CN206588489U - A kind of solar energy silicon crystal chip automatic gas cutting machine - Google Patents
A kind of solar energy silicon crystal chip automatic gas cutting machine Download PDFInfo
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- CN206588489U CN206588489U CN201621441650.0U CN201621441650U CN206588489U CN 206588489 U CN206588489 U CN 206588489U CN 201621441650 U CN201621441650 U CN 201621441650U CN 206588489 U CN206588489 U CN 206588489U
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- cutting machine
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- crystal chip
- automatic gas
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Abstract
The utility model provides a kind of solar energy silicon crystal chip automatic gas cutting machine, including Rack Body and workbench, workbench is fixedly mounted on Rack Body, workbench includes feed mechanism, cutting agency and surface trimming area, feed mechanism is arranged on the side of workbench, and cutting agency is arranged on the workbench opposite side relative with feed mechanism, and surface trimming area is located in the middle of feed mechanism and cutting agency.The beneficial effects of the utility model are to realize the full-automation of solar energy silicon crystal chip cutting, effective to reduce manual work intensity, save the time, improve inefficiency, reduce the damage of chip.
Description
Technical field
The utility model belongs to solar energy and electronic applications, more particularly, to a kind of solar energy silicon crystal chip automatic gas cutting machine.
Background technology
Solar wafer matter is thin, and frangible, and the cutting mechanics of solar energy silicon crystal chip are manual, people in existing technology
Work feeding.Solar energy silicon crystal chip can be caused to damage in the presence of artificial feeding, inefficiency, the technical problem such as speed is slow.
The content of the invention
Problem to be solved in the utility model is to provide a kind of solar energy silicon crystal chip automatic gas cutting machine, it is therefore intended that realize too
The full-automation of positive energy silicon wafer cutting.
In order to solve the above technical problems, the technical solution adopted in the utility model is：A kind of solar energy silicon crystal chip is cut automatically
Cutting mill, including Rack Body and workbench, the workbench are fixedly mounted on the Rack Body, and the workbench includes feeder
Structure, cutting agency, surface trimming area, the feed mechanism is arranged on the side of the workbench, and the cutting agency is arranged on
The workbench opposite side relative with the feed mechanism, the surface trimming area is located at the feed mechanism and the blanking
In the middle of mechanism.
Further, the feed mechanism and the cutting agency include belt line, and motor, timing belt insert is synchronous
Band belt wheel and locating piece, the two ends of the belt line are respectively provided with the Toothed belt pulley, and the motor is arranged on the belt
Multiple locating pieces are set in line side, the belt line, and four angles of each locating piece are respectively provided with the timing belt
Insert.
Further, the surface trimming area includes detent mechanism, electronic two-dimensional stage and laser cutting machine, the positioning
Mechanism is located at the top of the electronic two-dimensional stage, and the laser cutting machine is fixedly mounted at the top of the detent mechanism.
Further, the surface trimming area also includes transplanting mechanism, and the transplanting mechanism includes electric platforms, lifting air
Cylinder, guide rail slide block, the lift cylinder controls the guide rail slide block to move up and down, and guide rail is set on the electric platforms, described
Transplanting mechanism is translated on the guide rail.
Further, the transplanting mechanism also includes vacuum cup.
Further, the detent mechanism includes being arranged on the stomata in the middle of detent mechanism, is fixedly installed on the positioning
Three servo-actuated locating wheels at the adjacent both sides edge of mechanism, are arranged on two needle-like cylinders on the adjacent other both sides of detent mechanism, often
The front end of the individual needle-like cylinder sets servo-actuated locating wheel.
Further, the laser cutting machine is optical fiber 20W laser cutting machines, and the laser cutting machine girder uses handwheel
T-shaped screw rod is driven, linear guides are oriented to.
Further, the industrial computer that setting control laser cutting machine is operated inside the Rack Body, Main Control Tank, power supply box,
The industrial computer, the Main Control Tank and power supply box electrical connection.
Further, in addition to protective cover, the protective cover is arranged on the bench-top, the protective cover and set
Warning lamp.
Further, set at the top of the protective cover under cantilever, the cantilever and connect control panel.
