CN219246637U

CN219246637U - Silicon-based photoelectronic chip packaging equipment

Info

Publication number: CN219246637U
Application number: CN202223601612.5U
Authority: CN
Inventors: 陈伟; 武玉玺; 王海勇; 王世群; 张文衡
Original assignee: Suzhou Yisuo Micro Semiconductor Technology Co ltd
Current assignee: Suzhou Yisuo Micro Semiconductor Technology Co ltd
Priority date: 2022-12-30
Filing date: 2022-12-30
Publication date: 2023-06-23
Anticipated expiration: 2032-12-30

Abstract

The utility model belongs to the technical field of electronic chips, in particular to silicon-based optoelectronic chip packaging equipment, which comprises a base; a workbench is fixedly connected to the top of the base; one end of the top of the workbench is fixedly connected with a supporting plate; two groups of fixing rods are fixedly connected to one side, away from the workbench, of the supporting plate; the two groups of fixing rods are fixedly connected at the right angle of the supporting plate; one ends of the two groups of fixing rods, which are far away from the supporting plate, are connected with clamping rods in a sliding manner; the middle part of the supporting plate is connected with a moving rod in a sliding way; the electric telescopic rod is started by an operator, the electric telescopic rod drives the movable rod to move back and forth, the first connecting rod and the second connecting rod on the movable rod are further enabled to move forward or backward, when the first connecting rod and the second connecting rod move forward, the first connecting rod and the second connecting rod are close to each other, otherwise, the first connecting rod and the second connecting rod are far away from each other, further the clamping rods are driven to be close to each other or far away from each other, base plates of different specifications are fixed, and therefore different specifications of optoelectronic chips are packaged conveniently.

Description

Silicon-based photoelectronic chip packaging equipment

Technical Field

The utility model belongs to the technical field of electronic chips, and particularly relates to silicon-based optoelectronic chip packaging equipment.

Background

Chips are a collective term for semiconductor device products, and are also called microcircuits, microchips, integrated circuits. Refers to a silicon wafer containing integrated circuits that is small in size and is often part of a computer or other electronic device. Semiconductors are a generic term for a class of materials, integrated circuits are large collections of circuits made from semiconductor materials, and chips are products formed from different types of integrated circuits or from a single type of integrated circuit.

The chip has very strict production conditions, must keep constant temperature and humidity, the dust granularity in the air is strictly controlled, the bare chip can be influenced by the corrosion of the air dust and static electricity, in order to ensure the integrity of the chip, the chip needs to utilize a film technology and a micro-processing technology, and the chip and other elements are laid out, adhered and fixed on a frame or a substrate, connected with a leading-out wiring terminal and encapsulated and fixed through a plastic insulating medium.

In the prior art, when the chip is packaged, certain defects still exist in the use process of the packaging structure, for example, the base plates with different specifications cannot be fixed, so that the packaging of the optoelectronic chips with different specifications is inconvenient, the application range is limited, and the practicability is low.

Accordingly, a silicon-based optoelectronic chip packaging apparatus is presented that addresses the above-described problems.

Disclosure of Invention

In order to overcome the defects in the prior art and solve the problems, the silicon-based optoelectronic chip packaging equipment is provided.

The technical scheme adopted for solving the technical problems is as follows: the utility model relates to a silicon-based photoelectronic chip packaging device, which comprises a base; a workbench is fixedly connected to the top of the base; one end of the top of the workbench is fixedly connected with a supporting plate; two groups of fixing rods are fixedly connected to one side, away from the workbench, of the supporting plate; the two groups of fixing rods are fixedly connected at the right angle of the supporting plate; one ends of the two groups of fixing rods, which are far away from the supporting plate, are connected with clamping rods in a sliding manner; the middle part of the supporting plate is connected with a moving rod in a sliding way; one end of the movable rod, which is far away from the supporting plate, is hinged with a first connecting rod and a second connecting rod; the first connecting rod and the second connecting rod are respectively hinged to the upper side and the lower side of the moving rod; one ends of the first connecting rod and the second connecting rod, which are far away from the moving rod, are hinged on the two groups of clamping rods.

Preferably, an electric telescopic rod is fixedly connected to the supporting plate; the output end of the electric telescopic rod is fixedly connected to the movable rod.

Preferably, rubber sheets are fixedly connected to the two groups of clamping rods; the rubber sheet is fixedly connected to one side of the clamping rods, which are close to each other.

Preferably, the clamping rod is L-shaped; and a limiting plate is fixedly connected to one end of the clamping rod, which is close to the fixing rod.

