CN110819298A - 一种有机硅灌封胶及其制备方法 - Google Patents
一种有机硅灌封胶及其制备方法 Download PDFInfo
- Publication number
- CN110819298A CN110819298A CN201910675359.1A CN201910675359A CN110819298A CN 110819298 A CN110819298 A CN 110819298A CN 201910675359 A CN201910675359 A CN 201910675359A CN 110819298 A CN110819298 A CN 110819298A
- Authority
- CN
- China
- Prior art keywords
- silicone oil
- component
- pouring sealant
- parts
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000565 sealant Substances 0.000 title claims abstract description 44
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 37
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 37
- 239000010703 silicon Substances 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 229920002545 silicone oil Polymers 0.000 claims abstract description 41
- 239000000463 material Substances 0.000 claims abstract description 35
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 27
- 239000000945 filler Substances 0.000 claims abstract description 25
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 22
- 239000001257 hydrogen Substances 0.000 claims abstract description 18
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 18
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000003054 catalyst Substances 0.000 claims abstract description 16
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 16
- 238000002156 mixing Methods 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 12
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 9
- 239000003112 inhibitor Substances 0.000 claims abstract description 6
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910000077 silane Inorganic materials 0.000 claims abstract description 4
- 239000002585 base Substances 0.000 claims description 32
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims description 20
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 10
- 239000003513 alkali Substances 0.000 claims description 10
- 239000000706 filtrate Substances 0.000 claims description 10
- 238000001914 filtration Methods 0.000 claims description 10
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims description 10
- 235000017557 sodium bicarbonate Nutrition 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 claims description 5
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 5
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000008096 xylene Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 230000003472 neutralizing effect Effects 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 3
- MTEZSDOQASFMDI-UHFFFAOYSA-N 1-trimethoxysilylpropan-1-ol Chemical compound CCC(O)[Si](OC)(OC)OC MTEZSDOQASFMDI-UHFFFAOYSA-N 0.000 claims description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- -1 polydimethylsiloxane Polymers 0.000 claims description 2
- 239000002318 adhesion promoter Substances 0.000 claims 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 2
- 230000000052 comparative effect Effects 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 238000009472 formulation Methods 0.000 description 5
- 238000001723 curing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910675359.1A CN110819298B (zh) | 2019-07-24 | 2019-07-24 | 一种有机硅灌封胶及其制备方法 |
Applications Claiming Priority (1)
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CN201910675359.1A CN110819298B (zh) | 2019-07-24 | 2019-07-24 | 一种有机硅灌封胶及其制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN110819298A true CN110819298A (zh) | 2020-02-21 |
CN110819298B CN110819298B (zh) | 2021-11-30 |
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Family Applications (1)
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CN201910675359.1A Active CN110819298B (zh) | 2019-07-24 | 2019-07-24 | 一种有机硅灌封胶及其制备方法 |
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CN (1) | CN110819298B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115838477A (zh) * | 2021-12-13 | 2023-03-24 | 上海市塑料研究所有限公司 | 一种硼硅氧烷聚合物及其制备方法和在硅橡胶自粘带中的应用 |
CN116536027A (zh) * | 2023-05-23 | 2023-08-04 | 江西天永诚高分子材料有限公司 | 一种低应力有机硅双组份灌封胶及其制备方法 |
CN116574383A (zh) * | 2023-05-23 | 2023-08-11 | 江西天永诚高分子材料有限公司 | 一种低挥发高导热单组份加成型导热胶泥及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003029355A1 (fr) * | 2001-09-27 | 2003-04-10 | Sekisui Chemical Co., Ltd. | Compositions durcissables, materiau de scellement et adhesif |
CN106147698A (zh) * | 2016-07-01 | 2016-11-23 | 广州市高士实业有限公司 | 光伏组件接线盒用导热阻燃有机硅灌封胶及制备方法 |
CN106221666A (zh) * | 2016-08-17 | 2016-12-14 | 株洲时代新材料科技股份有限公司 | 一种高导热、高粘接强度有机硅灌封胶及其制备方法和其封装电机端部的方法 |
-
2019
- 2019-07-24 CN CN201910675359.1A patent/CN110819298B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003029355A1 (fr) * | 2001-09-27 | 2003-04-10 | Sekisui Chemical Co., Ltd. | Compositions durcissables, materiau de scellement et adhesif |
CN106147698A (zh) * | 2016-07-01 | 2016-11-23 | 广州市高士实业有限公司 | 光伏组件接线盒用导热阻燃有机硅灌封胶及制备方法 |
CN106221666A (zh) * | 2016-08-17 | 2016-12-14 | 株洲时代新材料科技股份有限公司 | 一种高导热、高粘接强度有机硅灌封胶及其制备方法和其封装电机端部的方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115838477A (zh) * | 2021-12-13 | 2023-03-24 | 上海市塑料研究所有限公司 | 一种硼硅氧烷聚合物及其制备方法和在硅橡胶自粘带中的应用 |
CN115838477B (zh) * | 2021-12-13 | 2024-03-01 | 上海市塑料研究所有限公司 | 一种硼硅氧烷聚合物及其制备方法和在硅橡胶自粘带中的应用 |
CN116536027A (zh) * | 2023-05-23 | 2023-08-04 | 江西天永诚高分子材料有限公司 | 一种低应力有机硅双组份灌封胶及其制备方法 |
CN116574383A (zh) * | 2023-05-23 | 2023-08-11 | 江西天永诚高分子材料有限公司 | 一种低挥发高导热单组份加成型导热胶泥及其制备方法 |
CN116536027B (zh) * | 2023-05-23 | 2023-10-17 | 江西天永诚高分子材料有限公司 | 一种低应力有机硅双组份灌封胶及其制备方法 |
CN116574383B (zh) * | 2023-05-23 | 2024-05-10 | 江西天永诚高分子材料有限公司 | 一种低挥发高导热单组份加成型导热胶泥及其制备方法 |
Also Published As
Publication number | Publication date |
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CN110819298B (zh) | 2021-11-30 |
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Address after: 330300 workshop No.1, Xingyun Avenue, Xinghuo Industrial Park, Yunshan Economic Development Zone, Yongxiu County, Jiujiang City, Jiangxi Province Patentee after: Jiangxi tianyongcheng polymer material Co.,Ltd. Address before: 213000 No. 200, Chuangxin Road, Longhutang street, Changzhou City, Jiangsu Province Patentee before: GOLOHO TECH (CHANGZHOU) Co.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A silicone sealant and its preparation method Effective date of registration: 20231215 Granted publication date: 20211130 Pledgee: Bank of China Limited Yongxiu sub branch Pledgor: Jiangxi tianyongcheng polymer material Co.,Ltd. Registration number: Y2023980072273 |