The utility model has the advantages and positive effects of：Due to using above-mentioned technical proposal, solar energy silicon wafer is realized
The full-automation of piece cutting, with optical fiber 20W laser cutting machines groove on solar energy silicon crystal chip, equipment uses automatic loading/unloading,
It is effective to reduce manual work intensity, the time is saved, inefficiency is improved, the damage of chip is reduced.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is internal structure schematic diagram of the present utility model；
Fig. 3 is the utility model feeding, discharge mechanism structure schematic diagram；
Fig. 4 is the utility model transplanting mechanism structural representation；
Fig. 5 is the utility model detent mechanism structural representation.
In figure：
1st, Rack Body 2, protective cover 3, feed mechanism
31st, motor 32, timing belt insert 33, Toothed belt pulley
34th, locating piece 4, cutting agency 5, detent mechanism
51st, stomata 52, locating wheel 53, needle-like cylinder
6th, electronic two-dimensional stage 7, transplanting mechanism 71, electric platforms
72nd, lift cylinder 73, guide rail slide block 74, vacuum cup
8th, laser cutting machine 9, cutting machine focusing platform 10, external interface
11st, guidance panel 12, organic glass door 13, warning lamp
Embodiment
As depicted in figs. 1 and 2, a kind of solar energy silicon crystal chip automatic gas cutting machine of this example, including Rack Body 1 and workbench,
Workbench is fixedly mounted on Rack Body 1, and Rack Body 1 is the cube structure being welded using square steel, firm welding, frame
The inside of body 1 sets control system, mainly concentrates control system relevant with laser cutting machine control operation, including industrial computer, main
Control case, power supply box, workbench switch board etc., industrial computer, Main Control Tank and power supply box are electrically connected.The side of Rack Body sets outside connect
Mouth 10, is electrically connected with the control system being arranged in Rack Body 1.
Workbench is fixedly mounted on Rack Body 1, workbench include feed mechanism 3, cutting agency 4, surface trimming area, on
Material mechanism 3 is arranged on the side of workbench, and cutting agency 4 is arranged on the workbench opposite side relative with feed mechanism 3, cut automatically
Area is cut in the middle of feed mechanism 3 and cutting agency 4.As shown in figure 3, feed mechanism and cutting agency include belt line, electricity
Machine 31, timing belt insert 32, Toothed belt pulley 33 and locating piece 34, belt line portion chassis are formed using aluminium section bar overlap joint, side
Just firmly, the two ends of belt line are respectively provided with Toothed belt pulley 33, and motor 31 is arranged on belt line side, and motor 31 is using big torsion
Square stepper motor, the driving synchronous pulley 33 of motor 31 mechanism is realized sets multiple locating pieces 34 in the transmission of belt line, belt line,
Four edges of each locating piece 34 are respectively provided with timing belt insert 32, and the positioning on detection switch, belt is respectively arranged with per compartment
Block 34 can be recycled.
Surface trimming area includes transplanting mechanism 7, detent mechanism 5, electronic two-dimensional stage 6 and laser cutting machine 8, and product passes through
Product transplanting mechanism 7 is transplanted in the positioning fixture of detent mechanism.As shown in figure 4, product transplanting mechanism 7 passes through electric platforms 71
It is mobile, realized and lifted using lift cylinder 72 and guide rail slide block 73, transplanting mechanism 7 also includes vacuum cup 74, is inhaled using vacuum
Disk 74 realizes the absorption of silicon wafer, and product transplanting mechanism 7 installs pressure sensor additional, and when insufficient pressure alarm, product is not held
Shi Chongxin is drawn, and transplanting mechanism 7 moves the wafer into removal, and the input and output for realizing chip are avoided due to artificially causing chip
It is damaged.After product orientation absorption, electronic two-dimensional stage 6 is moved to, electronic two-dimensional stage 6 moves to 8 times progress of laser cutting machine
Cutting, electronic two-dimensional stage 6 realizes the movement of X-axis, Y-axis according to cutting parameter set in touch-screen, carrys out cut crystal.
