CN210429760U - Feeding track of automatic bar cutting forming machine for semiconductor packaging - Google Patents
Feeding track of automatic bar cutting forming machine for semiconductor packaging Download PDFInfo
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- CN210429760U CN210429760U CN201921800243.8U CN201921800243U CN210429760U CN 210429760 U CN210429760 U CN 210429760U CN 201921800243 U CN201921800243 U CN 201921800243U CN 210429760 U CN210429760 U CN 210429760U
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Abstract
The utility model discloses an automatic muscle make-up machine feeding track of cutting of semiconductor encapsulation relates to semiconductor preparation technical field. The utility model discloses a processing main part, processing main part one side is fixed with the blanking and collects the basket, and the one end welding of processing main part has the brilliant storage box that supports of circle, and the top welding of processing main part has the assembly roof, and the top of assembly roof is fixed with first hydraulic piston cylinder through the screw, and the lower extreme of first hydraulic piston cylinder is fixed with towards appearance mould. The utility model discloses a carry out preliminary blanking plastic to the brilliant circle before the feeding, the holistic production of device of being convenient for has saved the cost of extra processing, and has increased ejection of compact arm structure and support the board and snatch the arm around blowing processing structure, through the joining in marriage and the work of multimachine arm, has realized automatic discharging, clearance blanking and has accomodate and support the board, greatly reduced the manpower extravagant, improved work efficiency.
Description
Technical Field
The utility model relates to a semiconductor preparation technical field, more specifically say, relate to an automatic muscle make-up machine feeding track of cutting of semiconductor encapsulation.
Background
Semiconductor package is the process that will obtain independent chip according to product model and functional requirement processing through the wafer of test, and for the automatic muscle make-up machine of cutting of semiconductor package of the apparatus that realizes this process and often adopt, for the use of device, need carry out the brilliant feed supplement of circle to the device through the feeding track, but current feeding track can only accomplish single raw materials and feed, can not accomplish the processing to the raw materials, needs extra device to process, and the cost is higher, and is lower at the efficiency of raw materials feeding, the utility model discloses a new solution is proposed to above problem.
SUMMERY OF THE UTILITY MODEL
The invention aims to provide a feeding rail of an automatic bar cutting forming machine for semiconductor packaging, which aims to solve the technical problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a feeding track of a semiconductor packaging automatic rib cutting forming machine comprises a processing main body, wherein a blanking collecting basket is fixed on one side of the processing main body, a round crystal abutting plate containing box is welded at one end of the processing main body, an assembly top plate is welded at the top end of the processing main body, a first hydraulic piston cylinder is fixed at the top end of the assembly top plate through a screw, a sample punching die is fixed at the lower end of the first hydraulic piston cylinder, an abutting plate grabbing arm is fixed at the bottom end of the assembly top plate through a screw,
a material placing and processing structure is fixed in the processing main body and comprises a fixed rod, an assembly constraint disc, a wafer placing sleeve, a wafer abutting plate, a wafer and a second hydraulic piston cylinder, wherein the assembly constraint disc is fixed at one end of the fixed rod through a screw, the wafer placing sleeve is fixed in the assembly constraint disc, the second hydraulic piston cylinder is fixed in the wafer placing sleeve, the wafer abutting plate is fixedly arranged at the upper end of the second hydraulic piston cylinder, the wafer is placed at the upper end of the wafer abutting plate,
the pneumatic and pneumatic combined machine is characterized in that discharging mechanical arm structures are fixed on two sides of the upper surface of the machining main body through screws, each discharging mechanical arm structure comprises a positioning chassis, an angle adjusting block, a moving main arm, a sucker angle positioning block, a pneumatic sucker and a pneumatic cylinder, the angle adjusting block is fixed at the top end of the positioning chassis, the moving main arm is fixed on one side of the angle adjusting block, the sucker angle positioning block is fixed at one end of the moving main arm through a rotating shaft, and the pneumatic sucker is fixed at the bottom end of the sucker angle positioning block.
