CN110844174B - Silicon wafer boxing mechanism - Google Patents
Silicon wafer boxing mechanism Download PDFInfo
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- CN110844174B CN110844174B CN201911239523.0A CN201911239523A CN110844174B CN 110844174 B CN110844174 B CN 110844174B CN 201911239523 A CN201911239523 A CN 201911239523A CN 110844174 B CN110844174 B CN 110844174B
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- Prior art keywords
- tightening
- screw rod
- silicon wafer
- plate
- foam box
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
- B65B35/10—Feeding, e.g. conveying, single articles
- B65B35/20—Feeding, e.g. conveying, single articles by reciprocating or oscillatory pushers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses a silicon wafer boxing mechanism which comprises a silicon wafer tightening module and two foam box pushing modules, wherein the foam box pushing modules are symmetrically arranged on two sides of the silicon wafer tightening module. The driving motor on the silicon wafer tightening module enables the tightening screw rod to rotate through the coupler, and the tightening nut arranged on the tightening screw rod drives the pressing plate structure to clamp or loosen the silicon wafer. The driving motor on the foam box pushing module drives the movable screw rod to rotate through the second coupling, the screw rod nut arranged on the movable screw rod drives the pushing guide rod to stretch out and draw back, and the pushing guide rod pushes the pushing plate to move forwards or backwards, so that two half foam boxes on the two symmetrically arranged foam box pushing modules are combined, and the silicon wafer box on the foam box pushing module is packaged. The silicon wafer boxing mechanism has the advantages of high boxing efficiency, low personnel dependence, good silicon wafer boxing integrity and low silicon wafer boxing cost.
Description
Technical Field
The application relates to silicon wafer boxing equipment, in particular to a silicon wafer boxing mechanism.
Background
The silicon chips belong to fragile products, the silicon chips are packaged by adopting a foam box in order to avoid damage during transportation, each box of silicon chips is separated by foam, and a corrugated board is respectively placed on the outermost layer, so that the silicon chips are relatively static in the foam box, and the impact damage is avoided due to the buffer protection of foam during transportation.
Disclosure of Invention
The application aims to solve the technical problem of providing a silicon wafer boxing mechanism.
The application realizes the above purpose through the following technical scheme: a silicon wafer boxing mechanism, wherein: the device comprises a silicon wafer tightening module and two foam box pushing modules, wherein the foam box pushing modules are symmetrically arranged on two sides of the silicon wafer tightening module;
the silicon wafer tightening module comprises a fixing frame, a driving motor, a coupler, tightening screw rods, tightening nuts and a pressing plate structure, wherein the driving motor is arranged at the top of the fixing frame, one end of the coupler is connected with the output end of the driving motor, the other end of the coupler is connected with the tightening screw rods, two tightening nuts with opposite directions are arranged on the tightening screw rods, and each tightening nut is provided with a pressing plate structure in a sliding manner;
the foam box pushing module comprises a driving motor II, a coupling II, a movable screw rod, a screw rod nut, a pushing guide rod, a pushing plate, a cylinder, a tightening pressing plate, a fixing frame II, a backup plate and a foam box support, wherein the driving motor II is arranged at one end of the fixing frame II; the tightening pressing plate, the backup plate and the foam box support are fixed on three sides of the push plate, form a foam box accommodating groove with the push plate, and the air cylinder is arranged at the rear of the push plate.
As a further optimization scheme of the application, the fixing frame further comprises a first guide post, a second guide post, a first bearing seat mounting plate, a second bearing seat mounting plate, a first screw rod fixing bearing seat and a second screw rod fixing bearing seat, wherein the first guide post is arranged on two sides of the fixing frame, the second guide post is arranged on two sides of the screw rod, the first bearing seat mounting plate is arranged below the coupler, the second bearing seat mounting plate is arranged at the lowest part of the fixing frame, the first bearing seat mounting plate and the second bearing seat mounting plate are respectively correspondingly provided with the first screw rod fixing bearing seat and the second screw rod fixing bearing seat, and the tightening screw rod is arranged between the first screw rod fixing bearing seat and the second screw rod fixing bearing seat.
