CN110733140A - sapphire wafer cutting equipment and process - Google Patents
sapphire wafer cutting equipment and process Download PDFInfo
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- CN110733140A CN110733140A CN201911022763.5A CN201911022763A CN110733140A CN 110733140 A CN110733140 A CN 110733140A CN 201911022763 A CN201911022763 A CN 201911022763A CN 110733140 A CN110733140 A CN 110733140A
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- sapphire crystal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
Abstract
The invention discloses a sapphire wafer cutting device and a process, which comprises a support plate, a second support plate, a bottom plate, a U-shaped support plate, a side sliding plate, a strip-shaped groove, a long cylinder, a cylinder, a strip-shaped cutter, a second cylinder, an L-shaped plate, a ring frame, a bearing, a ring gear, a short cylinder, a screw, a servo motor, a driving gear, balls, a suction disc, a third cylinder, a threaded long rod, a second suction disc, threaded deep holes and a circular plate.
Description
Technical Field
The invention relates to cutting equipment and processes, in particular to sapphire wafer cutting equipment and processes, and belongs to the technical field of sapphire wafer cutting application.
Background
The wafer is which is the main raw material of LED, and is the luminous component of LED, the core part of LED, the quality of wafer will directly determine the performance of LED, the wafer is composed of III and V group compound semiconductor substance, when LED is packaged, the wafer material is arranged on the wafer film, such as sapphire wafer.
In the process of cutting a sapphire crystal bar into a plurality of sapphire wafers, due to the fact that a cutter is clamped when a cutting blade is not operated properly, after each cutting, the feeding speed is low, the feeding speed is discontinuous or a part of cutting equipment is short of feeding, and the potential hazard of accidental falling and damage exists in the split paired sapphire wafers in the instant of separation.
Disclosure of Invention
The invention aims to provide sapphire wafer cutting equipment and processes for solving the problems.
The invention achieves the purpose through the following technical scheme that sapphire wafer cutting equipment comprises a long cylinder, a clamping mechanism, a stretch-cutting mechanism and a driving mechanism, wherein the annular surface of the long cylinder is in sliding connection with two corresponding strip-shaped grooves through two side sliding plates, and the two strip-shaped grooves are formed in the end surfaces of two ends of a U-shaped support plate;
the clamping mechanism comprises an th air cylinder, a screw and a third air cylinder, the third air cylinder is installed on the end face of the end of the long cylinder , a push rod of the third air cylinder is provided with a th sucking disc, the number of the th air cylinders is four, the four th air cylinders are annularly installed at the end of the annular surface of the long cylinder, balls are installed on the end face of the end of the push rod of the th air cylinder in a rolling mode, the screw thread penetrates through the middle position of the inner circular wall of the short cylinder, and the end of the screw is rotatably provided with a second sucking disc;
the stretching and cutting mechanism comprises a strip-shaped cutter, the top end of the strip-shaped cutter is arranged at the end of a push rod of a second cylinder, the strip-shaped cutter is connected with the corresponding part of the inner annular wall of the port of the short cylinder in a sliding mode and penetrates through the corresponding part of the inner annular wall of the port of the short cylinder, the second cylinder is arranged on a transverse plate of the L-shaped plate, and the second cylinder is connected with a pneumatic controller and a micro air pump which are;
the driving mechanism comprises a ring gear which is assembled at the end of the short cylinder and is in meshed connection with a driving gear, the driving gear is installed at the end of a shaft of a servo motor, and the servo motor is installed on the side of a support plate .
Preferably, the circular suction opening of the second suction cup is fixed in the middle hole structure of the circular plate, and the structure of the second suction cup and the th suction cup is .
Preferably, the end of the strip-shaped groove is communicated with the side wall of the U-shaped support plate, and the other end of the strip-shaped groove is rotatably provided with a threaded long rod .
Preferably, the bottom of the side wall of the side sliding plate is provided with a threaded deep hole, and the threaded deep hole is in threaded connection with a threaded long rod.
Preferably, the bottom of the U-shaped support plate is mounted on the top surface of the bottom plate, and the bottom end of the second support plate is mounted on the side of the top of the bottom plate.
Preferably, the second support plate is arranged at the bottom of the annular surface of the annular frame, the annular frame is rotatably connected with the short cylinder through a bearing, and the bearing is assembled in the middle of the short cylinder.