Preferably, a movable clamping groove is formed in one side of the processing main body, a positioning sliding block is fixed to one side of the blanking collecting basket, and the movable clamping groove is in clearance fit with the positioning sliding block.
In any of the above schemes, preferably, the inside of the angle adjusting block and the top end of the positioning chassis are both fixed with a rotating motor, the positioning chassis is linked with the angle adjusting block through a flat key at the output end of the rotating motor, and the angle adjusting block is linked with the main moving arm through a flat key at the output end of the rotating motor.
In any of the above schemes, preferably, the output end of the pneumatic cylinder is connected with a pneumatic conduit, and the pneumatic cylinder is connected with the pneumatic suction cup through the pneumatic conduit.
In any of the above schemes, preferably, twenty wafer supporting plates and wafers can be placed inside the wafer placing sleeve, and the wafer placing sleeve is in clearance fit with the assembling constraint disk.
In any of the above schemes, preferably, the first hydraulic piston cylinder, the abutting plate grabbing arm, the discharging mechanical arm structure and the second hydraulic piston cylinder are all electrically connected with a PLC programming controller, and the PLC programming controller is of a type Q25 HCPU.
3. Advantageous effects
Compared with the prior art, the utility model has the advantages of:
(1) the utility model fixes the round crystal placing sleeve with twenty round crystals and round crystal supporting plates respectively inside the round crystal placing sleeve inside the assembling constraint plate through the sliding grooves around the round crystal placing sleeve, at the moment, the second hydraulic piston cylinder is controlled by the program, the distance between one round crystal supporting plate and the round crystal is upwards ejected every two seconds, the round crystal supporting plate is used for separating two round crystals, thereby generating a protection effect, when the round crystal is ejected out, the first hydraulic piston cylinder drives the sample punching mould to press downwards, because the sample punching die is meshed with the first hydraulic piston cylinder through threads, the sample punching die is convenient to replace and can be replaced according to the processing requirements, the sample punching die is pressed down to the round crystal abutting plate to generate blanking, the wafer is processed to obtain the wafer required by packaging, so that the device can process the raw material wafer before feeding for semiconductor packaging, the integral production of the device is facilitated, and the additional processing cost is saved;
(2) the utility model carries out the absorption displacement of the processed and formed round crystal through the discharging mechanical arm structure at one side of the device, when the absorption displacement is carried out, the discharging mechanical arm structure drives the air pressure sucker to rotate above the round crystal through the rotating motor inside the positioning chassis, at the moment, the air pressure cylinder works to generate suction to absorb the round crystal on the air pressure sucker, the air pressure cylinder adjusts the position to the top end of the feeding conveyor belt through the rotating motor inside the positioning chassis, the air pressure cylinder is controlled to stop working, the round crystal is put into the upper end of the feeding conveyor belt to start feeding, the discharging mechanical arm structure at the other side absorbs the punched round crystal into the blanking collecting basket in the same way, the round crystal at the bottom end of the processed round crystal is clamped by the round crystal supporting plate clamping arm and then is placed inside the round crystal supporting plate collecting box to be collected, so that the device realizes the automatic discharging, the blanking and the collecting of the blanking and the, greatly reduces the manpower waste and improves the working efficiency.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural view of the discharging mechanical arm structure of the present invention;
FIG. 3 is a cross-sectional view of the discharging processing structure of the present invention;
the reference numbers in the figures illustrate:
1. processing the main body; 2. a blanking collecting basket; 3. a wafer support plate storage box; 4. a resisting plate grabbing arm; 5. assembling a top plate; 6. a first hydraulic piston cylinder; 7. punching a sample mould; 8. a discharging processing structure; 9. fixing the rod; 10. assembling a restraint plate; 11. a wafer placing sleeve; 12. a wafer support plate; 13. carrying out wafer rounding; 14. a second hydraulic piston cylinder; 15. a feed conveyor; 16. positioning the chassis; 17. an angle adjusting block; 18. moving the main arm; 19. a sucker angle positioning block; 20. an air pressure sucker; 21. a pneumatic cylinder; 22. the ejection of compact arm structure.
