CN216633301U - Efficient processing device for DFN packaging device - Google Patents
Efficient processing device for DFN packaging device Download PDFInfo
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- CN216633301U CN216633301U CN202123419222.1U CN202123419222U CN216633301U CN 216633301 U CN216633301 U CN 216633301U CN 202123419222 U CN202123419222 U CN 202123419222U CN 216633301 U CN216633301 U CN 216633301U
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Abstract
The utility model discloses a high-efficiency processing device of a DFN packaging device, wherein one end of a rack meshed with a gear extends outwards from the inside of a supporting shell and is in sliding fit with the side wall of the supporting shell, the gear is rotatably arranged on a workbench through a vertically arranged rotating shaft, the upper surface of the gear is provided with at least 2 arc through grooves which are arranged at equal intervals along the circumferential direction, a support plate is provided with rectangular through grooves which correspond to the arc through grooves and extend along the radial direction, a bidirectional screw rod is rotatably connected between 2 first mounting plates which are symmetrically arranged at two sides of an electric cylinder, one end of the bidirectional screw rod penetrates through one first mounting plate and is connected with a motor output shaft arranged on the first mounting plate, a second mounting plate is respectively sleeved on the bidirectional screw rod and positioned at two sides of the electric cylinder, and a baffle is arranged at the bottom of the second mounting plate. The utility model effectively avoids the condition that the chip is damaged when the chip falls on the workbench while improving the position precision of the substrate, thereby improving the processing efficiency.
Description
Technical Field
The utility model relates to the field of semiconductor device processing, in particular to a high-efficiency processing device for a DFN packaging device.
Background
With the rapid development of the information society and the coming of the big data era, the requirements of networks, data centers and high-performance computers on the transmission speed, the broadband and the power consumption of the data are higher and higher. Chip bonding is a key process step in the semiconductor device packaging process, and typical bonding technologies include tape automated bonding technology, wire bonding technology, flip chip bonding technology, and the like.
Flip chip bonding techniques have significant advantages: high packaging density, good electrical and thermal properties, high reliability and low cost. This technology has attracted much attention in electronic products as it has been realized toward smaller devices.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide the efficient processing device of the DFN packaging device, which can ensure the safety of a chip in the transferring process on the basis of picking, transferring and bonding the chip, avoid the damage of the chip caused by the chip falling on a workbench, improve the picking efficiency of the chip and further improve the processing efficiency.
In order to achieve the purpose, the utility model adopts the technical scheme that: an efficient processing apparatus for DFN packaged devices, comprising: the chip processing device comprises a workbench, a top plate positioned right above the workbench and a support plate vertically connected between the workbench and the top plate, wherein a mounting seat for placing a substrate to be processed is installed on the workbench, a placing plate for placing a chip to be processed is arranged on the outer side of the mounting seat, an electric cylinder is installed on the side surface of the support plate in a sliding mode, a sucking disc for picking up the chip to be processed is installed on the output end of the electric cylinder and can move to the position above the mounting seat from the position above the placing plate along with the electric cylinder, an air cylinder is installed on the top plate and positioned right above the mounting seat, and a pressing plate for being in extrusion contact with the chip to be processed above the substrate to be processed is installed on a piston rod of the air cylinder;
the mount further includes: a support plate arranged on the worktable through a support shell, a gear positioned below the support plate in the support shell and a rack meshed with the gear, wherein one end of the rack meshed with the gear extends outwards from the support shell and is in sliding fit with the side wall of the support shell, the gear is rotatably arranged on the workbench through a vertically arranged rotating shaft, the upper surface of the gear is provided with at least 2 arc-shaped through grooves which are arranged at equal intervals along the circumferential direction, the carrier plate is provided with a rectangular through groove which corresponds to the arc-shaped through groove and extends along the radial direction, the lower end of a vertically arranged straight rod is embedded into the arc-shaped through groove and is in sliding fit with the inner wall of the arc-shaped through groove, the upper end of the straight rod penetrates through the corresponding rectangular through groove and is provided with a fixture block, and a clamping area for placing a substrate to be processed is formed between at least 2 fixture blocks in sliding fit with the upper surface of the support plate;
the improved electric cylinder is characterized in that a strip-shaped groove extending along the horizontal direction is formed in the side surface of the supporting plate, one side of a sliding plate is arranged in the strip-shaped groove in a sliding mode, the electric cylinder is arranged on the lower surface of the other side of the sliding plate, the sliding plate is horizontally arranged, two ends of the lower surface of the sliding plate are respectively connected with a first vertically-arranged mounting plate, the sliding plate is symmetrically arranged on 2 of two sides of the electric cylinder, a bidirectional screw rod is rotatably connected between the first mounting plates, one end of the bidirectional screw rod penetrates through the first mounting plate and is connected with a motor output shaft arranged on the first mounting plate, a second mounting plate is sleeved on each of the two sides of the bidirectional screw rod and located on two sides of the electric cylinder, and a baffle is arranged at the bottom of the second mounting plate.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the piston rod of the air cylinder is connected with the pressing plate through a push rod, the upper end of the push rod is installed on the piston rod of the air cylinder, and the lower end of the push rod is connected with the upper surface of the pressing plate.
