CN211685813U - Silicon chip cartoning machine constructs - Google Patents
Silicon chip cartoning machine constructs Download PDFInfo
- Publication number
- CN211685813U CN211685813U CN201922181725.6U CN201922181725U CN211685813U CN 211685813 U CN211685813 U CN 211685813U CN 201922181725 U CN201922181725 U CN 201922181725U CN 211685813 U CN211685813 U CN 211685813U
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- Prior art keywords
- tightening
- screw rod
- plate
- module
- foam box
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Abstract
The utility model discloses a silicon chip cartoning machine constructs, tighten up the module including the silicon chip, two foam box propelling movement modules, foam box propelling movement module symmetry set up in the both sides that the module was tightened up to the silicon chip. A driving motor on the silicon wafer tightening module enables a tightening screw rod to rotate through a coupler, and a tightening nut arranged on the tightening screw rod drives a pressing plate structure to clamp or loosen the silicon wafer. A second driving motor on the foam box pushing module drives the movable screw rod to rotate through a second coupler, a screw nut arranged on the movable screw rod drives the pushing guide rod to stretch, and the pushing guide rod pushes the push plate to move forwards or retreat, so that two half foam boxes on the two symmetrically arranged foam box pushing modules are combined, and the silicon wafer on the foam box pushing module is packed. The utility model discloses silicon chip cartoning machine dress box is efficient, and personnel's dependence is low, and it is good to have dress box silicon chip integrality, and silicon chip dress box advantage with low costs.
Description
Technical Field
The utility model relates to a silicon chip cartoning equipment, concretely relates to silicon chip cartoning mechanism.
Background
Because the silicon chip belongs to fragile article, in the way of transportation in order to avoid damaging, so adopt the foam box to pack the silicon chip, separate with the bubble cotton between every box silicon chip, outmost one set of corrugated container board again respectively, the silicon chip is static relatively in the foam box like this, there is the cotton buffer protection of bubble to avoid the collision damage in the way of transporting, because this kind of "sandwich" form dress box mode is more loaded down with trivial details, present traditional dress box still adopts the manual mode dress box, dress box efficiency is not high, personnel's dependence is high, increase dress box cost.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in that to above-mentioned problem, a silicon chip cartoning machine constructs is provided.
The utility model discloses a following technical scheme realizes above-mentioned purpose: a silicon wafer boxing mechanism, wherein: the silicon chip tightening module comprises a silicon chip tightening module and two foam box pushing modules, wherein the foam box pushing modules are symmetrically arranged on two sides of the silicon chip tightening module;
the silicon wafer tightening module comprises a fixing frame, a driving motor, a coupler, a tightening screw rod, tightening nuts and a pressing plate structure, wherein the driving motor is installed at the top of the fixing frame, one end of the coupler is connected with the output end of the driving motor, the other end of the coupler is connected with the tightening screw rod, the tightening screw rod is provided with two tightening nuts with opposite rotation directions, and each tightening nut is provided with one pressing plate structure in a sliding manner;
the foam box pushing module comprises a second driving motor, a second coupling, a movable screw rod, a screw nut, a pushing guide rod, a push plate, an air cylinder, a tightening pressing plate, a second fixing frame, a backup plate and a foam box support, wherein the second driving motor is installed at one end of the second fixing frame; the tightening pressing plate, the backup plate and the foam box support are fixed on three sides of the push plate and form a foam box accommodating groove with the push plate, and the air cylinder is arranged behind the push plate.
As the utility model discloses a further optimization scheme still includes guide pillar one on the mount, guide pillar two, bearing frame mounting panel one, bearing frame mounting panel two, lead screw fixed bearing seat one, lead screw fixed bearing seat two, guide pillar one sets up in the both sides of mount, guide pillar two sets up in the both sides of tightening up the lead screw, bearing frame mounting panel one sets up in the shaft coupling below, bearing frame mounting panel two sets up in the below of mount, bearing frame mounting panel one, bearing frame mounting panel two corresponds installation lead screw fixed bearing seat one respectively, lead screw fixed bearing seat two, it sets up in lead screw fixed bearing seat one, between lead screw fixed bearing seat two to tighten up the lead screw.
