TWI733129B - 雷射加工方法及雷射加工裝置 - Google Patents

雷射加工方法及雷射加工裝置 Download PDF

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Publication number
TWI733129B
TWI733129B TW108122080A TW108122080A TWI733129B TW I733129 B TWI733129 B TW I733129B TW 108122080 A TW108122080 A TW 108122080A TW 108122080 A TW108122080 A TW 108122080A TW I733129 B TWI733129 B TW I733129B
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TW
Taiwan
Prior art keywords
scanning
processing
laser
laser light
processed
Prior art date
Application number
TW108122080A
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English (en)
Chinese (zh)
Other versions
TW202030038A (zh
Inventor
恒吉拓央
川西努
小林勇治
岡田敏幸
木田勝啓
Original Assignee
日商松下知識產權經營股份有限公司
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Publication of TW202030038A publication Critical patent/TW202030038A/zh
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Publication of TWI733129B publication Critical patent/TWI733129B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW108122080A 2018-08-08 2019-06-25 雷射加工方法及雷射加工裝置 TWI733129B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018149667A JP7122559B2 (ja) 2018-08-08 2018-08-08 レーザ加工方法及びレーザ加工装置
JP2018-149667 2018-08-08

Publications (2)

Publication Number Publication Date
TW202030038A TW202030038A (zh) 2020-08-16
TWI733129B true TWI733129B (zh) 2021-07-11

Family

ID=69547691

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108122080A TWI733129B (zh) 2018-08-08 2019-06-25 雷射加工方法及雷射加工裝置

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JP (1) JP7122559B2 (enExample)
CN (1) CN110814522B (enExample)
TW (1) TWI733129B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7438009B2 (ja) * 2020-04-28 2024-02-26 浜松ホトニクス株式会社 レーザ加工装置
CN117001168A (zh) * 2023-07-31 2023-11-07 伊欧激光科技（苏州）有限公司 一种用于多层膜截面结构或多层复合材料基材的激光加工方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244197A (ja) * 1995-05-31 2001-09-07 Semiconductor Energy Lab Co Ltd レーザー処理方法
TW200406277A (en) * 2002-10-01 2004-05-01 Nippon Steel Chemical Co Laser processing device and laser processing method
TW201029789A (en) * 2009-02-13 2010-08-16 Hitachi High Tech Corp Laser processing method and device, and manufacturing method of solar panels
TW201801838A (zh) * 2016-04-28 2018-01-16 Takei Electric Industries Co Ltd 雷射加工方法及雷射加工裝置
JP2018094582A (ja) * 2016-12-12 2018-06-21 株式会社ブイ・テクノロジー レーザ加工装置及びレーザ加工方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0274538B1 (en) * 1986-07-09 1992-12-02 Matsushita Electric Industrial Co., Ltd. Laser beam machining method
JP3100478B2 (ja) * 1992-10-27 2000-10-16 株式会社トプコン 往復レーザ走査システムを有するレーザ回転照射装置
JP2008238209A (ja) 2007-03-27 2008-10-09 Tokyu Car Corp レーザ溶接方法及びレーザ溶接装置
JP5081557B2 (ja) * 2007-09-28 2012-11-28 パナソニック デバイスＳｕｎｘ株式会社 レーザ加工装置
JP2011212727A (ja) * 2010-03-31 2011-10-27 Panasonic Electric Works Sunx Co Ltd レーザ加工装置
CN103817433B (zh) * 2014-01-23 2016-04-13 浙江工业大学 一种激光加工光斑控制方法及其专有装置
JP5965094B1 (ja) 2016-01-06 2016-08-03 オー・エム・シー株式会社 原反の分割方法とその分割機構及び分割装置
JP6721439B2 (ja) * 2016-07-11 2020-07-15 株式会社ディスコ レーザー加工装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244197A (ja) * 1995-05-31 2001-09-07 Semiconductor Energy Lab Co Ltd レーザー処理方法
TW200406277A (en) * 2002-10-01 2004-05-01 Nippon Steel Chemical Co Laser processing device and laser processing method
TW201029789A (en) * 2009-02-13 2010-08-16 Hitachi High Tech Corp Laser processing method and device, and manufacturing method of solar panels
TW201801838A (zh) * 2016-04-28 2018-01-16 Takei Electric Industries Co Ltd 雷射加工方法及雷射加工裝置
JP2018094582A (ja) * 2016-12-12 2018-06-21 株式会社ブイ・テクノロジー レーザ加工装置及びレーザ加工方法

Also Published As

Publication number Publication date
CN110814522B (zh) 2021-07-09
JP2020028883A (ja) 2020-02-27
TW202030038A (zh) 2020-08-16
CN110814522A (zh) 2020-02-21
JP7122559B2 (ja) 2022-08-22

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