CN113658899A - CSP core stripping machine - Google Patents
CSP core stripping machine Download PDFInfo
- Publication number
- CN113658899A CN113658899A CN202110917012.0A CN202110917012A CN113658899A CN 113658899 A CN113658899 A CN 113658899A CN 202110917012 A CN202110917012 A CN 202110917012A CN 113658899 A CN113658899 A CN 113658899A
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- China
- Prior art keywords
- platform
- moving platform
- patch film
- csp
- jig
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- 239000000463 material Substances 0.000 claims abstract description 7
- 239000012528 membrane Substances 0.000 claims abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A CSP core stripping machine relates to the technical field of semiconductor packaging equipment, in particular to a CSP packaging chip demoulding device. The device comprises a working platform, wherein a moving platform is arranged on the working platform, a jig is arranged on the moving platform, the jig comprises a patch film placing ring, and a positioning sinking platform corresponding to the patch film is arranged on the patch film placing ring; the patch film placing ring is also provided with a clamping mechanism; a material receiving box is arranged below the jig; still set up the door type frame on the work platform, set up telescopic machanism on the door type frame, set up ultrasonic vibrator on telescopic machanism's the output, ultrasonic vibrator's end corresponds with the paster membrane. When the ultrasonic patch is actually used, the position of the ultrasonic vibrator is kept fixed, and the patch film moves along with the moving platform; the potential safety hazard is eliminated, the failure rate is reduced, and the service life and the production efficiency of the equipment are improved.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging equipment, in particular to a CSP packaging chip demoulding device.
Background
After the CSP chip is packaged, the chip is integrally adhered to the adhesive film, and cutting and grading operations are required. In the prior art, the classification operation after cutting is performed using a chip film stripping machine. When the film stripping machine strips the film, the corners of the chip are easy to be damaged, so that defective products are caused; or the adhesive layer on the chip film is remained on the chip, and a chip feeding channel is blocked in the subsequent detection process, so that the production line is stopped, and the efficiency is reduced.
For example, in the Mini LED chip demolding device described in patent application No. CN202020624221.7 and publication No. CN211700325U, an ultrasonic generator is used to convert electric energy into a high-frequency ac signal matched with an ultrasonic transducer, the ultrasonic transducer converts the high-frequency ac signal into mechanical vibration to drive a vibrating rod to generate high-frequency vibration, an ejector pin rod arranged at the end of the vibrating rod contacts with the surface of a patch film, and the chip is instantaneously separated from the patch film by the high-frequency vibration in the area where the ejector pin rod is aligned with the chip. In the technical scheme, the vibrating device and the moving device are both arranged above, so that a mechanism above the whole device is too large, and potential safety hazards are easy to occur in the production process; the vibrating rod is arranged on the sliding seat, the service life of the sliding system is shortened due to long-time vibration, and faults are frequent and difficult to maintain.
Disclosure of Invention
The invention aims to provide a CSP core stripping machine, which achieves the purposes of optimizing the structure of the core stripping machine, prolonging the service life of the core stripping machine and improving the production efficiency.
The CSP core stripping machine is characterized by comprising a working platform, wherein a moving platform is arranged on the working platform, a jig is arranged on the moving platform, the jig comprises a chip film placing ring, and a positioning sinking platform corresponding to a chip film is arranged on the chip film placing ring; the patch film placing ring is also provided with a clamping mechanism; a material receiving box is arranged below the jig; still set up the door type frame on the work platform, set up telescopic machanism on the door type frame, set up ultrasonic vibrator on telescopic machanism's the output, ultrasonic vibrator's end corresponds with the paster membrane.
Furthermore, the moving platform comprises a longitudinal moving platform and a transverse moving platform, and the transverse moving platform is arranged on the working platform through a transverse guide rail and a transverse lead screw nut mechanism; the longitudinal moving platform is arranged on the transverse moving platform through a longitudinal guide rail and a longitudinal screw rod nut mechanism; the screw rod is driven by a motor.
Furthermore, the telescopic mechanism is a cylinder or a hydraulic cylinder.
Furthermore, the CSP core stripping machine further comprises a PLC control system, and the motor and the telescopic mechanism are connected to the PLC control system.
Further, a cabinet is arranged below the working platform.
Furthermore, universal wheels are arranged below the cabinet.
According to the CSP core stripping machine provided by the invention, when the CSP core stripping machine is actually used, the position of the ultrasonic vibrator is kept fixed, and the patch film moves along with the moving platform; the potential safety hazard is eliminated, the failure rate is reduced, and the service life and the production efficiency of the equipment are improved.
Drawings
The accompanying drawings disclose, in part, specific embodiments of the present invention, wherein,
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural diagram of a mobile platform according to the present invention;
FIG. 3 is a schematic structural view of a jig according to the present invention;
fig. 4 is a schematic structural view of the patch film.
Detailed Description
As shown in fig. 1, the CSP core stripping machine provided by the present invention includes a cabinet 1 at the lower part, in which related devices of a PLC control system are arranged; 4 universal wheels 2 are arranged at the bottom of the cabinet, so that the cabinet is convenient to move; the upper part of the cabinet is provided with a working platform 3 which is made of a steel plate; the working platform is provided with a moving platform, the working platform is also provided with a portal frame 4, and the middle position of the upper part of the portal frame is provided with a telescopic mechanism 5 which is a cylinder; the output end of the telescopic mechanism is connected with an ultrasonic vibrator 6, and the tail end of the ultrasonic vibrator corresponds to the chip 16 on the chip film 15.