2. In the above scheme, the piston rod of the electric cylinder is connected with the sucker through a first connecting rod.
3. In the above scheme, the number of the arc-shaped through grooves, the rectangular through grooves, the straight rods and the clamping blocks is 4.
4. In the above scheme, the straight rod is sleeved with at least one limiting block in sliding fit with the lower surface of the support plate or the gear.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
1. according to the efficient processing device for the DFN packaging device, the electric cylinder is slidably mounted on the side surface of the supporting plate, the sucker for picking up the chip to be processed is mounted on the output end of the electric cylinder and can move to the upper part of the mounting seat along with the electric cylinder from the upper part of the object placing plate, the air cylinder is mounted on the top plate and located right above the mounting seat, the pressing plate for being in pressing contact with the chip to be processed above the substrate to be processed is mounted on the piston rod of the air cylinder, the chip can be picked up, transferred and bonded in one set of device, and space resources are saved; and in addition, the electric cylinder is installed on the lower surface of the other side of the sliding plate, the two ends of the lower surface of the horizontally arranged sliding plate are respectively connected with a vertically arranged first mounting plate, the two first mounting plates are symmetrically arranged on two sides of the electric cylinder and are rotatably connected with a two-way screw rod, one end of the two-way screw rod penetrates through the first mounting plate and is connected with a motor output shaft installed on the first mounting plate, the two-way screw rod is positioned on two sides of the electric cylinder and is respectively sleeved with a second mounting plate, a baffle is installed at the bottom of the second mounting plate, in the chip transfer process, the baffle can be moved to the lower part of the chip through the bottom of the second mounting plate, the situation that the chip is damaged on a workbench due to the falling of the chip is effectively avoided, the safety of the chip in the picking and transferring process is ensured, the picking efficiency of the chip is also improved, and the processing efficiency is improved.
2. The utility model relates to a high-efficiency processing device of a DFN packaging device, wherein one end of a rack meshed with a gear extends outwards from a support shell and is matched with the side wall of the support shell in a sliding manner, the gear is rotatably arranged on a workbench through a vertically arranged rotating shaft, the upper surface of the gear is provided with at least 2 arc through grooves which are arranged at equal intervals along the circumferential direction, a support plate is provided with rectangular through grooves which correspond to the arc through grooves and extend along the radial direction, the lower end of a vertically arranged straight rod is embedded into the arc through grooves and is matched with the inner wall of the arc through grooves in a sliding manner, the upper end of the straight rod penetrates through the corresponding rectangular through groove and is provided with a fixture block, a clamping area for placing a substrate to be processed is formed between at least 2 fixture blocks which are matched with the upper surface of the support plate in a sliding manner, the position fixation of the substrate can be conveniently and quickly realized, and the condition that the bonding position is inaccurate caused by the movement of the substrate in the bonding process is effectively avoided while the position precision of the substrate is improved, therefore, the quality of processed products is guaranteed, substrates of different sizes can be fixed, and the overall applicability is improved.
Drawings
FIG. 1 is a cross-sectional elevation view of an efficient tooling apparatus for DFN packaged devices in accordance with the present invention;
FIG. 2 is an enlarged view of FIG. 1 at A of the apparatus for processing the integrated circuit package device of the present invention;
fig. 3 is a schematic view of a part of the structure of the processing apparatus of the integrated circuit package device of the present invention.