Preferably, the annular surface at the port of the short cylinder is provided with a through hole, and the through hole is mutually connected with the strip-shaped cutter in a sliding manner.
Preferably, the vertical plate side of L type board is installed and is linked up the strip piece, and links up the strip groove sliding connection that the strip piece and the strip cutter lateral wall were seted up.
Preferably, the central axis of the th sucking disc coincides with the central axis of the second sucking disc, and the suction surface of the corresponding sucking disc is fixed to with the corresponding smooth end surface of the column bar in an adsorbing manner.
Preferably, the process of sapphire wafer cutting equipment comprises the following steps:
, fixing the cylindrical sapphire crystal bar, namely fixedly connecting the smooth end face of the sapphire crystal bar with a third cylinder through a sucking disc and positioning the smooth end face in a long cylinder, simultaneously starting four cylinders which are distributed annularly, rolling the cylinders through balls and slightly attaching the cylinders to the annular surface of the sapphire crystal bar, and fixing the sapphire crystal bar to be cut into wafers;
adjusting and fixing, namely adjusting the distance between the inner side wall of the strip-shaped cutter and the adsorption surface of the second sucker according to the thickness of the cut sapphire wafer, wherein the distance is the thickness of the cut sapphire wafer, and the other end of the fixed sapphire crystal bar is pushed to gradually extend into the port of the short cylinder by starting a third air cylinder and is mutually adsorbed and fixed with the second sucker at , so that the two ends of the sapphire crystal bar can be simultaneously fixed;
thirdly, adjusting the cutter: the blade end of the connected strip-shaped cutter is pushed to be attached to the corresponding position of the annular surface of the sapphire crystal bar in an extending state by starting the second cylinder;
fourthly, cutting: the servo motor is started to operate to drive the short cylinder connected with the driving gear and the ring gear and the connecting part of the short cylinder to rotate at a proper speed, and meanwhile, the strip-shaped cutter is divided into a plurality of times of equal feed lengths under the action of the controlled second air cylinder, so that the sapphire crystal bar can be cut in a circulating and gradual mode, and the condition of cutter clamping is avoided;
after the sapphire wafers are to be cut and separated, an operator rotates the threaded long rod to drive the two side sliding plates and the long round cylinder to move rightwards under the mutual action of force, so that the sapphire crystal bars can be separated from the cut sapphire crystal wafers, the distance between the sapphire crystal wafers which can be taken out is reserved, and the sapphire crystal wafers and the second sucking disc are always fixed at in an adsorption mode, so that the sapphire crystal wafers can be prevented from falling;
and sixthly, repeating the operation mode for cutting a plurality of sapphire crystal bars into a plurality of sapphire crystal wafers in a limited and reasonable mode.
The invention has the beneficial effects that:
1. the cutting device is reasonable in structural design, two ends of a sapphire crystal bar to be cut are conveniently fixed through two corresponding suckers and a connecting structure, and meanwhile, the effect of gradually feeding materials to a cutting structure can be achieved under the pushing of a third cylinder and the assistance of a ball on a push rod of an th cylinder, and the feeding length of each time is equal to the thickness of a cut sapphire crystal wafer .
2. The cutting device is compact in structural design, the strip-shaped cutter is pushed to stretch the cutter to cut the same part of the sapphire crystal bar by stages by starting the second cylinder, the condition of cutter clamping can be avoided, meanwhile, the strip-shaped cutter can perform annular cutting around the same part of the sapphire crystal bar, and the same cutting amount in each time is ensured.
3. According to the invention, the end face of the sapphire crystal bar to be separated is always adsorbed and fixed by the second sucker, so that the problem that the cut sapphire crystal wafer falls off can be avoided, and the yield is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive exercise.
FIG. 1 is a perspective view of the overall structure of the present invention;
FIG. 2 is a cross-sectional view of the overall structure of the present invention;
FIG. 3 is a partial cross-sectional view of a U-shaped plate of the present invention;
FIG. 4 is a schematic view of the connection structure of the second suction cup and the circular plate according to the present invention.