As the utility model discloses a further optimization scheme, the clamp plate structure includes linear slide rail module, the slide rail mounting panel, two clamp plate installation pieces, two spring stop blocks, the spring guide arm, the compression spring that resets, two clamp plates, slide rail mounting panel slidable mounting is in tightening up the lead screw, guide pillar one, on the guide pillar two, the linear slide rail module is fixed in on the slide rail mounting panel, two clamp plate installation piece slidable mounting are on linear slide rail module, clamp plate mounting is positive in clamp plate installation piece, the spring stop block is fixed in clamp plate mounting piece lower surface or upper surface, and slide on the spring guide arm, the compression spring that resets cup joints on the spring guide arm.
As a further optimization scheme of the utility model, the linear slide rail module slides on guide pillar one, guide pillar two through linear bearing.
As the utility model discloses a further optimization scheme, the mount is installed on guide rail, lead screw, and a side-mounting driving motor of lead screw is three, and three drive lead screw mounts back-and-forth movement of motor.
As the utility model discloses a further optimization scheme, one side of push pedal is seted up jaggedly, tightens up the clamp plate and is the U-shaped structure, tightens up the clamp plate and is fixed in breach department, and above the breach, tightens up the clamp plate internalization and is equipped with a foam box clamp plate, and the cylinder is connected to the foam box clamp plate. Through setting up breach and foam box clamp plate, realized the regulation to foam box accepting groove size, can hold the foam box of unidimensional not.
As the utility model discloses a further optimization scheme, the top of foam box propelling movement module is equipped with photoelectric sensor, photoelectric sensor electric connection driving motor two. Through setting up photoelectric sensor, can realize that foam box propelling movement module independently adjusts foam box propelling movement position.
The utility model has the advantages that:
through setting up the silicon chip and tightening up the module, realized pressing from both sides and get and compress tightly the silicon chip.
Through setting up foam box propelling movement module, realized the automatic dress box of silicon chip.
Through setting up breach and foam box clamp plate, realized the regulation to foam box accepting groove size, can hold the foam box of unidimensional not.
Through setting up photoelectric sensor, can realize that foam box propelling movement module independently adjusts foam box propelling movement position.
Drawings
FIG. 1 is a schematic structural view of a silicon wafer boxing mechanism of the present invention;
FIG. 2 is a top view of the silicon wafer loading mechanism of the present invention;
FIG. 3 is a schematic structural view of a silicon wafer tightening module of the silicon wafer boxing mechanism of the utility model;
FIG. 4 is a front view of a silicon wafer tightening module of the silicon wafer boxing mechanism of the utility model;
FIG. 5 is a side view of the silicon wafer tightening module of the silicon wafer boxing mechanism of the utility model;
FIG. 6 is a schematic structural view of a foam box pushing module of the silicon wafer boxing mechanism of the present invention;
1-silicon chip tightening module, 2-foam box pushing module, 3-fixing frame, 4-driving motor, 5-coupler, 6-tightening screw rod, 7-tightening nut, 9-pressing plate structure, 11-driving motor II, 12-coupler II, 13-moving screw rod, 14-screw rod nut, 15-pushing guide rod, 16-push plate, 18-tightening pressing plate, 19-fixing frame II, 20-backing plate, 21-foam box holder, 22-guide column I, 23-guide column II, 24-bearing seat mounting plate I, 25-bearing seat mounting plate II, 26-screw rod fixing bearing seat I, 27-screw rod fixing bearing seat II, 28-guide rail, 29-screw rod, 30-foam box pressing plate, 31-photoelectric sensor, 91-linear slide rail module, 92-slide rail mounting plate, 93-pressure plate mounting block, 94-spring stop block, 95-spring guide rod, 96-reset compression spring, 97-pressure plate and 161-notch
Detailed Description
The present application will now be described in further detail with reference to the drawings, it should be noted that the following detailed description is given for illustrative purposes only and is not to be construed as limiting the scope of the present application, as those skilled in the art will be able to make numerous insubstantial modifications and adaptations to the present application based on the above disclosure.
