CN110814522B - 激光加工方法以及激光加工装置 - Google Patents

激光加工方法以及激光加工装置 Download PDF

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Publication number
CN110814522B
CN110814522B CN201910665233.6A CN201910665233A CN110814522B CN 110814522 B CN110814522 B CN 110814522B CN 201910665233 A CN201910665233 A CN 201910665233A CN 110814522 B CN110814522 B CN 110814522B
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China
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scanning
laser
processed
speed
scanner
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Chinese (zh)
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CN110814522A (zh
Inventor
恒吉拓央
川西努
小林勇治
冈田敏幸
木田胜启
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
CN201910665233.6A 2018-08-08 2019-07-22 激光加工方法以及激光加工装置 Active CN110814522B (zh)

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JP2018149667A JP7122559B2 (ja) 2018-08-08 2018-08-08 レーザ加工方法及びレーザ加工装置
JP2018-149667 2018-08-08

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CN110814522A CN110814522A (zh) 2020-02-21
CN110814522B true CN110814522B (zh) 2021-07-09

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CN201910665233.6A Active CN110814522B (zh) 2018-08-08 2019-07-22 激光加工方法以及激光加工装置

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JP (1) JP7122559B2 (enExample)
CN (1) CN110814522B (enExample)
TW (1) TWI733129B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7438009B2 (ja) * 2020-04-28 2024-02-26 浜松ホトニクス株式会社 レーザ加工装置
CN117001168A (zh) * 2023-07-31 2023-11-07 伊欧激光科技（苏州）有限公司 一种用于多层膜截面结构或多层复合材料基材的激光加工方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1115038A (zh) * 1992-10-27 1996-01-17 托伯康株式会社 具有往返激光扫描系统的激光旋转照射装置
JP2009082942A (ja) * 2007-09-28 2009-04-23 Sunx Ltd レーザ加工装置
JP2011212727A (ja) * 2010-03-31 2011-10-27 Panasonic Electric Works Sunx Co Ltd レーザ加工装置
CN103817433A (zh) * 2014-01-23 2014-05-28 浙江工业大学 一种激光加工光斑控制方法及其专有装置
CN107598389A (zh) * 2016-07-11 2018-01-19 株式会社迪思科 激光加工装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0274538B1 (en) * 1986-07-09 1992-12-02 Matsushita Electric Industrial Co., Ltd. Laser beam machining method
JP2001244197A (ja) * 1995-05-31 2001-09-07 Semiconductor Energy Lab Co Ltd レーザー処理方法
JP2004122167A (ja) * 2002-10-01 2004-04-22 Nippon Steel Chem Co Ltd レーザ加工装置及びレーザ加工方法
JP2008238209A (ja) 2007-03-27 2008-10-09 Tokyu Car Corp レーザ溶接方法及びレーザ溶接装置
JP5392943B2 (ja) * 2009-02-13 2014-01-22 株式会社日立ハイテクノロジーズ レーザ加工方法、レーザ加工装置及びソーラパネル製造方法
JP5965094B1 (ja) 2016-01-06 2016-08-03 オー・エム・シー株式会社 原反の分割方法とその分割機構及び分割装置
JP6035461B1 (ja) * 2016-04-28 2016-11-30 武井電機工業株式会社 レーザー加工方法及びレーザー加工装置
JP2018094582A (ja) * 2016-12-12 2018-06-21 株式会社ブイ・テクノロジー レーザ加工装置及びレーザ加工方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1115038A (zh) * 1992-10-27 1996-01-17 托伯康株式会社 具有往返激光扫描系统的激光旋转照射装置
JP2009082942A (ja) * 2007-09-28 2009-04-23 Sunx Ltd レーザ加工装置
JP2011212727A (ja) * 2010-03-31 2011-10-27 Panasonic Electric Works Sunx Co Ltd レーザ加工装置
CN103817433A (zh) * 2014-01-23 2014-05-28 浙江工业大学 一种激光加工光斑控制方法及其专有装置
CN107598389A (zh) * 2016-07-11 2018-01-19 株式会社迪思科 激光加工装置

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TWI733129B (zh) 2021-07-11
JP2020028883A (ja) 2020-02-27
TW202030038A (zh) 2020-08-16
CN110814522A (zh) 2020-02-21
JP7122559B2 (ja) 2022-08-22

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