In the figure, the device comprises a support plate 1, an th support plate, a support plate 2, a second support plate 3, a bottom plate 4, a U-shaped support plate 5, a side sliding plate 6, a strip-shaped groove 7, a long cylinder 8, a th air cylinder 9, a strip-shaped cutter 10, a second air cylinder 11, an L-shaped plate 12, a ring frame 13, a bearing 14, a ring gear 15, a short cylinder 16, a screw rod 17, a servo motor 18, a driving gear 19, a ball 20, a th suction cup 21, a third air cylinder 22, a threaded long rod 23, a second suction cup 24, a threaded deep hole 25 and a circular plate.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the embodiments of the present invention will be described in detail and completely with reference to the accompanying drawings, it is obvious that the embodiments described below are only a part of the embodiments of the present invention, but not all embodiments.
The technical solution of the present invention is further illustrated by the following detailed description with reference to the drawings.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Referring to fig. 1-4, sapphire wafer cutting devices comprise a long cylinder 7, a clamping mechanism, a stretch-cutting mechanism and a driving mechanism, wherein the annular surface of the long cylinder 7 is slidably connected with two corresponding strip-shaped grooves 6 through two side sliding plates 5, and the two strip-shaped grooves 6 are formed in the end surfaces of two ends of a U-shaped support plate 4;
the clamping mechanism comprises air cylinders 8, a screw 16 and three air cylinders 21, the third air cylinders 21 are installed on the end face of the long cylinder 7 , the push rods of the third air cylinders 21 are provided with suction cups 20, the air cylinders 8 are provided with four, the four air cylinders 8 are annularly installed at the annular face end of the long cylinder 7, the end face of the push rod end of the air cylinder 8 is provided with balls 19 in a rolling mode, the screw 16 penetrates through the middle position of the inner circular wall of the short cylinder 15 in a threaded mode, and the screw 16 end is rotatably provided with a second suction cup 23;
the stretching and cutting mechanism comprises a strip-shaped cutter 9, the top end of the strip-shaped cutter 9 is installed at the end of a push rod of a second cylinder 10, the strip-shaped cutter 9 is connected with the corresponding part of the inner annular wall of the port of the short cylinder 15 in a sliding mode, the second cylinder 10 is installed on a transverse plate of the L-shaped plate 11, and the second cylinder 10 is connected with a pneumatic controller and a micro air pump which are installed on the short cylinder 15 through hoses;
the driving mechanism comprises a ring gear 14, the ring gear 14 is assembled at the end of a short cylinder 15 , the ring gear 14 is in meshed connection with a driving gear 18, the driving gear 18 is installed at the end of a shaft of a servo motor 17, and the servo motor 17 is installed at the side of a th supporting plate 1 .
The circumference of the circular suction port of the second suction cup 23 is fixed in the middle hole structure of the circular plate 25, and the second suction cup 23 and the th suction cup 20 form a structure .
The strip-shaped groove 6 end is communicated with the side wall of the U-shaped support plate 4, and the other end in the strip-shaped groove 6 is rotatably provided with a threaded long rod 22 end.
The bottom of the side wall of the side sliding plate 5 is provided with a threaded deep hole 24, and the threaded deep hole 24 is in threaded connection with the threaded long rod 22.
The bottom of the U-shaped support plate 4 is arranged on the top surface of the bottom plate 3, and the bottom end of the second support plate 2 is arranged on the top side of the bottom plate 3.
The second support plate 2 is arranged at the bottom of the annular surface of the ring frame 12, the ring frame 12 is rotatably connected with the short cylinder 15 through a bearing 13, and the bearing 13 is assembled in the middle of the short cylinder 15.
And a through hole is formed in the annular surface at the port of the short cylinder 15 and is in mutual sliding connection with the strip-shaped cutter 9.
The riser side of L template 11 is installed and is linked up a piece, and links up a piece and link up a groove sliding connection that the lateral wall of strip cutter 9 was seted up.
The central axis of the th sucking disc 20 coincides with the central axis of the second sucking disc 23, and the sucking surface of the corresponding sucking disc is fixed to with the corresponding smooth end surface of the column rod in an adsorbing manner.