In the above drawings: 1. a work table; 2. a support plate; 3. a top plate; 4. a mounting seat; 5. a storage plate; 6. an electric cylinder; 7. a suction cup; 8. a cylinder; 9. pressing a plate; 10. a support housing; 11. a carrier plate; 12. a gear; 13. a rack; 14. a rotating shaft; 15. an arc-shaped through groove; 16. a rectangular through groove; 17. a straight rod; 18. a clamping block; 19. a strip-shaped groove; 20. a sliding plate; 21. a first mounting plate; 22. a bidirectional screw; 23. a motor; 24. a second mounting plate; 25. a baffle plate; 26. a push rod; 27. a first connecting rod; 28. and a limiting block.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: an efficient processing apparatus for DFN packaged devices, comprising: the device comprises a workbench 1, a top plate 3 positioned over the workbench 1 and a support plate 2 vertically connected between the workbench 1 and the top plate 3, wherein a mounting seat 4 for placing a substrate to be processed is installed on the workbench 1, a storage plate 5 for placing a chip to be processed is arranged on the outer side of the mounting seat 4, an electric cylinder 6 is slidably installed on the side surface of the support plate 2, a sucker 7 for picking up the chip to be processed is installed on the output end of the electric cylinder 6 and can move to the position above the mounting seat 4 from the position above the storage plate 5 along with the electric cylinder 6, an air cylinder 8 is installed on the top plate 3 and positioned over the mounting seat 4, a pressing plate 9 for being in extrusion contact with the chip to be processed above the substrate to be processed is installed on a piston rod of the air cylinder 8, the substrate is placed on the mounting seat, the chip is placed on the storage plate, and the electric cylinder drives the sucker to move downwards, adsorbing the chip on a sucker, moving the sucker to drive the chip to move above the substrate, and pushing a pressing plate by using an air cylinder to realize bonding of the substrate and the semiconductor chip;
the mount 4 further includes: a support plate 11 mounted on the worktable 1 through a support housing 10, a gear 12 located below the support plate 11 in the support housing 10, and a rack 13 engaged with the gear 12, one end of the rack 13 engaged with the gear 12 extends outwards from the inside of the support housing 10 and is in sliding fit with the side wall of the support housing 10, the gear 12 is rotatably mounted on the worktable 1 through a vertically arranged rotating shaft 14, at least 2 arc through grooves 15 arranged at equal intervals along the circumferential direction are formed on the upper surface of the gear 12, a rectangular through groove 16 corresponding to the arc through groove 15 and extending along the radial direction is formed on the support plate 11, the lower end of a vertically arranged straight rod 17 is embedded into the arc through groove 15 and is in sliding fit with the inner wall of the arc through groove 15, the upper end of the support plate 17 passes through the corresponding rectangular through groove 16 and is mounted with a fixture block 18, and at least 2 fixture blocks 18 in sliding fit with the upper surface of the support housing 11 form a clamping block between the fixture blocks 18 for placing a substrate to be processed The substrate is placed on the upper surface of the carrier plate, the rack is pushed, the rack drives the gear to rotate, the straight rod in the arc-shaped through groove of the gear slides along the arc-shaped through groove, the straight rod also slides along the rectangular through groove, the four clamping blocks move towards the positions close to the center of the carrier plate, and the substrate is clamped tightly, so that the phenomenon that the bonding position is inaccurate due to the fact that the substrate moves in the bonding process is avoided, the structure is simple, the operation is convenient, and the substrate fixing device can adapt to the fixation of substrates of different sizes;
a strip-shaped groove 19 extending along the horizontal direction is formed on the side surface of the support plate 2, one side of a sliding plate 20 is slidably arranged in the strip-shaped groove 19, the electric cylinder 6 is arranged on the lower surface of the other side of the sliding plate 20, two ends of the lower surface of the horizontally arranged sliding plate 20 are respectively connected with a vertically arranged first mounting plate 21, a two-way screw 22 is rotatably connected between 2 first mounting plates 21 symmetrically arranged at two sides of the electric cylinder 6, one end of the two-way screw 22 passes through one first mounting plate 21 and is connected with an output shaft of a motor 23 arranged on the first mounting plate 21, a second mounting plate 24 is respectively sleeved on the two-way screw 22 and positioned at two sides of the electric cylinder 6, a baffle 25 is arranged at the bottom of the second mounting plate 24, and after a semiconductor chip is adsorbed by a sucker, the motor is started to drive the two-way screw to rotate, and then make two second mounting panels produce the motion in opposite directions for two baffles are located semiconductor chip's bottom, can avoid semiconductor chip to drop on the workstation at the removal in-process.