Preferably, a bottom plate is fixedly connected to one side of the supporting plate, which is close to the electric telescopic rod; bolts are connected to four corners of the bottom plate in a threaded manner; the electric telescopic rod is fixedly connected to the bottom plate.

Preferably, a conveyor belt is fixedly connected to one side of the workbench far away from the supporting plate; and a plurality of groups of brackets are fixedly connected to the bottom of the conveyor belt.

Preferably, the top of the workbench is fixedly connected with a baffle; the baffle is located at the bottom of the clamping rod.

Preferably, the clamping rod is provided with a groove; the first connecting rod is hinged on the groove.

The utility model has the beneficial effects that:

the utility model provides a silicon-based photoelectronic chip packaging device, which is characterized in that an operator starts an electric telescopic rod to drive a movable rod to move forwards and backwards, so that a first connecting rod and a second connecting rod on the movable rod move forwards or backwards, when the first connecting rod and the second connecting rod move forwards, the first connecting rod and the second connecting rod are close to each other, otherwise, the first connecting rod and the second connecting rod are far away from each other, and further drive clamping rods to be close to each other or far away from each other, so that base plates with different specifications are fixed, and packaging of photoelectronic chips with different specifications is facilitated.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:

FIG. 1 is a perspective view of the entire present utility model;

FIG. 2 is a perspective view of a first embodiment of the present utility model;

FIG. 3 is a perspective view of a second embodiment of the present utility model;

FIG. 4 is a perspective view of a third embodiment of the present utility model;

legend description:

1. a conveyor belt; 2. a bracket; 3. a work table; 4. a base; 5. a clamping rod; 6. a rubber sheet; 7. a baffle; 8. a first connecting rod; 9. an electric telescopic rod; 10. a limiting plate; 11. a support plate; 12. a fixed rod; 13. a groove; 14. a bottom plate; 15. a second connecting rod; 16. and (3) moving the rod.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Specific examples are given below.

Referring to fig. 1-4, the present utility model provides a silicon-based optoelectronic chip packaging apparatus, which includes a base 4; the top of the base 4 is fixedly connected with a workbench 3; a supporting plate 11 is fixedly connected to one end of the top of the workbench 3; two groups of fixing rods 12 are fixedly connected to one side, far away from the workbench 3, of the supporting plate 11; the two groups of fixing rods 12 are fixedly connected at the right angle of the supporting plate 11; the two groups of fixing rods 12 are connected with clamping rods 5 in a sliding manner at one end far away from the supporting plate 11; the middle part of the supporting plate 11 is connected with a movable rod 16 in a sliding way; one end of the moving rod 16, which is far away from the supporting plate 11, is hinged with a first connecting rod 8 and a second connecting rod 15; the first connecting rod 8 and the second connecting rod 15 are respectively hinged on the upper side and the lower side of the moving rod 16; one ends of the first connecting rod 8 and the second connecting rod 15, which are far away from the moving rod 16, are hinged on the two groups of clamping rods 5. During operation, because among the prior art at present, packaging structure still exists certain defect in the use when the chip is packaged, for example, can not fix the backing plate of different specifications to the encapsulation of the optoelectronic chip of different specifications is inconvenient, application scope receives the restriction, the practicality is low, drive the movable rod 16 through operating personnel and reciprocate, and then make the head rod 8 on the movable rod 16 and second connecting rod 15 move forward or backward, when head rod 8 and second connecting rod 15 move forward both are close to each other, otherwise both keep away from each other, and then drive clamping lever 5 and be close to each other on dead lever 12 or keep away from each other, fix the backing plate of different specifications, thereby be convenient for encapsulate the optoelectronic chip of different specifications.

An electric telescopic rod 9 is fixedly connected to the supporting plate 11; the output end of the electric telescopic rod 9 is fixedly connected to a movable rod 16. During operation, the electric telescopic rod 9 is utilized to drive the first connecting rod 8 and the second connecting rod 15 to move, and an operator is not required to manually move, so that the electric telescopic rod is convenient and quick.

The two groups of clamping rods 5 are fixedly connected with rubber sheets 6; the rubber sheet 6 is fixedly connected to one side of the clamping rod 5, which is close to each other. During operation, the friction force between the base plate and the clamping rod 5 is increased by utilizing the rubber sheet 6, so that the clamping rod 5 clamps the base plate more firmly.

The clamping rod 5 is L-shaped; and a limiting plate 10 is fixedly connected to one end of the clamping rod 5, which is close to the fixed rod 12. During operation, the clamping rod 5 is limited through the baffle 7, and the clamping rod 5 is prevented from falling off when sliding on the fixed rod 12.