A process for a sapphire wafer dicing apparatus, the process comprising the steps of:
, fixing the cylindrical sapphire crystal bar, namely fixedly connecting the smooth end face of the sapphire crystal bar with a third cylinder 21 through a sucking disc 20 and positioning the smooth end face in a long cylinder 7, simultaneously starting four circularly distributed cylinders 8 to roll through balls 19 and slightly attach to the annular surface of the sapphire crystal bar, and fixing the sapphire crystal bar to be cut into circular sheets;
adjusting and fixing, namely adjusting the distance between the inner side wall of the strip-shaped cutter 9 and the adsorption surface of the second sucker 23 according to the thickness of the cut sapphire wafer, wherein the distance is the thickness of the cut sapphire wafer, and the third cylinder 21 is started to push the other end of the fixed sapphire crystal bar to gradually extend into the port of the short cylinder 15 and mutually adsorb and fix the end of the fixed sapphire crystal bar with the second sucker 23 at , so that the two ends of the sapphire crystal bar can be simultaneously fixed;
thirdly, adjusting the cutter: the blade end of the connected strip-shaped cutter 9 is pushed to be attached to the corresponding position of the ring surface of the sapphire crystal bar by starting the second cylinder 10 to be in an extension state;
fourthly, cutting: the servo motor 17 is started to operate to drive the short cylinder 15 connected with the driving gear 18 and the ring gear 14 and the connected part of the short cylinder to rotate at a proper speed, and meanwhile, the strip-shaped cutter 9 is divided into a plurality of times of equivalent feed lengths under the action of the controlled second air cylinder 10, so that the sapphire crystal bar can be sliced in a circulating and gradual mode, and the condition of cutter clamping is avoided;
fifthly, taking out the slices, namely after the slices are to be cut and separated, an operator rotates the threaded long rod 22 to drive the two side sliding plates 5 and the long cylinder 7 to move rightwards under the mutual action of force, so that the sapphire crystal bar can be separated from the cut sapphire crystal wafer, and the distance between the sapphire crystal bar and the cut sapphire crystal wafer is reserved, and the sapphire crystal wafer and the second sucking disc 23 are always fixed at in an adsorption manner, so that the sapphire crystal wafer can be prevented from falling;
and sixthly, repeating the operation mode for cutting a plurality of sapphire crystal bars into a plurality of sapphire crystal wafers in a limited and reasonable mode.
It will thus be seen that the embodiments are illustrative and not restrictive in any respect point of view, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
- The sapphire wafer cutting equipment is characterized by comprising a long cylinder (7), a clamping mechanism, an extension cutting mechanism and a driving mechanism, wherein the annular surface of the long cylinder (7) is in sliding connection with two corresponding strip-shaped grooves (6) through two side sliding plates (5), and the two strip-shaped grooves (6) are formed in the end faces of two ends of a U-shaped support plate (4);the clamping mechanism comprises air cylinders (8), a screw rod (16) and three air cylinders (21), the third air cylinders (21) are installed on the end face of the end of the long cylinder (7), the push rods of the third air cylinders (21) are provided with sucking discs (20), the number of the air cylinders (8) is four, the four air cylinders (8) are annularly installed at the end of the annular face of the long cylinder (7), the end face of the push rod of the air cylinder (8) is provided with balls (19) in a rolling mode, the screw rod (16) penetrates through the middle position of the inner circular wall of the short cylinder (15) in a threaded mode, and the second sucking disc (23) is rotatably installed at the end of the screw rod (16) ;the stretching and cutting mechanism comprises a strip-shaped cutter (9), the top end of the strip-shaped cutter (9) is installed at the end of a push rod of a second cylinder (10), the strip-shaped cutter (9) is slidably connected with the corresponding part of the inner annular wall of the port of the short cylinder (15), the second cylinder (10) is installed on the transverse plate of the L-shaped plate (11), and the second cylinder (10) is connected with a pneumatic controller and a micro air pump which are installed on the short cylinder (15) through a hose;the driving mechanism comprises a ring gear (14), the ring gear (14) is assembled at the end of a short cylinder (15) , the ring gear (14) is in meshed connection with a driving gear (18), the driving gear (18) is installed at the end of a shaft of a servo motor (17), and the servo motor (17) is installed on the side of a th support plate (1) .
- 2. The sapphire wafer cutting apparatus according to claim 1, wherein the second suction cup (23) has a circular suction opening fixed around its circumference in the central hole structure of the circular plate (25), and the second suction cup (23) and the suction cup (20) have a structure of .
- 3. The sapphire wafer cutting equipment of claim 1, wherein the end of the strip-shaped groove (6) is communicated with the side wall of the U-shaped support plate (4), and the end of the threaded long rod (22) is rotatably arranged at the other end in the strip-shaped groove (6).