As a further optimization scheme of the application, the pressing plate structure comprises a linear slide rail module, a slide rail mounting plate, two pressing plate mounting blocks, two spring stop blocks, a spring guide rod, a reset compression spring and two pressing plates, wherein the slide rail mounting plate is slidably mounted on a tightening screw rod, a first guide pillar and a second guide pillar, the linear slide rail module is fixed on the slide rail mounting plate, the two pressing plate mounting blocks are slidably mounted on the linear slide rail module, the pressing plates are mounted on the front surface of the pressing plate mounting blocks, the spring stop blocks are fixed on the lower surface or the upper surface of the pressing plate mounting blocks and are slidably mounted on the spring guide rod, and the reset compression spring is sleeved on the spring guide rod.
As a further optimization scheme of the application, the linear slide rail module is slid on the first guide post and the second guide post through the linear bearings.
As a further optimization scheme of the application, the fixing frame is arranged on the guide rail and the screw rod, one side of the screw rod is provided with the driving motor III, and the motor III drives the screw rod fixing frame to move back and forth.
As a further optimization scheme of the application, a notch is formed in one side of the push plate, the tightening pressing plate is of a U-shaped structure, the tightening pressing plate is fixed at the notch, a foam box pressing plate is movably arranged above the notch in the tightening pressing plate, and the foam box pressing plate is connected with the air cylinder. Through setting up breach and foam box clamp plate, realized the regulation to foam box accepting groove size, can hold the not unidimensional foam box.
As a further optimization scheme of the application, a photoelectric sensor is arranged at the top of the foam box pushing module and is electrically connected with a driving motor II. Through setting up photoelectric sensor, can realize that foam box propelling movement module independently adjusts foam box propelling movement position.
The beneficial effects of the application are as follows:
by arranging the silicon wafer tightening module, the clamping and compacting of the silicon wafer are realized.
Through setting up foam box propelling movement module, realized the automatic dress box of silicon chip.
Through setting up breach and foam box clamp plate, realized the regulation to foam box accepting groove size, can hold the not unidimensional foam box.
Through setting up photoelectric sensor, can realize that foam box propelling movement module independently adjusts foam box propelling movement position.
Drawings
FIG. 1 is a schematic diagram of a silicon wafer boxing mechanism;
FIG. 2 is a top view of the silicon wafer boxing mechanism of the application;
FIG. 3 is a schematic diagram of a silicon wafer tightening module of the silicon wafer boxing mechanism;
FIG. 4 is a front view of a silicon wafer tightening module of the silicon wafer boxing mechanism of the application;
FIG. 5 is a side view of a silicon wafer tightening module of the silicon wafer boxing mechanism of the present application;
FIG. 6 is a schematic diagram of a foam box pushing module structure of the silicon wafer boxing mechanism;
1-silicon wafer tightening module, 2-foam box pushing module, 3-fixing frame, 4-driving motor, 5-coupling, 6-tightening screw rod, 7-tightening nut, 9-pressing plate structure, 11-driving motor two, 12-coupling two, 13-moving screw rod, 14-screw nut, 15-pushing guide rod, 16-pushing plate, 18-tightening pressing plate, 19-fixing frame two, 20-backing plate, 21-foam box support, 22-guide post one, 23-guide post two, 24-bearing seat mounting plate one, 25-bearing seat mounting plate two, 26-screw rod fixing bearing seat one, 27-screw rod fixing bearing seat two, 28-guide rail, 29-screw rod, 30-foam box pressing plate, 31-photoelectric sensor, 91-linear slide rail module, 92-slide rail mounting plate, 93-pressing plate mounting block, 94-spring stopper, 95-spring guide rod, 96-reset compression spring, 97-pressing plate, 161-notch
Detailed Description
The present application will be described in further detail with reference to the accompanying drawings, wherein it is to be understood that the following detailed description is for the purpose of further illustrating the application only and is not to be construed as limiting the scope of the application, as various insubstantial modifications and adaptations of the application to those skilled in the art can be made in light of the foregoing disclosure.
Example 1
The silicon wafer boxing mechanism shown in fig. 1 comprises a silicon wafer tightening module 1, two foam box pushing modules 2, wherein the foam box pushing modules 2 are symmetrically arranged on two sides of the silicon wafer tightening module 1, the silicon wafer tightening module 1 is used for clamping silicon wafers, the silicon wafers are clamped, the foam box pushing modules 2 are used for placing foam boxes and pushing the foam boxes to the silicon wafers, and the silicon wafers are boxed.
The silicon wafer tightening module 1 comprises a fixing frame 3, a driving motor 4, a coupler 5, tightening screw rods 6, tightening nuts 7 and a pressing plate structure 9, wherein the driving motor 4 is installed at the top of the fixing frame 3, one end of the coupler 5 is connected with the output end of the driving motor 4, the other end of the coupler 5 is connected with the tightening screw rods 6, two tightening nuts 7 with opposite directions are installed on the tightening screw rods 6, each tightening nut 7 is provided with the pressing plate structure 9 in a sliding mode, and the tightening nuts 7 are driven to move up and down through rotation of the driving motor 4, so that up-and-down movement of the pressing plate structure 9 is achieved.
The fixing frame 3 further comprises a first guide post 22, a second guide post 23, a first bearing seat mounting plate 24, a second bearing seat mounting plate 25, a first screw rod fixing bearing seat 24 and a second screw rod fixing bearing seat 25, and the pressing plate structure 9 is arranged on the first guide post 22 and the second guide post 23 in a sliding manner. The first guide pillar 22 is arranged on two sides of the fixed frame 3, the second guide pillar 23 is arranged on two sides of the tightening screw rod 6, the first bearing seat mounting plate 24 is arranged below the coupler 5, the second bearing seat mounting plate 25 is arranged on the lowest side of the fixed frame 3, the first bearing seat mounting plate 24 and the second bearing seat mounting plate 25 are respectively correspondingly provided with the first screw rod fixing bearing seat 24 and the second screw rod fixing bearing seat 25, and the tightening screw rod 6 is arranged between the first screw rod fixing bearing seat 24 and the second screw rod fixing bearing seat 25. The second guide post 23 on one side of the fixing frame 3 is also provided with a photoelectric mounting plate, the pressing plate structure 9 is provided with a photoelectric baffle, the photoelectric baffle is matched with the photoelectric mounting plate, and the photoelectric mounting plate is electrically connected with the driving motor 4, so that the position of the pressing plate structure 9 is accurately controlled.
The foam box pushing module 2 comprises a driving motor II 11, a coupling II 12, a movable screw rod 13, a screw rod nut 14, a pushing guide rod 15, a push plate 16, an air cylinder, a tightening pressing plate 18, a fixing frame II 19, a backup plate 20 and a foam box support 21, wherein the driving motor II 11 is arranged at one end of the fixing frame II 19, the output end of the driving motor II 11 is connected with the movable screw rod 13 through the coupling II 12, one end of the pushing guide rod 15 is fixed on the screw rod nut 14, the screw rod nut 14 is rotatably arranged on the movable screw rod 13, and the other end of the pushing guide rod 15 is connected with the push plate 16; the tightening pressing plate 18, the backup plate 20 and the foam box support 21 are fixed on three sides of the push plate 16, form a foam box accommodating groove with the push plate 16, and the air cylinder is arranged behind the push plate 16.
When the silicon wafer tightening module works, the driving motor 4 on the silicon wafer tightening module 1 drives the tightening screw rod 6 to rotate through the coupler 5, and the tightening screw rod 6 enables the two tightening nuts 7 to respectively drive the two pressing plate structures 9 to be opened or combined, so that the silicon wafer is clamped. After the silicon wafers are clamped, a second driving motor 11 on the foam box pushing module 2 drives a movable screw rod 13 to rotate through a second coupling 12, a screw rod nut 14 drives a pushing guide rod 15 to advance, half of the foam boxes are placed in a foam box accommodating groove on each foam box pushing module 2, and the foam boxes are combined to box the silicon wafers due to pushing of a push plate 16.
Example 2
The silicon wafer boxing mechanism according to embodiment 1 is different only in that the pressing plate structure 9 comprises a linear slide rail module 91, a slide rail mounting plate 92, two pressing plate mounting blocks 93, two spring stoppers 94, a spring guide rod 95, a reset compression spring 96 and two pressing plates 97, the slide rail mounting plate 92 is slidably mounted on the first guide post 22 and the second guide post 23 through linear bearings, and the slide rail mounting plate 92 is fixed on the tightening nut 7 through screws. The linear slide rail module 91 is fixed in on the slide rail mounting panel 92, two clamp plate installation pieces 93 slidable mounting are on the linear slide rail module 91, the clamp plate 97 is installed in clamp plate installation piece 93 openly, spring dog 94 is fixed in clamp plate installation piece 93 lower surface or upper surface, the spring dog 94 that is in clamp plate structure 9 of top sets up in clamp plate installation piece 93's lower surface, the spring dog 94 that is in clamp plate structure 9 of below sets up in clamp plate installation piece's upper surface, guarantee two clamp plate structures 9 are the symmetry setting in vertical direction, and slide on spring guide 95, reset compression spring 96 cup joints on spring guide 95.
Example 3
The silicon wafer boxing mechanism as shown in the embodiment 1 is only different in that the fixing frame 3 is arranged on the guide rail 28 and the screw rod 29, a driving motor III 28 is arranged on one side of the screw rod 29, and the output end of the motor III 28 drives the screw rod 29 to rotate so as to realize the forward and backward movement of the fixing frame 3. The silicon wafer tightening module 1 can clamp and receive the silicon wafer by arranging the guide rail 28 and the screw rod 29.
Example 3
The silicon wafer boxing mechanism in embodiment 1 is characterized in that a notch 161 is formed in one side of the push plate 16, the tightening pressing plate 18 is of a U-shaped structure, the tightening pressing plate 18 is fixed at the notch 161, a foam box pressing plate 30 is movably arranged in the tightening pressing plate 18 above the notch 161, and the foam box pressing plate 30 is connected with an air cylinder. Through setting up breach 161, tighten up clamp plate 18 for U-shaped structure, foam box clamp plate 30 connection cylinder can realize that foam box clamp plate 30 makes a round trip at breach 161 departments and stretches out and draws back to realize the control to foam box accepting groove size, hold the foam box of equidimension not.
Example 4
The silicon wafer boxing mechanism as shown in the embodiment 1 is only different in that the photoelectric sensor 31 is arranged at the top of the foam box pushing module 2, the photoelectric sensor 31 is electrically connected with the driving motor II 11, the position of the silicon wafer to be packaged is detected by the photoelectric sensor 31, and the photoelectric sensor 31 transmits a signal to the driving motor II 11, so that the position of the push plate 16 is controlled.
The above examples are merely illustrative of the preferred embodiments of the present application and are not intended to limit the spirit and scope of the present application. Various modifications and improvements of the technical scheme of the present application will fall within the protection scope of the present application without departing from the design concept of the present application, and the technical content of the present application is fully described in the claims.
Claims (5)
1. The utility model provides a silicon chip boxing mechanism which characterized in that: the device comprises a silicon wafer tightening module (1), two foam box pushing modules (2), wherein the foam box pushing modules (2) are symmetrically arranged on two sides of the silicon wafer tightening module (1);
the silicon wafer tightening module (1) comprises a fixing frame (3), a driving motor (4), a coupler (5), tightening screw rods (6), tightening nuts (7) and a pressing plate structure (9), wherein the driving motor (4) is installed at the top of the fixing frame (3), one end of the coupler (5) is connected with the output end of the driving motor (4), the other end of the coupler (5) is connected with the tightening screw rods (6), two tightening nuts (7) with opposite directions are installed on the tightening screw rods (6), and one pressing plate structure (9) is arranged on each tightening nut (7) in a sliding mode;
the foam box pushing module (2) comprises a driving motor II (11), a coupling II (12), a movable screw rod (13), a screw rod nut (14), a pushing guide rod (15), a push plate (16), an air cylinder, a tightening pressing plate (18), a fixing frame II (19), a leaning plate (20) and a foam box support (21), wherein the driving motor II (11) is arranged at one end of the fixing frame II (19), the output end of the driving motor II (11) is connected with the movable screw rod (13) through the coupling II (12), one end of the pushing guide rod (15) is fixed on the screw rod nut (14), the screw rod nut (14) is rotatably arranged on the movable screw rod (13), and the other end of the pushing guide rod (15) is connected with the push plate (16); the tightening pressing plate (18), the backup plate (20) and the foam box support (21) are fixed on three sides of the push plate (16), form a foam box accommodating groove with the push plate (16), and the air cylinder is arranged behind the push plate (16).
