixing member 10 includes a connecting block 44 and an arc block 45, the connecting block 44 is fixedly welded on the upper surface of the base station 8, the side walls of the connecting block 44 and the arc block 45 are both provided with a connecting plate 46, a through hole is formed in the connecting plate 6, a connecting bolt is arranged in the through hole, an arc notch is formed in the upper end of the connecting block 44, and the electric push rod 9 is installed between the arc notch and the arc block 45.
As shown in fig. 1 and 4, the welding wire assembly 2 includes a thermocompression bonding structure 11, a far infrared heating plate 12, a welding wire placing structure 13 and a fixing frame 14, the fixing frame 14 is welded on the base station 8, the thermocompression bonding structure 11 and the welding wire placing structure 13 are both installed at the upper end of the fixing frame 14, the welding end of the thermocompression bonding structure 11 penetrates through the fixing frame 14 and is located above the placing plate 7, the far infrared heating plate 12 is installed on the side wall of the fixing frame 14, a guiding assembly 15 for the welding wire to pass through is arranged on the fixing frame 14, a hollow tube 43 is fixedly embedded in the fixing frame 14, the guiding assembly 15 is set as a guiding fixed pulley, the guiding fixed pulley is located at the center of the upper end tube orifice of the hollow tube 43, and an arc-shaped chamfer is arranged at the lower end tube orifice of the hollow tube 43.
As shown in fig. 4, the thermocompression bonding structure 11 includes a first lifting mechanism 24, a pressing block 25, a sliding column 26, a compression spring 27 and a thermocompression bonding machine 28, wherein the pressing block 25 is fixedly mounted at a lifting end of the first lifting mechanism 24, a through hole is formed in the fixing frame 14, the sliding column 26 is slidably inserted into the through hole, the compression spring 27 is sleeved on the sliding column 26, a pressing plate 29 is disposed at an upper end of the sliding column 26, the pressing block 25 is tightly pressed and attached to an upper surface of the pressing plate 29, two ends of the compression spring 27 respectively abut against the upper surface of the fixing frame 14 and the upper surface of the pressing plate 29, and the thermocompression bonding machine 28 is mounted at a lower end of the sliding column 26.
As shown in fig. 4, the bonding wire placing structure 13 includes a column 30, a rolling bearing, a flat plate 32 and a bonding wire bundle placing column 33, the column 30 is fixedly welded at the upper end of the fixing frame 14, the rolling bearing is embedded in the lower surface of the flat plate 32, one end of the column 30 is fixedly inserted into the inner ring of the rolling bearing, the bonding wire bundle placing column 33 is fixed on the upper surface of the flat plate 32, a screw hole is formed at the upper end of the bonding wire bundle placing column 33, a limiting block is connected to the inner thread of the screw hole, the bonding wire bundle is placed on the bonding wire bundle placing column 33, the upper end of the bonding wire bundle is clamped and fixed through the limiting block, one end of the bonding wire is guided by a guiding fixed pulley and then passes through the hollow tube 43 to be connected with the wiring end of the thermocompressor 28.
As shown in fig. 6, the hot air drying component 3 is located between the fixing frame 14 and the adhesive dispensing component 4, the hot air drying component 3 includes a mounting plate and a hot air blower 16, and a blowing end of the hot air blower 16 penetrates through the mounting plate and is located above the placing plate 7.
As shown in fig. 7, the dispensing assembly 4 includes: support 17, storage packing element 18, lift pressure glued structure 19 and point gluey head 20, storage packing element 18, lift pressure glued structure 19 all set up the upper end at support 17, point gluey head 20 and the inside intercommunication of storage packing element 18, just the one end of point gluey head 20 runs through support 17 and is located and places board 7 top.