As shown in fig. 2-3, the transverse moving platform 7 is mounted on the working platform through a transverse guide rail 7-1 and a transverse screw and nut mechanism 7-2; the longitudinal moving platform 8 is arranged on the transverse moving platform through a longitudinal guide rail 8-1 and a longitudinal screw rod nut mechanism 8-2; the screw rods are driven by a motor 9, the motor is connected into a PLC control system, a moving path of the platform is preset in the PLC control system, and the moving path corresponds to the chip area; 7 upright posts 10 are arranged on the longitudinal moving platform, and a jig 11 is arranged at the upper parts of the upright posts; a drawer type material receiving box 12 is arranged between the jig and the longitudinal moving platform; the jig comprises a patch film placing ring, and a positioning sinking platform 13 corresponding to the patch film is processed on the patch film placing ring; the patch film placing ring is also provided with a clamping mechanism 14 which is two clamps arranged at two sides so as to be convenient for clamping the patch film.
During actual production, the patch film is placed on a positioning sinking platform at the patch film placing ring and is clamped by a clamp; starting the CSP core stripping machine, enabling an air cylinder on the door-shaped frame to act, and enabling the tail end of the ultrasonic vibrator to be in contact with the surface mount film; the ultrasonic vibrator vibrates, and the mobile platform moves according to a preset moving path; the chip 15 on the film falls down into a material receiving box; after the movement is finished, the mobile platform is reset, and the ultrasonic vibrator is reset; taking down the chip film after core stripping, mounting the chip film without core stripping, and repeating the operation; and taking out the chip in the material receiving box after the material receiving box is full.
Claims (6)
1. A CSP core stripping machine is characterized by comprising a working platform, wherein a moving platform is arranged on the working platform, a jig (7) is arranged on the moving platform, and a material collecting box (12) is arranged below the jig; the jig comprises a patch film placing ring, and a positioning sinking platform (13) corresponding to the patch film is arranged on the patch film placing ring; the patch film placing ring is also provided with a clamping mechanism (14); still set up door type frame (4) on the work platform, set up telescopic machanism (5) on the door type frame, set up ultrasonic vibrator (6) on telescopic machanism's the output, ultrasonic vibrator's end corresponds with paster membrane (15).
2. CSP core stripping machine according to claim 1 characterized by that the moving platform comprises a longitudinal moving platform (8) and a transversal moving platform (7), the transversal moving platform is installed on the working platform through transversal guide rail (7-1) and transversal screw-nut mechanism (7-2); the longitudinal moving platform (8) is arranged on the transverse moving platform through a longitudinal guide rail (8-1) and a longitudinal screw and nut mechanism (8-2); the screw rod is driven by a motor (9).
3. The CSP core stripper as defined in claim 2, wherein the telescoping mechanism is a pneumatic or hydraulic cylinder.
4. The CSP core stripping machine as claimed in claim 1, wherein the CSP core stripping machine further comprises a PLC control system, and the motor and the telescoping mechanism are connected to the PLC control system.
5. CSP core stripper as claimed in claim 1, characterized in that below the working platform is arranged a cabinet (1).
6. CSP core stripper according to claim 1, characterized in that universal wheels (2) are provided below the cabinet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110917012.0A CN113658899A (en) | 2021-08-11 | 2021-08-11 | CSP core stripping machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110917012.0A CN113658899A (en) | 2021-08-11 | 2021-08-11 | CSP core stripping machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113658899A true CN113658899A (en) | 2021-11-16 |
Family
ID=78491338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110917012.0A Pending CN113658899A (en) | 2021-08-11 | 2021-08-11 | CSP core stripping machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113658899A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981437A (en) * | 2017-03-09 | 2017-07-25 | 铜陵三佳山田科技股份有限公司 | Sorting characterization processes and its equipment for QFN BGA semiconductor chips |
| CN110880464A (en) * | 2019-11-18 | 2020-03-13 | 苏州新米特电子科技有限公司 | Chip unloading device for semiconductor packaging process |
| CN211700325U (en) * | 2020-04-23 | 2020-10-16 | 先进光电器材（深圳）有限公司 | Mini LED chip demoulding device |
| US20210035837A1 (en) * | 2019-08-02 | 2021-02-04 | Rohinni, LLC | Bridge apparatus and method for semiconductor die transfer |
| CN216145596U (en) * | 2021-08-11 | 2022-03-29 | 日照东讯电子科技有限公司 | CSP core stripping machine |
-
2021
- 2021-08-11 CN CN202110917012.0A patent/CN113658899A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981437A (en) * | 2017-03-09 | 2017-07-25 | 铜陵三佳山田科技股份有限公司 | Sorting characterization processes and its equipment for QFN BGA semiconductor chips |
| US20210035837A1 (en) * | 2019-08-02 | 2021-02-04 | Rohinni, LLC | Bridge apparatus and method for semiconductor die transfer |
| CN110880464A (en) * | 2019-11-18 | 2020-03-13 | 苏州新米特电子科技有限公司 | Chip unloading device for semiconductor packaging process |
| CN211700325U (en) * | 2020-04-23 | 2020-10-16 | 先进光电器材（深圳）有限公司 | Mini LED chip demoulding device |
| CN216145596U (en) * | 2021-08-11 | 2022-03-29 | 日照东讯电子科技有限公司 | CSP core stripping machine |
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