Example 1
The silicon wafer boxing mechanism shown in fig. 1 comprises a silicon wafer tightening module 1 and two foam box pushing modules 2, wherein the foam box pushing modules 2 are symmetrically arranged on two sides of the silicon wafer tightening module 1, the silicon wafer tightening module 1 is used for clamping a silicon wafer and clamping the silicon wafer, and the foam box pushing modules 2 are used for placing foam boxes and pushing the foam boxes to the silicon wafer to box the silicon wafer.
The silicon wafer tightening module 1 comprises a fixing frame 3, a driving motor 4, a coupler 5, a tightening screw rod 6, a tightening nut 7 and a pressing plate structure 9, the driving motor 4 is installed at the top of the fixing frame 3, one end of the coupler 5 is connected with the output end of the driving motor 4, the other end of the coupler 5 is connected with the tightening screw rod 6, two tightening nuts 7 with opposite rotation directions are installed on the tightening screw rod 6, a pressing plate structure 9 is arranged on each tightening nut 7 in a sliding mode, the tightening nuts 7 are driven to move up and down through the rotation of the driving motor 4, and therefore the up-and-down movement of the.
The fixed frame 3 further comprises a first guide pillar 22, a second guide pillar 23, a first bearing seat mounting plate 24, a second bearing seat mounting plate 25, a first screw rod fixing bearing seat 24 and a second screw rod fixing bearing seat 25, and the pressing plate structure 9 is arranged on the first guide pillar 22 and the second guide pillar 23 in a sliding mode. The first guide posts 22 are arranged on two sides of the fixing frame 3, the second guide posts 23 are arranged on two sides of the tightening screw 6, the first bearing seat mounting plate 24 is arranged below the coupler 5, the second bearing seat mounting plate 25 is arranged on the lowest portion of the fixing frame 3, the first bearing seat mounting plate 24 and the second bearing seat mounting plate 25 are correspondingly provided with the first screw fixing bearing seat 24 and the second screw fixing bearing seat 25 respectively, and the tightening screw 6 is arranged between the first screw fixing bearing seat 24 and the second screw fixing bearing seat 25. A photoelectric mounting plate is further arranged on the second guide pillar 23 on one side of the fixing frame 3, a photoelectric blocking piece is arranged on the pressing plate structure 9, the photoelectric blocking piece is matched with the photoelectric mounting plate, and the photoelectric mounting plate is electrically connected with the driving motor 4, so that the position of the pressing plate structure 9 is accurately controlled.
The foam box pushing module 2 comprises a second driving motor 11, a second coupling 12, a movable screw rod 13, a screw rod nut 14, a pushing guide rod 15, a push plate 16, an air cylinder, a tightening pressure plate 18, a second fixing frame 19, a backup plate 20 and a foam box support 21, the second driving motor 11 is installed at one end of the second fixing frame 19, the output end of the second driving motor 11 is connected with the movable screw rod 13 through the second coupling 12, one end of the pushing guide rod 15 is fixed on the screw rod nut 14, the screw rod nut 14 is rotatably installed on the movable screw rod 13, and the other end of the pushing guide rod 15 is connected with the push plate; the tightening pressure plate 18, the backup plate 20 and the foam box holder 21 are fixed on three sides of the push plate 16 to form a foam box accommodating groove with the push plate 16, and the air cylinder is arranged behind the push plate 16.
When the silicon wafer tightening module works, the driving motor 4 on the silicon wafer tightening module 1 drives the tightening screw rod 6 to rotate through the coupler 5, and the tightening screw rod 6 enables the two tightening nuts 7 to respectively drive the two pressure plate structures 9 to be opened or combined, so that the silicon wafer is clamped. After the silicon chip presss from both sides tightly, two 11 driving motor on the foam box propelling movement module 2 drive through two 12 shaft couplings and remove lead screw 13 and rotate, and screw-nut 14 drives and promotes guide arm 15 and to advancing, places half foam box in the foam box accepting groove on every foam box propelling movement module 2, because the promotion of push pedal 16, the foam box merges, packs the silicon chip into box.