As shown in fig. 7 and 8, the lifting and dropping rubber pressing mechanism 19 includes a second lifting mechanism 34, a connecting column 35 and a piston block 36, the connecting column 35 is fixed at the lifting end of the second lifting mechanism 34, the piston block 36 is fixedly connected at one end of the connecting column 35, the piston block 36 is located inside the rubber storage cylinder 18, the inner wall of the rubber storage cylinder 18 is set as a smooth inner wall, a sealing rubber ring 37 is sleeved on the piston block 36, and the sealing rubber ring 37 is attached to the inner wall of the rubber storage cylinder 18.
The moving end of the second lifting mechanism 34 is connected with the piston block 36 through the connecting column 35, the piston block 36 is driven to be accurately pressed down through the second lifting mechanism 34, and therefore glue injection quantity is controlled, quantitative glue injection is achieved, and the glue injection quantity in sequence in the processing method can be accurately controlled to be 30% +/-3% of the capacity of the placing groove.
As shown in fig. 5, the first lifting mechanism 24 includes a hollow column 38, a driving motor 39, a ball screw 40 and a sliding block 41, the driving motor 39 is fixedly mounted at the upper end of the hollow column 38, an output shaft of the driving motor 39 penetrates through the hollow column 38 and is connected with one end of the ball screw 40, the sliding block 41 is mounted at one end of a screw seat of the ball screw 40, a sliding slot 42 is formed on the inner wall of the hollow column 38, and the sliding block 41 is slidably mounted inside the sliding slot 42;
specifically, the first lifting mechanism 24 and the second lifting mechanism 34 are arranged in the same manner.
As shown in fig. 7, the connection column 35 includes a transverse fixing rod, a transverse connection rod, a vertical fixing rod and a vertical connection rod, the transverse fixing rod is connected to the screw seat of the ball screw 40 of the second lifting mechanism 34, the vertical connection rod is fixed to the end of the transverse fixing rod, the direction of the vertical connection rod is upward, the end of the vertical connection rod is connected and fixed to the transverse connection rod, and the end of the transverse connection rod is fixed to the upper end of the vertical fixing rod.
As shown in fig. 1, the control system includes a plurality of groups of signal receivers 21, a plurality of groups of infrared sensing gratings 22 and a PLC control cabinet 23, the plurality of groups of signal receivers 21 are respectively installed at the control end of electric putter 9, thermocompression bonding structure 11, lifting/lowering adhesive structure 19 and air heater 16, the plurality of groups of infrared sensing gratings 22 are respectively installed at fixing frame 14, mounting plate and support 17, the plurality of groups of output ends of infrared sensing gratings 22 are all in communication connection with input end of PLC control cabinet 23, the plurality of groups of input ends of signal receivers 21 are all in communication connection with output end of PLC control cabinet 23, and PLC control cabinet 23 is installed at the side wall of base station 8.
Through including a plurality of signal receiver 21, a plurality of infrared induction grating 22 of group and PLC control cabinet 23 with control system, place the position of board 7 through infrared induction grating 22 response, then with information transmission to PLC control cabinet 23, action signal is sent to air heater, driving motor and electric putter's control end to rethread PLC control cabinet 23, controls its corresponding action, can realize braking high accuracy welding and encapsulation.
On the basis of the above LED packaging apparatus, an embodiment of the present invention further provides a method for packaging an LED, as shown in fig. 9, including the following steps:
s1, pushing a placing plate to move from initial displacement to a position right below a dispensing head through an electric push rod, and injecting resin into a placing groove;
s2, moving the placing plate to an initial position through an electric push rod, placing the LED chip on resin in the placing groove, and reserving a welding wire end of the LED chip;
s3, pushing the placing plate to the lower end of an air heater through an electric push rod, and pre-drying the resin through the air heater to relatively fix the LED chip and the resin;
s4, pushing the lower end of a welding head of the hot-press welding machine by the placing plate through an electric push rod, heating the LED chip through the far infrared heating plate, and welding and fixing the LED chip and the connecting wire through a hot-press welding method;
s5, after welding, pushing the placing plate to move to the position right below the dispensing head on the guide rail through the electric push rod again, and performing secondary glue injection to completely encapsulate the LED chip;
s6, after secondary glue injection, pushing the placing plate to the lower end of the air heater through the electric push rod again, and pre-drying the newly injected resin;
s7, pulling the placing plate to return to the initial position through an electric push rod, and taking materials.