The piston rod of the cylinder 8 is connected with the pressing plate 9 through a push rod 26, the upper end of the push rod 26 is installed on the piston rod of the cylinder 8, the lower end of the push rod 26 is connected with the upper surface of the pressing plate 9, when the substrate reaches a proper temperature, and after the semiconductor chip is stacked on the substrate, the semiconductor chip is pressed by the pressing plate through the downward movement of the starting cylinder, so that the semiconductor chip and the substrate are bonded together.
The number of the arc-shaped through grooves 15, the rectangular through grooves 16, the straight rods 17 and the clamping blocks 18 is 4.
Example 2: an efficient processing apparatus for DFN packaged devices, comprising: the device comprises a workbench 1, a top plate 3 positioned over the workbench 1 and a support plate 2 vertically connected between the workbench 1 and the top plate 3, wherein a mounting seat 4 for placing a substrate to be processed is installed on the workbench 1, a storage plate 5 for placing a chip to be processed is arranged on the outer side of the mounting seat 4, an electric cylinder 6 is slidably installed on the side surface of the support plate 2, a sucker 7 for picking up the chip to be processed is installed on the output end of the electric cylinder 6 and can move to the position above the mounting seat 4 from the position above the storage plate 5 along with the electric cylinder 6, an air cylinder 8 is installed on the top plate 3 and positioned over the mounting seat 4, a pressing plate 9 for being in extrusion contact with the chip to be processed above the substrate to be processed is installed on a piston rod of the air cylinder 8, the substrate is placed on the mounting seat, the chip is placed on the storage plate, and the electric cylinder drives the sucker to move downwards, adsorbing the chip on a sucker, moving the sucker to drive the chip to move above the substrate, and pushing a pressing plate by using an air cylinder to realize bonding of the substrate and the semiconductor chip;
the mount 4 further includes: a support plate 11 mounted on the worktable 1 through a support housing 10, a gear 12 located below the support plate 11 in the support housing 10, and a rack 13 engaged with the gear 12, one end of the rack 13 engaged with the gear 12 extends outwards from the inside of the support housing 10 and is in sliding fit with the side wall of the support housing 10, the gear 12 is rotatably mounted on the worktable 1 through a vertically arranged rotating shaft 14, at least 2 arc through grooves 15 arranged at equal intervals along the circumferential direction are formed on the upper surface of the gear 12, a rectangular through groove 16 corresponding to the arc through groove 15 and extending along the radial direction is formed on the support plate 11, the lower end of a vertically arranged straight rod 17 is embedded into the arc through groove 15 and is in sliding fit with the inner wall of the arc through groove 15, the upper end of the support plate 17 passes through the corresponding rectangular through groove 16 and is mounted with a fixture block 18, and at least 2 fixture blocks 18 in sliding fit with the upper surface of the support housing 11 form a clamping block between the fixture blocks 18 for placing a substrate to be processed The substrate is placed on the upper surface of the carrier plate, the rack is pushed, the rack drives the gear to rotate, the straight rod in the arc-shaped through groove of the gear slides along the arc-shaped through groove, the straight rod also slides along the rectangular through groove, the four clamping blocks move towards the positions close to the center of the carrier plate, and the substrate is clamped tightly, so that the phenomenon that the bonding position is inaccurate due to the fact that the substrate moves in the bonding process is avoided, the structure is simple, the operation is convenient, and the substrate fixing device can adapt to the fixation of substrates of different sizes;
a strip-shaped groove 19 extending along the horizontal direction is formed on the side surface of the support plate 2, one side of a sliding plate 20 is slidably arranged in the strip-shaped groove 19, the electric cylinder 6 is arranged on the lower surface of the other side of the sliding plate 20, two ends of the lower surface of the horizontally arranged sliding plate 20 are respectively connected with a vertically arranged first mounting plate 21, a two-way screw 22 is rotatably connected between 2 first mounting plates 21 symmetrically arranged at two sides of the electric cylinder 6, one end of the two-way screw 22 passes through one first mounting plate 21 and is connected with an output shaft of a motor 23 arranged on the first mounting plate 21, a second mounting plate 24 is respectively sleeved on the two-way screw 22 and positioned at two sides of the electric cylinder 6, a baffle 25 is arranged at the bottom of the second mounting plate 24, and after a semiconductor chip is adsorbed by a sucker, the motor is started to drive the two-way screw to rotate, and then make two second mounting panels produce the motion in opposite directions for two baffles are located semiconductor chip's bottom, can avoid semiconductor chip to drop on the workstation at the removal in-process.