2. A silicon wafer boxing mechanism in accordance with claim 1, wherein: the fixing frame (3) further comprises a first guide pillar (22), a second guide pillar (23), a first bearing seat mounting plate (24), a second bearing seat mounting plate (25), a first screw rod fixing bearing seat (26) and a second screw rod fixing bearing seat (27), wherein the first guide pillar (22) is arranged on two sides of the fixing frame (3), the second guide pillar (23) is arranged on two sides of the tightening screw rod (6), the first bearing seat mounting plate (24) is arranged below the coupling, the second bearing seat mounting plate (25) is arranged at the lowest part of the fixing frame (3), the first bearing seat mounting plate (24) and the second bearing seat mounting plate (25) are respectively correspondingly provided with the first screw rod fixing bearing seat (26) and the second screw rod fixing bearing seat (27), and the tightening screw rod (6) is arranged between the first screw rod fixing bearing seat (26) and the second screw rod fixing bearing seat (27).
3. A silicon wafer boxing mechanism in accordance with claim 1, wherein: the clamp plate structure (9) includes linear slide rail module (91), slide rail mounting panel (92), two clamp plate installation blocks (93), two spring dog (94), spring guide arm (95), reset compression spring (96), two clamp plates (97), slide rail mounting panel (92) slidable mounting is on tightening screw rod (6), guide pillar one (22), guide pillar two (23), linear slide rail module (91) is fixed in on slide rail mounting panel (92), two clamp plate installation blocks (93) slidable mounting are on linear slide rail module (91), clamp plate (97) are installed in clamp plate installation block (93) openly, spring dog (94) are fixed in clamp plate installation block (93) lower surface or upper surface, and slide on spring guide arm (95), reset compression spring (96) cup joint on spring guide arm (95).
4. A silicon wafer boxing mechanism in accordance with claim 1, wherein: one side of the push plate (16) is provided with a notch (161), the tightening pressure plate (18) is of a U-shaped structure, the tightening pressure plate (18) is fixed at the notch (161), a foam box pressure plate (30) is movably arranged in the tightening pressure plate (18) above the notch (161), and the foam box pressure plate (30) is connected with an air cylinder.
5. A silicon wafer boxing mechanism in accordance with claim 1, wherein: the top of foam box propelling movement module (2) is equipped with photoelectric sensor (31), and photoelectric sensor (31) electric connection driving motor two (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911239523.0A CN110844174B (en) | 2019-12-06 | 2019-12-06 | Silicon wafer boxing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911239523.0A CN110844174B (en) | 2019-12-06 | 2019-12-06 | Silicon wafer boxing mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110844174A CN110844174A (en) | 2020-02-28 |
| CN110844174B true CN110844174B (en) | 2023-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911239523.0A Active CN110844174B (en) | 2019-12-06 | 2019-12-06 | Silicon wafer boxing mechanism |
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| CN (1) | CN110844174B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112678252B (en) * | 2020-12-23 | 2022-07-29 | 联宝(合肥)电子科技有限公司 | Packaging system |
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| CN211685813U (en) * | 2019-12-06 | 2020-10-16 | 杭州中为光电技术有限公司 | Silicon chip cartoning machine constructs |
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| JP2005335734A (en) * | 2004-05-25 | 2005-12-08 | Yamato Scale Co Ltd | Inserting apparatus, inserting method and automatic boxing apparatus |
| CN202245327U (en) * | 2011-09-17 | 2012-05-30 | 无锡先导自动化设备股份有限公司 | Silicon chip boxing device |
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| CN110844174A (en) | 2020-02-28 |
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