In some embodiments, the amount of glue injected in step S1 is 30% ± 3% of the holding tank capacity.
According to the LED packaging method, the movement and the position positioning of the electric push rod are sensed through the infrared induction grating and transmitted to the PLC control cabinet, and the starting and stopping of the air heater, the vertical position movement of the welding head of the hot-press welding machine and the glue injection amount are automatically and accurately controlled through the PLC control cabinet to output signals of the control ends of the air heater and the driving motor.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. An apparatus for encapsulating an LED, comprising: the wire welding machine comprises a base platform (8), a mobile placing component (1), a wire welding component (2), a hot air drying component (3), a control system and a dispensing component (4), wherein the wire welding component (2), the hot air drying component (3) and the dispensing component (4) are sequentially arranged on the base platform (8) along the advancing direction of the mobile placing component (1);
the movable placing assembly (1) comprises a guide rail (5), a sliding block (6), an electric push rod (9), a movable plate (31) and a placing plate (7), the guide rail (5) is fixedly installed at the upper end of a base station (8), the sliding block (6) is installed on the guide rail (5) in a sliding mode, the movable plate (31) is installed on the sliding block (6), the placing plate (7) is installed on the movable plate (31) in a sliding mode through an electric sliding table, the electric push rod (9) is fixedly installed on the base station (8) through a fixing piece (10), one end of a piston rod of the electric push rod (9) is fixedly connected with the side wall of the movable plate (31), and a placing groove is formed in the placing plate (7);
the welding line component (2) comprises a hot-press welding structure (11), a far infrared heating plate (12), a welding line placing structure (13) and a fixing frame (14), the fixing frame (14) is welded on the base station (8), the hot-press welding structure (11) and the welding line placing structure (13) are both installed at the upper end of the fixing frame (14), the welding end of the hot-press welding structure (11) penetrates through the fixing frame (14) and is located above the placing plate (7), the far infrared heating plate (12) is installed on the side wall of the fixing frame (14), and a guide component (15) for the welding line to penetrate through is arranged on the fixing frame (14);
the hot air drying component (3) is positioned between the fixed frame (14) and the spot gluing component (4), the hot air drying component (3) comprises a mounting plate and an air heater (16), and the blowing end of the air heater (16) penetrates through the mounting plate and is positioned above the placing plate (7);
glue dispensing assembly (4) include support (17), store up packing element (18), lift and fall and press glued structure (19) and some rubber head (20), store up packing element (18), lift and press glued structure (19) and all set up the upper end at support (17), some glue head (20) and store up inside intercommunication of packing element (18), just the one end of some glue head (20) is run through support (17) and is located and place board (7) top.
2. The device as claimed in claim 1, wherein: hot-pressure welding structure (11) include first elevating system (24), briquetting (25), slip post (26), compression spring (27) and hot-pressure welding machine (28), briquetting (25) fixed mounting is in the lift end of first elevating system (24), the through-hole has been seted up on mount (14), slip post (26) slide and peg graft inside the through-hole, compression spring (27) suit is on slip post (26), the upper end of slip post (26) is provided with clamp plate (29), briquetting (25) compress tightly the laminating in the upper surface of clamp plate (29), the both ends of compression spring (27) are contradicted respectively in the upper surface of mount (14) and the upper surface of clamp plate (29), hot-pressure welding machine (28) are installed in the lower extreme of slip post (26).