The piston rod of the cylinder 8 is connected with the pressing plate 9 through a push rod 26, the upper end of the push rod 26 is installed on the piston rod of the cylinder 8, the lower end of the push rod 26 is connected with the upper surface of the pressing plate 9, when the substrate reaches a proper temperature, and after the semiconductor chip is stacked on the substrate, the semiconductor chip is pressed by the pressing plate through the downward movement of the starting cylinder, so that the semiconductor chip and the substrate are bonded together.
The piston rod of the electric cylinder 6 is connected to the suction cup 7 by a first connecting rod 27.
The straight rod 17 is sleeved with at least one limiting block 28 which is in sliding fit with the lower surface of the carrier plate 11 or the gear 12, and the straight rod cannot generate vertical deviation by matching with the clamping block, so that the substrate is accurately clamped and positioned.
When the efficient processing device of the DFN packaging device is adopted, the working principle is as follows: when the semiconductor chip placing device is used, the semiconductor chip is placed at the top of the object placing plate, the sliding plate is moved, the sucker is located at the top of the object placing plate, the electric cylinder is started, the electric cylinder drives the first connecting rod and the sucker to move downwards, the chip is adsorbed on the sucker, the sliding plate is moved again, the semiconductor chip is moved to the top of the carrier plate, and the semiconductor chip is placed at the top of the base plate; after the semiconductor chip is adsorbed by the sucker, the motor is started, so that the motor drives the bidirectional screw to rotate, the two second mounting plates 25 move oppositely, the two baffles are positioned at the bottom of the semiconductor chip, and the semiconductor chip can be prevented from falling on the workbench in the moving process;
the base plate is placed at the top of the support plate, the rack is pushed, the rack drives the gear to rotate, the straight rod in the arc through groove of the gear slides along the arc through groove, the straight rod slides along the rectangular through groove, the four clamping blocks move towards the position close to the center of the support plate, the base plate is clamped, and the phenomenon that the base plate moves in the bonding process and the bonding position is inaccurate is avoided.
A strip-shaped groove extending along the horizontal direction is formed in the side surface of a supporting plate, one side of a sliding plate is arranged in the strip-shaped groove in a sliding mode, an electric cylinder is arranged on the lower surface of the other side of the sliding plate, a sucker used for picking up a chip to be processed is arranged on the output end of the electric cylinder and can move to the position above an installation seat along with the electric cylinder from the position above an object placing plate, an air cylinder is arranged on a top plate and located right above the installation seat, a pressing plate used for being in extrusion contact with the chip to be processed above a substrate to be processed is arranged on a piston rod of the air cylinder, the chip can be picked up, transferred and bonded in one set of device, and space resources are saved;
in addition, the other end of the rack, one end of which is meshed with the gear, extends outwards from the inside of the supporting shell and is in sliding fit with the side wall of the supporting shell, the gear is rotatably arranged on the workbench through a vertically arranged rotating shaft, the upper surface of the gear is provided with at least 2 arc-shaped through grooves which are arranged at equal intervals along the circumferential direction, the carrier plate is provided with a rectangular through groove which corresponds to the arc-shaped through groove and extends along the radial direction, the lower end of a vertically arranged straight rod is embedded into the arc-shaped through groove and is in sliding fit with the inner wall of the arc-shaped through groove, the upper end of the straight rod penetrates through the corresponding rectangular through groove and is provided with a clamping block, a clamping area for placing a substrate to be processed is formed between at least 2 clamping blocks which are in sliding fit with the upper surface of the carrier plate, the position fixation of the substrate can be conveniently and quickly realized, the condition that the bonding position is inaccurate as the substrate moves in the bonding process is effectively avoided while the position precision of the substrate is improved, therefore, the quality of a processed product is guaranteed, substrates of different sizes can be fixed, and the overall applicability is improved;
in addition, the two ends of the lower surface of a horizontally arranged sliding plate are respectively connected with a vertically arranged first mounting plate, the two first mounting plates are symmetrically arranged on two sides of the electric cylinder and are rotatably connected with a two-way screw rod, one end of the two-way screw rod penetrates through the first mounting plate and is connected with a motor output shaft arranged on the first mounting plate, the two second mounting plates are respectively sleeved on the two-way screw rod and are positioned on two sides of the electric cylinder, a baffle is arranged at the bottom of each second mounting plate, in the chip transferring process, the two-way screw rod can move to the lower part of the chip through the baffle arranged at the bottom of the second mounting plate, the situation that the chip is damaged due to the fact that the chip falls on a workbench is effectively avoided, the safety of the chip in the picking and transferring process is ensured, the picking efficiency of the chip is also improved, and the processing efficiency is improved.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (5)