Example 2
The silicon wafer boxing mechanism in embodiment 1 is different in that the pressing plate structure 9 includes a linear slide rail module 91, a slide rail mounting plate 92, two pressing plate mounting blocks 93, two spring stoppers 94, a spring guide rod 95, a return compression spring 96, and two pressing plates 97, the slide rail mounting plate 92 is slidably mounted on the first guide pillar 22 and the second guide pillar 23 through linear bearings, and the slide rail mounting plate 92 is fixed to the tightening nut 7 through screws. Linear slide rail module 91 is fixed in on the slide rail mounting panel 92, two clamp plate installation pieces 93 slidable mounting are on linear slide rail module 91, clamp plate 97 installs in clamp plate installation piece 93 openly, spring dog 94 is fixed in clamp plate installation piece 93 lower surface or upper surface, the spring dog 94 that is in the clamp plate structure 9 of top sets up in the lower surface of clamp plate installation piece 93, the spring dog 94 that is in the clamp plate structure 9 of below sets up in the upper surface of clamp plate installation piece, guarantee that two clamp plate structure 9 are the symmetry setting in vertical direction, and slide on spring guide 95, reset compression spring 96 cup joints on spring guide 95.
Example 3
The silicon wafer boxing mechanism as shown in embodiment 1 is different only in that the fixing frame 3 is mounted on the guide rail 28 and the screw 29, the driving motor III 28 is mounted on one side of the screw 29, and the output end of the driving motor III 28 rotates through the driving screw 29 so as to realize the forward and backward movement of the fixing frame 3. The silicon wafer can be clamped and received by the silicon wafer tightening module 1 by arranging the guide rail 28 and the screw rod 29.
Example 3
The silicon wafer boxing mechanism in embodiment 1 is different in that a notch 161 is formed in one side of the push plate 16, the tightening pressure plate 18 is of a U-shaped structure, the tightening pressure plate 18 is fixed at the notch 161, a foam box pressure plate 30 is movably arranged in the tightening pressure plate 18 above the notch 161, and the foam box pressure plate 30 is connected to an air cylinder. Through setting up breach 161, tighten up clamp plate 18 and be the U-shaped structure, foam box clamp plate 30 connects the cylinder and can realize that foam box clamp plate 30 makes a round trip to stretch out and draw back in breach 161 department to the realization holds the foam box of equidimension to the control of foam box accepting groove size.
Example 4
The silicon wafer boxing mechanism in embodiment 1 is different in that a photoelectric sensor 31 is arranged at the top of the foam box pushing module 2, the photoelectric sensor 31 is electrically connected to the second driving motor 11, the position of a silicon wafer to be packaged is detected by the photoelectric sensor 31, and the photoelectric sensor 31 transmits a signal to the second driving motor 11, so that the position of the push plate 16 is controlled.
The above-described embodiments are merely illustrative of the preferred embodiments of the present invention and are not intended to limit the spirit and scope of the present invention. Without departing from the design concept of the present invention, various modifications and improvements made by the technical solution of the present invention by those skilled in the art should fall into the protection scope of the present invention, and the technical contents claimed by the present invention have been fully recorded in the claims.
Claims (7)
1. The silicon wafer boxing mechanism is characterized in that: the silicon chip tightening device comprises a silicon chip tightening module (1) and two foam box pushing modules (2), wherein the foam box pushing modules (2) are symmetrically arranged on two sides of the silicon chip tightening module (1);
the silicon wafer tightening module (1) comprises a fixing frame (3), a driving motor (4), a coupler (5), a tightening screw rod (6), tightening nuts (7) and a pressing plate structure (9), wherein the driving motor (4) is installed at the top of the fixing frame (3), one end of the coupler (5) is connected with the output end of the driving motor (4), the other end of the coupler (5) is connected with the tightening screw rod (6), two tightening nuts (7) with opposite rotation directions are installed on the tightening screw rod (6), and the pressing plate structure (9) is arranged on each tightening nut (7) in a sliding mode;
the foam box pushing module (2) comprises a second driving motor (11), a second coupler (12), a movable lead screw (13), a lead screw nut (14), a pushing guide rod (15), a push plate (16), an air cylinder, a tightening pressure plate (18), a second fixing frame (19), a backup plate (20) and a foam box support (21), wherein the second driving motor (11) is installed at one end of the second fixing frame (19), the output end of the second driving motor (11) is connected with the movable lead screw (13) through the second coupler (12), one end of the pushing guide rod (15) is fixed on the lead screw nut (14), the lead screw nut (14) is rotatably installed on the movable lead screw (13), and the other end of the pushing guide rod (15) is connected with the push plate (16; the tightening pressure plate (18), the backup plate (20) and the foam box holder (21) are fixed on three sides of the push plate (16) to form a foam box containing groove with the push plate (16), and the air cylinder is arranged behind the push plate (16).