Detailed Description
The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention based on the embodiments of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are used in a broad sense, and for example, "connected," may be fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediate medium, or connected between two elements.
The specific embodiment is as follows:
referring to fig. 1-3, a feeding track of an automatic bar cutting forming machine for semiconductor packaging comprises a processing main body 1, a blanking collecting basket 2 is fixed on one side of the processing main body 1, a round crystal supporting plate containing box 3 is welded on one end of the processing main body 1, an assembly top plate 5 is welded on the top end of the processing main body 1, a first hydraulic piston cylinder 6 is fixed on the top end of the assembly top plate 5 through screws, a sample punching mold 7 is fixed on the lower end of the first hydraulic piston cylinder 6, a supporting plate grabbing arm 4 is fixed on the bottom end of the assembly top plate 5 through screws,
a discharging processing structure 8 is fixed inside the processing main body 1, the discharging processing structure 8 comprises a fixed rod 9, an assembly restraint plate 10, a round crystal placing sleeve 11, a round crystal abutting plate 12, a round crystal 13 and a second hydraulic piston cylinder 14, the assembly restraint plate 10 is fixed at one end of the fixed rod 9 through a screw, the round crystal placing sleeve 11 is fixed inside the assembly restraint plate 10, the second hydraulic piston cylinder 14 is fixed inside the round crystal placing sleeve 11, the round crystal abutting plate 12 is fixedly arranged at the upper end of the second hydraulic piston cylinder 14, the round crystal 13 is arranged at the upper end of the round crystal abutting plate 12,
both sides of the upper surface of the processing main body 1 are all fixed with discharging mechanical arm structures 22 through screws, each discharging mechanical arm structure 22 comprises a positioning chassis 16, an angle adjusting block 17, a moving main arm 18, a sucker angle positioning block 19, an air pressure sucker 20 and an air pressure cylinder 21, the top end of the positioning chassis 16 is fixed with the angle adjusting block 17, one side of the angle adjusting block 17 is fixed with the moving main arm 18, one end of the moving main arm 18 is fixed with the sucker angle positioning block 19 through a rotating shaft, and the bottom end of the sucker angle positioning block 19 is fixed with the air pressure sucker 20.
In this embodiment, in order to facilitate the replacement of the blanking collecting basket 2, a movable clamping groove is formed in one side of the processing main body 1, a positioning sliding block is fixed on one side of the blanking collecting basket 2, and the movable clamping groove is in clearance fit with the positioning sliding block.
In this embodiment, in order to realize the multi-angle adjustment of the discharging mechanical arm structure 22, so as to adapt to more working angles, the rotating motors are fixed inside the angle adjusting block 17 and at the top end of the positioning chassis 16, the positioning chassis 16 is connected with the angle adjusting block 17 through the flat key at the output end of the rotating motor, and the angle adjusting block 17 is connected with the main moving arm 18 through the flat key at the output end of the rotating motor.
In this embodiment, in order to enable the pneumatic chuck 20 to generate a suction force, the processed round crystal 13 is sucked and placed on the feeding conveyor belt 15 to complete feeding, the suction force is adopted to avoid abrasion of the round crystal 13 caused by metal grabbing, the output end of the pneumatic cylinder 21 is connected with a pneumatic conduit, and the pneumatic cylinder 21 is connected with the pneumatic chuck 20 through the pneumatic conduit.
In this embodiment, in order to facilitate the alternate operation of the plurality of round crystal holding sleeves 11, the device is convenient to rapidly process and replace the round crystal holding sleeves 11, twenty round crystal supporting plates 12 and round crystals 13 can be placed inside the round crystal holding sleeves 11, and the round crystal holding sleeves 11 are in clearance fit with the assembling constraint disk 10.