Laser cutting machine 8 uses optical fiber 20W laser cutting machines, and laser cutting machine uses handwheel with the convenient focusing of girder lifting, lifting body
T-shaped screw rod is driven, linear guides are oriented to, and is easy to quick focusing equipped with scale and pointer,
As shown in figure 5, detent mechanism 5 includes the stomata 51 for being arranged on the middle part of detent mechanism 5, positioning is fixedly installed on
Three servo-actuated locating wheels 52 at the adjacent both sides edge of mechanism, are arranged on two needle-like cylinders on the adjacent other both sides of detent mechanism 5
53, the front end of each needle-like cylinder sets servo-actuated locating wheel 52.Two needle-like cylinders 53 drive servo-actuated locating wheel 52 to position, and use
Four point positioning, wherein 2 points are fixed, 2 points of movements, the positioning method of vacuum suction.To adapt to product specification change, there is automatic tune
Detent mechanism 5 everywhere is adjusted for section mechanism, and accurate positioning, conveniently can be achieved, simple in construction.Detent mechanism 5 is fitted with
The optical fiber of product thickness is detected, two panels alarm is held when simultaneously.Detent mechanism 5 is arranged in electronic two-dimensional stage 6, passes through electricity
The motion of dynamic two-dimensional stage 6, by chip conveying to the position pre-set, is cut by laser.
As shown in figure 1, solar energy silicon crystal chip automatic gas cutting machine also includes protective cover 2, protective cover 2 is set on the table
Side, whole workbench is covered in protective cover 2, and protective cover 2 uses aluminium profiles framework, sets organic glass door 12, using metal plate door
Mosaic glass observation window, convenient observation monitoring, good appearance, each door is respectively arranged with safety switch.Warning lamp is set on protective cover 2
13, it is three color alarm lamps, the top of protective cover 2 sets horizontal brace rod, and horizontal brace rod is connected with the top of protective cover 2 to rotate,
Horizontal brace rod end connects vertical connecting rod, and horizontal brace rod constitutes cantilever, the end of vertical connecting rod with vertical connecting rod
Control panel 11 is connected, display is set on control panel 11, touch-screen, operation button, manually or automatically switching button, in machine
Lighting button, start button, scram button, the person of being convenient to operation carries out various operations as needed, simple and convenient.
The course of work of this example：Product is put into the locating piece of feed mechanism, per lattice 40, advance after a lattice have been transplanted
One position, only alarming lamp prompt blowing during a surplus lattice, starts workbench, on charging belt line, feed mechanism installs optical fiber additional
Detection, when fiber laser arrays to feed mechanism have silicon wafer, silicon wafer is grabbed detent mechanism and positioned by product transplanting mechanism；Positioning
After mechanism finishes silicon wafer positioning, two-dimentional electric platforms drive detent mechanism to run to cutting position and cut.Cut
Cheng Hou, two-dimentional electric platforms playback, transplanting mechanism simultaneously adsorbs the product on upper material position product and detent mechanism, electric platforms
The product that feed mechanism is adsorbed is transplanted on detent mechanism, while the product on detent mechanism is transplanted to cutting agency, blanking
The locating piece of mechanism belt line can put 40 per lattice, a position of advancing after a lattice are piled, full up rear warning lamp prompting blanking.
The beneficial effects of the utility model are：The full-automation of solar energy silicon crystal chip cutting is realized, it is effective to reduce manually
Operation intensity, saves the time, improves inefficiency, reduces the damage of chip.
One embodiment of the present utility model is described in detail above, but the content is only of the present utility model
Preferred embodiment, it is impossible to be considered as being used to limit practical range of the present utility model.It is all to be made according to present utility model application scope
Equivalent change with improve etc., all should still belong within patent covering scope of the present utility model.
Claims (10)
1. a kind of solar energy silicon crystal chip automatic gas cutting machine, it is characterised in that：Including Rack Body and workbench, the workbench is fixed
On the Rack Body, the workbench includes feed mechanism, and cutting agency, surface trimming area, the feed mechanism is set
Put in the side of the workbench, the cutting agency is arranged on the workbench opposite side relative with the feed mechanism,
The surface trimming area is located in the middle of the feed mechanism and the cutting agency.
2. a kind of solar energy silicon crystal chip automatic gas cutting machine according to claim 1, it is characterised in that：The feed mechanism and
The cutting agency includes belt line, motor, timing belt insert, Toothed belt pulley and locating piece, the head and the tail of the belt line
End is respectively provided with the Toothed belt pulley, and the motor, which is arranged in the belt line side, the belt line, sets multiple described
Locating piece, four angles of each locating piece are respectively provided with the timing belt insert.
3. a kind of solar energy silicon crystal chip automatic gas cutting machine according to claim 1, it is characterised in that：The surface trimming area
Including detent mechanism, electronic two-dimensional stage and laser cutting machine, the detent mechanism is located at the top of the electronic two-dimensional stage, institute
Laser cutting machine is stated to be fixedly mounted at the top of the detent mechanism.