- 4. The sapphire wafer cutting device of claim 1, wherein the bottom of the side wall of the side sliding plate (5) is provided with a threaded deep hole (24), and the threaded deep hole (24) is in threaded connection with the threaded long rod (22).
- 5. The sapphire wafer cutting apparatus of claim 1, wherein the U-shaped support plate (4) is mounted at the bottom on the top surface of the bottom plate (3), and the bottom end of the second support plate (2) is mounted at the top side of the bottom plate (3).
- 6. The sapphire wafer cutting device of claim 5, wherein the second support plate (2) is mounted at the bottom of the annular surface of the ring frame (12), and the ring frame (12) is rotatably connected with the short cylinder (15) through a bearing (13), and the bearing (13) is assembled in the middle of the short cylinder (15).
- 7. The device for cutting sapphire wafers as set forth in claim 1, wherein the short cylinder (15) has a hole on its end opening, and the hole is slidably engaged with the strip-shaped blade (9).
- 8. The kinds of sapphire wafer cutting equipment of claim 1, wherein the L-shaped plate (11) has engaging strips mounted on the side of the riser and slidably connected to engaging strips formed on the side wall of the strip-shaped knife (9) .
- 9. The sapphire wafer cutting apparatus of claim 1, wherein the central axis of the chuck (20) coincides with the central axis of the second chuck (23), and the suction surface of the corresponding chuck and the corresponding smooth end surface of the rod are sucked and fixed at .
- 10. The process for obtaining sapphire wafer cutting devices from the sapphire wafer cutting devices of claims 1-9, wherein the process comprises the steps of:, fixing the cylindrical sapphire crystal bar, namely fixedly connecting the smooth end face of the sapphire crystal bar with a third cylinder (21) through a sucking disc (20) and positioning the smooth end face in a long cylinder (7), simultaneously starting four cylinders (8) which are distributed annularly, rolling through balls (19) and slightly attaching the cylinders to the annular surface of the sapphire crystal bar, and fixing the sapphire crystal bar to be cut into wafers;adjusting and fixing, namely adjusting the distance between the inner side wall of the strip-shaped cutter (9) and the adsorption surface of the second sucker (23) according to the thickness of the cut sapphire wafer, wherein the distance is the thickness of the cut sapphire wafer, and the other end of the fixed sapphire crystal bar is pushed to gradually extend into the port of the short cylinder (15) by starting the third air cylinder (21) and is mutually adsorbed and fixed with the second sucker (23) at , so that the two ends of the sapphire crystal bar can be simultaneously fixed;thirdly, adjusting the cutter: the blade end of the connected strip-shaped cutter (9) is pushed to be attached to the corresponding position of the ring surface of the sapphire crystal bar by starting the second cylinder (10) to be in an extending state;fourthly, cutting: a servo motor (17) is started to operate to drive a short cylinder (15) connected with a driving gear (18) and a ring gear (14) and a connecting part of the short cylinder to rotate at a proper speed, and meanwhile, a strip-shaped cutter (9) is divided into a plurality of times of equal feed lengths under the action of a controlled second air cylinder (10), so that the sapphire crystal bar can be cut in a circulating and gradual mode, and the condition of cutter clamping is avoided;fifthly, taking out the slices, namely after the slices are to be cut and separated, an operator rotates the threaded long rod (22) to drive the two side sliding plates (5) and the long cylinder (7) to move rightwards under the mutual action of force, so that the sapphire crystal bar can be separated from the cut sapphire crystal wafers, and the distance for taking out the sapphire crystal wafers is reserved, and the sapphire crystal wafers and the second sucking disc (23) are always fixed at in an adsorption manner, so that the condition that the sapphire crystal wafers fall off can be avoided;and sixthly, repeating the operation mode for cutting a plurality of sapphire crystal bars into a plurality of sapphire crystal wafers in a limited and reasonable mode.
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| CN201911022763.5A CN110733140B (en) | 2019-10-25 | 2019-10-25 | Sapphire wafer cutting equipment and process |
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| CN201911022763.5A CN110733140B (en) | 2019-10-25 | 2019-10-25 | Sapphire wafer cutting equipment and process |
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| CN112697492A (en) * | 2020-12-07 | 2021-04-23 | 苏州布克斯包装有限公司 | Sampling cutter for adhesive tape production detection |
| CN113172782A (en) * | 2021-05-17 | 2021-07-27 | 伍路旺 | Single-chip microcomputer wafer slicing device |
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