In this embodiment, in order to enable the device to obtain a better control effect, the first hydraulic piston cylinder 6, the abutting plate grabbing arm 4, the discharging mechanical arm structure 22 and the second hydraulic piston cylinder 14 are all internally and electrically connected with a PLC programming controller, and the model of the PLC programming controller is Q25 HCPU.
The working principle is as follows:
when the device is used, the wafer placing sleeve 11 internally and respectively overlapped with twenty wafers 13 and wafer supporting plates 12 is fixed inside the assembly constraint disc 10 through the sliding grooves on the periphery of the wafer placing sleeve 11, at the moment, the second hydraulic piston cylinder 14 is controlled in programming, the distance between one wafer supporting plate 12 and one wafer 13 is upwards ejected every two seconds, the wafer supporting plate 12 is used for separating the two wafers 13, so that a protection effect is generated, when the wafers 13 are ejected, the first hydraulic piston cylinder 6 drives the sample punching mold 7 to downwards press, because the sample punching mold 7 and the first hydraulic piston cylinder 6 are meshed through threads, the replacement is convenient, the sample punching mold 7 can be replaced according to the processing requirement, the sample punching mold 7 downwards presses the wafer supporting plate 12 to generate blanking, so that the wafers 13 are processed, wafers required by packaging are obtained, and the device can process raw material wafers before semiconductor packaging feeding, the integral production of the device is convenient, and the additional processing cost is saved; adsorbing and displacing the processed and formed round crystal 13 through a discharging mechanical arm structure 22 at one side of the device, when adsorbing and displacing, the discharging mechanical arm structure 22 drives an air pressure sucker 20 to rotate above a wafer through a rotating motor inside a positioning chassis 16, at the moment, the air pressure cylinder 21 works to generate suction to adsorb the wafer on the air pressure sucker 20, the position of the wafer is adjusted to the top end of a feeding conveyor belt 15 through the rotating motor inside the positioning chassis 16, the air pressure cylinder 21 is controlled to stop working, the wafer is placed at the upper end of the feeding conveyor belt 15 to start feeding, the discharging mechanical arm structure 22 at the other side adsorbs the punched round crystal 13 into a blanking collecting basket 2 in the same way, a round crystal abutting plate grabbing arm 4 is clamped by a round crystal abutting plate 12 at the bottom end of the processed round crystal 13 and then is placed inside a round crystal abutting plate containing box 3 to be contained, so that the device realizes automatic discharging, Clear up the blanking and accomodate and support the board, greatly reduced the manpower extravagant, improved work efficiency.
The above description is only the preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.
Claims (6)
1. A feeding track of a semiconductor packaging automatic bar cutting forming machine comprises a processing main body (1) and is characterized in that a blanking collecting basket (2) is fixed on one side of the processing main body (1), a round crystal butt plate containing box (3) is welded at one end of the processing main body (1), an assembly top plate (5) is welded at the top end of the processing main body (1), a first hydraulic piston cylinder (6) is fixed at the top end of the assembly top plate (5) through screws, a punching mold (7) is fixed at the lower end of the first hydraulic piston cylinder (6), a butt plate grabbing arm (4) is fixed at the bottom end of the assembly top plate (5) through screws,
the processing device is characterized in that a discharging processing structure (8) is fixed inside the processing main body (1), the discharging processing structure (8) comprises a fixing rod (9), an assembly constraint plate (10), a wafer placing sleeve (11), a wafer abutting plate (12), a wafer (13) and a second hydraulic piston cylinder (14), the assembly constraint plate (10) is fixed at one end of the fixing rod (9) through a screw, the wafer placing sleeve (11) is fixed inside the assembly constraint plate (10), the second hydraulic piston cylinder (14) is fixed inside the wafer placing sleeve (11), the wafer abutting plate (12) is fixedly placed at the upper end of the second hydraulic piston cylinder (14), the wafer (13) is placed at the upper end of the wafer abutting plate (12),
processing main part (1) upper surface's both sides all are fixed with ejection of compact mechanical arm structure (22) through the screw, ejection of compact mechanical arm structure (22) are including location chassis (16), angle adjustment block (17), motion main arm (18), sucking disc angle locating piece (19), atmospheric pressure sucking disc (20) and pneumatic cylinder (21), the top of location chassis (16) is fixed with angle adjustment block (17), one side of angle adjustment block (17) is fixed with motion main arm (18), the one end of motion main arm (18) is fixed with sucking disc angle locating piece (19) through the pivot, the bottom mounting of sucking disc angle locating piece (19) has atmospheric pressure sucking disc (20).