3. The device as claimed in claim 1, wherein: the welding wire placing structure (13) comprises a stand column (30), a rotating bearing, a flat plate (32) and a welding wire bundle placing column (33), wherein the stand column (30) is fixedly welded at the upper end of the fixing frame (14), the rotating bearing is embedded in the lower surface of the flat plate (32), one end of the stand column (30) is fixedly inserted into the inner ring of the rotating bearing, the welding wire bundle placing column (33) is fixed on the upper surface of the flat plate (32), a screw hole is formed in the upper end of the welding wire bundle placing column (33), and a limiting block is connected to the inner thread of the screw hole.
4. The device as claimed in claim 1, wherein: go up and down to press glued structure (19) to include second elevating system (34), spliced pole (35) and piston piece (36), spliced pole (35) are fixed in the lift end of second elevating system (34), piston piece (36) fixed connection is in the one end of spliced pole (35), just piston piece (36) are located and store up packing element (18) inside, the inner wall that stores up packing element (18) sets up to smooth inner wall, the cover is provided with sealing rubber circle (37) on piston piece (36), sealing rubber circle (37) and the inner wall laminating of storing up packing element (18).
5. The LED package according to claim 2, wherein: first elevating system (24) are including hollow post (38), driving motor (39), ball screw (40) and sliding block (41), driving motor (39) fixed mounting is in the upper end of hollow post (38), just the output shaft of driving motor (39) runs through hollow post (38) and is connected with the one end of ball screw (40), sliding block (41) are installed in the one end of ball screw (40) lead screw seat, spout (42) have been seted up on the inner wall of hollow post (38), sliding block (41) slidable mounting is inside spout (42).
6. The device as claimed in claim 1, wherein: the hollow pipe (43) is fixedly embedded in the fixing frame (14), the guide assembly (15) is arranged to be a guide fixed pulley, the guide fixed pulley is located at the center of an upper pipe orifice of the hollow pipe (43), and an arc-shaped chamfer is formed in a lower pipe orifice of the hollow pipe (43).
7. The device as claimed in claim 1, wherein: control system includes a plurality of signal receiver (21), a plurality of infrared induction grating (22) of group and PLC control cabinet (23), a plurality of groups signal receiver (21) are installed respectively in electric putter (9), heat-pressure welding structure (11), the control end of lift pressure cement structure (19) and air heater (16), a plurality of groups infrared induction grating (22) are installed respectively on mount (14), mounting panel and support (17), a plurality of groups the output of infrared induction grating (22) all with PLC control cabinet (23) input communication connection, a plurality of groups the input of signal receiver (21) all with PLC control cabinet (23) output communication connection, PLC control cabinet (23) are installed on the lateral wall of base station (8).
8. A method for packaging an LED, wherein the LED packaging device of any one of claims 1 to 7 is used, comprising the steps of:
s1, pushing a placing plate to move from initial displacement to a position right below a dispensing head through an electric push rod, and injecting resin into a placing groove;
s2, moving the placing plate to an initial position through an electric push rod, placing the LED chip on resin in the placing groove, and reserving a welding wire end of the LED chip;
s3, pushing the placing plate to the lower end of an air heater through an electric push rod, and pre-drying the resin through the air heater to relatively fix the LED chip and the resin;
s4, pushing the lower end of a welding head of the hot-press welding machine by the placing plate through an electric push rod, heating the LED chip through the far infrared heating plate, and welding and fixing the LED chip and the connecting wire through a hot-press welding method;
s5, after welding, pushing the placing plate to move to the position right below the dispensing head on the guide rail through the electric push rod again, and performing secondary glue injection to completely encapsulate the LED chip;
s6, after secondary glue injection, pushing the placing plate to the lower end of the air heater through the electric push rod again, and pre-drying the newly injected resin;
s7, pulling the placing plate to return to the initial position through an electric push rod, and taking materials.
9. The method of claim 8, wherein: the amount of glue injected in step S1 is 30% ± 3% of the holding tank capacity.
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Application publication date: 20220125 |