A bottom plate 14 is fixedly connected to one side of the supporting plate 11, which is close to the electric telescopic rod 9; bolts are connected to four corners of the bottom plate 14 in a threaded manner; the electric telescopic rod 9 is fixedly connected to the bottom plate 14. The electric telescopic rod 9 can be detached by an operator through the cooperation of the bolt and the nut during operation.

A conveyor belt 1 is fixedly connected to one side, far away from the supporting plate 11, of the workbench 3; the bottom of the conveyor belt 1 is fixedly connected with a plurality of groups of brackets 2. The operator conveys the base plate to the workbench 3 by using the conveyor belt 1, and the operator is not required to place the base plate on the workbench 3, so that the workload of the operator is reduced.

A baffle 7 is fixedly connected to the top of the workbench 3; the baffle 7 is positioned at the bottom of the clamping rod 5. In operation, the range which is moved by inertia to exceed the clamping range of the clamping rod 5 is blocked by the baffle 7.

The clamping rod 5 is provided with a groove 13; the first connecting rod 8 is hinged to the groove 13. In operation, the first connecting rod 8 is hinged on the groove 13, so that the connecting rod has sufficient space when moving.

Working principle: because among the prior art at present, packaging structure still has certain defect in the use when the chip is packaged, for example, can not fix the backing plate of different specifications to the encapsulation of the optoelectronic chip of different specifications is inconvenient, application scope is restricted, and the practicality is low, start electric telescopic handle 9 through operating personnel, make electric telescopic handle 9 drive movable rod 16 back and forth movement, and then make the first connecting rod 8 on the movable rod 16 and second connecting rod 15 move forward or backward, when first connecting rod 8 and second connecting rod 15 move forward both are close to each other, otherwise then both keep away from each other, and then drive clamping rod 5 and be close to each other or keep away from each other, fix the backing plate of different specifications, thereby be convenient for encapsulate the optoelectronic chip of different specifications.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.

Claims

1. A silicon-based optoelectronic chip packaging apparatus comprising a base (4); the method is characterized in that: a workbench (3) is fixedly connected to the top of the base (4); one end of the top of the workbench (3) is fixedly connected with a supporting plate (11); two groups of fixing rods (12) are fixedly connected to one side, far away from the workbench (3), of the supporting plate (11); the two groups of fixing rods (12) are fixedly connected at the right angle of the supporting plate (11); one ends of the two groups of fixing rods (12) far away from the supporting plate (11) are connected with clamping rods (5) in a sliding manner; the middle part of the supporting plate (11) is connected with a moving rod (16) in a sliding way; one end of the moving rod (16) far away from the supporting plate (11) is hinged with a first connecting rod (8) and a second connecting rod (15); the first connecting rod (8) and the second connecting rod (15) are respectively hinged to the upper side and the lower side of the moving rod (16); one ends of the first connecting rod (8) and the second connecting rod (15) far away from the moving rod (16) are hinged on the two groups of clamping rods (5).

2. A silicon-based optoelectronic chip package as set forth in claim 1 wherein: an electric telescopic rod (9) is fixedly connected to the supporting plate (11); the output end of the electric telescopic rod (9) is fixedly connected to the moving rod (16).

3. A silicon-based optoelectronic chip package as set forth in claim 2 wherein: the two groups of clamping rods (5) are fixedly connected with rubber sheets (6); the rubber sheet (6) is fixedly connected to one side of the clamping rod (5) which is close to each other.

4. A silicon-based optoelectronic chip package as set forth in claim 3 wherein: the clamping rod (5) is L-shaped; and a limiting plate (10) is fixedly connected to one end of the clamping rod (5) close to the fixed rod (12).

5. A silicon-based optoelectronic chip package as set forth in claim 4 wherein: a bottom plate (14) is fixedly connected to one side of the supporting plate (11) close to the electric telescopic rod (9); bolts are connected to four corners of the bottom plate (14) in a threaded manner; the electric telescopic rod (9) is fixedly connected to the bottom plate (14).

6. A silicon-based optoelectronic chip package as set forth in claim 5 wherein: one side of the workbench (3) far away from the supporting plate (11) is fixedly connected with a conveyor belt (1); the bottom of the conveyor belt (1) is fixedly connected with a plurality of groups of brackets (2).

7. A silicon-based optoelectronic chip package as set forth in claim 6 wherein: a baffle (7) is fixedly connected to the top of the workbench (3); the baffle (7) is positioned at the bottom of the clamping rod (5).

8. A silicon-based optoelectronic chip package as set forth in claim 7 wherein: a groove (13) is formed in the clamping rod (5); the first connecting rod (8) is hinged on the groove (13).