4. according to a kind of any described solar energy silicon crystal chip automatic gas cutting machines of claim 1-3, it is characterised in that：It is described automatic
Cutting area also includes transplanting mechanism, and the transplanting mechanism includes electric platforms, lift cylinder, guide rail slide block, the lift cylinder
Control the guide rail slide block to move up and down, guide rail is set on the electric platforms, the transplanting mechanism is translated on the guide rail.
5. a kind of solar energy silicon crystal chip automatic gas cutting machine according to claim 4, it is characterised in that：On the transplanting mechanism
Also set up vacuum cup.
6. a kind of solar energy silicon crystal chip automatic gas cutting machine according to claim 3, it is characterised in that：The detent mechanism bag
The stomata being arranged in the middle of detent mechanism is included, three servo-actuated positioning at the adjacent both sides edge of the detent mechanism are fixedly installed on
Wheel, is arranged on two needle-like cylinders on the adjacent other both sides of detent mechanism, and the front end of each needle-like cylinder sets servo-actuated fixed
Position wheel.
7. a kind of solar energy silicon crystal chip automatic gas cutting machine according to claim 3 or 6, it is characterised in that：The laser is cut
Cutting mill is optical fiber 20W laser cutting machines, and the laser cutting machine girder drives T-shaped screw rod using handwheel, and linear guides are oriented to.
8. a kind of solar energy silicon crystal chip automatic gas cutting machine according to claim 1, it is characterised in that：Inside the Rack Body
The industrial computer of control laser cutting machine operation, Main Control Tank, power supply box, the industrial computer, the Main Control Tank and the power supply are set
Case is electrically connected.
9. a kind of solar energy silicon crystal chip automatic gas cutting machine according to claim 1, it is characterised in that：Also include protective cover,
The protective cover is arranged on the bench-top, the protective cover and sets warning lamp.
10. a kind of solar energy silicon crystal chip automatic gas cutting machine according to claim 9, it is characterised in that：The protective cover top
Portion sets and connects control panel under cantilever, the cantilever.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621441650.0U CN206588489U (en) | 2016-12-27 | 2016-12-27 | A kind of solar energy silicon crystal chip automatic gas cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621441650.0U CN206588489U (en) | 2016-12-27 | 2016-12-27 | A kind of solar energy silicon crystal chip automatic gas cutting machine |
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| Publication Number | Publication Date |
|---|---|
| CN206588489U true CN206588489U (en) | 2017-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201621441650.0U Active CN206588489U (en) | 2016-12-27 | 2016-12-27 | A kind of solar energy silicon crystal chip automatic gas cutting machine |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106735933A (en) * | 2016-12-27 | 2017-05-31 | 天津曼科科技有限公司 | A kind of solar energy silicon crystal chip automatic gas cutting machine |
| CN108015432A (en) * | 2017-12-04 | 2018-05-11 | 大族激光科技产业集团股份有限公司 | Laser cutting machine |
| CN108544104A (en) * | 2018-04-17 | 2018-09-18 | 李涛 | Hand diamond laser cutting machine |
| CN110733140A (en) * | 2019-10-25 | 2020-01-31 | 江苏晶杰光电科技有限公司 | sapphire wafer cutting equipment and process |
| CN112719380A (en) * | 2020-12-22 | 2021-04-30 | 贵州顺安科技有限公司 | Probe side hole processing machine |
| CN112775223A (en) * | 2021-01-21 | 2021-05-11 | 镇安芯木田科技有限公司 | Probe bending machine |
-
2016
- 2016-12-27 CN CN201621441650.0U patent/CN206588489U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106735933A (en) * | 2016-12-27 | 2017-05-31 | 天津曼科科技有限公司 | A kind of solar energy silicon crystal chip automatic gas cutting machine |
| CN108015432A (en) * | 2017-12-04 | 2018-05-11 | 大族激光科技产业集团股份有限公司 | Laser cutting machine |
| CN108544104A (en) * | 2018-04-17 | 2018-09-18 | 李涛 | Hand diamond laser cutting machine |
| CN110733140A (en) * | 2019-10-25 | 2020-01-31 | 江苏晶杰光电科技有限公司 | sapphire wafer cutting equipment and process |
| CN112719380A (en) * | 2020-12-22 | 2021-04-30 | 贵州顺安科技有限公司 | Probe side hole processing machine |
| CN112775223A (en) * | 2021-01-21 | 2021-05-11 | 镇安芯木田科技有限公司 | Probe bending machine |
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