2. The feeding rail of the automatic bar cutting forming machine for semiconductor packaging according to claim 1, wherein: a movable clamping groove is formed in one side of the machining main body (1), a positioning sliding block is fixed to one side of the blanking collecting basket (2), and the movable clamping groove is in clearance fit with the positioning sliding block.
3. The feeding rail of the automatic bar cutting forming machine for semiconductor packaging according to claim 1, wherein: the angle adjusting mechanism is characterized in that rotating motors are fixed inside the angle adjusting blocks (17) and at the top ends of the positioning base plates (16), the positioning base plates (16) are connected with the angle adjusting blocks (17) through flat keys at the output ends of the rotating motors, and the angle adjusting blocks (17) are connected with the main moving arms (18) through flat keys at the output ends of the rotating motors.
4. The feeding rail of the automatic bar cutting forming machine for semiconductor packaging according to claim 1, wherein: the output end of the pneumatic cylinder (21) is connected with a pneumatic guide pipe, and the pneumatic cylinder (21) is connected with the pneumatic sucker (20) through the pneumatic guide pipe.
5. The feeding rail of the automatic bar cutting forming machine for semiconductor packaging according to claim 1, wherein: twenty wafer resisting plates (12) and wafers (13) can be placed in the wafer placing sleeve (11), and the wafer placing sleeve (11) is in clearance fit with the assembling constraint disc (10).
6. The feeding rail of the automatic bar cutting forming machine for semiconductor packaging according to claim 1, wherein: the first hydraulic piston cylinder (6), the abutting plate grabbing arm (4), the discharging mechanical arm structure (22) and the second hydraulic piston cylinder (14) are all internally connected with a PLC (programmable logic controller) through an electric connection mode, and the model of the PLC is Q25 HCPU.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921800243.8U CN210429760U (en) | 2019-10-24 | 2019-10-24 | Feeding track of automatic bar cutting forming machine for semiconductor packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921800243.8U CN210429760U (en) | 2019-10-24 | 2019-10-24 | Feeding track of automatic bar cutting forming machine for semiconductor packaging |
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| Publication Number | Publication Date |
|---|---|
| CN210429760U true CN210429760U (en) | 2020-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921800243.8U Expired - Fee Related CN210429760U (en) | 2019-10-24 | 2019-10-24 | Feeding track of automatic bar cutting forming machine for semiconductor packaging |
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| CN (1) | CN210429760U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113649499A (en) * | 2021-10-15 | 2021-11-16 | 江苏煜晶光电科技有限公司 | Automatic production line for semiconductor device |
-
2019
- 2019-10-24 CN CN201921800243.8U patent/CN210429760U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113649499A (en) * | 2021-10-15 | 2021-11-16 | 江苏煜晶光电科技有限公司 | Automatic production line for semiconductor device |
| CN113649499B (en) * | 2021-10-15 | 2021-12-14 | 江苏煜晶光电科技有限公司 | Automatic production line for semiconductor device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200428 Termination date: 20211024 |