1. An efficient processing apparatus for DFN packaged devices, comprising: workstation (1), be located roof (3) directly over workstation (1) and vertical connect in backup pad (2) between workstation (1) and roof (3), its characterized in that: the processing device is characterized in that a mounting seat (4) used for placing a substrate to be processed is mounted on the workbench (1), a storage plate (5) used for placing a chip to be processed is arranged on the outer side of the mounting seat (4), an electric cylinder (6) is slidably mounted on the side surface of the supporting plate (2), a sucker (7) used for picking up the chip to be processed is mounted on the output end of the electric cylinder (6) and can move to the upper side of the mounting seat (4) from the upper side of the storage plate (5) along with the electric cylinder (6), an air cylinder (8) is mounted on the top plate (3) and is positioned right above the mounting seat (4), and a pressing plate (9) used for being in extrusion contact with the chip to be processed above the substrate to be processed is mounted on a piston rod of the air cylinder (8);
the mount (4) further comprises: a support plate (11) arranged on a workbench (1) through a support shell (10), a gear (12) positioned below the support plate (11) in the support shell (10) and a rack (13) meshed with the gear (12), wherein one end of the rack (13) meshed with the gear (12) extends outwards from the support shell (10) and is in sliding fit with the side wall of the support shell (10), the gear (12) is rotatably arranged on the workbench (1) through a vertically arranged rotating shaft (14), the upper surface of the gear (12) is provided with at least 2 arc through grooves (15) which are arranged at equal intervals along the circumferential direction, the support plate (11) is provided with a rectangular through groove (16) which corresponds to the arc through groove (15) and extends along the radial direction, the lower end of a vertically arranged straight rod (17) is embedded into the arc through groove (15) and is in sliding fit with the inner wall of the arc through groove (15), the upper end of the straight rod (17) penetrates through the corresponding rectangular through groove (16) and is provided with a fixture block (18), and a clamping area for placing a substrate to be processed is formed among at least 2 fixture blocks (18) in sliding fit with the upper surface of the support plate (11);
a strip-shaped groove (19) extending along the horizontal direction is arranged on the side surface of the supporting plate (2), one side of a sliding plate (20) is arranged in the strip-shaped groove (19) in a sliding way, the electric cylinder (6) is arranged on the lower surface of the other side of the sliding plate (20), two ends of the lower surface of the horizontally arranged sliding plate (20) are respectively connected with a first mounting plate (21) which is vertically arranged, a bidirectional screw (22) is rotatably connected between 2 first mounting plates (21) which are symmetrically arranged at two sides of the electric cylinder (6), one end of the bidirectional screw rod (22) passes through a first mounting plate (21) and is connected with an output shaft of a motor (23) arranged on the first mounting plate (21), and a second mounting plate (24) is sleeved on each of the two-way screw rods (22) and positioned on two sides of the electric cylinder (6), and a baffle plate (25) is mounted at the bottom of each second mounting plate (24).
2. The efficient processing apparatus for DFN packaged devices according to claim 1, wherein: the piston rod of the air cylinder (8) is connected with the pressing plate (9) through a push rod (26), the upper end of the push rod (26) is installed on the piston rod of the air cylinder (8), and the lower end of the push rod (26) is connected with the upper surface of the pressing plate (9).
3. The efficient processing apparatus for DFN packaged devices according to claim 1, wherein: the piston rod of the electric cylinder (6) is connected with the sucker (7) through a first connecting rod (27).
4. The apparatus for efficient processing of DFN packaged devices according to claim 1, wherein: the number of the arc-shaped through grooves (15), the number of the rectangular through grooves (16), the number of the straight rods (17) and the number of the clamping blocks (18) are all 4.
5. The efficient processing apparatus for DFN packaged devices according to claim 1, wherein: the straight rod (17) is sleeved with at least one limiting block (28) which is in sliding fit with the lower surface of the carrier plate (11) or the gear (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123419222.1U CN216633301U (en) | 2021-12-30 | 2021-12-30 | Efficient processing device for DFN packaging device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123419222.1U CN216633301U (en) | 2021-12-30 | 2021-12-30 | Efficient processing device for DFN packaging device |
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| Publication Number | Publication Date |
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| CN216633301U true CN216633301U (en) | 2022-05-31 |
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| CN202123419222.1U Active CN216633301U (en) | 2021-12-30 | 2021-12-30 | Efficient processing device for DFN packaging device |
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