2. The silicon wafer boxing mechanism of claim 1, wherein: the fixing frame (3) is further provided with a first guide pillar (22), a second guide pillar (23), a first bearing seat mounting plate (24), a second bearing seat mounting plate (25), a first screw rod fixing bearing seat (26) and a second screw rod fixing bearing seat (27), the first guide pillar (22) is arranged on two sides of the fixing frame (3), the second guide pillar (23) is arranged on two sides of a tightening screw rod (6), the first bearing seat mounting plate (24) is arranged below the coupler (5), the second bearing seat mounting plate (25) is arranged on the lowest portion of the fixing frame (3), the first bearing seat mounting plate (24) and the second bearing seat mounting plate (25) respectively correspond to the first screw rod fixing bearing seat (26) and the second screw rod fixing bearing seat (27), and the tightening screw rod (6) is arranged between the first screw rod fixing bearing seat (.
3. The silicon wafer boxing mechanism of claim 1, wherein: the pressing plate structure (9) comprises a linear sliding rail module (91), a sliding rail mounting plate (92), two pressing plate mounting blocks (93), two spring stop blocks (94), a spring guide rod (95), a reset compression spring (96) and two pressing plates (97), wherein the sliding rail mounting plate (92) is slidably mounted on a tightening screw rod (6), a first guide pillar (22) and a second guide pillar (23), the linear sliding rail module (91) is fixed on the sliding rail mounting plate (92), the two pressing plate mounting blocks (93) are slidably mounted on the linear sliding rail module (91), the pressing plates (97) are mounted on the front surfaces of the pressing plate mounting blocks (93), the spring stop blocks (94) are fixed on the lower surfaces or the upper surfaces of the pressing plate mounting blocks (93), the spring stop blocks slide on the spring guide rod (95), and the reset compression spring (96) is sleeved on the.
4. The silicon wafer boxing mechanism of claim 1, wherein: the linear slide rail module (91) slides on the guide post I (22) and the guide post II (23) through the linear bearing.
5. The silicon wafer boxing mechanism of claim 1, wherein: the fixing frame (3) is arranged on the guide rail (28) and the screw rod (29), one side of the screw rod (29) is provided with a driving motor III (32), and the motor III (32) drives the screw rod (29) and the fixing frame (3) to move back and forth.
6. The silicon wafer boxing mechanism of claim 1, wherein: a notch (161) is formed in one side of the push plate (16), the tightening press plate (18) is of a U-shaped structure, the tightening press plate (18) is fixed to the notch (161), a foam box press plate (30) is movably arranged in the tightening press plate (18) above the notch (161), and the foam box press plate (30) is connected with the air cylinder.
7. The silicon wafer boxing mechanism of claim 1, wherein: the top of foam box propelling movement module (2) is equipped with photoelectric sensor (31), and photoelectric sensor (31) electric connection driving motor two (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922181725.6U CN211685813U (en) | 2019-12-06 | 2019-12-06 | Silicon chip cartoning machine constructs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922181725.6U CN211685813U (en) | 2019-12-06 | 2019-12-06 | Silicon chip cartoning machine constructs |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211685813U true CN211685813U (en) | 2020-10-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922181725.6U Withdrawn - After Issue CN211685813U (en) | 2019-12-06 | 2019-12-06 | Silicon chip cartoning machine constructs |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211685813U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110844174A (en) * | 2019-12-06 | 2020-02-28 | 杭州中为光电技术有限公司 | Silicon chip cartoning machine constructs |
-
2019
- 2019-12-06 CN CN201922181725.6U patent/CN211685813U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110844174A (en) * | 2019-12-06 | 2020-02-28 | 杭州中为光电技术有限公司 | Silicon chip cartoning machine constructs |
| CN110844174B (en) * | 2019-12-06 | 2023-10-03 | 杭州中为光电技术有限公司 | Silicon wafer boxing mechanism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20201016 Effective date of abandoning: 20231003 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20201016 Effective date of abandoning: 20231003 |
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |